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Rev. 0.4 8/11 Copyright © 2016 by Silicon Laboratories Si24xxVMB-EVB
Global Voice ISOmodem-EVB
Evaluation Board for the Si2494/39/38/37/36/35/29/19/18/17 ISOModem
Description
The Global Voice ISOmodem EVB evaluation boardprovides the system designer with an easy way ofevaluating the ISOmodem. The Voice ISOmodem EVBconsists of a motherboard with a complete removabledaughter cardThe Voice ISOmodem is a complete controller basedmodem chipset with an integrated and programmabledirect access arrangement (DAA) that meets the globaltelephone line requirements. It is available in a 24-pin or38-pin system side device and a 16-pin line side device.The hardware versions at the time of publication are:
Voice Mother Board Si24xxVMB Rev 2.0
Modem Daughter Card Si24xx2G-DC Rev 2.0
Modem Daughter Card Si24xx2G-QFN38-DC Rev 1.0
The voice daughter card is populated with the correctISOmodem system side chip (Si2494/39/38/37/36/35/29/19/18/17) and the correct line side DAA chip, theSi3018 to suit the voice applications.
The ISOmodem eliminates the need for a separate DSPdata pump, modem controller, memories, codec,isolation transformers, relays, opto-isolators and a 3-4wire hybrid. The ISOmodem is ideal for embeddedmodem and voice applications due to its small boardarea, controller based architecture, low powerconsumption and global compliance.
An onboard rectifier, filter, and voltage regulator allowthe power input to be 7.5–13 V ac or dc (either polarity)supplied through a screw terminal (J8) or a standard2 mm power jack (J9). Alternatively, power can besupplied through the USB interface (whether the USB orRS232 interface is used).
The Power Source Selection in automatic, while thesignaling port is selected by a jumper (JP23).
The evaluation board audio power amplifier can drivean external speaker for either call progress monitoringor speakerphone function. A small onboard speaker,suitable for call progress monitoring, is installed.
Please note that fax modem versions listed in the titlerequire a software driver in order to implement fax send/receive functionality. The driver must be compliant withthe Silicon Labs ISOmodem and with applicable ITU-Tstandards (e.g., T.30, T.31, T.4 and T.6) Contact SiliconLabs for details.
Features
This evaluation board includes the following:
Socketed module with the modem chipset
USB or asynch RS232 Serial Interface
RJ11 connection to the phone line
Onboard relay-excludable RJ11 connection
RS232 and USB interface to the PC
Direct access to the ISOmodem signals for embedded system evaluation
Power from a provided 8.5–13.5 V dc power supply or from the USB port
Handset connector (J1)
Onboard hookswitch
External hookswitch connector
Jumper matrix that allows any handset wiring scheme to work with this board
Onboard speakerphone microphone
RCA jack connector to an optional off-board speakerphone electret microphone
Selectable and adjustable electret power supplies for both handset and speakerphone microphones
Onboard 300 mW audio power amplifier (into a 4 load) for driving either onboard or external speaker.
Onboard voice coil driven loudspeaker for call monitoring
LED display of all RS232 signals
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
2 Rev. 0.4
Functional Block Diagram
As shown in Figure 1, the daughter card is a plug-in component with the complete modem, while the rest of themotherboard provides selectable serial RS232 or USB links, the sound subsystem, and power regulation anddistribution.
Figure 1. Functional Block Diagram
The voice ISOmodem EVB provides a sound system consisting of the Si3000 codec along with a handset RJ10connector as well as onboard microphone and loudspeaker with options for these devices to be placed off-board.
The bias voltages for both the onboard microphone and the handset microphone can modified and alternatesources used.
This allows the board to be used as a telephone or as a speakerphone as is, or to be integrated into the customer'ssystem.
The evaluation board can drive an external speaker or a small onboard speaker. For speaker-phone applications itis recommended that an off board loudspeaker be used.
An onboard rectifier, filter and voltage regulator allow the power input to be 8.5 to 13.5 V peak ac or dc of eitherpolarity supplied through screw terminals (J8) or a standard 2 mm power jack (J9). Alternatively the power can besupplied through the USB interface. Automatic switching is provided for the power, but not for the data interface.That data interface is selected by JP23.
Call Progress
Audio
Si3000PCM
USB/RS232 Connectors
J11/J10
I/O LED Display
SoundSubsystem
RJ 11 Telephone Connector
RJ 11 Telephone Connector
Exclusion Relay
On Board Hook Switch
Si2494/Si2438 Series
ISOmodem
Silicon Labs SI3018 DAA
ISOmodem Daughter
Card
Handset RJ10
Ext. Speaker
JP11
Interface Logic
EXT. Microphone
J2
Loudspeaker
Power Connectors
Regulation &
Switching
LED Status Display
Pwr Amp
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 3
1. Global Voice ISOmodem EVB
The evaluation board is shown in Figure 2. Note the socketed daughter card with the modem chipset on the bottomright of the board.
Figure 2. Global Voice ISOmodem Evaluation Board
The ISOmodem chip requires software driver in order to perform either FAX or sound functionality. Contact SiliconLabs for details. “AN244: Si2438/37/36/35/29/19/18/17 Fax Modem Designer’s Guide” and “AN93: Si2494/93/57/39/34/15/04 Data Modem Designer’s Guide” are useful for driver development.
The Global Voice ISOmodem EVB provides an RJ11 jack for interfacing to the phone line and the USB or serialports can interface to a PC or a host CPU. This allows the board to operate as a class 1 fax modem for anevaluation or as a global voice and data modem (depending on the specific ISOmodem used).
A handset, microphone and speaker can also be attached to demonstrate the sound features, which may includeTAM and speaker-phone operations, depending on the specific ISOmodem chip used. Table 1 lists whichISOmodem chips have these features. A software driver or application is required to perform these data and soundoperations. The included UltraCOM application can demonstrate the sound features of the ISOmodem andprovides a tool to aid development.
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
4 Rev. 0.4
2. Daughter Cards
There are two types of daughter cards available for this EVB. One supports the TSSOP version of the system sidechip, and the other supports the QFN38 version of the system side.
An example of the TSSOP version of the daughter card is shown in Figure 3. It has the ISOmodem system-sidechip as well as the Si3018 DAA chip. The left side of the board contains the system side while the right sidecontains the DAA chip along with the few interface parts needed to connect tot a telephone line.
Figure 3. Daughter Card
Although this card is provided as part of the global voice EVB, it can also be directly connected to an embeddedsystem using TTL logic.
When run by a software driver the chipset on this daughter card is capable of making fax calls, telephone calls witha handset, data calls and both. TAM and speaker-phone operations. Table 1 lists the various ISOmodem chips andtheir features.
Table 1. ISOModem Features
Part Number Fax Data Handset TAM Speaker Phone
Si2417 ≤V.17 — — —
Si2418 ≤V.17 —
Si2419 ≤V.17 ≤V.32bis — —
Si2429 ≤ V.29 —
Si2435 ≤V.34 — — —
Si2436 ≤V.34 —
Si2437 ≤V.34 ≤V.34 — —
Si2438 ≤V.34 ≤V.34
Si2439 — ≤V.34
Si2494 — ≤V.92
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 5
3. Setup and Evaluation
This section explains how to set up the Voice ISOmodem EVB for evaluation as an RS-232 or USB interface.Jumper settings and system interconnections are given, as well as the use of an demonstration and testapplication provided called UltraCOM.
See the following documents for additional technical details
Si2494/39/38/37/36/35/29/19/18/17 data sheets
“AN244: Fax Modem Designer's Guide"
“AN93: Data Modem Designer’s Guide”
Diagrams and tables are provided here that define the operation of all the jumpers, settings and connectors, aswell as their default states.
A typical global voice EVB as it arrives from the factory can be connected into a system by using only four cables.
Figure 4. Global Voice ISOmodem EVB Connection
The UltraCOM application provided on the included CD can be used to demonstrate:
Telephone Operation.
Speakerphone Operation
Telephone answering machine operation.
Fax Operation can be demonstrated but requires a fax driver application.
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
6 Rev. 0.4
3.1. JumpersFigure 5 shows the function and location of the jumpers present on the global fax EVB.
JP23
Sel
ects
USB
or
RS2
32
oper
atio
n bu
t If
no ju
mpe
r is i
n pl
ace
neith
er is
us
ed a
nd h
ost
mus
t con
nnec
tvi
a J
103
to
conn
ect
J10.
DB9
co
nnec
tion
to
Host
if J
P 23
se
lect
s it.
J11.
USB
co
nnec
tion
to H
ost
if JP
23
sele
cts i
t.
J2. O
ptio
nal
mic
. Inp
ut
conn
ecto
r
JP8.
On
boar
d m
ic. A
nd
jum
per t
o en
able
it.
JP1,
2, 3
, 4.
Jum
pers
that
co
nfig
ure
hand
set w
iring
to
any
styl
e. S
ee
sche
mat
ic fo
r de
tails
.
JP14
, On
Boar
d Sp
eake
r ena
ble
jum
per
JP12
. On
Boar
d Po
wer
Am
p En
able
.
J8, J
9. A
ltern
ate
pow
er su
pply
co
nnec
tor
optio
ns.
JP11
, Aud
io
pow
er o
utpu
t. Re
com
men
ded
for s
peak
er-
phon
e op
erat
ion.
J5. P
STN
RJ1
1 co
nnec
tion
J5. T
elep
hone
RJ
11 co
nnec
tion
Daug
hter
Car
ds
(rev
2.0
TSS
OP
, or
rev
1.0
QFN
) pl
ug in
to J1
01,
and
JP16
. her
e.
T1, V
1A, V
1B, Y
2A, Y
2B, P
STN
pr
otec
tion
devi
ces.
Alte
rnat
e fo
otpr
ints
supp
ort m
ost
poss
ible
con
figur
atio
ns
UAR
T sig
nal
LED
disp
lays
an
d te
st
poin
ts
J103
. Alte
rnat
e sig
nal
conn
ectio
n pa
th to
ho
st. U
sed
if no
ju
mpe
r is
at JP
23.
CMO
S sig
nalin
g
LS1,
On
Boar
d Sp
eake
r.
J1. H
ands
et
Conn
ecto
r
JP33
Aut
obau
den
able
T59,
TP1
2,TP
13.
Shun
t Res
istor
and
te
st p
oint
s for
cu
rren
t m
easu
rem
ents
J30.
Aux
Au
dio
conn
ecto
r
R13.
Spe
aker
-ph
one
mic
gain
co
ntro
l
JP6,
JP15
, JP9
. Si
3000
line
in m
ixer
ju
mpe
rs fo
r :
mic
roph
one,
AU
X in
(J3
0), &
AO
UT
JP5.
Mic
. fix
ed g
ain
vsad
just
able
ga
in ju
mpe
r
R24.
Aud
io
pow
er a
mpl
ifier
ga
in c
ontr
ol
J6.
Uar
tSig
nalin
g op
tions
. Sh
own
for T
SSO
P an
d Q
FN d
efau
lt se
tup.
JP34
Ena
ble
Excl
usio
n Re
lay
(ope
rate
d by
RI
pin)
JP24
Cho
oses
EE
PRO
M o
pera
tion
inst
ead
of S
i300
0 fo
r no
n Q
FN d
augh
ter
card
s
JP10
, JP7
, JP1
3.
PWR
Amp
inpu
t mix
er
jum
pers
for :
AO
UT,
Si3
000
line
out,
& A
UX
IN (J
30)
Fig
ure
5.F
un
ctio
n a
nd
Lo
cati
on
of
Glo
bal
Vo
ice
ISO
mo
dem
EV
B J
um
per
s
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 7
Table 2 explains the use of the data related jumpers. It also shows the default state.
Check all jumper settings on the EVB before applying power.
These default data related jumper settings shown below configure the EVB for USB serial operation with auto baudas a default. Any terminal emulator program configured to communicate through the virtual com port created by theprovided driver can be used to communicate with the EVB. There are no BAUD settings required since the modemhas an auto baud feature.
The USB virtual com port drivers needed for the USB link to work are on the provided CD.
Customers that want to use an RS232 port only need to change JP23 and connect an RS232 cable to the host. Aswith the USB configuration, any terminal emulator program configured to communicate through a PC COM portcan be used to communicate with the EVB.
Although the user can exercise many of the modem commands (including voice features) using a terminalemulator program, a fax driver is required to implement fax send/receive functionality.
This EVB also provides an application, UltraCOM distributed on the CD that can act as a terminal emulator and asa sound feature demonstration vehicle. See Appendix I for an UltraCOM quick start guide that shows how to runthis demonstration.
Table 2. Digital Data Related Jumpers
Jumper Number Pins Jumped Default State Comments
JP231–2 USB selected
2–3 UART selected
J6 1-2, 4-5, 7-8, 10-11, 13-14 Typical Si2438/37/36/35/29/19/18/17 FT setup (24 pin pkg)
JP33 1-2 Disable Auto baud
JP24 1-2 Enable EEPROM
2-3 Enable Si3000
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
8 Rev. 0.4
Table 3 explains the use of the analog audio oriented jumpers and adjustments, while showing the default state.These jumpers and adjustments can be used to tailor the operation of the global fax EVB so that it interfaces wellwith the users host system and provides the maximum flexibility as the choice of loudspeaker microphone andalternate sources of sound.
Table 3. Sound Related Jumpers
Jumper Number
Pins Jumped Default State
Comments
JP34 1–2 Enable Exclusion Relay
JP1 1–2 Handset pin 4 connection (ground)*
JP2 1–2 Handset pin 3 connection (ground)*
JP3 4–5 Handset pin 2 connection (earpiece signal)*
JP4 2–3 Handset pin 1 connection (mouthpiece signal)*
JP241–2 Enable EEPROM (factory use only)
2–3 Enable Si3000
JP51–2 Variable mic gain = 6 to 34 dB
3–3 Fixed mic gain = 21 dB
JP6 1–2 Mic to input mixer
JP15 1–2 External Line In to input mixer
JP9 1–2 AOUT to input mixer
JP8 1–2 Connects on board mic
JP10 1–2 AOUT to power amp mixer
JP7 1–2 Si3000 line out to power amp mixer
JP13 1–2 Aux Input to power amp mixer
JP14 1–2 On Board Speaker connected
JP12 1–2 Enable Pwr Amp.
