Global Markets for Next Generation PICs · Global market sales: photonics components Summary photonics market •Forecast to grow to $43B by 2025 with 7% CAGR (20-25) –Includes

1

Global Markets for Next Generation PICs

Michael Lebby, CEO

Lightwave Logic (LWLG:OTCQB)

14th June 2017, s’Hertogenbosh

Overview

• Introduction

• Environment and markets

• PIC Platforms and roadmap analysis

• New PIC markets

– Biophotonics, medical, consumer

• Closing remarks

NB: These green bars give a summary of each slide

https://youtu.be/wwbQt6tmVgk

https://youtu.be/wwbQt6tmVgk?t=18s

2

Introduction (and memory challenge)

3 takeaways to remember today…

• Photonics enables many things. It’s already part of our lifestyle…

• Photonics will be integrated – just like ICs 50 years ago and drive new product designs and markets…

• Is integrated photonics a paradigm shift for the tech community?

Our thirst for smaller, lighter, faster will enable PICs…



3

The Environment: Quick Review

Bell’s Photophone

1880 - Photophone Transmitter

1880 - Photophone Receiver

“The ordinary man…will find a little difficulty in comprehending how sunbeams are to be used. Does Prof. Bell intend to connect Boston and Cambridge…with a line of sunbeams hung on telegraph posts, and, if so, what diameter are the sunbeams to be…?…will it be necessary to insulate them against the weather…?…until (the public) sees a man going through the streets with a coil of No. 12 sunbeams on his shoulder, and suspending them from pole to pole, there will be a general feeling that there is something about Prof. Bell’s photophone which places a tremendous strain on human credulity.”

New York Times Editorial, 30 August 1880

Was he lucky or visionary? Perhaps even clairvoyant?

Source: UCSC

https://youtu.be/wwbQt6tmVgk?t=1m22s



4

Video driving internet traffic…

I guess Prof Bell and his ‘photophone’ was indeed correct…Source: Cisco VNI

Kilo = 103

Mega = 106

Giga = 109

Tera = 1012

Peta = 1015

Exa = 1018

Zetta = 1021

Yotta = 1024

Home Mbps Datacenter Gbps

Old phone Kbps

Front plates Tbps

Traffic Traffic today Traffic tomorrow

International Metric

Photophone video

IP traffic

Addressing datacenter needs



5

Datacenter engineering headaches

LARGER

FASTER

GREENER

DENSER

SM fiber

400G plus

Less than 2W/port

Integrated photonics and packaging

ECONOMIC ~ $1/Gbps

Integrated photonics platform

Scalable PIC platform Will Win Datacenter Market

Datacenter

DC Single Mode Fiber Growth

500m 2km 10km

~100m

Volume in modern data center is moving up to longer distances 500m ~ 2km

STOP

Multi Mode Fiber (SR)

Single Mode Fiber (LR)

400G

100/400G becomes more ubiquitous using SM fiber…

400G

VCSEL laser

DFB laser

~200m

LARGER Single Mode Fiber



6

400Gbps, 1Tbps and Beyond…• While 10Gbps and 100Gbps are sweet spots (systems designed to these

speeds), 400Gbps represents the next ‘sweet spot’ for network designers.

The battle for datacenter will be at 400Gbps…

Source: Ethernet Alliance

FASTER 400G +

400G

• Classic TxRx solution

– High labor, assembly costs

– Precision alignment

– Discrete components

• PIC platform

– With large format wafer scale manufacturing; FC InP/GaAs sources, 3D silicon design, integrated optics, CoB, SiOB…

Using ‘silicon-like’ platform also enables scaling…

PIC enables integration

Source: Lucent, Entroptix, JDSU, Nortel

Integrated photonics and packagingDENSER



7

Smaller Box Quest Denser Faceplates• Line cards today in the datacenter regularly achieve traffic transfer of 40Gbps x

10 transceivers, which totals 400Gbps or 0.4Tbps and 100Gbps x 10 = 1Tbps– Designs today are moving towards 22 QSFP28 x 100Gbps = 2.2Tbps

• Customers are requesting 50-100Tbps solutions…

• Integrated photonics (PICs) has the potential of 250 x 400Gbps = 100Tbps…

Integrated Photonics Enables Smaller Boxes…Higher Traffic

Source: www.cables-solutions.com

DENSERSmallest Footprint

(QSFP, uQSFP)

• Bandwidth density growing at 1 decade per 7 years: SLOWER than switch capacity growth!

