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Helicopter Data Acquisition SystemHelicopter Data Acquisition System
ECE 4522 Senior Design IIECE 4522 Senior Design II
Team MembersTeam Members
David PaulDavid Paul
Aaron HillAaron Hill
Robert McInnisRobert McInnis
Jason SchemmelJason Schemmel
Dr. Rob KingDr. Rob King (Advisor)(Advisor)
Team ResponsibilitiesTeam Responsibilities Aaron Hill (Power)Aaron Hill (Power)
Power consumption, PCB layout, and documentation
David Paul (Controls)David Paul (Controls)
Control circuit design and synchronization
Jason Schemmel (Communications)Jason Schemmel (Communications)
Antenna simulation, transmitter/receiver research, PCB layout
Robert McInnis (Communications)Robert McInnis (Communications)
Signal conditioning, sampling, and data conversion
HelicopterHelicopter
Design ExplanationDesign Explanation
Hub
Blade
Pivot
Nonlinear stiffness spring
POT
Strain Gauge
Design ExplanationDesign Explanation
HUBHUB PIVOTPIVOT
Strain Gage
Design ExplanationDesign ExplanationPosition Position
TransducerTransducerPosition Position
TransducerTransducer Battery Battery Pack Pack
Power Power SourceSource
900 Mhz 900 Mhz TransmitterTransmitter900 Mhz 900 Mhz
TransmitterTransmitter
2:1 Mux2:1 Mux2:1 Mux2:1 Mux
10 bit A/D Converter10 bit A/D Converter10 bit A/D Converter10 bit A/D Converter
Wheatstone Wheatstone BridgeBridge
Wheatstone Wheatstone BridgeBridge
Amplifier Amplifier Signal Signal
ConditionerConditioner
Amplifier Amplifier Signal Signal
ConditionerConditioner
Strain GaugeStrain GaugeStrain GaugeStrain Gauge
KEYKEY
PowerPower
SignalSignal
EM SignalEM Signal
BASIC Stamp BASIC Stamp MicrocontrollerMicrocontrollerBASIC Stamp BASIC Stamp
MicrocontrollerMicrocontroller
Design ExplanationDesign Explanation
Helicopter Helicopter House House PowerPower
10 bit D/A 10 bit D/A ConverterConverter
10 bit D/A 10 bit D/A ConverterConverter
KEY
Power
Signal
EM Signal
Data Enable
900 MHz 900 MHz ReceiverReceiver
900 MHz 900 MHz ReceiverReceiver
LaptopLaptopLaptopLaptop
Internal Internal Sensor Sensor
PackagePackage
Internal Internal Sensor Sensor
PackagePackage
DAQ DAQ PCMCIAPCMCIADAQ DAQ
PCMCIAPCMCIA
BASIC Stamp BASIC Stamp MicrocontrollerMicrocontrollerBASIC Stamp BASIC Stamp
MicrocontrollerMicrocontroller
10 bit D/A 10 bit D/A ConverterConverter
10 bit D/A 10 bit D/A ConverterConverter
Status - CompleteStatus - Complete
• Transmission / reception
• Data conversion
• Acquisition instrumentation
• Power supplies
• Dual signal multiplexing
• BASIC Stamp programming/implementation
Status – IncompleteStatus – Incomplete
• PCB
• Software
• Strain Gauge Signal Conditioner
• Adequate noise filtration
Simulation ComparisonSimulation Comparison
Control SignalControl Signal
Channel 1
Channel 0Simulated Signal
5V
0V
5V
0V
Simulation ComparisonSimulation Comparison
Sampling RateSampling Rate
0 1 2 3 4 5 6 7 8 -100
-80
-60
-40
-20
0
20
40
60
80
100
Time (sec)
Bla
de L
ead
Ang
le (
deg)
Baseline Case w/ Duffing Spring Transmitted Signal
Input Signal (3Hz)
Simulated Input Signal
Problems SolutionsProblems Solutions
1. Encoder/Decoder was slowing our sampling rate
2. Transmission Scheme transmitting unwanted address bits @ 10 kbps (22 bits per packet) 300MHz
3. Error checking overkill
1. Implemented BASIC stamp for quick custom solution
2. Using 50 kbps @ 900 MHz scheme transmitting 2-10 bit packets
3. Parity checking performed by BASIC stamp
Problems SolutionsProblems Solutions
4. Multiplexor would not latch analog data for output
5. Overall system noise.
4. Used a dual D/A configuration with control logic tied to chip selects.
5. Each chip data sheet calls for different de-coupling capacitors, which will be utilized during PCB design stage.
PCB DesignPCB Design
Receiver Schematic
PCB DesignPCB Design
• Used Microsim PC-Boards (P-SPICE)
• Encountered Node Limit (Shareware)
• Single sided • Decided to use Express PCB
– Included CAD software– Double sided– Quick turnaround
Technical Challenges Technical Challenges RemainingRemaining
• Final PCB Layout with size consideration
• Noise filtration during testing
• Calibration of acquisition devices
(i.e. strain gage)
Placement of Transmitter Placement of Transmitter PackagePackage
• Size limitations of PCB board (6”x2.5”)
• Proposed position of final installation of Transmitter PCB board.
Placement of Transmitter Placement of Transmitter PackagePackage
• Packaging can be up to 2.5 inches tall
• Package will be secured to rotor tightly to prevent our hard work from slinging away
TimelineTimeline
January February March April MayPrototype
DAQ Software
Testing/ Tweaking
PCB Fabrication
Final Documen-tation
Preliminary Design Review
Final Design Review
Preliminary Hardware Review
Future ImprovementsFuture Improvements
Implement remote transmitting on/off switch
Battery reduction circuitry
Graphical User Interface (GUI)
Automated helicopter control system
Eliminate D/A conversion, allow Computer to do any needed operations to data
Helicopter Data Acquisition SystemHelicopter Data Acquisition System
ECE 4522 Senior Design IIECE 4522 Senior Design II
The End