*Note: For typical Cisco handset.
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 9
3.2. I/O and AdjustmentsTable 4 explains the use of the adjustable analog audio-oriented controls as well as their default state.
3.3. USB Interface Data Link Setup Quick Start1. Set jumpers according to the default configuration shown in Table 2 on page 7.
2. Connect:
Install USB cable and provided driver.
RJ-11 to phone line or test box.
3. Open the terminal emulator program, and apply power to the EVB.
4. Select the serial COM channel used.
5. Type "AT" followed by a carriage return. (Autobaud automatically adjusts modem DTE speed and protocol.). The modem should echo "AT" and then send the "OK" response code.
6. Type ATH1 and ATH0 to seize and release the telephone line.
3.4. UltraCOM Installation InstructionsPerform the following steps:
1. Double-click the ultracom.msi file to launch the installer. Click Next.
Figure 6. UltraCOM Setup Wizard
2. Accept the default installation path and click Next.
Table 4. Audio Adjustments
Ref Default State Comments
R13 4 turns CW Mic Preamp Gain 6 dB to 34 dB
R24 CCW(21.4 dB) Power Amp Gain 21.4 dB to 46.4 dB WRT line out
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
10 Rev. 0.4
Figure 7. Select Installation Folder Dialog Box
3. Click Install to start the installation.
Figure 8. Install Dialog Box
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 11
4. After installation is complete, click Finish to close the installer.
Figure 9. Completing UltraCOM Setup Wizard
5. UltraCOM may be launched from the desktop link or from the Start menu: Start Programs→UltraCOM→UltraCOM
6. From the UltraCOM main menu, select Help Index. This will load the help file.
7. Select the Quick Start link from the main menu and review the information.
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
12 Rev. 0.4
Figure 10. Quick Start
3.5. USB Interface Data Link Setup Quick Start1. Set jumpers according to the default configuration shown in Figure 5.
2. Install the USB driver for your operating system from the CD supplied with the evaluation board.
3. Connect:
USB cable to PC
RJ-11 to phone line or test box
4. Open the terminal emulator program.
5. Select one of the USB Virtual Com Port numbers in the emulator program's user interface.
6. Type "AT" followed by a carriage return. (Autobaud automatically adjusts modem DTE speed and protocol.). The modem should echo "AT" and then send the "OK" response code.
7. Type ATH1 and ATH0 to seize and release the telephone line.
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 13
3.6. Sound Demonstration Using UltraCOM Quick Start GuideStep 1: Perform the Quick Start USB Interface Data Link Setup Quick Start
1. Set jumpers according to the default configuration shown in Figure 5.
2. Install the USB driver for your operating system from the CD supplied with the evaluation board.
3. Connect:
USB cable to PC
RJ-11 to phone line or test box
4. Open the terminal emulator program.
5. Select one of the USB Virtual Com Port numbers in the emulator program's user interface.
6. Type "AT" followed by a carriage return. (Autobaud automatically adjusts modem DTE speed and protocol.). The modem should echo "AT" and then send the "OK" response code.
7. Type ATH1 and ATH0 to seize and release the telephone line.
Step 2
Add connections to a loudspeaker and a handset as shown in the following diagram.
Figure 11. Sound Demonstration Hardware Interconnect Guide
Step 3:
1. Install UltraCOM (provided in this kit) on Windows XP
2. Launch UltraCOM.
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
14 Rev. 0.4
Step 4:
Select "Terminal-Open" making sure the serial configuration is as shown (except for port selection), then select OK.
Figure 12. UltraCOM Serial Configuration Dialog Box
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 15
Step 5:
1. Select Open Plug-In (The Green Icon) in the screen snapshot that follows.
2. Respond OK to "Load Plug-in" "24xx Voice Functions"
Figure 13. UltraCOM Load Plug-In Dialog Box
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
16 Rev. 0.4
Step 6:
Wait for the screen below to open and the patch to load.
Figure 14. UltraCOM Plug-Ins Patch Load Phase
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 17
Step 7:
Use the interface above to do the following:
Go off hook with the handset by selecting the handset symbol
Select the speakerphone button to start that mode.
Dial a DTMF number.
Note the following suggestions.Use the external off-board speaker for speakerphone functionalityUse the on-board electret for the microphone.Use the PSTN, a PBX or a Line Simulator for the phone line.
How to Change the Patch Used in the UltraCOM Plug-In
Figure 15. UltraCOM Plug-In Patch Changing
3.7. Power RequirementsThe EVB has an onboard diode bridge, filter capacitor, and voltage regulators. Power can be supplied from theUSB connection or a source capable of providing 8.5–13.5 V dc or 6–9.5 VRMS peak ac and at least 300 mA. Asuitable wall mounted 9 V supply is provided with the kit.
Of the 300 mA required current 200 mA is used to drive the loudspeaker and may be removed from therequirement if the power amp is enabled by placing a jumper on JP12.
Power may be applied to the Voice ISOmodem EVB through the screw terminals, J8, the 2 mm power jack, J9, orthe USB cable. The modem cable may be used to supply power even if the modem is configured for RS-232operation.
The power consumed by the audio section is limited with an active limiter. This circuit will protect the powersources when the sound is overdriven or if the amplifier output is shorted. The power amplifier is also naturallyprotected with thermal limiting. Digital operations such as host to modem serial data transfer or the modemtelephone line operations are unaffected by the limiter operation.
Note that the modem will take power from wherever it finds it and that it is possible to use the RS232 port for
signaling and the USB for power or to use the USB for signaling and to provide power through the providedexternal 9 V supply.
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
18 Rev. 0.4
3.8. EVB Part NumbersThe Voice ISOmodem evaluation boards are offered in multiple versions. The first four numbers indicate thesystem-side device. The options include speed and various audio capabilities as well as package and temperature.See Figure 16:
Figure 16. EVB Part Number Example
S i2 4 3 8 F T 1 8 -E V BS i2 4 3 7 F T 1 8 -E V BS i2 4 3 6 F T 1 8 -E V BS i2 4 3 5 F T 1 8 -E V BS i2 4 1 9 F T 1 8 -E V BS i2 4 1 8 F T 1 8 -E V BS i2 4 1 7 F T 1 8 -E V BS i2 4 9 4 A F M 1 8 -E V BS i2 4 3 9 A F M 1 8 -E V B
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 19
4. Voice ISOmodem EVB Functional Description
The Voice ISOmodem EVB is a multipurpose evaluation system. The modem daughter card illustrates the smallsize and few components required to implement an entire controller-based modem with global compatibility. Thedaughter card can be used independently of, or in conjunction with, the motherboard. The motherboard addsfeatures that enhance the ease of evaluating the many capabilities of the Si24xx ISOmodem.
4.1. MotherboardThe motherboard provides a convenient interface to the Si24xx ISOmodem DC (daughter card). The versatilepower supply allows for a wide range of ac and dc voltages to power the board.
A versatile digital IO system allows either a USB virtual com port to be used to interface to the board or an RS-232transceivers with a DB9 connector allowing the EVB to be easily connected to a PC or other terminal device. Ajumper option allows direct access to the LVCMOS/TTL level serial inputs to the Si24xx, bypassing the RS-232transceivers or USB interface. This is particularly useful for directly connecting the Si24xx to embedded systems.
The motherboard provides connectivity to a telephone line or a phone extension via a pair of RJ11connectors. Theextension connector may be actively excluded by an onboard relay.
A switch and a connector is provided on the motherboard that is read by the modem firmware and can perform thehookswitch function.
The motherboard also contains a complete sound system including microphone, loudspeaker and handsetconnector. The sound system includes easy to adjust gain controls and extra inputs that allow system generatednoises to be added to the sound.
A functional block diagram of the system as a whole can be seen below.
Figure 17. Sound System Block Diagram
Call Progress
Audio PWM
RXD, TXD, CTSb
Si3000PCM
USB Interface CP2101
USB Connector
J11
RS232 Connector
J10
MUX
LED Drivers & Display
OptioningSwitchMatrix
J6
Sound Subsystem
CD, RI,
DTR, RTS, DSR
RJ 11 Telephone Connector
RJ 11 Telephone Connector
Exclusion Relay
Tip and RingRIb
Enabled by JP34
J103
JP23 jumper selects USB vs. UART or neither
Si24xx ISOmodem
Silicon Labs Si3018 DAA ISOmodem
Daughter Card
J101
JP16
Direct Access Header
Handset RJ10
Ext. Speaker
JP11 RS232
Drivers & receivers
EXT. Microphone
J2
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
20 Rev. 0.4
4.1.1. Power Supply
4.1.1.1. Power Distribution
The power distribution diagram for the global voice EVB can be seen in Figure 18 below. Analog and Digitalvoltages are separately regulated while the audio power amplifier supply is current limited to prevent accidentaloverload and disruption of the digital supplies.
Figure 18. Power Distribution Diagram
The onboard full-wave rectifier and filter ensure the correct polarity is applied to the Voice ISOmodem EVB.
Daughter card 3.3 V power is supplied through voltage regulator U3. Daughter card current can be measured byconnecting a DVM across R59, a 1 current sensing resistor in the 3.3 V supply line to the daughter card.
The input voltage to either J8 or J9 must be between 8.5 and 13.5 V dc, or 6 and 9.5 VPEAK ac. The motherboardincludes a diode bridge (D12) to guard against a polarity reversal of the dc voltage or to rectify an ac voltage. Thepower source must be capable of continuously supplying at least 100 mA. The voltage regulator, U10, can provide5 V for the motherboard and the input for voltage regulator U3, which outputs 3.3 V for use on the motherboard andto power the daughter card. Alternately, power may be supplied to U3 through D11 from the USB port.
The power consumed by the audio section is limited with an active limiter. This circuit will protect both powersources and the audio amplifier when the sound is overdriven or if the amplifier output is shorted. Digital operationssuch as host to modem serial data transfer or the modem telephone line operations are unaffected by the limiteroperation.
Two indicator LEDs indicate main power (+5 V) and audio amp power (~+4.5 V). See Figure 15 for locations. Youwill notice the one for the audio power blinking when audio is loud and clipping. This is normal.
USB Connector
J11
External Power
Connector J8
External Power
Connector J9
Rectifier Bridge & Capacitor
5 Volt Regulator
Switch(2 diodes)
3.3 Volt Regulator
Reset GeneratorManual
Reset Switch
Switch(2 diodes)
5 Volt Regulator
CurrentLimiter
+(4-5)V Audio Pwr Amp
3.3 Volt Regulator
+3.3V Analog
+3.3V Digital
+5V Power
Master Reset
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 21
4.1.2. Reset Circuitry
The Si24xx requires a reset pulse to remain low for at least 5.0 ms after the power supply has stabilized during thepower up sequence or for at least 5.0 ms during a power-on reset. Most production Si24xx modem chipsetapplications require that RESET be controlled by the host processor. Certain Si24xx operation modes, includingpower down, require a hardware reset to recover.
The Voice ISOmodem EVB contains two reset options, an automatic power-on reset device, U18 (DS1818)(default), and a manual reset switch (S1) to permit resetting the chip without removing power. A reset, regardless ofthe mechanism, causes all modem settings to revert to factory default values.
4.1.3. DS1818
The DS1818 is a small, low-cost device that monitors the voltage on VD and an external reset pushbutton. If VDdrops below 3.0 V, the DS1818 provides a 220 ms active-low reset pulse. On power up, the DS1818 also outputsan active low reset pulse for 220 ms after VD reaches 90% of the nominal 3.3 V value. The DS1818 outputs a 220ms reset pulse any time the power supply voltage exceeds the 3.3 V 10% window.
4.1.4. Manual Reset
The manual reset switch (S1) performs a power-on reset. This resets the Si24xx to factory defaults without turningoff power. Pressing S1 activates the reset monitor in the DS1818 and produces a 220 ms active low reset pulse.
4.1.5. Interface Selection
The serial interface of the Voice ISOmodem EVB can be connected to a computer, terminal, embedded system, orany other data terminal equipment (DTE) via a standard RS-232 interface, USB interface, or through a direct TTLserial interface.
At the heart of this capability is the MUX and the jumper that controls it: JP23.
4.1.5.1. RS-232 Interface
The serial cable connects to J10 on the motherboard and provides a data link the PC or embedded host processor.
Moving the jumper on JP23 enables the RS232 interface or the USB interface.
The Maxim MAX3237 transceiver interfaces directly with the TTL levels available at the serial interface of theSi24xx and, using internal charge pumps, makes these signals compatible with the RS-232 standard. The RS-232transceiver on the Voice ISOmodem EVB can communicate at rates between 300 bps and 1 Mbps. This simplifiesthe connection to PCs and other data terminal equipment (DTE).
The signals available on the Voice ISOmodem EVB serial interface (DB9 connector) are listed in Table 6 along withthe various signal names used and both connector pin numbers and ISOmodem package pin numbers.
Table 5. Board Configuration
JP23 Modem Signalling Done Via
X Header, J103
1–2 Jumped USB Port
2–3 Not Jumped Serial Port
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
22 Rev. 0.4
4.1.5.2. USB Interface
The USB cable connects to J11 on the motherboard and provides both data and power.
This operation mode uses the standard factory jumper settings illustrated in Table 2 on page 7.
Installing a jumper on J23 enables the USB interface and disables the RS-232 interface. The USB interface isprovided by U12. A USB driver for this chip is available for most PC and MAC operating systems on the CD.
4.1.5.3. Direct Access Interface
The direct access interface header (J103) can be used to connect the motherboard to an embedded system.
If J103 is used in this manner, it is necessary to remove the jumber from JP23 to disable both the RS-232 and USBinterface and prevent signal contention. See Table 5.
In this mode, the motherboard continue to supply a few other signals and functions such as power (derived fromJ8, J9, or USB) as well as a power-on reset signal and the telephone line connection via the exclusion relay contactand the RJ-11 jack connected to the modem line side.