The challenge of bandwidth (BW) density

Concern: pluggable optics needs to scale faster at 400G+

OSFP = Octal SFP; QSFP = Quad SFP

Switch capacity growth(smaller <100G but greater >100G)

DENSER Smallest Footprint

(QSFP, OSFP)

Source: Google (2017)

BW density Gap appearing



8

The challenge in faceplates…

Faceplate is now crammed…fiber to on-board optics?

Standard 1RU faceplate with 48 ports

By using 16 fibers to connect TxRxon board then more room on faceplate for cooling

Transceiver boxes have been shrinking quickly… which opens opportunities for polymer based technology

DENSER Smallest Footprint

(QSFP, uQSFP)

Source: TE Connectivity, Molex

Lower power Drives New Form Factors

• Stringent power requirements is forcing new form factors in transceiver design

Smaller drives lower power

Source: Ethernet Alliance

GREENER Less than 2W/port

On-board optics via fiber connection through the faceplate



9

Lower power Critical for 400Gbps+

• Energy improvement ~1 decade of Energy/Bit every 10years

• Aggressive thermal management needed for 400Gbps and beyond

Thermal management: critical issue to address

Source: Google (Zhou et al 2017)

GREENER Less than 10pJ/bit

Addressing economic designsPICs have the potential at 100 and 400Gbps to be

scalable in cost structure…

ECONOMIC ~ $1/Gbps

Source: Lightwave Logic

Integrated photonics is key to achieve economics of scale

10

1

10

1

0.1

2025

2025



10

Global market sales: photonics components

Summary photonics market

• Forecast to grow to $43B by 2025 with 7% CAGR (20-25)

– Includes both Discrete and PIC components

– Photonics components market forecasted to reach $21B in 2017

Strong growth forecasted in photonics components

$43B




11

Photonics components segments

• Segments split between WAN, access, and datacom

• Photonics components grows to $43B in 2025

– WAN forecast to $27B by 2025 with 19% CAGR (20-25)

– Datacom forecast $12.1B by 2025 with 22% CAGR (20-25)

Datacom and photonics components drive growth

$43B

$21B


PIC based technologies• PIC technologies ~$30B by 2025 with 16% CAGR (20-25)

– PICs include InP, GaAs, Other/SiP/Polymer reach 69% by 2025

– PIC based technologies are expected to reach $5B in 2017 at 24% of the photonic components market

PIC based technologies become de facto by 2025

$43B

$30B, 69%




12

Transceivers grow significantly

• Photonics Components achieve $43B in 2025

• Photonics Transceivers achieve $25B in 2025

Fiber optic transceiver growth strong next decade

$43B

$25B, 58%


Photonic transceivers

• Key segments achieve $11.3B in 2017

– Strong growth for DWDM, Ethernet-datacom, and WAN-client based transceivers over the forecast period

TxRx growth driven by WAN, Ethernet and DWDM segments

$11B

$25B




13

PIC transceiver forecast to 2025

• PIC TxRx forecast to $20B by 2025 with 17% CAGR (20-25)

– PIC based TxRx are expected to reach $3.2B in 2017

– PIC based technologies lead the segment by 2021

PIC transceivers surpass discrete TxRx ~2021

$3.2B

$20B


PIC transceiver market

• PIC transceivers are driven by the WAN-client side, Ethernet and DWDM markets

– Driven by high performance (100Gbps, 400Gbps) based TxRxtechnology

PIC based technologies drive high performance solutions

$20B




14

PIC enabling Ethernet TxRx

100GE main driver for PIC based technologies

• Ethernet based transceivers driven by 100GE based PIC technology solutions

– 100GE forecast to $4.5B by 2025 with 6% CAGR (20-25)

– 400GE forecast to $0.9B by 2025 with 16% CAGR (20-25)

100G

$7B

$4.5B

$0.9B


Global market volume: photonics components



15

Summary photonics market volume

• Forecast to grow to 420M by 2025 with 6% CAGR (20-25)

– Includes both Discrete and PIC components

– Photonics components market volume forecasted to reach 242M in 2017

Strong growth volume forecasted in photonics components

$420M units


Summary photonics market

• Forecast to 420M units by 2025 with 6% CAGR (20-25)

