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HYPERLYNX- A PWB DESIGN TOOL
Sandy Mazzola
BAE Systems Inc
HYPERLYNX
The HyperLynx suite of tools can be used in virtually any design flow to help eliminate signal integrity, crosstalk, and EMC problems early, allowing you to "get it right the first time." These simulation tools come ready to use with unprecedented ease of use, delivering high speed analysis to every engineer's desktop.
HYPERLYNX
Before layout begins (LineSim) Generation of high-speed PCB-routing
constraints (LineSim) After PCB layout (BoardSim) During system analysis of a multiple
board design (BoardSim MultiBoard Option)
HYPERLYNX VERSIONS
LINESIM LINESIM EMC LINESIM CROSSTALK BOARDSIM BOARDSIM EMC BOARDSIM CROSSTALK BOARDSIM MULTI-BOARD
HYPERLYNX
A Mentor Graphics Product Pricey Initial cost is 3K to 50K depending on
configuration 2K a year maintenance cost
HYPERLYNX - BOARDSIM
PWB Design provides 3 ASCII source files unique to ALLEGRO to a local pc
Component & connectivity data (a_c) Layout data (a_l) Outline data (a_o)
Hyperlynx ALLEGRO translator run at a local PC converts these ASCII files to HYP files
Result is an image viewable PWB layout
HYPERLYNX PRELIMINARY PROCESS
Use stackup editor to verify Power/Ground plane & signal layer assignments & add/delete layers or change type
Adjust dielectric thicknesses/constants Adjust copper thicknesses Layers are color coded Use Power supply editor to verify correct
assignment of power supply voltages
CROSSTALK - BATCH MODE BATCH MODE –select board wizard Set voltage coupled threshold and rise/fall
times – Then run Report issued showing all aggressor nets
that produce crosstalk at or greater then threshold value on every victim net
Report does not know what actually drives the aggressor nets. It assumes default rise/fall times.
Requires analysis to identify true problems.
CROSSTALK - BATCH MODE ANALYSIS
Analyze batch crosstalk results Test points may be don’t care situations Static sources not an issue Is the source Synchronus/Asynchronus ?
CROSSTALK ISSUESFORWARD CROSSTALK Forward Crosstalk = Crosstalk appearing on
the victim line at the receiver end of the aggressor line
• Function of the difference between capacitive crosstalk and mutual inductance crosstalk
• Duration = rise time of aggressor line driver• Amplitude proportional to rise time and line
length• Polarity opposite aggressor driver signal
transition polarity
CROSSTALK ISSUESBACKWARD CROSSTALK Backward Crosstalk = Crosstalk appearing on the victim
line at the driver end of the aggressor line• Function of the sum of the capacitive and mutual
inductance crosstalk currents• Duration = Twice the transition time (Time for signal to
travel down the line and return)• Amplitude = Independent of line length when line is
electrically long; directly proportional to length when line is short
• Polarity = same as aggressor driver signal transition polarity
SIGNAL INTEGRITY
Delays Overshoot Multiple Threshold Crossing Ringing
SIGNAL INTEGRITY ANALYSIS PROCESS
Select Net (sorted by name, length, or trace width)
Net now visible on PWB image with colors corresponding to layer colors
All nets can be shown Nets on a single layer can be shown by
changing all other layer colors to background color
ASSIGN DRIVERS AND RECEIVERS
Click on component button associated with that net
Select models Array of IBIS, Hyperlynx.mod and .mdl devices
along with easy models May need to obtain IBIS models from vendors Repeat for all other drivers/receivers on net
IBIS- Input/Output Buffer Information Specification
The input/output buffer information specification (IBIS) is a device-modeling standard that was developed in 1993 by a consortium of companies from within the electronic design industry. IBIS allows the development of device models that preserve the proprietary nature of integrated circuit device designs, while at the same time providing information-rich models for signal integrity and electromagnetic compatibility (EMC) analysis.
IBIS - Input/Output Information Specification An IBIS model library comes with Hyperlynx.