J103 provides access to all the ISOmodem system side signals available on the daughter card.
If the user wishes to go further and use his embedded system's power supply or reset line, he can remove thedaughter card from the mother board and integrate it directly into his system.
Table 6. DB9 Pin Connections (J10)
J10 Name J10 Symbol J10 Pin ISOmodem Pin Number
ISOmodem Signal Name
Carrier Detect CD 1* See Note* DCD/EESD
Received Data RXD 2 9 RXD
Transmit Data TXD 3 10 TXD
Data Terminal Ready DTR 4* See Note* ESC/RI
Signal Ground SG 5 6 GND
Data Set Ready DSR 6* See Note* INT/AOUT
Ready to Send RTS 7* See Note* RTS/RXCLK
Clear to Send CTS 8 11 CTS
Ring Indicator RD 9* 17 RI
*Note: JP6 jumper option.
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 23
4.1.6. Exclusion Relay
The exclusion relay (Figure 19) on the motherboard allows the modem to turn on the relay and exclude the phoneline connection from an auxiliary device such as a telephone connected to the second RJ11 socket. The relay isenabled via jumper JP34.
The control signal used is the one called RIb and is managed by special command sequences (see applicationnotes AN93 or AN244). RIb goes low to turn on the relay via a driver transistor.
See the diagram below for the location of the connectors and the relay.
Note that the RIb signal must be kept high during the reset pulse, due to the use of this pin for specialmanufacturing functions. This demands that this pin drive either an NMOS relay driver transistor or a 3.3 Vreferenced buffer like the one used here.
Figure 19. Exclusion Relay and Surge Protection
RJ11 connection to PSTN
RJ11 connection to Telephone
Exclusion Relay
Optional Footprints to be used if customer longitudinal surge voltage requirements exceed capability of exclusion relay.
Optional Footprints to be used if customer has unusual metallic surge voltage requirements.
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
24 Rev. 0.4
4.1.7. Surge Protection Circuits
This evaluation board is designed to provide several possible levels of surge protection.
The ISOmodem alone does not need surge protection for a global implementation except for the componentsnormally selected and implemented on the daughter card. These are the P3100B sidactor and the Y2 caps usedfor C1, C2, C8, and C9.
There are two basic reasons a customer may enhance this surge protection. The first is to protect the telephoneexclusion relay, which often does not meet the same surge capability of the Y2 caps, and the second is to meetenhanced requirements put forth by customers and/or corporate guidelines.
Thus, footprints for either low-current 800 V or 1 kV high-current longitudinal GDTs are in place on the board (seeFigure 20) to protect either the typical 2.5 kV exclusion relay or the 5 kV capacitors on the daughter card. But, notethat the relay used on this motherboard is 5 kV rated (as are the capacitors) and does not need special protection.Regardless of which GDT is used by the customer, it is required to stay at 1 kV or less to control stress on theISOmodem during the GDT arcing process.
For extra metallic protection where higher current surges are mandated, a GDT combined with a common-modechoke acting as a delay element is recommended. The choke protects the Sidactor due to its leakage inductance,allowing the metallic GDT to fire first. There are two possible GDTs shown in Figure 20, and the optimal one can bechosen by the trading of cost for current carrying capacity. When populated with capable ceramic parts, themotherboard and modem can survive 15 kV/ 2 , 1.2/50 µs combination waveform, i.e. 7.5 kA surge current.
Figure 20. Optional Surge Protection Enhancement Circuits
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 25
4.1.8. The Sound System
Figure 21. Sound System
The sound system on the board is centered around the Si3000 code chip shown in the above diagram, and isdesigned to demonstrate handset operation as well as speakerphone and telephone answering machineoperation.
The Si3000 links to the ISOmodem via a PCM bus that allows the transfer of audio between the modem and thevarious audio "peripherals" that the Si3000 links to the following:
Loudspeaker
Handset microphone and speaker
Microphone
Line In
Line Out
4.1.8.1. The Power Amplifier and Loudspeaker
The Power amplifier on the global Voice ISOmodem EVB can drive a 4 speaker with 300 mW of audio that has 3possible sources:
Si3000 Line out
Aux in, J30 signal SPKR_AUX_IN (e.g., a customer system's generated beeps or ticks)
Call progress analog signal from modem. (ISOmodem's call dialing and negotiation tones)
The power amplifier itself is a low cost, rugged 3.3 V bridge device, the LM4862M. Similar parts are available fromother vendors.
The sources listed above can be independently turned off by jumpers JP7, 10, and 13 or be gain controlled with nointeraction, by changing the value of the summing node current injection resistors' values.
The inverted input of this chip is used as a summing junction for an audio mixer for the inputs mentioned above andwith gain control effected via the feedback resistor R24.
PWM PCM
JP15
JP6
AOUT
ISOmodem Si3000
External Speaker
JP11 Mixer & Jumpers
External Microphone
J2
Handset J1
Line Out
Aux In (JP30)
Local Speaker Enabled by JP14
Mixer
SI3000 LINE IN (J30)
Filter
JP7
Line In
JP10
JP13
JP9
Handset Type Matrix JP1-4
Power Amp
R24 sets gain,JP12 enables
Preamp
JP5 & R13 set gain
JP30
SP
KR
_L
SP
KR
_R
LIN
E_O
Optional Connections
Internal Microphone
JP8
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
26 Rev. 0.4
The customer can change the resistor values when integrating the global Voice ISOmodem EVB to his system, butshould keep the RC formed by the 1 µF input caps at a 50 Hz or higher corner to avoid a thump on turn on.
The power amplifier is enabled by JP12. This jumper can also be tied to a host signal to allow the host to shut downthe amplifier.
4.1.8.2. The Call Progress Signal
The call progress tone discussed in this section comes from a PWM output pin on the ISOmodem. The PWMsignal is processed by a high-pass filter (see below).
When using this circuit it is important to extend the modem reset time to 10 ms. This is the time to charge C83 viathe built in weak pull ups in case that the modem has been operating prior to reset and has put the AOUT into aPWM state that is 100% low. Any modifications to this circuit or reset time should be done keeping in mind thefollowing rule: The ISOmodem reset time and AOUT capacitive loading must be balanced so that the AOUT pinmust have time to charge it's load to a high state.
It should be noted that when creating the call progress output with this circuit, about half the noise present in theaudio bandwidth on the modem supply pins is passed along with the call progress tone. Consequently, the modemsupply needs to be fairly clean.
Figure 22. High-Pass Filter
4.1.8.3. The Input Mixer
An input mixer is also in the sound section of the global fax EVB. It drives the line input of the Si3000 with a mixtureof the following possible sources:
An electret microphone
An auxiliary line input, J30 signal (Si3000_LINE_IN)
Call progress analog signal from modem. (ISOmodem's call dialing and negotiation tones)
4.1.8.4. The Speakerphone Electret Microphone
The electret microphone listed above is amplified by a preamp before this mixer. The gain of the microphonepreamp can be adjusted via a potentiometer if JP5 pins 1 and 2 are jumpered, or is fixed by R12 and R15 whenJP5 pins 2 and 3 are jumpered. It is intended for speakerphone use.
This electret microphone in this case can be either the microphone that comes installed on this board or anexternal one connected to the RCA jack J2. There is a dedicated electret power supply available to power either ofthese two microphones. The supply is configured so that it is easy for the user to adjust its voltage between 0 and3.3 V by varying R27 and R30. This allows the user to most closely match the operation of his intended target. Theonboard electret is enabled by JP8.
PWM FilterPWM Filter
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 27
4.1.8.5. The Handset
The handset signals are all processed by the Si3000 chip. The board provides a matrix of connectors to allow ANYhandset pin configuration to be used. This jumper array is shown in Figure 23. The default setting is shown inTable 3 on page 8.
Figure 23. Handset
Microphone Signal
Earpiece Signal
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
28 Rev. 0.4
4.2. Daughter CardsThere are two types of daughter card; one is for QFN packaged modem chips, and one is for smaller packages.The daughter card itself is a complete modem solution perfectly suited for use in an embedded system.
The daughter card requires a 3.3 V supply capable of providing at least 35 mA. Be sure to provide the properpower-on reset pulse to the daughter card if it is used in the stand-alone mode.
The Voice ISOmodem EVB motherboard connects to the daughter card through two connectors, J101 and JP16.JP101 is an 8x2 socket providing connection to all Si24xx digital signals and a regulated 3.3 V power.
The Si24xx digital signals and power also appear at JP103 and they are LVCMOS and TTL compatible. JP103 canbe used for monitoring purposes or may be used as the interface to the users host if JP23 has no jumper, thusdisabling the on board digital multiplexer. In this case note that the PCM link to the Si3000 is still in place and is stillconnected to the daughter card signals.
JP16 is a 4x1 socket providing connection between the daughter card and both the RJ-11 phone jack and theexclusion relay on the motherboard.
The daughter cards for this global Voice ISOmodem EVB come with the appropriate ISOmodem system side chipinstalled and are identical otherwise. The possible ISOmodem system side chips are shown in Figure 24:
Figure 24. ISOmodem System-Side Chip Part Number Scheme
The line side chip on the daughter card is the Si3018 DAA chip. It works with a few low cost discrete parts thatcomplete the telephone line interface.
Small 33 pF capacitors link the system side to the isolated side and provide both data and power transfer to theisolated telephone line circuit.
The connection between the Si3018 chip and the telephone line is done via a diode bridge to control line polarityand beads to control EMI.
A Sidactor is placed across the phone line for surge arresting reasons, while a pair of capacitors link the tip andring to system ground in order to minimize EMI radiation and EMI Susceptibility.
PCB layout for this circuit is somewhat critical, for link integrity, EMI, and surge reasons,. Anyone planning todesign a PCB layout should check application note AN244 or AN93 and also submit the PCB design to SiliconLabs for checking. The layout used on this daughter card is shown in this user's guide.
Si2438FTSi2437FTSi2436FTSi2435FTSi2419FTSi2418FTSi2417FTSi2494FMSi2439FM
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 29
4.2.1. Reset Requirements
The Voice ISOmodem daughter card must be properly reset at powerup. The reset pin (pin 8) of the Si24xx (J101,pin 13) must be held low for at least 5.0 ms after power is applied and stabilized to ensure the device is properlyreset.
4.2.2. Crystal Requirements
Clock accuracy and stability are important in modem applications. To ensure reliable communication betweenmodems, the clock must remain within 100 ppm of the design value over the life of the modem. The crystalselected for use in a modem application must have a frequency tolerance of less than 100 ppm for the combinationof initial frequency tolerance, drift over the normal operating temperature range, and five year aging. Otherconsiderations, such as production variations in PC board capacitance and the tolerance of loading capacitors,must also be taken into account.
4.2.3. Protection
The Voice ISOmodem EVB meets or exceeds all FCC and international PTT requirements and recommendationsfor high-voltage surge and isolation testing without any modification. The protection/isolation circuitry includes C1,C2, C8, C9, FB1, FB2, and RV1. The PCB layout is also a key "component" in the protection circuitry. The VoiceISOmodem EVB provides isolation to 3 kV. Contact Silicon Laboratories for information about designing to higherlevels of isolation.
4.2.4. Daughter Card Strapping and Jumper Options
Both types of daughter cards have some strapping options that are preconfigured at the factory. These areexplained in the schematic and in more detail in AN93.
The QFN daughter card also has a two jumper options. One, JP1, selects SPI operation, which is usable if the useralso does not use a jumper at JP23 on the motherboard and provides host SPI connectivity at J103. The otherjumper, JP2, enables the operation of the EEPROM chip, which is on the daughter card. There is an EEPROM chipon the motherboard, which is only used with the TSSOP daughter card.
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
30 Rev. 0.4
5. Motherboard and Daughter Card Schematics
"RS232"
Connectors
for ISOModem
module.
TXD
GPIO3
RXD
NC
CTS
NC
RESET
GND
NC
VD
GPIO4
GPIO5
NC
NC
Si2401
GPIO2
GPIO1
TXD/WR
ESC/D3
RXD/RD
SDI/EESD/D2
CTSb/CS
RIb/D1
RESET
GND
INTb/D0
VD
AOUT/INTb
FSYNCH/D6
RTSb/D7
CLKOUT/EECS/A0
Si24xx
DCDb/D4
SDO/EECLK_RTSb/D5
15
16
13
14
11
12
9 10
7 861 3 4 5
Net names correspond to Si24xx.
See table for Si2401 equivalents
2
Table NOT on silkscreen
JP1/3
"USB"
RXD
TXD
CTSb
CDRIb
RTSb
RTSb
"FSYNCHb"
"SDO_EECLK_RTSb"
"SDI_EESD"
DSRb
"RXD"
"TXD"
"CTSb"
"RESETb"
"RTSb"
"DCDb"
"INT"
"AOUT_INTb"
"RIb"
"ESC"
"CLKOUT_EECSb"
"SI3000 EN"
"EEPROM EN"
TSSOP24
SOIC16
SOIC16
24xx
24xx
2401
SDI/EESD
NC
NC
FSYNCH
RIb
RIb
RIb
NC
NC
SDO/EECLK
RTSb
GPIO1
AOUT/INTb
INTb
INTb/AOUT
TSSOP24
24xx
SOIC16
24xx
SOIC16
2401
DCD
DCD
DCD
NC
NC
RIb
ESC
ESC
ESC
NC
NC
INTb
NC
NC
RTSb
Silk Screen Text
"GND"
"+3.3V"
JP6 Left Pin Signals
JP6 Right Pin Signals
Lea
ded
Lea
ded
Lea
ded
Lea
ded
Pull Down Can
strap FSYNCHb to
GND enabling
EEPROM
Select High Chooses B2 port
From
Pow
er S
uppl
y P
age
To H
ost I
nter
face
Pag
e
To A
OU
T ci
rcui
t on
Voi
cean
d C
all P
rogr
ess
Pag
e
To S
i300
0 C
odec
on
Voi
cean
d C
all P
rogr
ess
Pag
e
T1 a
nd G
DT'
s m
ay b
ene
eded
for
unn
usua
lsu
rge
req
uire
men
ts.