– Ethernet 172M units with 6% CAGR (20-25)

– WAN 215M units with 6% CAGR (20-25)


$215M units

$172M units

$34M units




16

Top segments: photonics volume

• Segments >10M volume in 2017 grow quickly to 2025

– Led by Datacom receivers (68M); WDM filters (47M) in 2025

– Top segments generate >365M (over 87% volume by 2025)


365M units

245M units


Summary transceiver volume• Transceiver volume approaches 100M by 2025 with 4%

CAGR (20-25)

– Volume driven by Ethernet and Radio (RF) markets

– Ethernet transceivers >43M by 2025 (24M units in 2017)

Transceiver volume grows linearly

99M units

66M units




17

Transceiver volume in units

• Key segments of Ethernet and Radio grow quickly

– Ethernet and Radio total 74M units (~74% of the volume)

– Other key segments include: AOC & optical engine, FC, WAN

Volume is driven by 2 key market segments

99M units

31M units

43M units


Ethernet volume in units • Ethernet volume grows quickly by 2025 @ 43M units

– Ethernet volume by 2025 in 100G @ 13M units

– Ethernet volume by 2025 in 400G @ 1M units

Volume is driven by 10G and 100G with 400G growing

14M units

13M units


1M units



18

Line-side modules volume

• Line-side modules 37M units 2025 with 18% CAGR (20-25)

– Segments include Mux/Demux, ROADM, Amplifiers, Interleavers, CATV Amplifiers, DCM, DGEF, OPMs

Volume in grows strongly to 37M units by 2025

Source: Lightwave Logic; DGEF=Dynamic Gain Equalization Fiber, DCM=Dispersion Compensating Module, OPM=Optical Power Meter

37M units

5.6M units

Line-side modules volume

• Line-side modules 37M units 2025 with 18% CAGR (20-25)

– Driven strongly by Mux/Demux datacom volumes (28M in 2025)

– Followed by Mux/Demux telecom volumes (6.5M in 2025)

Volume in datacom mux/demux dominates segment

37M units

5.6M units




19

PIC platforms

InP laserSiP and PP photonicsSi driver/TIASi Semi-custom ASIC

PIC platform will become OEICs with electronics

Integrated photonics is critical for datacenters…

All InP combinations of technology All SiP

InP laserInP photonicsInP driver/TIAInP Semi-custom ASIC

Silicon photonics

✔✔✔

✔✔✔

InP compound semiconductor

Incumbent

?

Polymer/Dielectric photonics

Polymer/Dielectric W/GPolymer/Dielectric SSCPolymer/Dielectric ModulatorPolymer/Dielectric Mux/Demux

✔✔✔✔



20

The Challenge for PICs…

Beating customer expectations…

• Customers want $1/Gbps at 400Gbps…

– This is $400 per link ($200 per TxRx) at 400Gbps

– Industry expected to fall behind gap appears

– By 2025 industry - customer gap widens…problem

Gap in $/Gbps$1/Gbps

Source: Oculi llc

Industry lagging innovation needed



21

Innovation drives scaling to $1/Gbps

Meet customer expectations using silicon economics

Acceleration path from a PIC platform

Source: Oculi llc

Innovation needed to accelerate path to $1/Gbps

Roadmapping customer expectations



22

Industry roadmap from 2015/6 (Ref: USC)

2015 2018 2020 2022

Modules/TxRx

Data rate density

Form factor

Typical link reach

Ind wish (@400Gbps)

Technology plan

Typical link reach

Ind wish (@400Gbps)

Technology plan

S/C chip line rate

Level of integration

Energy/bit

Modulation format

Packaging platform

Generic pkg design

Perf/real estate

Bumping design

Perf/channel

Channels/real estate

TSV processes

Chip interconnect

Fiber technology

AC/DC wafer test

Connector design

R&QA

25G PIC/OEIC M/Ch 100Gbps OEICNH 25GHz PIC OSA NH100Gbps OEIC OSA (SiP or C/S)

SiP PIC stk 10-25GHz TSV+3D stk 50GHz OEIC (SiP or C/S) 3D-baseline 3D 25GHz PIC 3D 50GHz PIC

