Upload
vuongnguyet
View
213
Download
0
Embed Size (px)
Citation preview
Components Packaging and Manufacturing Technology (CPMT) Malaysia Chapter
Newsletter H1-2016
1
Greeting from Chapter Chair:
Greetings to all CPMT M’sia members!
With the new era of “Things”, we are embarking this year into a very exciting
time for the semiconductor industry, specifically in the packaging sector. For all
of us in the semiconductor industry, it has been another extremely busy year,
given the rapid recovery of the global economy.
As mentioned, the intense growth in the new trend of “Internet of Things” (IoT)
presents a formidable challenge and definitely a remarkable opportunity for
components and packaging technologists. Hence, the M’sia Chapter is planning
to organize our flagship conference based on the theme - “Packaging the IoT”.
Wong Shaw Fong
IEEE CPMT M’sia
Chair 2016
Intel Technology
This major undertaking of combining 2 technical conferences has been keeping the core team busy. The IEMT-
EMAP2016 (the 37th International Electronics Manufacturing Technology Conference and 18th Electronic
Materials and Packaging Conference) will be held at G-Hotel, Penang, in September 2016. We are very pleased
to be able to offer a similar standard of reception for the joint conference per previous IEMT events despite
pressing financial times. Moreover, despite challenging global economics, the overseas participants from
China, Germany, Japan, Korea, Maldives, Philippines, Singapore, Taiwan and the United States of America,
formed ~35% of the total abstract submissions. We also have some exciting programs prepared, consisting of
established trainers or renowned speakers for short courses and keynote deliveries. Furthermore, the
organizing team has extended our invitation to some distinguished speakers to provide 16 invited papers as
well as a few specially arranged and dedicated sessions to fully engage our local and international technologists
in this year’s major event. You can refer to the official website of the IEMT2016 for more details.
This year, the team has discussed about some vibrant activities to be hosted and engaged into by the M’sia
Chapter. There are many reach-out opportunities that we plan to partner with our regional CPMT chapters to
exchange knowledge and ideas. We will deliver some keynote speeches and technical invited papers to
various regional conferences. We have embarked on cooperative efforts with Collaborative Research in
Engineering, Science and Technology (CREST) in order to develop some potential electronic packaging related
project clusters. Kindly contact any one of the year 2016 Exco if you are interested to participate. Last but not
least, it will be a very great honor for all the dedicated members here to work together to build a passionate
chapter, within R10 and, to a larger extent, with our HQ CPMT at Santa Clara. I strongly believe we can
maintain the good linkage with our long-time established friends aside from the technical knowledge
exchanges. We are planning to reward our long time loyal members with some membership recognition
program - please stay tuned for future announcements of the details.
I wish you all a fantastic year in 2016 and hope to see your strong participation in all our exciting
activities!
Components Packaging and Manufacturing Technology (CPMT) Malaysia Chapter
Newsletter H1-2016
2
Minutes of Chapter AGM 2016 (Compiled by CHEW Guat Li)
A. Chapter AGM (annual general meeting) – 30th January, 2016 at Pullman Hotel, Bangsar
B. List of Office Bearers for 2016
No Name Post Affiliations Responsibilities
1 Wong Shaw Fong Chair Intel Technology Chapter Chair
2 Chew Chee Hiong Vice Chair On Semiconductor Chapter Vice-Chair (industry)
3 Prof Cheong Kuan Yew Vice Chair USM Chapter Vice-Chair (academia)
4 Dr. Hin Tze Yang Secretary Lumileds Chapter Secretary
5 Azhar Aripin Treasurer ON Semiconductor Chapter Finance Planner
6 Zain Ashraf Abdul Malek Exco Sony Webmaster & Social Media
7 Banu Poobalan Exco UniMAP Webmaster & Social Media
8 Chew Guat Li Exco Lumileds Newsletter & Technews
9 Lily Khor Exco Carsem Industry Liaison
10 Prof Mohd Nasir Tamin Exco UTM Academia Liaison
11 Lim Wee Teck Exco ON Semiconductor Auditor
12 Dr. Wong Yew Hong Exco UM Membership Development
13 Dr. Chee Choong Kooi Exco Alcatel Industry-Academic alignment
Figure 1: CPMT 2016 EXCO group photo was taken after the AGM at Pullman Bangsar.
CPMT was one of the few chapters recognized for being most active in 2015, under the leadership of Dr.
Siow Kim Shyong and was awarded an “angpau” as a token of recognition on the same night of the AGM
where a sumptuous dinner was held in Pullman Hotel. This was awarded by Dr. Zuhaina Zakaria the Chair of
IEEE Malaysia Section. Chew Guat Li received the token of recognition on behalf of IEEE Malaysia CPMT as
she was the only CPMT member attending the dinner.