These models enable accurate simulations of drivers and receivers
Can be downloaded from vendor and other websites
Models provide V/I characteristics of inputs and outputs including ground clamping and VCC clamping
Models include parasitics Defaults available for rapid simulation
SIGNAL ANALYSIS MODE
After selecting net - Assign Probes Select simulation Set horizontal and vertical scales Use cursors to obtain waveform details Print or copy/paste scope display
SIGNAL ANALYSIS MODE
CROSSTALK - SIGNAL ANALYSIS MODE
Need models Enable crosstalk Set Threshold PWB image will now display aggressor
nets as dotted lines These nets will produce crosstalk at
threshold level or greater on selected net
CROSSTALK SIGNAL ANALYSIS
Cross-sectional view of traces involved in crosstalk is displayed
On PWB image, footprint view is highlighted
Make changes as necessary based on results
EMC ANALYSIS MODE
Have not used program in Spectrum Analyzer mode with antenna probes
Simulation against radiated emissions requirements
Very complicated – unbounded condition Hope to work with it in the future
LAYOUT/STACKUP DESIGN RULES GENERAL RULES -Partition Signals
- Static/Quasistatic-Low Level-High Level- Clock and high rate signals- Video and Analog-Low Level-Moderate Level-High Level- Gates- Triggers- Differential
LAYOUT/STACKUP DESIGN RULES
Digital Power and Digital Ground should be assigned planes
Adjacent signal layers should have traces orthogonal
A signal trace should ideally run over an unbroken plane layer so that the current return is in the image of the trace
A slot in the plane under a signal trace will result in significant radiation from the trace
LAYOUT/STACKUP DESIGN RULES
For power not assigned to planes, use the widest possible traces (50 mils preferred) and run ground traces in parallel
Keep like signals together to the extent practical
Clocks and high rate signals on their own layer Analog and video on a separate layer
Keep low traces away from moderate and high level traces
LAYOUT/STACKUP DESIGN RULES
Bury the fastest signals the deepest (bury them between the power and ground planes)
Static/Quasistatic signals can be on top and bottom layers or outside Power/Ground planes
Keep differential signals together on same layer and equal in length
LAYOUT/STACKUP DESIGN RULES
Trace length to decoupling capacitors must be short
Tantalum decoupling capacitors should be located at the I/O connectors with shortest possible trace connection between connector and capacitor
The closer any trace is to a plane the better
LAYOUT/STACKUP DESIGN RULES
The wider the separation between traces that can interfere, the better
It is di/dt that causes crosstalk and EMI emissions. Pay close attention to signals involving large current swings.
For boards with mixed speeds/levels, keep high speed/level circuits closest to the I/O connector.
TRACES AS TRANSMISSION LINES
PCB traces act as transmission lines when line delay is equal to or greater than ½ the rise (or fall) time
National semiconductor uses 1/3 and Hyperlynx uses 1/6
Line delay is a function of propagation speed and trace length
TRACES AS TRANSMISSION LINES
Propagation Speed = C/(εr)1/2
C =Speed of Light = 3 x 10 8 meters per second
εr = Relative dielectric constant
For εr = 4.1 (typical value of polyimide) signal speed = 3 x 10 8 meters/sec x 39.37 inches/meter/(4.1) ½ = 5.83 x 10 9 inches per second = 5.83 inches per nanosecond
TRACES AS TRANSMISSION LINES
Propagation Delay- Tpd = reciprocal = 1 nanosecond/5.83” = .171 nanoseconds per inch
Transition electrical length for a 2 nanosecond rise time is 2 x 5.83 = 11.66 inches
Critical length = ½ transition electrical length For 2 nanosecond rise time critical length is
5.83 inches
TERMINATION TYPES AND THEIR ADVANTAGES/DISADVANTAGES
Series (BACKMATCHING)- A resistor in series with the driver output that attempts to match the source impedance to the transmission line impedance of the trace
Only one component required Least current power drain Damps entire switching circuit Best for a single receiver, or receivers grouped
at last third of the line Best for CMOS to CMOS logic interfaces
TERMINATION TYPES - SERIES
Hard to select the proper resistor value (Hyperlynx shines in this application)
Lower slew rates than parallel with capacitive loads
TERMINATION TYPES - DC PARALLEL, PULLUP OR PULLDOWN
A resistor to ground or to VCC at the receiver end
• Only one component required• Easier to chose resistor value• Works with multiple receivers (anywhere along
trace)• Pullup to VCC aids sourcing; pulldown to
ground aids sinking• Connect to ground for low duty cycle; VCC for
high
TERMINATION TYPES –AC PARALEL
Reduced power compared to DC termination Easier to chose resistor value Works with multiple receivers Requires two components Hard to choose capacitor value Too small a capacitor results in
over/undershoot Not for RS422 and not for high current drivers
TERMINATION TYPES - THEVENIN
Advantages/Disadvantages about the same as DC parallel
Good overshoot protection Aids in sourcing and sinking load currents Requires two components Lowers slew rate Can bias CMOS receiver to higher dissipation
state