Purple Brick Wall = Technology cost barrierSlanted Font: Major industry efforts are required for commercializationTechnologies noted in full proposal (black)

40Gbps 100Gbps 400Gbps 1000Gbps

<10km <10km <2km <2km <2km

10 Tbps/1U 25Tbps/1U 50Tbps/1U 100Tbps/1U 400Tbps/1U

$5/Gbps $2/Gbps <S0.5/Gbps

<$5/Gbps $0.5/Gbps$1/Gbps>$10/Gbps (<2km)

10-100m 5-50m 1-25m<$1/Gbps <$0.5/Gbps <$0.25/Gbps <$0.05/Gbps

$1/Gbps $0.25/Gbps <$0.15/Gbps

10-25Gbps 50Gbps 100Gbps >1000Gbps Disc Driver/TIA OEIC 100Gbps int Driver/TIAInt TIA OEIC int Driver/TIA 50Gbps

CFP4 QSFP DSFP SFP+ (new)

20pJ/b 10pJ/b 4pJ/b 2pJ/b 0.5-1pJ/b

25GHz FlipChip; 50GHz FlipChip 100GHz Flip Chip

25Gbps/Ch 50Gbps/Ch 100Gbps/Ch

CFP4/1D array QSFP and 2D array SFP & 2D array

100/mm2 500/mm2 1000/mm2 10,000/mm2

10Gb/mm2 40Gb/mm2 (inc driver/TIA) 80Gb/mm2 120Gb/mm2

300m 10G (1D array) 100m 25G (2D array/MCF)

NRZ NRZ/PAM4 NRZ/PAM4/8 NRZ/PAM4-16

10-25G 50G 100G

Std Bellcore Adv R&QA process R&QA C/S & SiP manf product

$1/Gbps

Purple Brick Wall

>100G

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Micro-SFP

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall Coherent?

3D 50GHz OEIC Purple Brick Wall 3D 100GHz OEICPurple Brick WallTSV+3D stk PIC 25GHz

Purple Brick WallNH 50Gbps OEIC OSA (SiP or C/S)10Gbps PIC Purple Brick Wall M/Ch 50G OEIC50G PIC/OEIC

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall 50m 50G (1D/MCF) 100m 25G (1D/MCF)Purple Brick Wall

Purple Brick Wall DSFP and 2D array

Purple Brick WallR&QA C/S and SiP for prototype

In 2015 roadmap focused on areas that needed attentionSource: USC

Industry roadmap analysis

2015 2018 2020 2022

Modules/TxRx

Data rate density

Form factor

Typical link reach

Ind wish (@400Gbps)

Technology plan

Typical link reach

Ind wish (@400Gbps)

Technology plan

S/C chip line rate


Energy/bit

Modulation format

Packaging platform

Generic pkg design

Perf/real estate

Bumping design

Perf/channel


TSV processes

Chip interconnect

Fiber technology

AC/DC wafer test

Connector design

R&QA



Purple Brick Wall = Technology cost barrier

Slanted Font: Major industry efforts are required for commercialization


<10km <10km <2km <2km <2km












100/mm2 500/mm2 1000/mm2 10,000/mm2




10-25G 50G 100G


$1/Gbps

Purple Brick Wall

>100G

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Micro-SFP

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall



Purple Brick WallNH 50Gbps OEIC OSA (SiP or C/S)10Gbps PIC Purple Brick WallM/Ch 50G OEIC50G PIC/OEIC

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall 50m 50G (1D/MCF) 100m 25G (1D/MCF)

Purple Brick Wall




Module TxRx 400Gbps by 2019 (on-target with initial prototypes in 2017)

Data rate density 100Tbps/1U by 2018 (delayed – 3-5 years today <10Tbps/1U)

Form Factor DSFP by 2018 (delayed – 2-3 years today QSFP moving to uQSFP, but not DSFP or equivalent yet )

Key metrics now delayed 2-5 years



23

Industry roadmap analysis – short links

2015 2018 2020 2022

Modules/TxRx

Data rate density

Form factor

Typical link reach

Ind wish (@400Gbps)

Technology plan

Typical link reach

Ind wish (@400Gbps)