Components Packaging and Manufacturing Technology (CPMT) Malaysia Chapter
Newsletter H1-2016
3
Figure 2: Collecting the “Angpau” award on behalf of CPMT at IEEE AGM Dinner.
Planned Chapter Activities in 2016 (Compiled by WONG Shaw Fong)
Figure 3: CPMT Malaysia Plan 2016 Focus Areas presented during the AGM
Opportunities for Engagement:
A. Promote local CPMT members for more paper publications to CPMT recognized conferences.
B. Engage CPMT exco for potential involvement in these conferences for chapter networking development
C. Appoint CPMT members for strategic involvement in CPMT recognized conferences as invited speakers
or keynote sharers
Additional focus for 2016:
A. Continuous improvement: Benchmark with CPMT HQ/R10 (Chapter development) and IEEE Malaysia
(members rewards and development)
B. More member linkage and interaction – from both industry and academic fields.
Components Packaging and Manufacturing Technology (CPMT) Malaysia Chapter
Newsletter H1-2016
4
37th IEMT – 18th EMAP 2016: Packaging the Internet of Things
An international event organized by the IEEE CPMT Malaysia Chapter with co-
sponsorship from CPMT society of IEEE, Santa Clara Valley Chapter. It is a major
forum, providing opportunities to network and meet leading experts, in addition to
exchange of up-to-date knowledge in the field. Since 1990’s, IEMT has gained a
reputation as a premier electronic materials and manufacturing technology
conference and well attended by experts all over the world.
This year IEMT-EMAP2016 will be held at G-Hotel, Penang. Some exciting programs which consist of established
trainers or speakers for short courses and keynote delivery. The organizing team has also extended the invitation
to some distinguished speakers to have 16 invited papers as well as a few special arranged and dedicated
sessions for good engagement of our local and international technologists in this year event. You can refer to
the official website of the IEMT2016 for more details. Grab this great opportunity to participate!!!
http://ewh.ieee.org/r10/malaysia/cpmt/Home/iemt/2016/iemt2016.html
Components Packaging and Manufacturing Technology (CPMT) Malaysia Chapter
Newsletter H1-2016
5
CPMT-CREST Collaboration Discussion (Compiled by WONG Shaw Fong)
CPMT members participated in the CREST Industry-Academia Forum (IAF) on 7th April held in Penang. Mr Shaw
Fong Wong and Dr Tze Yang Hin were invited to facilitate the “SEMICONDUCTOR Packaging” cluster. A pre-
meeting survey was conducted to define the technology gaps required by the industry members and research
interest of fellow researchers in academia. This led to a mutual interest of enabling 3D Packaging in both
semiconductor and LED industries. Multiple building blocks were discussed in packaging architecture, materials,
processing, reliability and test. The cluster looks forward to have sustainable research pipeline which will provide
relevant technical solution to the industry.
Figure 4: CREST Industrial Academia Forum April 2016
Benchmarking trip and Invited speaker at IMPACT 2015 Taiwan (Compiled by CHEW Chee Hiong)
Chew Chee Hiong from CPMT M’sia was invited as speaker @ IMPACT 2015 Taiwan to share on “Micro
Packaging: When will we stop shrinking?” Good benchmarking on the impressive IMPACT conference for CPMT
Malaysia. Received warm hospitality and had good Interactions with Taiwan IMPACT/CPMT committee. IMPACT
conference was organized by ITRI, IMAPS, CPMT and TPCA on a rotational basis. IMPACT 2015 included ICFPE
(International Conference of Flexible and Printed Electronics). There were a total of 800 registrations and 80
invited papers.
Figure 5: IMPACT Event at Taipei
Components Packaging and Manufacturing Technology (CPMT) Malaysia Chapter
Newsletter H1-2016
6
10th IEEE 2015 Regional Symposium on Micro and Nano Electronics (Compiled by Dr. HIN Tze Yang)
Dr Hin Tze Yang was invited to give a keynote as industry representative in 10th IEEE 2015 Regional Symposium
on Micro and Nano Electronics. The conference was held in Kuala Terengganu from 19 – 21 August 2015. TY
shared the market trend in driving towards 400G Ethernet standard and limitation of electrical signal in FPGA
industry. He proposed an optical interconnection and packaging solution for >50G to enable high data rates
application.
Project Management Industry Evaluation at USM Chemical Engineering (Compiled by WONG Shaw Fong)
SF Wong, CPMT M’sia representative, was invited to participate in the CREST Industrial Event held on 20th Nov.
2015, jointly organized by CREST for “Project Management Industry Evaluation” at the School of Chemical
Engineering, USM as Industry Panel Judge. Two main topics were available for the final year students, from a
total of 16 teams to complete their project research, which included: “Renewable polymer for industry
application (electronics, food packaging)” and “In-molding polymerization for semiconductor packaging”. Each
team was given 10 minutes to present their project with judging criterions comprised of: design, innovation,
project value and also finally the oral presentations by respective groups. The sharing by the students were
exceptional and met the design objectives with some excellent idea sharing covering the impact to our electronic
industry and local community needs.
