GLAST LAT ProjectPDU TRR, July, 2005 4.1.7 DAQ & FSWV4 1 GLAST Large Area Telescope: Presented by P. Young SLAC [email protected] (650) 926-4257

GLAST LAT Project PDU TRR, July, 2005

4.1.7 DAQ & FSW V4 1

GLAST Large Area Telescope:GLAST Large Area Telescope:

Presented by P. YoungSLAC

[email protected](650) 926-4257

Gamma-ray Large Gamma-ray Large Area Space Area Space TelescopeTelescope

PDU TRRPDU TRR


4.1.7 DAQ & FSW V4 2

ContentsContents

• Introduction– Overview– Significant Changes since CDR– Objectives– Status

• Requirements/Verification• EGSE and Test-Procedures• Verification Test Plan and Flow

– At Assembly Vendor• Test-plan and Flow• Facility• Man-Power• Quality Assurance• Vibration

– At SLAC• Test-plan and Flow• Thermal Vacuum Test• Mass Property• EMI/EMC (at sub-contractor)• Man-Power• Quality Assurance

• Equipment Calibration/Safety• Risk Assessment• Schedule• Status of Procedures• Issues and Concerns


4.1.7 DAQ & FSW V4 3

LAT ElectronicsLAT Electronics

3 Event-Processor Units (EPU) (2 + 1 spare)

– Event processing CPU– LAT Communication Board– SIB

ACD

empty

EPU-3

EPU-2EPU-1

empty empty

Power Dist. Unit*

GASU*

empty

empty

SIU*SIU*

Spacecraft Interface Units (SIU)*

– Storage Interface Board (SIB): Spacecraft interface, control & telemetry

– LAT control CPU– LAT Communication

Board (LCB): LAT command and data interface

16 Tower Electronics Modules & Tower Power Supplies

* Primary & Secondary Units shown in one chassis

Power-Distribution Unit (PDU)*

– Spacecraft interface, power

– LAT power distribution

– LAT health monitoring

Global-Trigger/ACD-EM/Signal-Distribution Unit*

TKR

CAL

TKR Front-End Electronics (MCM)ACD Front-End Electronics (FREE)

CAL Front-End Electronics (AFEE)


4.1.7 DAQ & FSW V4 4

EGSE PDU Mounted on LAT EGSE PDU Mounted on LAT

GASU

PDU


4.1.7 DAQ & FSW V4 5

Flight PDUFlight PDU

Primary and Redundant PDU DAQ Module in same enclosure, separated by metal


4.1.7 DAQ & FSW V4 6

• One enclosure houses primary and redundant Power Distribution DAQ Circuit Card Assembly

– Separated by aluminum wall

• Receives primary and redundant 28V DAQ feed from spacecraft

• Common mode filter

• Selects whether to use primary or redundant feed for a selected DAQ board via control signals from SIU

• Receives LAT command link from primary and redundant SIU into on-board ACTEL FPGA (via LVDS converter IO)

• On/off control of power to each of the loads: 16 TEM/TPS, 3 EPU’s, via configuration registers

• Readback of configuration registers to SIU

• Includes under-voltage, over-current protection and inrush current limiting for each output feed

• Digitization of 28 primary and 28 redundant RTD and 97 primary and 97 redundant thermistor sensor values

– Block redundancy: all primary sensors are connected to primary PDU, all redundant sensors are connected to redundant PDU

– Digitization in response to “digitize” command

– Readback of results after fixed minimum latency

• PDU 3.3V-supply voltage level and thermistor interface to spacecraft

Power Distribution ModulePower Distribution Module


4.1.7 DAQ & FSW V4 7

Changes since LAT CDRChanges since LAT CDR

• Modification of FPGA code – Code was rewritten by Eric Siskind– Code was reviewed by GSFC reviewer (Dr Rod)

• Some resistor/capacitor values have changed to optimize monitoring ranges

• Details of monitoring circuit have changed • Redesigned load-switch circuit

– To incorporate under-voltage protection• Added in case space-craft converters enters current-limiting

mode with subsequent drop in output voltage– To incorporate over-current protection

• Avoids damage to MOSFET switches– Changed resistor values to optimize in-rush current level

• Worst Case Analysis updated to incorporate changes• Thermal Analysis from CDR/Delta-CDR remained since changes don’t

impact thermal performance


4.1.7 DAQ & FSW V4 8

ObjectivesObjectives

• Demonstrate that hardware, software, procedures, and support equipment are prepared to support system environmental test

• Demonstrate that planned and completed testing meets performance and interface requirements