Technology plan

S/C chip line rate


Energy/bit

Modulation format

Packaging platform

Generic pkg design

Perf/real estate

Bumping design

Perf/channel


TSV processes

Chip interconnect

Fiber technology

AC/DC wafer test

Connector design

R&QA



Purple Brick Wall = Technology cost barrierSlanted Font: Major industry efforts are required for commercialization


<10km <10km <2km <2km <2km












100/mm2 500/mm2 1000/mm2 10,000/mm2




10-25G 50G 100G


$1/Gbps

Purple Brick Wall

>100G

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Micro-SFP

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall




Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall


Purple Brick Wall




Typical link reach for TxRx 2km by 2019 (on-target as datacenters showing strong interest)

Industry wish $1/Gbps by 2018 (now delayed by ~5yrs as current rates are $5-15/Gbps)

Technology Plan No one achieved $1/Gbps in the industry in 2017 and not likely in 2018

Industry wish delayed; technology plan delayed

Industry roadmap analysis – very short links

2015 2018 2020 2022

Modules/TxRx

Data rate density

Form factor

Typical link reach

Ind wish (@400Gbps)

Technology plan

Typical link reach

Ind wish (@400Gbps)

Technology plan

S/C chip line rate


Energy/bit

Modulation format

Packaging platform

Generic pkg design

Perf/real estate

Bumping design

Perf/channel


TSV processes

Chip interconnect

Fiber technology

AC/DC wafer test

Connector design

R&QA



Purple Brick Wall = Technology cost barrierSlanted Font: Major industry efforts are required for commercialization


<10km <10km <2km <2km <2km












100/mm2 500/mm2 1000/mm2 10,000/mm2




10-25G 50G 100G


$1/Gbps

Purple Brick Wall

>100G

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Micro-SFP

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall




Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall


Purple Brick Wall




Typical link reach for TxRx 1-25m by 2020 (on-target as datacenters showing interest to replace MM fiber and potentially copper DAC)

Industry wish $0.25/Gbps by 2020 (delayed by ~5yrs as current rates are $2-5/Gbps: AOC $60 @100Gbps = $0.6/Gbps @100G but $2.4/Gbpsat 400G)

Technology Plan No one achieved $0.5/Gbps in the industry in 2017 and not likely by 2020

Key metrics delayed 2-5 years



24

New draft industry roadmap – data rates added

2017 2018 2020 2022

Modules/TxRx

Data rate density

Form factor

Typical link reach

Ind wish (@400Gbps)

Industry plan

Typical link reach

Ind wish (@400Gbps)

Industry plan



Purple Brick Wall = Technology cost barrierSlanted Red Font: Major industry efforts are required for commercialization

100Gbps 400Gbps 1000Gbps

<10km <10km <2km <2km <2km

10 Tbps/1U 25Tbps/1U 100Tbps/1U 400Tbps/1U






QSFP DSFP SFP+ (new)





100/mm2 500/mm2 1000/mm2 10,000/mm2




10-25G 50G 100G


$1/Gbps

Purple Brick Wall

>100G

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Micro-SFP

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall




Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall


Purple Brick Wall




2024 2026

Purple brick wall: delayed ~2-3 years to 2020-2022

$1/Gbps industry wish: delayed to 2021 for short links (2km) Industry late by ~2-3 years

$0.25Gbps industry wish: delayed to 2021 for very short links (25m) Industry late by ~2-3 years

mircoQSFP

Purple brick wall delayed 2-3 years

10 devices 100 devices 1000 devices 10,000 devices25Gbps 50Gbps 100Gbps 400GbpsPIC WDM Tx & Rx OEIC Int driver/TIA 50Gbps OEIC Int driver/TIA 100Gbps (serial) OEIC ASIC 50GbpsNRZ/PAM4 NRZ/PAM4-8 NRZ/PAM4-16 Coherent client-side6” Wafer/fab 8” Wafer/fab 8 & 12” Wafer/fab 15” Wafer/fab?