For
deta
ils
con
tact
the
fact
ory.
5 kV
rat
ed R
elay
Ext
ra H
igh
Surg
e P
rote
ctio
n: L
arge
Cer
amic
GD
T's
Ext
ra S
urge
Pro
tect
ion:
Smal
l Gla
ssG
DT'
s.
RIGHT
RIGHT
NC or INTb
nc or INTb/AOUT
Table on back
silkscreen for
J6
RS-232
Si24xx 16 pin
Si2401 16 pin
CD
DCD or NC
DCD or nc
RI
NC or RIb
NC or RIb
DTR
ESC or NC
ESC or NC
RTS
NC or RTSb
nc or GPIO1
DSR
"J6 Jumper Connectiveity"
Si24xx 24 pin
"SOIC16: 1-2, 5-6, 7-8, 11-12, 14-15"
"TSSOP24: 1-2, 4-5, 7-8, 10-11, 13-14"
"Recommended J6 settings"
INTb or AOUT/INTb
DCD or SDI/EESD
RI or FSYNCH
ESC or RIb
RTS or SDO/EECLK
LEFT
LEFT
LEFT
RIGHT
CLK
OU
T_E
EC
Sb
FS
YN
CH
bS
DI_
EE
SD
CLK
OU
T_E
EC
Sb
CT
Sb
RE
SE
Tb
RXD
DC
Db
ES
C
RT
S_M
CD
_M
DT
R_M
DS
R_M
AO
UT
_IN
Tb
VC
C_M
odem
DC
Db
RIb
FS
YN
CH
b
RI_
M
RT
Sb
TXD
INT
b
SD
I_E
ES
D
ES
C
SD
I_E
ES
D
FS
YN
CH
b
RIb
RIb
SD
O_E
EC
LK_R
TS
b
SD
O_E
EC
LK_R
TS
b
SD
I_E
ES
D
ES
C
RT
Sb
DC
Db
RIb
INT
b
CT
Sb
INT
b
TXD
AO
UT
_IN
Tb
RXD
CLK
OU
T_E
EC
Sb
FS
YN
CH
b
RXD
TXD
RE
SE
Tb
CT
Sb
RT
Sb
SE
LEC
T
CLK
OU
T_E
EC
Sb
SD
O_E
EC
LK_R
TS
b
SD
O_E
EC
LK_R
TS
bS
DI_
EE
SD
DS
R_M
CD
_M RI_
M DT
R_M
RT
S_M
SD
O_E
EC
LK_R
TS
b
AO
UT
_IN
Tb
FS
YN
CH
bC
LKO
UT
_EE
CS
b
EN
AB
LE_M
UXb
TXD
_T
RT
S_T
DT
R_T
TXD
_U
RT
S_U
DT
R_U
RXD
_T
CT
S_T
DS
R_T
CD
_T
RI_
T
RXD
_U
CT
S_U
DS
R_U
CD
_U RI_
U
RE
SE
Tb
AO
UT
_IN
Tb
FS
YN
CH
bS
DI_
EE
SD
SS
I_S
DO
SS
I_C
LKO
UT
+5V
_RA
W+3
.3V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+5V
_RA
W
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
U14
IDT
74C
BT
LV32
57
U14
IDT
74C
BT
LV32
57
GND8
VCC16
1B1
2
2B1
5
3B1
11
4B1
14
1A4
2A7
3A9
4A12
1B2
3
2B2
6
3B2
10
4B2
13
OE
15
S1
R15
768
1R
157
681
C35
0.1u
FC
350.
1uF
K1C
K1C
910 8
D46
DT
RD
46D
TR
R91
10K
R91
10K
R15
568
1R
155
681
Q5
MM
BT
3906
-7-F
Q5
MM
BT
3906
-7-F
C70
560p
FC
7056
0pF
D48
DS
RD
48D
SR
TP
7T
urre
tG
ND
TP
7T
urre
tG
ND
J103
8X2
Shr
oude
d H
eade
rJ1
038X
2 S
hrou
ded
Hea
der
11
22
33
44
55
66
77
88
99
1010
1111
1313
1515
1212
1414
1616
D54
BA
V23
A
D54
BA
V23
A
C73
560p
FC
7356
0pF
C69
1uF
C69
1uF
C72
0.1u
FC
720.
1uF
R16
268
1R
162
681
TP
19T
P19
D53
RE
DR
S23
2D
53R
ED
RS
232
TP
17T
P17
V1A
1000
VR
A-1
02M
-C6-
YN
OP
OP
V1A
1000
VR
A-1
02M
-C6-
YN
OP
OP
D45
RI
D45
RI
R84
1.5k
R84
1.5k
U27
MA
X452
1U
27M
AX4
521
IN1
1
V+13
GND5
IN4
8IN
39
NC
311
V-4
NC
214
IN2
16
NC
13
NC
46
CO
M1
2
CO
M2
15
CO
M3
10
CO
M4
7
VL12
TP
24T
P24
TP
8T
urre
tG
ND
TP
8T
urre
tG
ND
R11
40
NI
R11
40
NIV
2A
350V
RA
-351
M-C
6-Y
NO
PO
P
V2A
350V
RA
-351
M-C
6-Y
NO
PO
P
R11
310
KR
113
10K
D6
MM
BD
3004
S-7
-FD
6M
MB
D30
04S
-7-F
R17
068
1R
170
681
C75
0.1u
FC
750.
1uF
TP
25T
urre
t
GN
DT
P25
Tur
ret
GN
D
R43
10K
R43
10K
D41
RXD
D41
RXD
V1B
800V
NO
PO
PG
TC
A28
-801
L-P
05
V1B
800V
NO
PO
PG
TC
A28
-801
L-P
05
FB
1160
0 O
hmB
LM18
AG
601S
N1
FB
1160
0 O
hmB
LM18
AG
601S
N1
R16
068
1R
160
681
TP
6
TIP
BLU
ET
P6
TIP
BLU
E
TP
23T
P23
C33
0.1u
FC
330.
1uF
R70
0R
700
R60
10K
R60
10K
+
-
K1A
Fuj
itsu
FT
R-C
1GA
4.5G
+
-
K1A
Fuj
itsu
FT
R-C
1GA
4.5G
1
12
V2B 35
0V
NO
PO
PG
TC
A28
-351
L-P
05
V2B 35
0V
NO
PO
PG
TC
A28
-351
L-P
05
Q1
MM
BT
A06
LT1
Q1
MM
BT
A06
LT1
TP
12
+3.3
VR
ED
TP
12
+3.3
VR
ED
J7 NO
PO
P
J7 NO
PO
P
11
22
33
44
55
JP24
JP24
R15
868
1R
158
681
R39
10K
NO
PO
P
R39
10K
NO
PO
P
R10
120
0R
101
200
R11
50
NI
R11
50
NI
TP
2T
urre
tG
ND
TP
2T
urre
tG
ND
TP
22T
P22
R15
668
1R
156
681
D52
RE
DU
SB
D52
RE
DU
SB
U13
IDT
74C
BT
LV32
57
U13
IDT
74C
BT
LV32
57
GND8
VCC16
1B1
2
2B1
5
3B1
11
4B1
14
1A4
2A7
3A9
4A12
1B2
3
2B2
6
3B2
10
4B2
13
OE
15
S1
J5A
RJ-
11
TE
LEP
HO
NE
J5A
RJ-
11
TE
LEP
HO
NE
1 2 3 4 5 6
D5
EXC
LUS
ION
D5
EXC
LUS
ION
R59
1.0R
59
1.0
K1B
K1B
43 5
R16
368
1R
163
681
J6
HE
AD
ER
5x3
J6
HE
AD
ER
5x3
1 23
4 56
7 89
10 11 131512
14 TP
20T
P20
C74
1uF
C74
1uF
T1
3.3m
HN
OP
OP
T1
3.3m
HN
OP
OP
23
14
R51
10K
R51
10K
J5B
RJ-
11
PS
TN
LIN
E
J5B
RJ-
11
PS
TN
LIN
E7 8 9 10 11 12
R85
1.5k
R85
1.5k
R87
10K
R87
10K
JP33
Aut
obau
d D
is.
JP33
Aut
obau
d D
is.
12JP
34
Exc
lusi
on E
n.
JP34
Exc
lusi
on E
n.
12
JP16
4X1
Soc
ket
JP16
4X1
Soc
ket
D44
CD
D44
CD
TP
9T
urre
tG
ND
TP
9T
urre
tG
ND
TP
5
RIN
GB
LUE
TP
5
RIN
GB
LUE
R41
10K
R41
10K
D43
CT
SD
43C
TS
TP
16T
P16
R52
10K
R52
10K
R69
0R
690
R16
968
1R
169
681
C71
0.1u
FC
710.
1uF
J101
HE
AD
ER
8x2
J101
HE
AD
ER
8x2
11
22
33
44
55
66
77
88
99
1010
1111
1313
1515
1212
1414
1616
TP
13
Isen
seR
ED
TP
13
Isen
seR
ED
R42
10K
R42
10K
D47
RT
SD
47R
TS
R15
968
1R
159
681
D42
TXD
D42
TXD
R49
10K
R49
10K
U5
EE
PR
OM
32K
U5
EE
PR
OM
32K
/CS
1M
ISO
2M
OS
I5
SC
LK6
/WP
3
GND4
/HO
LD7
VCC8
U26
74LC
X541
U26
74LC
X541
A1
2
A2
3
A3
4
A4
5
A5
6
A6
7
A7
8
A8
9
G1
1
G2
19
Y1
18
Y2
17
Y3
16
Y4
15
Y5
14
Y6
13
Y7
12
Y8
11
VCC20
GND10
JP23
JP23
TP
21T
P21
R40
10K
R40
10K
Fig
ure
25.M
oth
erb
oar
d M
ain
Dig
ital
Lo
gic
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 31
To MUX
EXT MIC IN
GAIN SEL
1-2 Variable
2-3 Fixed
5.5KHz
pole
CW: 34 dB
CCW: 6 dB
EXT MIC IN GAIN ADJ
power
Consumption
Here is 20
mA at 3.3
Volts
CAPS FOR AD8602ARM OPAMPS
EXT DIFF SPKR GAIN ADJ
High Pass set for 50 Hz Corner
"Do
not g
ound
spea
ker+
or
Spe
aker
-
14KHZ pole
Gain WRT to Line
Out: CW/46.4 dB
CCW: 21.4 dB
To MODEM
Si3000 Option Strapping
Several footprint compatiple
variations of this amplifier are in
production allowing an easy price
vs power tradeoff. EG. LM4819.
"Pin 1"
"Pin 1"
ATT Ref Handset
Speaker at pins 2&3
Mic. in. is at pin 4
with GND at pin 1.
Pin 1JP1
JP4
Pin 5
Pin 5
Cisco Ref Handset
Speaker at pins
2&3, Mic. in. is
at pin 1 and GND
is pin 4
Pin 1JP1
JP4
Differing handsets can be accomodated
as shown in these two examples
SP
KR
_AU
X_IN
SI3
000_
LIN
E_I
N
SI3
000_
LIN
E_I
N
SP
KR
_AU
X_IN
FS
YN
CH
b
RE
SE
Tb
SS
I_C
LKO
UT
SS
I_S
DO
SD
I_E
ES
D
AO
UT
_IN
Tb
+3V
3_A
VG
ND
+3V
3_A
VG
ND
+3V
3_A
+3V
3_A
+3V
3_A
VG
ND
+3.3
V
+3V
3_A
GN
D
GN
D
VG
ND
+3V
3_A
+3V
3_A
VG
ND
+3V
3_A
+4.5
V
VG
ND+3
.3V
JP6
JUM
PE
R
JP6
JUM
PE
R
12
R9
0R
90
C7
1uF
C7
1uF
R25
10K
R25
10K
JP14
En.
Lcl
. Spe
aker
JP14
En.
Lcl
. Spe
aker
12
C18
1uF
C18
1uF
R31 10
KR
31 10K
J30
5X2
Shr
oude
d H
eade
r
J30
5X2
Shr
oude
d H
eade
r
11
22
33
44
55
66
77
88
99
1010
R3
200
R3
200
R23 3.
01K
R23 3.
01K
R6
2KR6
2K
R20
10K
R20
10K
R45
100K R45
100K
FB
160
0 O
hmF
B1
600
Ohm
+C
1710
0uF
+C
1710
0uF
JP1
JP1
R410K R410K
C4
0.1u
F
C4
0.1u
F
R14
1KR
141K
R29
3.01
KR
293.
01K
C20 1u
F
C20 1u
F
R13
50K
R13
50K
13
2
U4
LM48
62
U4
LM48
62
SH
UTD
OW
N1
BY
PA
SS
2IN
+3
IN-
4
VO
28
GND7
VDD6
VO
15
FB
260
0 O
hmF
B2
600
Ohm
R37
100K
R37
100K
JP5
JP5
C15
2.2n
FC
152.
2nF
R33
1KR33
1K
R32
0
R32
0
R28
200
R28
200
R38
100K
R38
100K
R10
4.7K
R10
4.7K
C12 0.1u
F
C12 0.1u
F
R22 49
9R
22 499
Input
Output
Si3
000
U2
Input
Output
Si3
000
U2
MC
LK7
SC
LK8
FSY
NC
6S
DI
4S
DO
5
RE
SE
T*9
LIN
EI
11
MIC
_BIA
S2
MIC
_IN
10
LIN
EO
15
SP
KR
_L16
SP
KR
_R1
VD12
VA13
GND14
HD
ST
3
LS1
SP
EA
KE
R
LS1
SP
EA
KE
R
R12
5.1K
R12
5.1K
+ -
U22
BA
D86
02A
RM
+ -
U22
BA
D86
02A
RM
5 67
JP10
JP10
12
R30
10M
R30
10M
+
C6
100u
F
+
C6
100u
F
JP12
Pw
r A
mp
Ena
ble
JP12
Pw
r A
mp
Ena
ble
12
C11
1uF
C11
1uF
R3610
0KR
36100K
C28
0.1u
F
C28
0.1u
F
+-
U21
BA
D86
02A
RM
+-
U21
BA
D86
02A
RM
567
C37
1uF
C37
1uF
JP2
JP2
C27
0.1u
F
C27
0.1u
F
J2RC
A J
AC
K
EXT
MIC
.
