Automatic Test Equipment

HIOKI E.E. CORPORATION

1985 1990 1995 2000

1101

1110

1102

1111/12

1105

1300

1114

1115 1116

1117PCB

PACKAGE

BOARD ASSEMBLYX-Y HiTESTER

UNIT HiTESTER

PRESS-TYPE HiTESTER

X-Y HiTESTER

1107 1108

Road Map for ATE (Automated Test Equipment)

• High-speed inspection

• Capability of lifted IC lead detection

• High-stability measurement

• Reversely mounted capacitor detection

1105 IN-CIRCUIT HiTESTER

• Reduces running costs

• Flexibility

• Unmanned visual inspection.

• Unmanned operation.

1114 X-Y IN-CIRCUIT HiTESTER

• Ultra high speed

• High-precision probing

• Scratch-less

• High accuracy

• Gerber data utilization

• Unmanned Operation

1115 X-Y C HiTESTER

• Ultra high-speed inspection (4 arms)

• High-precision probing

• Scratch-less

• High accuracy (resolution of 5aF)

• Gerber data utilization

• Unmanned Operation

1116 X-Y C HiTESTER

• High-speed inspection of IC packages, MCM

• High-speed measurement

• High positioning accuracy: repeatability within +/-3um

• Dedicated fixture of minimum 150um pitch

• User-replaceable probe

1107 UNIT HiTESTER

1.High accuracy

Position repeatability : Within ±3μm

2.High-speed measurement

Inspection time : 0.3sec/1024points

3.Fine-pitch probe

Minimum pitch : 150μm

4.Component test

L, C, R and Diode measurement

5.Insulation test

Applied voltage: 1V-step adjustable

1107 UNIT HiTESTER Details

B

A

AlignmentArea

InspectionArea

1107 UNIT HiTESTERTwo Inspection Stages

High-speed testingfor IC packages,such as MCM, BGA,FC-PGA, FC-BGA, CSP and high-density boards

1108 UNIT HiTESTER

Probe

Pattern

　　Inspection stage

Sensor board

Insulating film

Bare board under test

Capacitance measurement

circuit

Each pattern has the capacitance that is proportional to its area between probe and electrically isolated inspecting electrode (sensor board).

In Actual Bare Board Inspection …

L: Length

A: Area

ε: Dielectric Constant

Capacitance C=εA

L

The capacitance between parallel lines is proportional factor to its area. Therefore, capacitance measurement enables to measure its area.

Short-Circuit/Disconnected Pattern Inspection with Area (Capacitance) Measurement

　　 A Flying probe contacts flip-chip side and four-terminal probes contact PGA side with a fixture to measure resistance

Four-terminal probe ﾞPattern

Resistance measurement Circuit

　　　　

Jig for inspection

Bare board under test

In Actual Inspection …

Four-terminal measurement methodWith four-terminal measurement method, accurate resistance value

can be measured by getting rid of wiring and contact resistance

Minute electrical path resistance can be measured with four-terminal method

Resistance measurement circuitConstant current source

Voltmeter

E0r4 r3 r1r2

E

I

r1～r4：

How To Measure Electrical Path Resistance

Resistance: R0

Wiring and contact resistance

1172-67 Double-Link Probe

1172-41 Ｆ our-Terminal Probe

Probe for reversely mounted capacitor detection contacts here

Probe for reversely mounted capacitor detection

A probe for reversely mounted capacitor detection contacts the case of a electrolytic capacitor and the probes of a jig contacts the terminals

In Actual testing …

Electrolytic capacitor

Probe for reversely mounted capacitor detection

Voltage measurement

circuit

PCB

How To Detect Reversely Mounted CapacitorsThe voltage drop between the case and the terminals of a electrolytic capacitor is measured to detect its polarity

Packaging Structure PGA QFP TCPMCM BGA CSPFlip Chip (BGA, LGA, SO, etc.)FBGA/LGAThick film circuit,LCD Display,Build-up structure board

In-circuit modules

COC

Light interconnection

3-D structure packaging

WOW

Inspection Object

Line/Space(μm) Pad size(μm) Dielectric constant Thickness of insulator Thickness of conductor

50/50 100 4.4 ～ 4.7 40 ～ 80 20

30/30 60 3.8 ～ 4.0 20 ～ 40 15

20/20 40 3.5 ～ 3.8 15 ～ 20 10

10/10 18 3.0 ～ 3.5 10 ～ 15 5

1995 2000 2005 2010

Road Map Appearance and Internal Inspection