• Identify and understand all the risks and limitations• TRR is not intended to

– Review PDU design– Review flight readiness– Buy-off hardware or software

• RFA’s should only be of sufficient concern to stop test– Prior to start of an given test, any applicable TRR RFAs

must be closed


4.1.7 DAQ & FSW V4 9

Test Entrance / Exit CriteriaTest Entrance / Exit Criteria

• Entrance– All required paperwork released and in place

• Procedures, drawings, etc– Test configuration verified and approved– Essential personnel in place– Pre-test PDU functional successfully passed

• Exit– As-run procedures completed– Correct and accurate application of test environment– Test data acquired and archived– No damage to PDU– PDU performance within specification limits– Post-test PDU functional successful


4.1.7 DAQ & FSW V4 10

StatusStatus

• First PDU (to be proto-flight tested)

– Assembled

– Pre-conformal coat PDU with enclosure-internal EGSE harness tested, tests to verify that ACTEL performs over temperature performed (was prerequisite to programming FPGA’s for second PDU box)

– Conformal coated, integrated in enclosure with flight harness

– Final PDU to be delivered to SLAC week of July 18, 2005

• Second PDU (to be flight acceptance tested)

– Will be spare or primary flight PDU, depending on schedule

– Board went thru reflow surface-mount assembly step

– ACTEL FPGA’s were programmed and are being assembled on boards

– Remaining are staking, integration of boards into enclosure, integration of EGSE harness, testing at SLAC, conformal coating, integration of flight harness, testing


4.1.7 DAQ & FSW V4 11

Tests To-DateTests To-Date

• PDU engineering modules were extensively tested– As EGSE in DAQ/I&T

• Testbed includes PDU for > 1 year• I&T uses EGSE PDU during integration of towers in LAT

for several months• Main difference to flight PDU: under-voltage/over-

current circuit was not implemented on EGSE PDU’s supplied to I&T and testbed

– One flight board was assembled with mostly flight parts and tested

– Additional PDU tests• Informal thermal test -40C to 55C• Informal EMI test on EGSE station sent to Lockheed for

thermal test


4.1.7 DAQ & FSW V4 12

RequirementsRequirements

• LAT-SS-00285 Specifications, Level 4 LAT Dataflow System

• LAT-SS-00019 Specifications, Level 3 T&DF Subsystem Specification

• LAT-SS-00136 Specifications, Level 3 Power Supply System

• LAT-SS-00183 Specifications, Level 4 Power Supply System

• LAT-SS-06988 Specifications, Level 5 PDU Specification

• LAT-TD-00606 LAT Inter-Module Communications

• LAT-TD-01743 PDU ICD Specification & Conceptual Design

• LAT-TD-01543 PDU, Programming ICD

• LAT-SS-00778 LAT Environmental Specification

• LAT-SS-06988 PDU lists requirements

• LAT-TD-06989 contains Verification Matrix which gives approach to verify each requirement

– Lists verification method used


4.1.7 DAQ & FSW V4 13

System PerformanceSystem Performance

• Level 3 and level 4 DAQ and TRG and power-system requirements are met with a combination of DAQ modules (TEM/TPS, GASU, SIU, PDU, etc), since the DAQ and trigger and power system is comprised of several sub-system module types– Level 5 PDU requirements which are verified are derived

from Level 3 and Level 4 DAQ and Trigger and Power system specifications (as noted in the L5 requirements doc)

– Level 5 requirement doc includes derived requirement addressing

• Functionality/performance• Power• Mass/C.G.• EMI/EMC• Environmental incl temperature and vibration


4.1.7 DAQ & FSW V4 14

Verification StatusVerification Status

• Engineering Module PDU– EM completed full functional test program with exception of

thermal-vacuum, EMI/EMC, mass, and C.G.– Demonstrated compliance with specifications


4.1.7 DAQ & FSW V4 15

EGSE and Test-ProceduresEGSE and Test-Procedures

• EGSE for Functional/Performance Tests– Test-Stand documented in LAT-DS-06627

• Test-Procedures– LAT-TD-04332 Electrical Interface Continuity and Isolation

Test procedure • Power-off impedance tests of I/O

– LAT-TD-04384 Stray-Voltage-Test Procedure• Power-on voltage test of I/O

– LAT-TD-01744 Comprehensive Test Procedure• Functionality and Performance test


4.1.7 DAQ & FSW V4 16

EGSE Test-ConfigurationEGSE Test-Configuration

• LAT-TD-01744-03

LAT-DS-03402-01

PDU BOXLAT-DS-01696

VMECRATE

MVME2304-0123 SBCv 0143 r VXWORKS 5.5

PDUPRIM

PDURDNT

Variable 28VDC PS 35A

Passive loads emulatingTEMs EPUs GASU ACD

3 BOARDS

LAT-DS-03405-03VERSION T, M, B

Local PC withLATTE, VxWorks,PDU test scripts

LCB v 03 r Xilinx V3.9 ActelV2.4

LAT-DS-03253

Networktaps(2)

