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Components Packaging and Manufacturing Technology (CPMT) Malaysia Chapter Newsletter H1-2016 1 Greeting from Chapter Chair: Greetings to all CPMT M’sia members! With the new era of “Things”, we are embarking this year into a very exciting time for the semiconductor industry, specifically in the packaging sector. For all of us in the semiconductor industry, it has been another extremely busy year, given the rapid recovery of the global economy. As mentioned, the intense growth in the new trend of “Internet of Things” (IoT) presents a formidable challenge and definitely a remarkable opportunity for components and packaging technologists. Hence, the M’sia Chapter is planning to organize our flagship conference based on the theme - “Packaging the IoT”. Wong Shaw Fong IEEE CPMT M’sia Chair 2016 Intel Technology This major undertaking of combining 2 technical conferences has been keeping the core team busy. The IEMT- EMAP2016 (the 37 th International Electronics Manufacturing Technology Conference and 18 th Electronic Materials and Packaging Conference) will be held at G-Hotel, Penang, in September 2016. We are very pleased to be able to offer a similar standard of reception for the joint conference per previous IEMT events despite pressing financial times. Moreover, despite challenging global economics, the overseas participants from China, Germany, Japan, Korea, Maldives, Philippines, Singapore, Taiwan and the United States of America, formed ~35% of the total abstract submissions. We also have some exciting programs prepared, consisting of established trainers or renowned speakers for short courses and keynote deliveries. Furthermore, the organizing team has extended our invitation to some distinguished speakers to provide 16 invited papers as well as a few specially arranged and dedicated sessions to fully engage our local and international technologists in this year’s major event. You can refer to the official website of the IEMT2016 for more details. This year, the team has discussed about some vibrant activities to be hosted and engaged into by the M’sia Chapter. There are many reach-out opportunities that we plan to partner with our regional CPMT chapters to exchange knowledge and ideas. We will deliver some keynote speeches and technical invited papers to various regional conferences. We have embarked on cooperative efforts with Collaborative Research in Engineering, Science and Technology (CREST) in order to develop some potential electronic packaging related project clusters. Kindly contact any one of the year 2016 Exco if you are interested to participate. Last but not least, it will be a very great honor for all the dedicated members here to work together to build a passionate chapter, within R10 and, to a larger extent, with our HQ CPMT at Santa Clara. I strongly believe we can maintain the good linkage with our long-time established friends aside from the technical knowledge exchanges. We are planning to reward our long time loyal members with some membership recognition program - please stay tuned for future announcements of the details. I wish you all a fantastic year in 2016 and hope to see your strong participation in all our exciting activities!

Greeting from Chapter Chair - ieee-epsmalaysia.org · Greetings to all CPMT M’sia members! ... Figure 6: SF Fong sharing a memory moment with the winning team at USM Leadership

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Components Packaging and Manufacturing Technology (CPMT) Malaysia Chapter

Newsletter H1-2016

1

Greeting from Chapter Chair:

Greetings to all CPMT M’sia members!

With the new era of “Things”, we are embarking this year into a very exciting

time for the semiconductor industry, specifically in the packaging sector. For all

of us in the semiconductor industry, it has been another extremely busy year,

given the rapid recovery of the global economy.

As mentioned, the intense growth in the new trend of “Internet of Things” (IoT)

presents a formidable challenge and definitely a remarkable opportunity for

components and packaging technologists. Hence, the M’sia Chapter is planning

to organize our flagship conference based on the theme - “Packaging the IoT”.

Wong Shaw Fong

IEEE CPMT M’sia

Chair 2016

Intel Technology

This major undertaking of combining 2 technical conferences has been keeping the core team busy. The IEMT-

EMAP2016 (the 37th International Electronics Manufacturing Technology Conference and 18th Electronic

Materials and Packaging Conference) will be held at G-Hotel, Penang, in September 2016. We are very pleased

to be able to offer a similar standard of reception for the joint conference per previous IEMT events despite

pressing financial times. Moreover, despite challenging global economics, the overseas participants from

China, Germany, Japan, Korea, Maldives, Philippines, Singapore, Taiwan and the United States of America,

formed ~35% of the total abstract submissions. We also have some exciting programs prepared, consisting of

established trainers or renowned speakers for short courses and keynote deliveries. Furthermore, the

organizing team has extended our invitation to some distinguished speakers to provide 16 invited papers as

well as a few specially arranged and dedicated sessions to fully engage our local and international technologists

in this year’s major event. You can refer to the official website of the IEMT2016 for more details.

