Product Sell Sheet

HeatSORB® Thermal Management Material

Efficient thermal management enables better performance of a device, a longer lifetime of that device, and more safety and comfort for the device user.

As users demand better performance from their devices, new thermal solutions are needed to ensure acceptable chip and smartphone skin temperatures. With the increasingly compact design of devices, the high-performing components within those devices, and the adoption of non-metal housing materials this is especially challenging.

Additional functionality is also in demand:• Wireless charging• Rapid charging• Advanced camera capabilities• High-speed/high-resolution streaming• Augmented Reality (AR)

HeatSORB® patent-pending phase change material goes above and beyond traditional heat dissipation methods, such as those based on heat spreaders, by providing benefits in applications where high heat of fusion and long-term reliable thermal management are concerns.

Excessive Heat

Safety

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HeatSORB thermal management material:• Helps to lower CPU temperature during

short-term activity• Delays temperature increase• Protects sensitive components from

elevated temperatures• Improves the user experience, ensuring no discomfort

from heat emanating from the device• Provides long-term reliability

Product Sell Sheet

HeatSORB® Thermal Management Material

The information contained in this Sell Sheet is intended to assist you in designing with Rogers’ Elastomeric Material Solutions. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or fitness for a particular

purpose or that the results shown in this Sell Sheet will be achieved by a user for a particular purpose. The user should determine the suitability of Rogers’ products for each application. The Rogers logo and HeatSORB are trademarks of Rogers Corporation or one of its

subsidiaries. © 2019, 2020 Rogers Corporation. All rights reserved. 0420-PDF • Publication #17-378

Test Condition:

• Power Output- 5W- 50.8mm x 50.8mm

• HeatSORB Sample Dimensions- 75mm x 125mm

• Aluminum Plate Dimensions- 75mm x 125mm x 0.3mm

Generally, the lifespan of semiconductor devices is halved for every ten degrees of increase in junction temperature.

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Thermal Camera

Rogers HeatSORB®

Metal Substrate

Omegalux HeatersFiberglass Insulation

Phase change materials help protect against the exposure of sensitive components to elevated temperatures.