J2RC
A J
AC
K
EXT
MIC
.
C23
1uF
C23
1uF
R27
324K
R27
324K
JP13
JP13
12
R35
1KR35
1K
R18
100K
R18
100K
+ -
V+
V-
U21
A AD
8602
AR
M
+ -
V+
V-
U21
A AD
8602
AR
M
123
48
C24
0.1u
F
C24
0.1u
F
C22
1uF
C22
1uF
MK
1
LCL.
MIC
.
MK
1
LCL.
MIC
.1 2
C8
10uF
C8
10uF
+ -
V+
V-
U20
A
AD
8602
AR
M
+ -
V+
V-
U20
A
AD
8602
AR
M
123
48
C26
0.1u
F
C26
0.1u
F
C25
0.1u
F
C25
0.1u
F
J1H
AN
DS
ET
J1H
AN
DS
ET
1 2 3 4JP
3JP
3
R2
0N
IR
20
NI
D1
MM
BD
3004
S-7
-F
D1
MM
BD
3004
S-7
-F
R7
2KR
72K
C29
0.1u
F
C29
0.1u
F
JP4
JP4
D2
MM
BD
3004
S-7
-F
D2
MM
BD
3004
S-7
-F
C21
1uF
C21
1uF
FB
460
0 O
hmF
B4
600
Ohm
JP11
DIF
F S
PK
R O
UT
JP11
DIF
F S
PK
R O
UT
R44
3.01
KR
443.
01K
C19
2.2n
FC
192.
2nF
C34 1u
FC
34 1uF
JP9
JUM
PE
RJP
9JU
MP
ER
12
C10
0.1u
F
C10
0.1u
F
C5 0.
1uF
C5 0.
1uF
FB
360
0 O
hmF
B3
600
Ohm
C3 0.1u
F
C3 0.1u
F
JP15
JUM
PE
RJP
15JU
MP
ER
12
JP8
EN
. LC
L M
ICJP
8E
N. L
CL
MIC
12
R24
50K
R24
50K
13
2
R34
1KR34
1K
C14
0.1u
F
C14
0.1u
F
R21
2KR21
2K
D3
MM
BD
3004
S-7
-F
D3
MM
BD
3004
S-7
-F
R11 2K
R11 2K
R17
10K
R17
10K
R15
49.9
K
R15
49.9
K
C30
0.1u
F
C30
0.1u
F
+ -
V+
V-
U22
AA
D86
02A
RM
+ -
V+
V-
U22
AA
D86
02A
RM
123
48
C31
1uF
C31
1uF
C98
4.7u
FC
984.
7uF
+-
U20
B
AD
8602
AR
M
+-
U20
B
AD
8602
AR
M
567
C13
560p
FC
1356
0pF
JP7
JP7
12
R19
10K
R19
10K
R5
100K
R5
100K
R16
1KR
161K
Fig
ure
26.M
oth
erb
oar
d S
ou
nd
Pro
cess
ing
Cir
cuit
s
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
32 Rev. 0.4
RS
-232
, Fem
ale,
Fro
nt V
iew
US
B
input
threshold of
0.8 and 2.4
Volts
Output voltages:
CMOS, 0 and 5
Volts
Keep Very Close
RXD
_232
CT
S_2
32
RD
_232
TXD
_232
DT
R_2
32
DS
R_2
32
RT
S_2
32
CD
_232
RXD
_T
CT
S_T
DS
R_T
CD
_T
RI_
T
TXD
_T
RT
S_T
DT
R_T
RI_
UC
D_U
DS
R_U
TXD
_UR
XD_U
CT
S_U
RT
S_U
DT
R_U
+3.3
V
+3.3
V
VC
C_U
SB
DN515V DN515V
C58
0.1u
F
C58
0.1u
F
R11
210
KR
112
10K
DN415V DN415V
DN115V DN115V
FB
8
600
Ohm
BLM
18A
G60
1SN
1
FB
8
600
Ohm
BLM
18A
G60
1SN
1
R11010K R11010K
U11
MA
X323
7
U11
MA
X323
7
C2+
1
C2-
3
C1+
28
C1-
25V
+27
V-
4
T1IN
24
T2IN
23
T3IN
22
T4IN
19
T5IN
17
R1O
UTB
16
R1O
UT
21
R2O
UT
20
R3O
UT
18
EN
13
GND2
T1O
UT
5
T2O
UT
6
T3O
UT
7
T4O
UT
10
T5O
UT
12
VCC26
R1I
N8
R2I
N9
R3I
N11
MB
AU
D15
SH
DN
14
C62
0.1u
F
C62
0.1u
F
DN815V DN815VC53
0.1u
F
C53
0.1u
F
DN315V DN315V
C52
560p
FC
5256
0pF
R10910K R10910K
J10
DB
9
J10
DB
9
CD
(O)
1
RX
D(O
)2
TXD
(I)
3
DTR
(I)
4
SG
5
DS
R(O
)6
RTS
(I)
7
CTS
(O)
8
RD
(O)
9
MH10
MH11
D14
D14
C63 0.
1uF
C63 0.
1uF
DN715V DN715V
DN215V DN215V
R11110K R11110K
U12
CP
2102
U12
CP
2102
RE
GIN
7
VDD6
GND3
VB
US
8
D-
5
D+
4
CTS
23R
TS24
RX
D25
TXD
26D
SR
27D
TR28
DC
D1
RI
2
SU
SP
EN
D11
SU
SP
EN
D12
RS
T9
GNDEPAD
D15
D15
C57
0.1u
FC
570.
1uF
C61 0.1u
F
C61 0.1u
F
J11
US
B T
ype
BJ1
1U
SB
Typ
e B
+V1
D-
2
D+
3
GN
D4
SH5SH6
C59 0.1u
F
C59 0.1u
F
C56
0.1u
FC
560.
1uF
DN615V DN615V
FB
9
600
Ohm
BLM
18A
G60
1SN
1
FB
9
600
Ohm
BLM
18A
G60
1SN
1
R10
80 N
OP
OP
R10
80 N
OP
OP
C54
1uF
C54
1uF
C60
0.01
uF
C60
0.01
uF
C55
1uF
C55
1uF
Fig
ure
27.M
oth
erb
oar
d H
ost
I/O
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 33
RE
SE
Tb
+4.5
V
+3.3
V
VC
C_U
SB
+3V
3_A
+5V
_RA
W
J8 7-12
V A
C/D
C P
WR
J8 7-12
V A
C/D
C P
WR
12
C40
0.1u
F
50VC40
0.1u
F
50V
R10
31.
6R
103
1.6
R10
51.
6R
105
1.6
+C
4156
0uF
6.3V
+C
4156
0uF
6.3V
D51
RE
D
+4.5
V
D51
RE
D
+4.5
V
Q4
MM
BT
A06
LT1
Q4
MM
BT
A06
LT1
D49
MM
BD
3004
S-7
-F
D49
MM
BD
3004
S-7
-F
D11
ST
PS
140Z
SO
D-1
23D
11
ST
PS
140Z
SO
D-1
23
R98
0.05
R98
0.05
TP
10
+4.5
VR
ED
TP
10
+4.5
VR
ED
U1
LT19
63A
-3.3
VS
OT
223
U1
LT19
63A
-3.3
VS
OT
223
GN
DIN
OU
TG
ND
D50
RE
D
+3.3
V P
WR
D50
RE
D
+3.3
V P
WR
C65
1uF
C65
1uF
D9
ST
PS
140Z
D9
ST
PS
140Z
D13
ST
PS
140Z
D13
ST
PS
140Z
U18 DS
1818
U18 DS
1818
VC
C2
GN
D3
RS
T1
U3
LT19
63A
-3.3
VS
OT
223
U3
LT19
63A
-3.3
VS
OT
223
GN
DIN
OU
TG
ND
+C45
470u
F
+C45
470u
F
C51
0.01
uF
25V
C51
0.01
uF
25V
C66
10uF
C66
10uF
R97
200
R97
200
C48
0.1u
F50
V
C48
0.1u
F50
VF
B7
600
Ohm
FB
7
600
Ohm
R10
01.
33K
R10
01.
33K
C96
0.1u
F
C96
0.1u
F
Q3
FC
X105
1AT
A
Q3
FC
X105
1AT
A
FB
6
600
Ohm
FB
6
600
Ohm
C2
10uF
C2
10uF
-+
D12
Brid
ge R
ectif
ier
-+
D12
Brid
ge R
ectif
ier
TP
1
+3V
3_A
RE
DT
P1
+3V
3_A
RE
D
C43
1uF
C43
1uF
R57
0.05
R57
0.05
C42
0.01
uF25
V
C42
0.01
uF25
V
R16
168
1R
161
681
R99
200R
99
200
C39
10uF
C39
10uF
C1
0.1u
FN
OP
OP
C1
0.1u
FN
OP
OP
C49
10uF
C49
10uF
R1
0.05
R1
0.05
+C44
470u
F
+C44
470u
F
U10
TO
263-
3NLM
2937
ES
-5.0
U10
TO
263-
3NLM
2937
ES
-5.0
GN
DIN
OU
TG
ND
U8
TO
263-
3NLM
2937
ES
-5.0
U8
TO
263-
3NLM
2937
ES
-5.0
GN
DIN
OU
TG
ND
S1
RE
SE
T
S1
RE
SE
T
R10
2
1.33
K
R10
2
1.33
K
J9 7-12
V A
C/D
C P
WR
J9 7-12
V A
C/D
C P
WR
3 2 1R
104
0.05
R10
40.
05
R96
3.57
R96
3.57
D7
ST
PS
140Z
SO
D-1
23D
7
ST
PS
140Z
SO
D-1
23
Fig
ure
28.M
oth
erb
oar
d P
ow
er S
up
ply
an
d R
eset
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
34 Rev. 0.4
The
se c
ompo
nent
s ar
e fo
r in
tern
al S
ilabs
use
onl
y.
����
���
���
�� �
������
�����
No
R103
R106
R101
No
No
No
No
No
No
Yes
No
No
No
Yes
PKG_16.11 & PKG_24.15
PKG_16.3 & PKG_24.4
PKG_16.15 & PKG_24.23
PKG_16.7 & PKG_24.11
PKG_24.16
R102
No
No
Yes
Yes
Yes
No
Yes
X XNo
No
Yes
SPI 32 kHz
SPI 27 MHz
SPI 4.9252 MHz
Pin11
Pin3
Pin15
Pin7
Pin15
Pin23
Pin11
R104
R106
R101
R102
No
Yes
X X
No
Yes
No
Yes
No
Yes
Pin16
SO
IC16
Sys
tem
Sid
e S
trap
ping
Tab
le
UART 4.9152 MHz
UART 27 MHz
UART 32 kHz
Parallel
PKG_24.17
R105
Pin17
XX
XX
Parallel
27 Mhz
4.9152 MHz
SPI
SPI
SPI
No
Yes
No
Yes
No
No
Yes
27 Mhz
Yes
X4.9152 MHz
32.768 kHz
No
No
No
No
UART
No
Yes
32.768 kHz
X
No
No
UART
No
No
No
No
No
UART
No
No
Yes
4.9152 MHz
27 Mhz
TS
SO
P24
Sys
tem
Sid
e S
trap
ping
Tab
le
Y1,
Y1B
& Y
3 ar
e al
tern
ate
foot
prin
ts a
nd fr
eque
ncie
s.T
he V
alue
s of
C40
& C
41 v
ary.
See
The
BO
M.
�����
����
����
�����
������
���
�����
�������
����
���
�� �
��
CTSb
AOUT_INTb
INTb
RIb
DCDb
CTSb
AOUT_INTb
FSYNCH(RI)
DCDb
SD
O_E
EC
LK_R
TS
b
DC
Db
ES
C
AO
UT
_IN
Tb
RX
D
RE
SE
Tb
XT
ALI
XT
ALO
RX
DR
TS
b
RE
SE
Tb
DC
Db
FS
YN
CH
RT
Sb
INT
b
ES
C
RIb
SD
I_E
ES
D
AO
UT
_IN
Tb
CLK
OU
T_E
EC
Sb_
AO
CLK
OU
T_E
EC
Sb_
AO
TX
DC
TS
b
TX
DC
TS
b
FS
YN
CH
SD
O_E
EC
LK_R
TS
b
SD
O_E
EC
LK_R
TS
b
SD
I_E
ES
DR
Ib
AO
UT
_IN
Tb
FS
YN
CH
INT
b
ES
C
DC
Db
RIb
SD
I_E
ES
D
VD
A
XT
ALO
XT
ALI
XT
ALO
AO
UT
_IN
Tb
CT
Sb
DC
Db
FS
YN
CH
INT
bR
IbVD
A
VD
B
RX
DT
XD
CT
Sb
XT
ALI
RE
SE
Tb
C1A
C2A
C1A
C2A
VD
D
VD
D
VD
D
VD
D
C41
33pF
C41
33pF
U12
Si2
493
U12
Si2
493
CLK
IN/X
TA
LI1
XT
ALO
2
CLK
OU
T/E
EC
Sb/
A0
3
FS
YN
CH
/D6
4
VD3.35
GND6
VD
A7
RT
Sb/
SP
I_C
Sb/
D7
8
VD
B19
GND20
VD 3.321
C2A
13
C1A
14
ES
C/D
322
DC
Db/
D4
23S
DO
/EE
CLK
/D5
24
CT
S/S
PI_
SC
LK/C
Sb
11
RX
D/S
PI_
MIS
O/R
Db
9
TX
D/S
PI_
MO
SI/W
Rb
10
RE
SE
T12
RIb
/D1
17
SD
I/EE
SD
/D2
18
AO
UT
/INT
b15
INT
b/D
016
Y3
27 M
Hz
Y3
27 M
Hz
GN
D2
VC
C4
OU
T3
NC
1
R11
120
0R
111
200
C54
1uF
C54
1uF
C55
0.1u
FC
550.