This year, the team has discussed about some vibrant activities to be hosted and engaged into by the M’sia

Chapter. There are many reach-out opportunities that we plan to partner with our regional CPMT chapters to

exchange knowledge and ideas. We will deliver some keynote speeches and technical invited papers to

various regional conferences. We have embarked on cooperative efforts with Collaborative Research in

Engineering, Science and Technology (CREST) in order to develop some potential electronic packaging related

project clusters. Kindly contact any one of the year 2016 Exco if you are interested to participate. Last but not

least, it will be a very great honor for all the dedicated members here to work together to build a passionate

chapter, within R10 and, to a larger extent, with our HQ CPMT at Santa Clara. I strongly believe we can

maintain the good linkage with our long-time established friends aside from the technical knowledge

exchanges. We are planning to reward our long time loyal members with some membership recognition

program - please stay tuned for future announcements of the details.

I wish you all a fantastic year in 2016 and hope to see your strong participation in all our exciting

activities!

Components Packaging and Manufacturing Technology (CPMT) Malaysia Chapter

Newsletter H1-2016

2

Minutes of Chapter AGM 2016 (Compiled by CHEW Guat Li)

A. Chapter AGM (annual general meeting) – 30th January, 2016 at Pullman Hotel, Bangsar

B. List of Office Bearers for 2016

No Name Post Affiliations Responsibilities

1 Wong Shaw Fong Chair Intel Technology Chapter Chair

2 Chew Chee Hiong Vice Chair On Semiconductor Chapter Vice-Chair (industry)

3 Prof Cheong Kuan Yew Vice Chair USM Chapter Vice-Chair (academia)

4 Dr. Hin Tze Yang Secretary Lumileds Chapter Secretary

5 Azhar Aripin Treasurer ON Semiconductor Chapter Finance Planner

6 Zain Ashraf Abdul Malek Exco Sony Webmaster & Social Media

7 Banu Poobalan Exco UniMAP Webmaster & Social Media

8 Chew Guat Li Exco Lumileds Newsletter & Technews

9 Lily Khor Exco Carsem Industry Liaison

10 Prof Mohd Nasir Tamin Exco UTM Academia Liaison

11 Lim Wee Teck Exco ON Semiconductor Auditor

12 Dr. Wong Yew Hong Exco UM Membership Development

13 Dr. Chee Choong Kooi Exco Alcatel Industry-Academic alignment

Figure 1: CPMT 2016 EXCO group photo was taken after the AGM at Pullman Bangsar.

CPMT was one of the few chapters recognized for being most active in 2015, under the leadership of Dr.

Siow Kim Shyong and was awarded an “angpau” as a token of recognition on the same night of the AGM

where a sumptuous dinner was held in Pullman Hotel. This was awarded by Dr. Zuhaina Zakaria the Chair of

IEEE Malaysia Section. Chew Guat Li received the token of recognition on behalf of IEEE Malaysia CPMT as

she was the only CPMT member attending the dinner.

Components Packaging and Manufacturing Technology (CPMT) Malaysia Chapter

Newsletter H1-2016

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Figure 2: Collecting the “Angpau” award on behalf of CPMT at IEEE AGM Dinner.

Planned Chapter Activities in 2016 (Compiled by WONG Shaw Fong)

Figure 3: CPMT Malaysia Plan 2016 Focus Areas presented during the AGM

Opportunities for Engagement:

A. Promote local CPMT members for more paper publications to CPMT recognized conferences.

B. Engage CPMT exco for potential involvement in these conferences for chapter networking development

C. Appoint CPMT members for strategic involvement in CPMT recognized conferences as invited speakers

or keynote sharers

Additional focus for 2016:

A. Continuous improvement: Benchmark with CPMT HQ/R10 (Chapter development) and IEEE Malaysia

(members rewards and development)

B. More member linkage and interaction – from both industry and academic fields.

Components Packaging and Manufacturing Technology (CPMT) Malaysia Chapter

Newsletter H1-2016

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37th IEMT – 18th EMAP 2016: Packaging the Internet of Things

An international event organized by the IEEE CPMT Malaysia Chapter with co-

sponsorship from CPMT society of IEEE, Santa Clara Valley Chapter. It is a major

forum, providing opportunities to network and meet leading experts, in addition to

exchange of up-to-date knowledge in the field. Since 1990’s, IEMT has gained a

reputation as a premier electronic materials and manufacturing technology

conference and well attended by experts all over the world.