New draft industry roadmap – technologies added

2017 2018 2020 2022

Modules/TxRx

Data rate density

Form factor

Typical link reach

Ind wish (@400Gbps)

Industry plan

Typical link reach

Ind wish (@400Gbps)

Industry plan

InP Monolithic

SiP & InP/SiGe hybrid

Polymer Photonics

Dielectric Photonics

GaAs (VCSEL)



<10km <10km <2km <2km <2km







$1/Gbps

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Micro-SFP

Purple Brick Wall


2024 2026

mircoQSFP5 Key technologies: InP, SiP, Polymer, Dielectric, GaAs

Metrics: Level of integration, base data rate, function, electronic modulation, wafer size/fabrication

10 devices 100 devices 1000 devices 10,000 devices25Gbps 50Gbps (Laser-Mod) 100Gbps (laser-Mod) 400GbpsPIC WDM/MZ Mod Tx & Rx OEIC Int driver/TIA (SiP/InP) 50Gbps OEIC Int driver/TIA (Sip/InP) 100Gbps (serial)

OEIC ASIC 50GbpsNRZ/PAM4 NRZ/PAM4-8 NRZ/PAM4-16 Coherent client-side3-4” Wafer/fab 4” Wafer/fab 4 & 6” Wafer/fab 8” Wafer/fab

100 devices 1000 devices 10,000 devices 100,000 devices25Gbps 50Gbps 100Gbps 400GbpsPIC Tx & Rx OEIC Int driver/TIA 50Gbps OEIC Int driver/TIA 100Gbps (serial)NRZ/PAM4 NRZ/PAM4-8 NRZ/PAM4-16 Coherent client-side6” Wafer/fab 8” Wafer/fab 8 & 12” Wafer/fab 15” Wafer/fab

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

10 devices 100 devices 1000 devices 10,000 devices25Gbps 50Gbps 100Gbps (VCSEL-Mod) 400Gbps (VCSEL-Mod) VCSEL PIC 25Gbps VCSEL PIC 50Gbps VCSEL PIC 100Gbps (serial)NRZ/PAM4 NRZ/PAM4-8 NRZ/PAM4-16 Coherent client-side3-4” Wafer/fab 6” Wafer/fab 8 ” Wafer/fab

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall



25



New draft industry roadmap

2017 2018 2020 2022

Modules/TxRx

Data rate density

Form factor

Typical link reach

Ind wish (@400Gbps)

Industry plan

Typical link reach

Ind wish (@400Gbps)

Industry plan

InP Monolithic

SiP & InP/SiGe hybrid

Polymer Photonics

Dielectric Photonics

GaAs (VCSEL)


<10km <10km <2km <2km <2km







$1/Gbps

Micro-SFP


2024 2026

mircoQSFP

10 devices 100 devices 1000 devices 10,000 devices25Gbps 50Gbps (Laser-Mod) 100Gbps (laser-Mod) 400GbpsPIC WDM/MZ Mod Tx & Rx OEIC Int driver/TIA (SiP/InP) 50Gbps OEIC Int driver/TIA (Sip/InP) 100Gbps (serial) OEIC ASIC 50GbpsNRZ/PAM4 NRZ/PAM4-8 NRZ/PAM4-16 Coherent client-side3-4” Wafer/fab 4” Wafer/fab 4 & 6” Wafer/fab 8” Wafer/fab

100 devices 1000 devices 10,000 devices 100,000 devices25Gbps 50Gbps 100Gbps 400GbpsPIC Tx & Rx OEIC Int driver/TIA 50Gbps OEIC Int driver/TIA 100Gbps (serial)NRZ/PAM4 NRZ/PAM4-8 NRZ/PAM4-16 Coherent client-side6” Wafer/fab 8” Wafer/fab 8 & 12” Wafer/fab 15” Wafer/fab

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

10 devices 100 devices 1000 devices 10,000 devices25Gbps 50Gbps 100Gbps (VCSEL-Mod) 400Gbps (VCSEL-Mod) VCSEL PIC 25Gbps VCSEL PIC 50Gbps VCSEL PIC 100Gbps (serial)NRZ/PAM4 NRZ/PAM4-8 NRZ/PAM4-16 Coherent client-side3-4” Wafer/fab 6” Wafer/fab 8 ” Wafer/fab

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall


New PIC markets



26

PICs many applications

Source: Mitsubishi Electric, Luxtera

PIC Opportunities

Medical Applications:Optical Coherence Tomography

Integration Enables Miniaturization Visible λ PIC?

Source: USDHHS, Topcon, Envisonoptical, Wikiepedia, Photonics.com, GE, Intel

Sarcoma

Eye

Integrated chip



27

Medical Applications: Cytometry & Detection

• Measurement & characterization of cells

Integration Enables Miniaturization Visible/IR λ PIC?