1uF
R11
020
0R
110
200
U13
Si2
4xx-
16 p
inU
13S
i24x
x-16
pinCLK
IN/X
TA
LI1
XT
ALO
2
RIb
3
VDD3.34
RX
D_S
PI_
MIS
O5
TX
D_S
PI_
MO
SI
6
CT
Sb_
SP
I_S
CLK
7
RE
SE
T8
C2A
9
C1A
10
INT
b11
GND12
VA
13
ES
C14
DC
Db
15
RT
Sb_
SP
I_C
Sb
16
R18
1.2K
R18
1.2K
R11
220
0R
112
200
C40
33pF
C40
33pF
Y1
4.91
52M
Hz
Y1
4.91
52M
Hz
C53
0.22
uFC
530.
22uF
J1S
OC
KE
T 8
x2J1
SO
CK
ET
8x2
11
22
33
44
55
66
77
88
99
1010
1111
1313
1515
1212
1414
1616
C56
0.1u
FC
560.
1uF
R10
310
KR
103
10K
R10
610
KR
106
10K
R12
0N
IR
120
NI
R12
1N
IR
121
NI
C50
0.1u
FC
500.
1uF
R10
110
KR
101
10K
C51
0.22
uFC
510.
22uF
C52
0.1u
FC
520.
1uF
Y1B
32.7
68K
Hz
Y1B
32.7
68K
Hz
R10
210
KR
102
10K
R10
410
KR
104
10K
FB
5F
B5
R10
51K
R10
51K
Fig
ure
29.D
aug
hte
r C
ard
(S
i24x
x2G
-DC
Rev
2.0
) S
yste
m S
ide
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 35
Bias
Ring Detect/CID/Voltage monitoring
DC Term
Add
0.0
20 to
0.0
30 s
q.in
ches
of
Cu
at a
lltr
ansi
stor
col
lect
ors
Place C3 near D1
No
GN
D o
r I_
GN
Dco
pper
pla
nes
in D
AA
se
ctio
n.
TIP
RING
Kee
p 5
mm
cre
epag
eru
les
betw
een
this
DA
A
sect
ion
and
all e
lse.
C1A
C2A
I_G
ND
I_G
ND
I_G
ND
I_G
ND
R12
56.2
R12
56.2
C10
0.01
uF
C10
0.01
uF
Q5
MM
BT
A06
LT1
Q5
MM
BT
A06
LT1
Q3
MM
BT
A42
LT1
Q3
MM
BT
A42
LT1
C4X
1uF
25V
X8R
C4X
1uF
25V
X8R
RV
1
P31
00S
B
RV
1
P31
00S
B
Q1
MM
BT
A42
LT1
Q1
MM
BT
A42
LT1
FB
1
600
Ohm
FB
1
600
Ohm
R2
150
R2
150
R4
2.49
K
R4
2.49
K
C5
0.1u
FC
0603
C5
0.1u
FC
0603
C6
0.1u
FC
0603
C6
0.1u
FC
0603
C2
33pF
C2
33pF
C8
680p
FC
868
0pF
-+
D1
HD
04
-+
D1
HD
04
Q2
MM
BT
A92
LT1
Q2
MM
BT
A92
LT1
C9
680p
FC
968
0pF
R6
100K
R6
100K
FB
2
600
Ohm
FB
2
600
Ohm
R11
73.2R11
73.2
C1
33pF
C1
33pF
R13
56.2
R13
56.2
C7
2.7n
FC
72.
7nF
+
C4
1uF
+
C4
1uF
R15 0R15 0
Z1
43V
Z1
43V
R7
20M
R7
20M
J2T
SM
-104
-01-
T-S
V4X
1 H
eade
r
J2T
SM
-104
-01-
T-S
V4X
1 H
eade
r
Q4
MM
BT
A06
LT1
Q4
MM
BT
A06
LT1
R8
20M
R8
20M
R3
3.65
K
R3
3.65
K
C3
0.01
uF
C3
0.01
uF
R9
1MR9
1M
R5
100K
R5
100K
R1
1.07
KR
11.
07K
R16 0
R16 0
U2
Si3
018
U2
Si3
018 Q
E1
DC
T2
RX
3
IB4
C1B
5
C2B
6
VR
EG
7
RN
G1
8
DC
T2
16IGND
15
DC
T3
14
QB
13
QE
212
SC11
VR
EG
210
RN
G2
9
R10
536R
10
536
Fig
ure
30.D
aug
hte
r C
ard
(S
i24x
x2G
-DC
Rev
2.0
) L
ine
Sid
e
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
36 Rev. 0.4
Thes
e co
mpon
ents
are
for
int
erna
l Si
labs
use
onl
y.
R103
R102
27 M
hz
4.91
52 M
Hz
32.7
68 k
Hz
The
two
Crys
tals
are
alte
rnat
e f
ootp
rint
s an
d fr
eque
ncie
s. T
he v
alue
s of
C40
and
C41
are
dif
fere
nt a
tth
e tw
o fr
eque
ncie
s. S
ee T
heBO
M.
The
27 M
Hz o
scil
lato
r is
ast
and-
in f
or a
cus
tome
rpr
ovid
e sy
stem
cl
ock,
sav
ing
the
cost
of
a cr
ysta
l an
d tw
oca
ps.
RIb
DCDb
P1 P2P3 P14
P10 P8 P4 P5 P9 P7 P11
P12
P16
P13
Pin
2Pi
n 35
Pin
19Pi
n 28
Yes
Yes
No No
No No
Y1C
Y1B
Y1A
Yes
Yes
Yes
NoNo
No
No
No No
** R
102
is 1
k be
caus
eVo
ice
moth
erbo
ards
use
a
10 k
pul
lup
on
RIb
when
the
excl
usio
n re
lay
driv
eris
ena
bled
via
the
jum
per.
RX
D_
SP
I_M
ISO
FS
YN
CH
RT
Sb
_S
PI_
CS
INT
b
ES
C
RIb
SD
I
AO
UT
CL
KO
UT
TX
D_
SP
I_M
OS
IC
TS
b_
SP
I_S
CL
K
SD
O
RE
SE
Tb
DC
Db
RIb
SD
I
XT
AL
O
DC
Db
INT
b
RIb
XT
AL
I
AO
UT
EE
SD
IE
ES
DO
RX
D_
SP
I_M
ISO
TX
D_
SP
I_M
OS
IR
TS
b_
SP
I_C
S
CT
Sb
_S
PI_
SC
LK
RE
SE
Tb
CL
KO
UT
ES
CX
TA
LO
EE
CS
DC
Db
EE
CL
K
XT
AL
I
SD
O
FS
YN
CH
INT
b
RIb
SD
I
FS
YN
CH
EE
CL
KE
ES
DI
EE
SD
OE
EC
S
GP
IO1
GP
IO1
C1
A
C2
A
VD
D
VD
D
VD
D
VD
D
VD
D
C1
AC
2A
TP
V3
TP
V3
JP2
EE
En
JP2
EE
En
C5
0
0.1
uFC
04
02
C5
0
0.1
uFC
04
02
TP
V6
TP
V6
TP
V4
TP
V4
C5
2
0.1
uFC
04
02
C5
2
0.1
uFC
04
02
C4
13
3p
FC
41
33
pF
R1
21
0R
12
10
C5
6
0.1
uF
C5
6
0.1
uF
R1
20
0R
12
00
J1S
OC
KE
T 8
x2J1
SO
CK
ET
8x2
11
22
33
44
55
66
77
88
99
10
10
11
11
13
13
15
15
12
12
14
14
16
16
FB
5F
B5
TP
V1
TP
V1
R1
01
10
KR
10
11
0K
TP
V5
TP
V5
C5
10
.22
uFC
51
0.2
2uF
R1
8
1.2
K
R1
8
1.2
K
TP
V2
TP
V2
C4
03
3p
FC
40
33
pF
JP1
SP
I En
JP1
SP
I En
C5
41
uFC
54
1uF
Y1
C2
7 M
Hz
Y1
C2
7 M
Hz
GN
D2
VC
C4
OU
T3
NC
1
C5
50
.1uF
C5
50
.1uF
R1
03
10
KR
10
31
0K
C5
70
.1uF
C5
70
.1uF
U3
EE
PR
OM
32
K
U3
EE
PR
OM
32
K/CS
1M
ISO
2M
OS
I5
SC
LK
6/W
P3
GND4
/HO
LD
7
VCC8
R1
02
1K
R1
02
1K
R1
22
0R
12
20
Y1
A3
2.7
68
KH
zY
1A
32
.76
8K
Hz
U1
Si2
49
3U
1S
i24
93
GP
IO1
1
NC
14
FS
YN
CH
_2
CLK
OU
T3
VDD5
GND6
VR
EG
7
SD
I8
RIb
19
GP
IO11/A
020
UA
RT
_C
TS
_/S
PI_
SC
LK
/CS
_21
EE
CLK
13
AO
UT
b14
UA
RT
_R
XD
/SP
I_M
ISO
/RD
_22
UA
RT
_T
XD
/SP
I_M
OS
I/W
R_
23
UA
RT
_R
TS
_/S
PI_
CS
_/D
724
EE
SD
O11
SD
O9
EE
SD
I10
EE
CS
12
C2A
17
C1A
18
AO
UT
15
RE
SE
T_
16
GP
IO18/D
034
INT
_35
CLK
IN/X
TA
LI
36
XT
ALO
37
NC
338
NC
227
GND25VDD
26
EC
/D5
29
GP
IO25/D
331
GP
IO16/D
232
DC
D_/D
628
GP
IO24/D
430
GP
IO17/D
133
TP
V7
TP
V7
R1
23
0R
12
30
Y1
B4
.91
52
MH
zY
1B
4.9
15
2M
Hz
R1
04
10
KR
10
41
0K
Fig
ure
31.Q
FN
Dau
gh
ter
Car
d (
Si2
4xx2
G-Q
FN
38-D
C R
ev 1
.0)
Sys
tem
Sid
e
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 37
Bias
Ring
Det
ect/
CID/
Volt
age
moni
tori
ng
Hook
swit
ch
DC T
erm
Add
0.02
0 to
0.0
30 s
q. i
nche
s of
Cu
at a
lltr
ansi
stor
col
lect
ors
Plac
e C3
nea
r D1
No
Gro
und
Pla
ne In
DA
A S
ectio
n
TIP
RING
C1
A
C2
A
I_G
ND
I_G
ND
I_G
ND
I_G
ND
C1
0
0.0
1uF
C1
0
0.0
1uF
R1
2
56
.2
R1
2
56
.2
Q1
MM
BT
A4
2L
T1
Q1
MM
BT
A4
2L
T1
RV
1
P3
10
0S
B
RV
1
P3
10
0S
B
C4
X1
uF2
5V
X8
RC
4X
1uF
25
VX
8R
Q3
MM
BT
A4
2L
T1
Q3
MM
BT
A4
2L
T1
Q5
MM
BT
A0
6L
T1
Q5
MM
BT
A0
6L
T1
R2
15
0
R2
15
0F
B1
60
0 O
hm
FB
1
60
0 O
hm
C2
33
pF
C2
33
pF
C6
0.1
uFC
06
03
C6
0.1
uFC
06
03
C5
0.1
uFC
06
03
C5
0.1
uFC
06
03
R4
2.4
9K
R4
2.4
9K
Q2
MM
BT
A9
2L
T1
Q2
MM
BT
A9
2L
T1
-+
D1
HD
04
-+
D1
HD
04
C8
68
0p
FC
86
80
pF
R6
10
0K
R6
10
0K
C9
68
0p
FC
96
80
pF
C1
33
pF
C1
33
pF
R1
1
73
.2
R1
1
73
.2
FB
2
60
0 O
hm
FB
2
60
0 O
hm
C7
2.7
nFC
72
.7nF
R1
3
56
.2
R1
3
56
.2R
15
0R
15
0
+
C4
1uF
+
C4
1uF
J2
TS
M-1
04
-01
-T-S
V
4X
1 H
ead
er
J2
TS
M-1
04
-01
-T-S
V
4X
1 H
ead
er
R7
20
MR
72
0M
Z1
43
VZ
14
3V
R8
20
MR
82
0M
Q4
MM
BT
A0
6L
T1
Q4
MM
BT
A0
6L
T1
R3
3.6
5K
R3
3.6
5K
C3
0.0
1uF
C3
0.0
1uF
R9
1M
R9
1M
R5
10
0K
R5
10
0K
R1
0
53
6R1
0
53
6
U2
Si3
01
8
U2
Si3
01
8 QE
1
DC
T2
RX
3
IB4
C1B
5
C2B
6
VR
EG
7
RN
G1
8
DC
T2
16
IGND15
DC
T3
14
QB
13
QE
212
SC11
VR
EG
210
RN
G2
9
R1
60
R1
60
R1
1.0
7K
R1
1.0
7K
Fig
ure
32.D
aug
hte
r C
ard
(S
i24x
x2G
-QF
N38
-DC
Rev
1.0
) L
ine
Sid
e
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
38 Rev. 0.4
6. Motherboard and Daughter Card PCB Layouts
Fig
ure
33.M
oth
erb
oar
d P
rim
ary
Sid
e C
om
po
nen
t an
d S
ilksc
reen
Vie
w
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 39
Fig
ure
34.M
oth
erb
oar
d B
ott
om
Sid
e C
om
po
nen
t an
d S
ilks
cree
n V
iew
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
40 Rev. 0.4
Fig
ure
35.M
oth
erb
oar
d P
rim
ary
Sid
e S
ign
al L
ayer
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 41
Fig
ure
36.M
oth
erb
oar
d L
ayer
2 G
rou
nd
Pla
ne
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
42 Rev. 0.4
Fig
ure
37.M
oth
erb
oar
d L
ayer
3 P
ow
er P
lan
e
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 43
Fig
ure
38.M
oth
erb
oar
d S
eco
nd
ary
Sid
e, S
ign
al L
ayer
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
44 Rev. 0.4
Fig
ure
39.D
aug
hte
r C
ard
Pri
mar
y S
ide,
Co
mp
on
ent
and
Silk
scre
en
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 45
Fig
ure
40.D
aug
hte
r C
ard
Sec
on
dar
y S
ide,
Co
mp
on
ent
and
Silk
scre
en
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
46 Rev. 0.4
.