This year IEMT-EMAP2016 will be held at G-Hotel, Penang. Some exciting programs which consist of established

trainers or speakers for short courses and keynote delivery. The organizing team has also extended the invitation

to some distinguished speakers to have 16 invited papers as well as a few special arranged and dedicated

sessions for good engagement of our local and international technologists in this year event. You can refer to

the official website of the IEMT2016 for more details. Grab this great opportunity to participate!!!

http://ewh.ieee.org/r10/malaysia/cpmt/Home/iemt/2016/iemt2016.html

Components Packaging and Manufacturing Technology (CPMT) Malaysia Chapter

Newsletter H1-2016

5

CPMT-CREST Collaboration Discussion (Compiled by WONG Shaw Fong)

CPMT members participated in the CREST Industry-Academia Forum (IAF) on 7th April held in Penang. Mr Shaw

Fong Wong and Dr Tze Yang Hin were invited to facilitate the “SEMICONDUCTOR Packaging” cluster. A pre-

meeting survey was conducted to define the technology gaps required by the industry members and research

interest of fellow researchers in academia. This led to a mutual interest of enabling 3D Packaging in both

semiconductor and LED industries. Multiple building blocks were discussed in packaging architecture, materials,

processing, reliability and test. The cluster looks forward to have sustainable research pipeline which will provide

relevant technical solution to the industry.

Figure 4: CREST Industrial Academia Forum April 2016

Benchmarking trip and Invited speaker at IMPACT 2015 Taiwan (Compiled by CHEW Chee Hiong)

Chew Chee Hiong from CPMT M’sia was invited as speaker @ IMPACT 2015 Taiwan to share on “Micro

Packaging: When will we stop shrinking?” Good benchmarking on the impressive IMPACT conference for CPMT

Malaysia. Received warm hospitality and had good Interactions with Taiwan IMPACT/CPMT committee. IMPACT

conference was organized by ITRI, IMAPS, CPMT and TPCA on a rotational basis. IMPACT 2015 included ICFPE

(International Conference of Flexible and Printed Electronics). There were a total of 800 registrations and 80

invited papers.

Figure 5: IMPACT Event at Taipei

Components Packaging and Manufacturing Technology (CPMT) Malaysia Chapter

Newsletter H1-2016

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10th IEEE 2015 Regional Symposium on Micro and Nano Electronics (Compiled by Dr. HIN Tze Yang)

Dr Hin Tze Yang was invited to give a keynote as industry representative in 10th IEEE 2015 Regional Symposium

on Micro and Nano Electronics. The conference was held in Kuala Terengganu from 19 – 21 August 2015. TY

shared the market trend in driving towards 400G Ethernet standard and limitation of electrical signal in FPGA

industry. He proposed an optical interconnection and packaging solution for >50G to enable high data rates

application.

Project Management Industry Evaluation at USM Chemical Engineering (Compiled by WONG Shaw Fong)

SF Wong, CPMT M’sia representative, was invited to participate in the CREST Industrial Event held on 20th Nov.

2015, jointly organized by CREST for “Project Management Industry Evaluation” at the School of Chemical

Engineering, USM as Industry Panel Judge. Two main topics were available for the final year students, from a

total of 16 teams to complete their project research, which included: “Renewable polymer for industry

application (electronics, food packaging)” and “In-molding polymerization for semiconductor packaging”. Each

team was given 10 minutes to present their project with judging criterions comprised of: design, innovation,

project value and also finally the oral presentations by respective groups. The sharing by the students were

exceptional and met the design objectives with some excellent idea sharing covering the impact to our electronic

industry and local community needs.

Figure 6: SF Fong sharing a memory moment with the winning team at USM

Leadership Camp and Chapter Chair Meeting (Compiled by Dr. WONG Yew Hong)

IEEE Components, Packaging and Manufacturing Technology (CPMT) participated in Leadership Camp and

Chapter Chair Meeting organized by IEEE Malaysia Section. This event was held on 12 March 2016 (Saturday) at

Grand Bluewave Hotel, Shah Alam. During the morning session, briefing was given to all chapters. There are

several key points pertaining to CPMT that were captured:

1. Reporting of Activity:

• CPMT is able to report its activity via on-line system (IEEE MGA vTools).