Figure 6: SF Fong sharing a memory moment with the winning team at USM
Leadership Camp and Chapter Chair Meeting (Compiled by Dr. WONG Yew Hong)
IEEE Components, Packaging and Manufacturing Technology (CPMT) participated in Leadership Camp and
Chapter Chair Meeting organized by IEEE Malaysia Section. This event was held on 12 March 2016 (Saturday) at
Grand Bluewave Hotel, Shah Alam. During the morning session, briefing was given to all chapters. There are
several key points pertaining to CPMT that were captured:
1. Reporting of Activity:
• CPMT is able to report its activity via on-line system (IEEE MGA vTools).
2. Rebate and Bonus:
• Each year, it is a must for each Chapter to hold two technical activities in order to rebate USD 200
from HQ.
• For CPMT, we get our rebate annually from Malaysia Section.
• If CPMT can organize 6 or more activities, an additional USD 75 will be given as bonus.
3. Nature of Activity:
Components Packaging and Manufacturing Technology (CPMT) Malaysia Chapter
Newsletter H1-2016
7
• Administrative meeting, technical activity (conference, workshop, talk, visit, etc), non-technical
(social event) are considered IEEE activity and must be reported to IEEE.
Chapter Chair Meeting was conducted in the afternoon session. Our CPMT chapter has successfully presented:
(1) List of ExComm Members, (2) Planned Activities, and (3) Budget for the Year 2016. During the meeting, it was
suggested that for future international conference, we may engage Malaysia Convention & Exhibition Bureau
(MyCEB) for financial and/or non-financial supports (website: www.myceb.com.my). Section also encouraged
CPMT to send Final Year Project (FYP) students to participate in Best FYP Research Award. This is to encourage
or motivate FYP students in research. Section also suggested that CPMT to organize dinner for networking or
social purpose.
Figure 7: Leadership Camp and Chapter Chair gathering and discussion
Up Coming CPMT Conferences & Meetings:
Networking and constant knowledge advancement opportunities are vital in any conference. CPMT chapters
have lined up an outstanding program with top tier speakers and timely topics for 2016. Below is a sampling.
Mark the dates!
CPMT CONFERENCES IN 2016:
2016 China Semiconductor Technology International Conference (CSTIC)
Shanghai, China Mar 13, 2016 – Mar 14, 2016
2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
San Jose, CA USA Mar 14, 2016 – Mar 17, 2016
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in
Microelectronics and Microsystems (EuroSimE)
Montpellier, France Apr 17, 2016 – Apr 20, 2016
2016 IEEE 20th Workshop on Signal and Power Integrity (SPI)
Turin, Italy May 8, 2016 – May 11, 2016
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Saratoga Springs, NY USA May 16, 2016 – May 19, 2016
Components Packaging and Manufacturing Technology (CPMT) Malaysia Chapter
Newsletter H1-2016
8
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
Las Vegas, NV USA May 31, 2016 – Jun 3, 2016
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
(ITherm)
Las Vegas, NV USA May 31, 2016 – Jun 3, 2016
2016 17th International Conference on Electronic Packaging Technology (ICEPT)
Wuhan, China Aug 16, 2016 – Aug 19, 2016
2016 Electronics Goes Green 2016+ (EGG)
Berlin, Germany Sep 7, 2016 – Sep 9, 2016
2016 6th Electronic System-Integration Technology Conference (ESTC)
Grenoble, France Sep 13, 2016 – Sep 16, 2016
2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and
Packaging (EMAP) Conference
Georgetown, Penang, Malaysia Sep 20, 2016 – Sep 22, 2016
2016 IEEE 62nd IEEE Holm Conference on Electrical Contacts (Holm)
Tampa, FL USA Oct 9, 2016 – Oct 12, 2016
2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Tampa, FL USA Oct 23, 2016 – Oct 26, 2016
2016 IEEE CPMT Symposium Japan (ICSJ)
Kyoto, Japan Nov 7, 2016 – Nov 9, 2016
2016 IEEE International 3D Systems Integration Conference (3DIC)
San Francisco, CA USA Nov 8, 2016 – Nov 11, 2016
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
HI, USA Dec 14, 2016 – Dec 16, 2016
Some Important References:
• Official IEEE website: http://www.ieee.org
• Official IEEE/CPMT website (HQ): http://cpmt.ieee.org
• Official IEEE/CPMT website (M’sia Chapter): http://ewh.ieee.org/r10/malaysia/cpmt/
• Official IEMT-EMAP2016: http://ewh.ieee.org/r10/malaysia/cpmt/Home/iemt/2016/iemt2016.html