Fig
ure
41.D
aug
hte
r C
ard
Pri
mar
y S
ide
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 47
Fig
ure
42.D
aug
hte
r C
ard
Sec
on
dar
y S
ide
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
48 Rev. 0.4
Fig
ure
43.Q
FN
Dau
gh
ter
Car
d P
rim
ary
Sid
e, C
om
po
nen
t an
d S
ilksc
reen
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 49
Fig
ure
44.Q
FN
Dau
gh
ter
Car
d S
eco
nd
ary
Sid
e, C
om
po
nen
t an
d S
ilksc
reen
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
50 Rev. 0.4
Fig
ure
45.Q
FN
Dau
gh
ter
Car
d P
rim
ary
Sid
e
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 51
Fig
ure
46.Q
FN
Dau
gh
ter
Car
d S
eco
nd
ary
Sid
e
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
52 Rev. 0.4
7. Bill of Materials
The following sections contain the bills of materials for the motherboard and daughter card.
7.1. Motherboard Bill of Materials
Table 7. MotherBoard Bill of Materials
Item NI Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
48 NI 3 R2, R114, R115
0 1A ThickFilm R0603 CR0603-16W-000 Venkel
1 NOPOP 1 C1 0.1 µF 10V ±20% X7R C0402 C0402X7R100-104M Venkel
33 NOPOP 1 J7 2 mm, RT ANG SHROUDED
CONN1X5-S5B-PH-SM4-TB
S5B-PH-SM4-TB JST
63 NOPOP 6 R39, R49, R51
10 k 1/10W ±1% ThickFilm R0603 CR0603-10W-1002F Venkel
71 NOPOP 1 R108 0 1A ThickFilm R0603 CR0603-16W-000 Venkel
77 NOPOP 1 T1 3.3 mH TelCom IND-CMC-7X8 750311349 Wurth/Mid-com
90 NOPOP 1 V1A 1000 V 1000V GDT GDT-RA-C6-Y RA-102M-C6-Y OKAYA
91 NOPOP 1 V1B 800 V 800V GDT GDT-450-6X8MM GTCA28-801L-P05 Tyco
92 NOPOP 1 V2A 350 V 350V GDT GDT-RA-C6-Y RA-351M-C6-Y OKAYA
93 NOPOP 1 V2B 350 V 350V GDT GDT-450-6X8MM GTCA28-351L-P05 Tyco
2 2 C2 C39 10 µF 10V ±20% X7R C1206 C1206X7R100-106M Venkel
3 27 C3, C4, C5, C10, C12, C14, C24, C25, C26, C27, C28, C29, C30, C33, C35, C53, C56, C57, C58, C59, C61, C62, C63, C71, C72, C75, C96
0.1 µF 10V ±20% X7R C0402 C0402X7R100-104M Venkel
4 2 C6, C17 100 µF 16V ±20% Alum_Elec C6.6X6.6MM EEEFK1C101P Panasonic
5 16 C7, C11, C18, C20, C21, C22, C23, C31, C34, C37, C43, C54, C55, C65, C69, C74
1 µF 10V ±10% X7R C0603 C0603X7R100-105K Venkel
6 3 C8, C49, C66
10 µF 16V ±10% X5R C0805 C0805X5R160-106K Venkel
7 4 C13, C52, C70 C73
560 pF 16V ±10% X7R C0603 C0603X7R160-561K Venkel
8 2 C15, C19 2.2 nF 16V ±10% X7R C0603 C0603X7R160-222K Venkel
9 2 C40, C48 0.1 µF 50V ±10% X7R C0603 C0603X7R500-104K Venkel
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 53
10 1 C41 560 µF 6.3V ±20% Alum_Elec C3.5X8MM-RAD EEUFM0J561 Panasonic
11 3 C42, C51, C60
0.01 µF 25 V ±10% X7R C0402 C0402X7R250-103K Venkel
12 2 C44, C45 470 µF 25 V ±20% Alum_Elec C10.3X10.3MM EMVE250ADA471MJA0G
United Chemicon
13 1 C98 4.7 µF 6.3 V ±10% X5R C0603 C0603X5R6R3-475K Venkel
14 8 DN1, DN2, DN3, DN4, DN5, DN6, DN7, DN8,
15 V 225 mW 15 V Zener, Dual SOT23-AAK MMBZ15VDLT1G On Semi
15 7 D1, D2, D3, D6, D14, D15, D49
MMBD3004S-7-F 225 mA 300 V DUAL SOT23-AKC MMBD3004S-7-F Diodes Inc.
16 13 D5, D41, D42, D43, D44, D45, D46, D47, D48, D50, D51, D52,
D53
RED 25 mA 1.9 V SMT, Chip-LED
LED-HSMX-C170 HSMC-C170 Avago Technolo-
gies
17 4 D7, D9, D11, D13
STPS140Z 1.0 A 40 V Schottky SOD-123 STPS140Z ST MICRO
18 1 D12 Bridge Rectifier
0.8 A 100 V BRIDGE MiniDIP4 HD01-T Diodes Inc.
19 1 D54 BAV23A 400 mA 200 V DUAL SOT23-KKA BAV23A Diodes Inc.
20 9 FB1, FB2, FB3, FB4, FB6, FB7, FB8, FB9,
FB11
600 200 mA SMT L0603 BLM18AG601SN1 MuRata
21 4 HD5, HD6, HD7, HD8
Screw MH-125NP NSS-4-4-01 Richco Plastic Co
22 4 HW1, HW2, HW3, HW4
Standoff N/A 2397 SPC Tech-nology
23 4 JP1, JP2, JP3, JP4
Header 5x1 Header CONN1X5-TSW TSW-105-07-T-S Samtec
24 3 JP5, JP23, JP24
Header 1x3 Header CONN-1X3 TSW-103-07-T-S Samtec
25 9 JP6, JP7, JP8, JP9,
JP10, JP12, JP13, JP14,
JP15
Jumper Header CONN-1X2 TSW-102-07-T-S Samtec
26 1 JP11 HEADER 4X1 Header CONN-1X4 TSW-104-07-T-S Samtec
27 1 JP16 4X1 Socket Socket CONN-1X4 SSW-104-01-T-S Samtec
28 2 JP33, JP34 JUMPER Unshrouded CONN-1X2 68000-402 Berg
29 1 J1 RJ10 - Handset Handset RJ10-4P4C 806-GMX-N-44 Mouser
30 1 J2 RCA Jack RCA CONN-RCA-RCJ-04X
161-0097-E Kobiconn
Table 7. MotherBoard Bill of Materials (Continued)
Item NI Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
54 Rev. 0.4
31 1 J5 RJ–11 RJ-11 RJ11-DUAL-MTJG MTJG-2-64-2-2-1 ADAM TECH
32 1 J6 HEADER 5x3 Header CONN3X5 TSW-105-07-S-T Samtec
34 1 J8 CONN TRBLK 2 TERM BLK CONN-1X2-TB 1729018 PHOENIX CONTACT
35 1 J9 Power Jack 1 A BARREL CONN-3-PWR ADC-002-1 Adam Tech
36 1 J10 DB9 D-SUB CONN-9-DBF D09S33E4GX00LF FCI
37 1 J11 USB Type B USB CONN-USB-B 292304-1 Tyco
38 1 J30 5x2 Shrouded Header
Shrouded CONN2X5-4W 5103309-1 Tyco
39 1 J101 HEADER 8x2 Header CONN2X8 TSW-108-07-S-D Samtec
40 1 J103 8x2 Shrouded Header
Shrouded CONN2X8-4W 5103309-3 Tyco
41 1 K1 Relay HV DPDT RLY-TXS2SA FTR-C1GA4.5G Fujitsu
42 1 LS1 Speaker 0.5 W Max
SPEAKER-RE2308NL
RE-2308-NL Regal
43 1 MK1 Microphone MIC-6X2.7mm CMC-2742PBJ-A CUI Inc
44 2 Q1 Q4 MMBTA06LT1 500 mA 80 V NPN SOT23-BEC MMBTA06LT1 On Semi
45 1 Q3 FCX1051ATA 2 W 40 V NPN SOT89-BCE FCX1051ATA Zetex
46 1 Q5 MMBT3906-7-F 200 mA 40 V PNP SOT23-BEC MMBT3906-7-F Diodes Inc.
47 4 R1, R57, R98, R104
0.05 1/4 W ±5% ThickFilm R0805 LCR0805-R050J Venkel
49 2 R3, R28 200 1/10 W ±1% ThickFilm R0603 CR0603-10W-2000F Venkel
50 16 R4, R17, R19, R20, R25, R31, R40, R41, R42, R43, R52, R60, R87, R91
R109, R110, R111, R112,
R113
10 k 1/10 W ±1% ThickFilm R0603 CR0603-10W-1002F Venkel
51 6 R5, R18, R36, R37, R38, R45
100 k 1/10 W ±1% ThickFilm R0603 CR0603-10W-1003F Venkel
52 4 R6, R7, R11, R21
2 k 1/10 W ±1% ThickFilm R0603 CR0603-10W-2001F Venkel
53 2 R9, R32 0 1A ThickFilm R0603 CR0603-16W-000 Venkel
54 1 R10 4.7 k 1/16 W ±5% ThickFilm R0603 CR0603-16W-472J Venkel
55 1 R12 5.1 k 1/16 W ±5% ThickFilm R0603 CR0603-16W-512J Venkel
56 2 R13, R24 50 k TRIM POT-PV37W PV37W503C01B00 Murata
57 5 R14, R16, R33, R34,
R35
1 k 1/16 W ±1% ThickFilm R0603 CR0603-16W-1001F Venkel
Table 7. MotherBoard Bill of Materials (Continued)
Item NI Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 55
58 1 R15 49.9 k 1/16 W ±0.5%
ThickFilm R0603 CR0603-16W-4992D Venkel
59 1 R22 499 1/10 W ±1% ThickFilm R0603 CR0603-10W-4990F Venkel
60 3 R23, R29, R44
3.01 k 1/16 W ±1% ThickFilm R0603 CR0603-16W-3011F Venkel
61 1 R27 324 k 1/10 W ±1% ThickFilm R0603 CR0603-10W-3243F Venkel
62 1 R30 10 M 1/16 W ±1% ThickFilm R0603 CR0603-16W-1005F Venkel
64 1 R59 1 1/10 W ±1% ThickFilm R0603 CR0603-10W-1R00F Venkel
65 2 R69, R70 0 10 A 0 Wire RES-7MM ZOR-12-R Yageo
66 2 R84, R85 1.5 k 1/16 W ±5% ThickFilm R0603 CR0603-16W-152J Venkel
67 1 R96 3.57 1/10 W ±1% ThickFilm R0603 CR0603-10W-3R57F Venkel
68 3 R97, R99, R101
200 1/10 W ±5% ThickFilm R0603 CR0603-10W-2000J Venkel
69 2 R100, R102 1.33 K 1/10 W ±1% ThickFilm R0603 CR0603-10W-1331F Venkel
70 2 R103, R105 1.6 1/4 W ±5% ThickFilm R1206 CR1206-8W-1R6J Venkel
72 11 R155, R156, R157, R158, R159, R160, R161, R162, R163, R169,
R170
681 1/10 W ±1% ThickFilm R0603 CR0603-10W-6810F Venkel
73 1 S1 SW Pushbutton
50 mA 12 Vdc Tactile SW4N6.5X4.5-PB 101-0161-EV Mountain Switch
74 4 TP1, TP10, TP12, TP13
Red Loop Testpoint 151-207-RC Kobiconn
75 5 TP2, TP7, TP8, TP9,
TP25
Turret Turret TP[12594] 2551-2-00-44-00-00-07-0
Mill-Max
76 10 TP5, TP6, TP16, TP17, TP19, TP20, TP21, TP22, TP23, TP24,
Blue Loop Testpoint 151-205-RC Kobiconn
78 2 U1, U3 LT1963A-3.3 V 1.5 A max
LDO SOT223 LT1963AEST-3.3#PBF
Linear Tech-nologies
79 1 U2 Si3000 VOICE CODEC
SO16N6.0P1.27 SI3000-KS SiLabs
80 1 U4 LM4862 SO8N6.0P1.27 LM4862M National Semicon-
ductor
81 1 U5 EEPROM 32K Serial TSSOP8N6.4P0.65 25LC320A-I/ST Microchip Technology
82 2 U8, U10 5 0.5 A max
LDO TO263-3N LM2937ES-5.0 National Semicon-ductors
83 1 U11 MAX3237 5.5 V RS232 TSSOP28 MAX3237EIPWR TI
Table 7. MotherBoard Bill of Materials (Continued)
Item NI Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
56 Rev. 0.4
84 1 U12 CP2102 MCU QFN28N5X5P0.5 CP2102-GM SiLabs
85 2 U13, U14 IDT74CBTLV3257 MUX TSSOP16N6.4P0.65 IDT74CBTLV3257PGG
IDT
86 1 U18 DS1818 3.3 V 10% SOT-23 DS1818-10 Dallas Semicon-
ductor
87 3 U20, U21, U22
AD8602ARM SOP8N4.9P0.65 AD8602ARM Analog Devices
88 1 U26 74LCX541 Buffer TSSOP20N6.4P0.65 74LCX541MTC Fairchild
89 1 U27 MAX4521 TSSOP16N6.4P0.65 MAX4521CUE+ Maxim
Table 8. Motherboard Bill of Materials (Non-Populated Footprints)
Item Qty Reference Value Rating Tol Dielectric PCB Footprint Manufacturer Part Number
Manufacturer
91 3 R1,R73,R102 0R 1/16 W RC0603 CR0603-16W-000T Venkel
92 2 R31,R32 10k 1/16 W ±5% RC0603 CR0603-16W-103JT Venkel
93 1 C10 10 uF 10 V ±10%
X7R CC0805 GRM21BR71A106KE51L Murata
Table 7. MotherBoard Bill of Materials (Continued)
Item NI Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 57
7.2. Daughter Card Bill of Materials
Table 9. Si24xx Daughter Card Bill of Materials
Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
1 2 C1, C2 33 pF Y2 250 V ±10% Y2 C1808 SCC1808X330K502T Holy Stone
2 1 C3 0.01 µF 250 V ±10% X7R C0805 GRM21BR72E103KW03L Murata
3 1 C4 1 µF 50 V ±20% Alum_Elec C3.3X3.3MM EEE1HS010SR Panasonic
4 2 C5, C6 0.1 µF 16 V ±20% X7R C0603 C0603X7R160-104M Venkel
5 1 C7 2.7 nF 50 V ±20% X7R C0603 C0603X7R500-272M Venkel
6 2 C8, C9 680 pF Y2 250 V ±10% Y2 C1808 SCC1808X681K502T Holy Stone
7 1 C10 0.01 µF 16 V ±20% X7R C0603 C0603X7R160-103M Venkel
8 2 C40, C41
18 pF 50 V ±5% COG C0603 C0603COG500-180J Venkel
9 3 C50, C52, C56
0.1 µF 10 V ±20% X7R C0603 C0603X7R100-104M Venkel
10 2 C51, C53
0.22 µF 6.3 V ±10% X5R C0603 C0603X7R6R3-224K Venkel
11 1 C54 1 µF 25 V ±10% X5R C0603 C0603X5R250-105K Venkel
12 1 D1 HD04 0.8 A 400 V BRIDGE MiniDIP4 HD04-T Diodes Inc.