2. Rebate and Bonus:

• Each year, it is a must for each Chapter to hold two technical activities in order to rebate USD 200

from HQ.

• For CPMT, we get our rebate annually from Malaysia Section.

• If CPMT can organize 6 or more activities, an additional USD 75 will be given as bonus.

3. Nature of Activity:

Components Packaging and Manufacturing Technology (CPMT) Malaysia Chapter

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• Administrative meeting, technical activity (conference, workshop, talk, visit, etc), non-technical

(social event) are considered IEEE activity and must be reported to IEEE.

Chapter Chair Meeting was conducted in the afternoon session. Our CPMT chapter has successfully presented:

(1) List of ExComm Members, (2) Planned Activities, and (3) Budget for the Year 2016. During the meeting, it was

suggested that for future international conference, we may engage Malaysia Convention & Exhibition Bureau

(MyCEB) for financial and/or non-financial supports (website: www.myceb.com.my). Section also encouraged

CPMT to send Final Year Project (FYP) students to participate in Best FYP Research Award. This is to encourage

or motivate FYP students in research. Section also suggested that CPMT to organize dinner for networking or

social purpose.

Figure 7: Leadership Camp and Chapter Chair gathering and discussion

Up Coming CPMT Conferences & Meetings:

Networking and constant knowledge advancement opportunities are vital in any conference. CPMT chapters

have lined up an outstanding program with top tier speakers and timely topics for 2016. Below is a sampling.

Mark the dates!

CPMT CONFERENCES IN 2016:

2016 China Semiconductor Technology International Conference (CSTIC)

Shanghai, China Mar 13, 2016 – Mar 14, 2016

2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

San Jose, CA USA Mar 14, 2016 – Mar 17, 2016

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in

Microelectronics and Microsystems (EuroSimE)

Montpellier, France Apr 17, 2016 – Apr 20, 2016

2016 IEEE 20th Workshop on Signal and Power Integrity (SPI)

Turin, Italy May 8, 2016 – May 11, 2016

2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

Saratoga Springs, NY USA May 16, 2016 – May 19, 2016

Components Packaging and Manufacturing Technology (CPMT) Malaysia Chapter

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2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

Las Vegas, NV USA May 31, 2016 – Jun 3, 2016

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

(ITherm)

Las Vegas, NV USA May 31, 2016 – Jun 3, 2016

2016 17th International Conference on Electronic Packaging Technology (ICEPT)

Wuhan, China Aug 16, 2016 – Aug 19, 2016

2016 Electronics Goes Green 2016+ (EGG)

Berlin, Germany Sep 7, 2016 – Sep 9, 2016

2016 6th Electronic System-Integration Technology Conference (ESTC)

Grenoble, France Sep 13, 2016 – Sep 16, 2016

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and

Packaging (EMAP) Conference

Georgetown, Penang, Malaysia Sep 20, 2016 – Sep 22, 2016

2016 IEEE 62nd IEEE Holm Conference on Electrical Contacts (Holm)

Tampa, FL USA Oct 9, 2016 – Oct 12, 2016

2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Tampa, FL USA Oct 23, 2016 – Oct 26, 2016

2016 IEEE CPMT Symposium Japan (ICSJ)

Kyoto, Japan Nov 7, 2016 – Nov 9, 2016

2016 IEEE International 3D Systems Integration Conference (3DIC)

San Francisco, CA USA Nov 8, 2016 – Nov 11, 2016

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

HI, USA Dec 14, 2016 – Dec 16, 2016

Some Important References:

• Official IEEE website: http://www.ieee.org

• Official IEEE/CPMT website (HQ): http://cpmt.ieee.org

• Official IEEE/CPMT website (M’sia Chapter): http://ewh.ieee.org/r10/malaysia/cpmt/

• Official IEMT-EMAP2016: http://ewh.ieee.org/r10/malaysia/cpmt/Home/iemt/2016/iemt2016.html

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Components Packaging and Manufacturing Technology (CPMT) Malaysia Chapter

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