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Greatest challenges of the 21st Century:
To create computing capability that can operate with THz speed with Terabits/cm2 information storage, and to apply this technology in biotechnology, business, and education
•Speed drives technology
•Technology drives society
“Terascale electronics---endless quest for IC speed”
Toh-Ming Lu
[email protected]; www.rpi.edu/~lut
Director
Center for Advanced Interconnect Science and Technology
(RPI, SUNY-Albany, MIT, UT-Austin, N. Texas, Texas Tech., Cornell, UC Berkeley, Columbia, Georgia Tech, Rochester, U. of Maryland)
Outline•End of scaling
•Systems technologies: on-chip/off-chip interconnect
•Nanoelectronics
Information age?
Execution, storage, and transmission of massive information
What technology drives the information age?
Hardware in Computer:
Chips, hard drives, display…….
-----Microelectronics technology
Technology for Information age--------Microelectronics
Electronics industry: driving force of the information age.
largest manufacturing industry in the United States and in the developed world
Over ~14% per year growth in the last 30 years --- continue to grow in the next few decades
Will need a continuing supply of BS, MS, and Ph.D
Who are chip makers?
•Intel, IBM, Motorola, AMD, DEC, LSI Logic, National Semiconductor, Lucent, TI, HP…..
•DELL, Compaq, Gateway…don’t make chips!
History
Invention of solid state electronics (40’s)--------The transistors
Then ICThen Mainframe (60’s)----execution and
storageThen PC (70’s)----execution and storageThen PC plus internet plus WWW-----execution, storage, and transmission
Why so exciting?
• Intellectually stimulating
• Impact: changes the society in major way– Business: creates enormous wealth – Education: fundamentally change the way
we learn– Medicine: will change the way we treat
diseases
“Turmoil and opportunities at the dawn of the 21st Century---the road of an academic department in higher education”
(Toh-Ming Lu, amazon.com, 2000)
Computer logic---a series of on and off operation (clicks)
Imaging a super fast telegraph!(1GHz: 1000 million clicks per second; 1THz = 1000GHz)
“Fast” means: more clicks per second
The narrower the “click” the faster you get
The shorter the device the narrower the click
time
Key questions in the industry
Technical:
---Is there an end to increase IC speed?
Business:
---Is there a market for super fast ICs?
Interconnect (RC) delay
Through wires
To avoid overlapping
Reduce the number of “clicks” per second ---separate the “clicks” apart
Therefore reduce the speed
time time
“Terascale electronics---endless quest for IC speed”
Toh-Ming Lu
[email protected]; www.rpi.edu/~lut
Director
Center for Advanced Interconnect Science and Technology
(RPI, SUNY-Albany, MIT, UT-Austin, N. Texas, Texas Tech., Cornell, UC Berkeley, Columbia, Georgia Tech, Rochester, U. of Maryland)
Outline•End of scaling
•Systems technologies: on-chip/off-chip interconnect
•Nanoelectronics
----Shorter wires, higher density, more functionalility
—Beyond RoadmapBeyond Roadmap
Mitsubishi Electronics America: ADVANCED PACKAGING June/July 2000 issue.
High bandwidth:to optoelectronics
systems (THz)
Heat extractors
I/O, passives, power
Logic layers
A/D, sensors, IP cores
memory
?
PC, communications,internect…
3D heterogeneous systems: bonding, alignment, via etching/filling
GaAs/Si?--killer tech
Opportunities for more Si mainstream technologies:
---Decades beyond the Roadmap
Stacked chip assemblies (logic, memories, interposer for passives);
Heterogeneous systems for sensors and MEMS;
Hard IP core-based SOC designs (including mixed signal);
High speed processors;
LAN architectures (for wireless applications and/or for multiplexed interconnects).
Gutmann et al (2001)
Pictorial Representation of 3D Integration Conceptusing Wafer Bonding,
* Figure adapted from IBM Corporation and used with permission.