Flow cytometer

SpectrophotometerHybridization arrays

Source: Becton-Dickinson, Affymetrix, ATI, Wikiepedia

Integrated chip

Mid Infra-red Applications: Spectroscopy

Integration Enables Miniaturization IR λ PIC?

FTIR (Fourier transform infrared spectroscopy)

Source: Nature, Wikiepedia, Agilent, Ocean Optics, Roberts biology

Integrated chip



28

Capsule endoscopy using photonics

Source: NIH-NCI, www.givenimaging.com

Integration enables miniaturization PIC intelligence?

Military applications for biophotonics

• Battle space• CB agent detection• Biowarfare defense (BWD)• Food safety• Field intelligence• Explosives & landmine detection• Intrusion detection• Water quality• Biomonitoring

• Medical

• Diagnostics

• Forensics

• Infectious disease detection

• Therapeutics

• Drug & vaccine development

• Homeland Defense

• CB agent detection

• Intrusion sensors

• Littoral & border protection

• Explosives detection

• Building & structural monitoring

• Water supply monitoring

• Immune Buildings

• Law enforcement

Source: MCH Engineering

Broad opportunities for PICs in defense…


http://www.ausaid.gov.au/keyaid/medical.jpg

http://www.173rdairborne.com/images/iraq-3 soldiers.jpg


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Flexible OLED displays: enables many new applications for integration

Source: Prof. Changhee Lee, SNU, Korea

Future display concepts

Applications drive different solutions to photonics

Closing thoughts



30

5 Capable Technology Platforms…

• Incumbents: – InP (Indium Phosphide)– GaAs (Gallium Arsenide)

• New challenger for roadmapping: – SiP (Silicon Photonics)

• Heterogeneous, oxide, nitride, SiGe

• Even newer challengers for roadmapping: – Polymer Photonics, Dielectric Photonics

All Will Be Symbiotic With Each Other

✔

✔

✔

Summary Checklist

• Internet still growing quickly driven by video usage– New market applications are being enabled through miniaturization

• Integrated photonics markets are strong– Photonics market $43B by 2025 with PIC penetration 69%

– Transceivers reach $25B by 2025 with PIC penetration 80% ($20B)• Driven by Ethernet, WAN-client, DWDM, and data rates of 100G then 400G

• Market demand for PICs will increase– Trend to integrate electronics with photonics for smaller real estate

– III-V InP, silicon photonics, polymer photonics, dielectric based PICs

– PICs offer a route to $1/Gbps for the customer

Markets will drive PICs to be the next generation IC…

✔✔

✔



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Memory challenge?

Remember the 3 takeaways

from the beginning…

• Photonics enables many things and is part of our lifestyles…from fiber comm markets to consumer, health, bio, defense markets etc.

• Photonics will be integrated – just like ICs 50 years ago and drive new product designs and markets…absolutely…it will be the next generation IC…

• Is integrated photonics a paradigm shift for the tech community…yes and it’s a major market accelerant!

The era of the PIC…



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Bell’s Photophone…market

1880 - Photophone Transmitter

1880 - Photophone Receiver

“The ordinary man…will find a little difficulty in comprehending how sunbeams are to be used. Does Prof. Bell intend to connect Boston and Cambridge…with a line of sunbeams hung on telegraph posts, and, if so, what diameter are the sunbeams to be…?…will it be necessary to insulate them against the weather…?…until (the public) sees a man going through the streets with a coil of No. 12 sunbeams on his shoulder, and suspending them from pole to pole, there will be a general feeling that there is something about Prof. Bell’s photophone which places a tremendous strain on human credulity.”

New York Times Editorial, 30 August 1880

Bell was thinking data (video) 100 years ago!

Source: UCSC

Thank You!



33

Questions?

Michael Lebby

CEO, Lightwave Logic Inc., (LWLG:OTCQB)

[email protected]

www.photondelta.eu/success

mailto:[email protected]?subject=keynote%20WTMF2017%20-%20Den%20Bosch%20NL

http://www.photondelta.eu/success


Documents

Global Markets for Next Generation PICs · Global market sales: photonics components Summary photonics market •Forecast to grow to $43B by 2025 with 7% CAGR (20-25) –Includes