13 3 FB1, FB2, FB5
600 200 mA SMT L0603 BLM18AG601SN1 Murata
14 1 J1 SOCKET 8x2 SOCKET SOCKETX8-100-SMT SSW-108-22-G-D-VS Samtec
15 1 J2 4X1 Header_0 CONN1X4-100-SMT TSM-104-01-T-SV Berg
16 2 Q1 Q3 MMBTA42LT1 200 mA 300 V NPN SOT23-BEC MMBTA42LT1 On Semi
17 1 Q2 MMBTA92LT1 100 mA 300 V PNP SOT23-BEC MMBTA92LT1 On Semi
18 2 Q4 Q5 MMBTA06LT1 500 mA 80 V NPN SOT23-BEC MMBTA06LT1 On Semi
19 1 RV1 P3100SB 275 V Sidactor DO-214AA-NP P3100SBL Littelfuse
20 1 R1 1.07 k 1/2 W ±1% ThickFilm R2010 CR2010-2W-1071F Venkel
21 1 R2 150 1/16 W ±5% ThickFilm R0603 CR0603-16W-151J Venkel
22 1 R3 3.65 k 1/2 W ±1% ThickFilm R2010 CR2010-2W-3651F Venkel
23 1 R4 2.49 k 1/2 W ±1% ThickFilm R2010 CR2010-2W-2491F Venkel
24 2 R5, R6 100 k 1/16 W ±5% ThickFilm R0603 CR0603-16W-104J Venkel
25 2 R7, R8 20 M 1/8 W ±5% ThickFilm R0805 CR0805-8W-206J Venkel
26 1 R9 1 M 1/16 W ±1% ThickFilm R0603 CR0603-16W-1004F Venkel
27 1 R10 536 1/4 W ±1% ThickFilm R1206 CR1206-4W-5360F Venkel
28 1 R11 73.2 1/2 W ±1% ThickFilm R2010 CR2010-2W-73R2F Venkel
29 2 R12, R13
56.2 1/16 W ±1% ThickFilm R0603 CR0603-16W-56R2F Venkel
30 2 R15, R16
0 1 A ThickFilm R0603 CR0603-16W-000 Venkel
31 2 R120, R121
0 1 A ThickFilm R0603 CR0603-16W-000 Venkel
32 1 R18 1.2 k 1/10 W ±5% ThickFilm R0603 CR0603-10W-121J Venkel
33 4 R101, R102, R103, R104, R106
10 k 1/10 W ±5% ThickFilm R0603 CR0603-10W-103J Venkel
34 1 R105 1 k 1/10 W ±5% ThickFilm R0603 CR0603-10W-102J Venkel
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
58 Rev. 0.4
35 3 R110, R111, R112
200 1/10 W ±5% ThickFilm R0603 CR0603-10W-2000J Venkel
36 1 U2 Si3018 300 V LineSide SO16N6.0P1.27 Si3018-F-GS SiLabs
37 1 U12 Si24xx ISOMODEM TSSOP24N6.4P0.65 Si2493-E-FT SiLabs
38 1 U13 Si24xx 16pin SOIC Si24xx Silicon Laboratories
39 1 Y1B (Y1, Y3)
32.768 kHz XTAL-3X8-LD ECS–.327–12.5–8X ECS International
40 1 Z1 43 V 500 mW 43 V Zener SOD-123 BZT52C43-7-F Diodes Inc.
Table 10. Daughter Card Bill of Materials (Non-Populated Footprints)
Item Qty Reference Value Rating Tol Dielectric PCB Footprint Manufacturer Part Number
Manufacturer
1 1 C50 0.1 µF 16 V ±20% X7R CC0603 C0603X7R160-104MNE Venkel
2 2 C55,C56 0.1 µF 10 V ±20% X7R CC0603 C0603C124K Kemet
3 1 R18 1.3 k 1/16 W ±5% RC0603 CR0603-16W-132JT Venkel
4 5 R19,R20,R21,R22,R23
0 1/16W ±5% RC0603 CR0603-16W-000J Venkel
5 1 U4 Si2401 16pin SOIC Silicon Labs
Table 9. Si24xx Daughter Card Bill of Materials (Continued)
Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 59
7.3. QFN Daughter Card Bill of Materials
Table 11. Si24xx QFN Daughter Card Bill of Materials
Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
1 2 C1, C2 33 pF Y2 250 V ±10% Y2 C1808 SCC1808X330K502T Holy Stone
2 1 C3 0.01 µF 250 V ±10% X7R C0805 C0805X7R251-103K Venkel
3 1 C4 1 µF 50 V ±20% Alum_Elec C3.3X3.3MM EEE1HS010SR Panasonic
5 2 C5, C6 0.1 µF 16 V ±20% X7R C0603 C0603X7R160-104M Venkel
6 1 C7 2.7 nF 50 V ±20% X7R C0603 C0603X7R500-272M Venkel
7 2 C8, C9 680 pF Y2 250 V ±10% Y2 C1808 SCC1808X681K502T Holy Stone
8 1 C10 0.01 µF 16 V ±20% X7R C0603 C0603X7R160-103M Venkel
9B 2 C40, C41 18 pF 50 V ±5% COG C0603 C0603COG500-180J Venkel
10 5 C50, C52, C55, C56,
C57
0.1 µF 10 V ±10% X7R C0402 C0402X7R100-104K Venkel
11 1 C51 0.22 µF 10 V ±10% X7R C0603 C0603X7R100-224K Venkel
12 1 C54 1 µF 25 V ±10% X5R C0603 C0603X5R250-105K Venkel
13 1 D1 HD04 0.8 A 400 V BRIDGE MiniDIP4 HD04-T Diodes Inc.
14 3 FB1, FB2, FB5
600 200 mA SMT L0603 BLM18AG601SN1 MuRata
15 2 JP1, JP2 JUMPER Header CONN-1X2 TSW-102-07-T-S Samtec
16 1 J1 SOCKET 8x2 SOCKET SOCKETX8-100-SMT SSW-108-22-G-D-VS Samtec
17 1 J2 4X1 Header SMT CONN1X4-TSM TSM-104-01-T-SV Samtec
18 2 Q1, Q3 MMBTA42LT1 200 mA 300 V NPN SOT23-BEC MMBTA42LT1 On Semi
19 1 Q2 MMBTA92LT1 100 mA 300 V PNP SOT23-BEC MMBTA92LT1 On Semi
20 2 Q4, Q5 MMBTA06LT1 500 mA 80 V NPN SOT23-BEC MMBTA06LT1 On Semi
21 1 RV1 P3100SB 275 V Sidactor DO-214AA-NP P3100SBL Littelfuse
22 1 R1 1.07 k 1/2 W ±1% ThickFilm R2010 CR2010-2W-1071F Venkel
23 1 R2 150 1/16 W ±5% ThickFilm R0603 CR0603-16W-151J Venkel
24 1 R3 3.65 k 1/2 W ±1% ThickFilm R2010 CR2010-2W-3651F Venkel
25 1 R4 2.49 k 1/2 W ±1% ThickFilm R2010 CR2010-2W-2491F Venkel
26 2 R5, R6 100 k 1/16 W ±5% ThickFilm R0603 CR0603-16W-104J Venkel
27 2 R7, R8 20 M 1/8 W ±5% ThickFilm R0805 CR0805-8W-206J Venkel
28 1 R9 1 M 1/16 W ±1% ThickFilm R0603 CR0603-16W-1004F Venkel
29 1 R10 536 1/4 W ±1% ThickFilm R1206 CR1206-4W-5360F Venkel
30 1 R11 73.2 1/2 W ±1% ThickFilm R2010 CR2010-2W-73R2F Venkel
31 2 R12, R13 56.2 1/16 W ±1% ThickFilm R0603 CR0603-16W-56R2F Venkel
32 2 R15, R16 0 1 A ThickFilm R0603 CR0603-16W-000 Venkel
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
60 Rev. 0.4
33 1 R18 1.2 k 1/16 W ±5% ThickFilm R0402 CR0402-16W-122J Venkel
34 2 R101, R104
10 k 1/10 W ±5% ThickFilm R0603 CR0603-10W-103J Venkel
36 1 R122 0 1 A ThickFilm R0402 CR0402-16W-000 Venkel
38 1 U1 Si2494/39 ISOMODEM QFN38N5X7P0.5 Si2494-A-FM/Si2439-A-FM
SiLabs
39 1 U2 Si3018 300 V LineSide SO16N6.0P1.27 Si3018-F-GS SiLabs
40 1 U3 EEPROM 32K Serial TSSOP8N6.4P0.65 25LC320A-I/ST Microchip Technology
41 1 Y1A 32.768 kHz XTAL-3X8-LD ECS–.327–12.5–8X ECSInternational
44 1 Z1 43 V 500 mW 43 V Zener SOD-123 BZT52C43-7-F Diodes Inc.
Table 12. Si24xx QFN Daughter Card Bill of Materials (Non-Populated Footprints)
Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
4 1 C4X 1 µF 25 V ±10% X8R C1206 C3216X8R1E105K TDK
9 2 C40, C41 33 pF 50 V ±5% COG C0402 C0402COG500-330J Venkel
32B 2 R120,R121
0 1 A ThickFilm R0603 CR0603-16W-000 Venkel
34 1 R103 10 k 1/10 W ±5% ThickFilm R0603 CR0603-10W-103J Venkel
35 1 R102 1 k 1/10 W ±5% ThickFilm R0603 CR0603-10W-1001J Venkel
36B 1 R123 0 1 A ThickFilm R0402 CR0402-16W-000 Venkel
42 1 Y1B 4.9152 MHz XTAL-HC49U-SMT FOXSDLF/049-20 FOX Electronic
43 1 Y1C 27 MHz 3.3 V XTAL OSC OSC4N5X3.2-FOX924 FOX924B-27.000 FOX
Table 11. Si24xx QFN Daughter Card Bill of Materials
Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 61
8. Complete Design Package on CD
(See Sales Representative for Details)
Silicon Laboratories can provide a complete design package of the Voice ISOmodem EVB including the following:
OrCad Schematics
Gerber Files
Please contact your local sales representative or Silicon Laboratories headquarters sales for ordering information.
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
62 Rev. 0.4
DOCUMENT CHANGE LIST
Revision 0.1 to Revision 0.2 Updated Voice Motherboard description,
schematics, silkscreens, and configuration from 1.0 to 2.0 revision.
Updated Daughtercard description, schematics, silkscreens, and configuration.
Added support for Si2494/39 voice and data modems.
Updated "Description" on page 1.
Updated "2.Daughter Cards" on page 4.
Added "4.1.7.Surge Protection Circuits" on page 24.
Updated "4.1.8.2.The Call Progress Signal" on page 26.
Updated "4.2.Daughter Cards" on page 28.
Added "4.2.4.Daughter Card Strapping and Jumper Options" on page 29.
Added "7.3.QFN Daughter Card Bill of Materials" on page 59.
Added "8.Complete Design Package on CD" on page 61.
Updated Figure 5, “Function and Location of Global Voice ISOmodem EVB Jumpers,” on page 6.
Updated Figure 29 on page 34.
Added Figure 31, “QFN Daughter Card (Si24xx2G-QFN38-DC Rev 1.0) System Side,” on page 36.
Added Figure 32, “Daughter Card (Si24xx2G-QFN38-DC Rev 1.0) Line Side,” on page 37.
Added Figure 43, “QFN Daughter Card Primary Side, Component and Silkscreen,” on page 48.
Added Figure 44, “QFN Daughter Card Secondary Side, Component and Silkscreen,” on page 49.
Added Figure 45, “QFN Daughter Card Primary Side,” on page 50.
Added Figure 46, “QFN Daughter Card Secondary Side,” on page 51.
Updated Table 2, “Digital Data Related Jumpers,” on page 7.
Added Table 11, “Si24xx QFN Daughter Card Bill of Materials,” on page 59.
Added Table 12, “Si24xx QFN Daughter Card Bill of Materials (Non-Populated Footprints),” on page 60.
Revision 0.2 to Revision 0.3 Updated Table 3, “Sound Related Jumpers,” on
page 8.
Corrected R13 adjustment information.
Changed obsolete references, such as “JP5”.
Updated Table 5, “Board Configuration,” on page 21.Added missing jumper information.
Revision 0.3 to Revision 0.4 Updated "3.3.USB Interface Data Link Setup Quick
Start" on page 9.Removed JP5 reference.
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 63
NOTES:
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