Via Plug
Second Level(Thinned Substrate)
First Level
Third Level(Thinned Substrate)
Via Bridge
Bond
DeviceSurface
DeviceSurface
Bond(Face-to-face)
(Face-to-back)
DeviceSurface
Substrate
Substrate
Substrate
J. Lu et al
•Processing issues: bonding-alignmentthrough wafer via etchingbarrier and metallization
•Reliability:thermo and mechanical stabilityelectromigrationheat extraction
Broad band interconnect technology---high speed data transfer
Replacing electrical connection by optics:•Modulators/switches: electro-optic, optic-optic•Optical waveguides•Data compression (software)
Modulators guide
Chip stack
switches
fiber
Or: wireless!
light
from THz source: A
modulating signal: B
read out: C
Mach-Zehnder Ring
B C
0101
0011
0001
A
AB
Cheterostructurelayer
substrate
d
R. Kersting, G. Stasser, and K. Unterrainer, Terahertz phase modulator, Electr. Lett., 36, 1156 (2000)
Electro-optic modulator
Electrical signal
Nonlinear EO
Modulated light
light
Optical switches: •MEMS---mirror switches: D. Bishop et al, Physics Today Oct 2001 (Lucent)•Nanotube switches: Zao et al (2001)---THz speed•Quantum dots switches: Dutta et al (2001)---THz speed
MEMS
Potentially viable optical interconnect schemes—Dr. Persans
waveguide
CMOS circuits and metallization
optoelectronic transceivers
• Bump-bond optoelectronic chip on top of complete CMOS package
• Grow optoelectronic components monolithically; local microphotonic waveguides grown and patterned; polymer waveguide layers for off-chip and longer distance
• Monolithic optoelectronic components; incorporate longer waveguides into metal interconnect package
• Use waveguides within sensor-chip or system-on-a-chip paradigm
waveguide
metal or multilayer dielectric mirror
via
cladding
receiver
Agarwal, Ponoth, Plawsky, Persans: Appl. Phys. Lett. 78, 2294 (2001)
Mainstream computer/communication technology:
•Strong industrial/State/Federal partner support•Enormous employment opportunities•Decades of growth---expected more growth in decades
End of device scaling does not imply end of Si technologies!
Emerging technologies
•Nano-scale electronics: very rich and unexplored science•Strong Government support•Long term benefits (not likely mainstream computing
in at least 20 years)
---The greatest and immediate impact may not be in electronics, but in biomedical applications
“Terascale electronics---endless quest for IC speed”
Toh-Ming Lu
[email protected]; www.rpi.edu/~lut
Director
Center for Advanced Interconnect Science and Technology
(RPI, SUNY-Albany, MIT, UT-Austin, N. Texas, Texas Tech., Cornell, UC Berkeley, Columbia, Georgia Tech, Rochester, U. of Maryland)
Outline•End of scaling
•Systems technologies: on-chip/off-chip interconnect
•Nanoelectronics
Interconnects via Terahertz
• ULSI chip divided in tiles • Communicate via plasma wave electronics receiver-transmitter pairs
Michael S. Shurhttp://nina.ecse.rpi.edu/shur/
Receiver-transmitter pairs
Source Drain
Gate2Delectronfluid
GateInsulator
Ug
Plasma wave
Deep sub-0.1
Oriented & interconnected nanotube networks—Ajayan et al
– Local modification and Junction formation
– Termination (cutting of structures)
Catalyst
Junctions
Focused Ions
Fantastic opportunities in applied and basic science research
Examples:
New materials synthesis: polymers; nitrides, carbidesNovel polymer-metal, polymer-cermic, polymer-polymer composites:Novel phase separation, crystallization, dynamic growth phenomenaNovel interfacial diffusion, reactions, and transformationsNovel nano-structure science; light emitting nano semiconductorsNovel non-linear thin film materials; high electro-optic coefficient materialsNovel opto-electronics materials, layered structuresQuantum effect on narrow linesMaterials response under extreme speed and frequencyReal time atomic scale microscopies
glas
s pl
ate
Nano-Si or nano-C layer
THz gratinghelps coupling
reference chip sample chip
THz Bio-Chip for Sensitive Detection
THz signature or fingerprint of genetic materials: DNA, RNA or Protein attach to nano-layer in sample chip, from 10 GHz to 10 THz frequency range. (Zhang, Kersting)
THz wave
On-Chip
Interconnect
3-Dimensional
Interconnect
3D Chips
Microsystems
•Non-Electronic Chips
•Scalable Systems
Yesterday
Today
Tomorrow“Norton” Facility
(IC Laboratory) 5”-8” 2µ CMOS
MCR(Wafer Processing
R&D) 8” State-of-the-Art Wafer Fab
Terascaleelectronics?Bio-devices?
•Welcome students doing PhD at Rensselaer
•Welcome visiting scholars and collaboration
Magnetic storage---towards terabits/in2
C. Ross, Annu. Rev. Mater. Res. 2001. 31:203-235.
Three strategies:
• exchange-decoupled grains (conventional)•In-plane patterned media•Perpendicular patterned media