Resistors emulating temp sensors

2 BOARDS

LAT-DS-03409-02VERSIONS T, B

Switches toemulate SIU

PowerResistors oncopper plate

LAT-DS-03886-01

COOLINGFANS

ACAdapter

JL13-28

JL8

JL7

JL6

JL31-34

JL29,30,248

JL4

JL3

LAT-DS-04307

LAT-DS-04305 (3)

LAT-DS-04306 (4)

LAT-DS-04308 (16)

RS232-CABLE

PDU TEST BOX 19" Rack Mount ChassisLAT-DS-3400-02schematic = LAT-DS-3401-02

GASU BOXLAT-DS-01611

JL40

JL41

JL44 LAT-DS-02104

LAT-DS-05550

LAT-DS-05550

Systran VMESC5

5 DAC128V IPModules

LAT-DS-04309-03

(3)

JL9-11LAT-DS-04308 (3)

LAT-DS-05940 (5)

Mates with PDU JL9-11,13-28 for VMon Cal Test.

J1-3

J1-3 (Ver. T)

J2 (Ver. B, Ver. M, Ver.T)

Resistors emulating tempsensors (7 BOARDS)

LAT-DS-03409-02VERSIONS 7590, 19800, 30100,60400, 205000, 361000, 806000

JL-29, 30, 248

JL-31-34

JL-31-34

JL-29, 30, 248

Lug typeconnector

J66

P2

P2

SIU

JL5

P5

P1-4

P1

JL7 J20

J78S

J78S

GASU

J20JL8

J78P

J78P

P1

P2

P2JL-9-11

JL-13-28

P1

P1

CAT5 Ethernet Cable

Debug

10/100Base

N/C

CAT5 Ethernet Cable

JL5

JL6LAT-DS-04307

serial port

GASU TEST BOXLAT-DS-04969

BK Precision1786A Power

Supply

LAT-DS-05218

JL153

Agilent 33250AFunction

Generator

gasu test

test box

gasu

LAT-DS-03246P3

P2

P1+_

B1B2

B1

B2

P1-3

BK Precision1786A Power

Supply

+_

coax cable

ext clk in

28v

kings-lemo 1075-1

BNC


4.1.7 DAQ & FSW V4 17

Verification Level – Module DetailVerification Level – Module Detail

• Breakout of verification at PDU Module Level• Tests to be conducted after successful TRR (order may change

depending on availability of resourced (TV/EMI)• EICIT & SVT• Functional test• Vibration (Wyle)• Functional test• Thermal cycle• Functional test• Mass properties including CG• Thermal vacuum (in-situ testing)• EMI/EMC (at CKC-lab for proto-flight, at SLAC for flight

acceptance)• Functional test • Review• Deliver to I&T

– DAQ (out-going) / I&T (incoming) test combined


4.1.7 DAQ & FSW V4 18

VerificationVerification

• Test-Stand– Supplied by SLAC– Operated by SLAC engineers

• Vibration facility at Wyle– LAT-TD-06101 Vibration test-procedure – SLAC engineers present for vibration tests

• Thermal Cycle in thermal chamber in SLAC clean-room


4.1.7 DAQ & FSW V4 19

TC and Vibration RequirementsTC and Vibration Requirements

Parameter Required Characteristic Thermal Cycling (4 cycles) -40 to +55 °C (Qualification and

Proto-flight) Thermal Cycling (4 cycles) -35 to +50 °C (Acceptance) Random Vibration See Figure 1. Sinusoidal Vibration 0.5g rms, 20 to 2000Hz

Figure 1. Vibration Levels, Duration, and Spectra

Electronics Module (Special Boxes)Random Vibration Spectra

ASD Level (G2/Hz)Freq (Hz) Accept Qual20 0.010 0.01075 0.037 0.03880 0.040 0.055115 0.180 0.360160 0.180 0.360325 0.040 0.060350 0.040 0.050500 0.040 0.0502000 0.025 0.050Overall 8.91 Grms 11.51 GrmsDuration 60s/axis AT, PT

120s/axis QT

0.001

0.010

0.100

1.000

10 100 1000 10000Freq. (Hz)

AS

D L

evel

(G

^2/H

z)

Accept

Qual


4.1.7 DAQ & FSW V4 20

Mass PropertyMass Property

• Mass properties checked at SLAC – Procedure to be written (performed at SLAC Metrology)– Expected: (ref LAT-TD-00564)

• Total 9.8 kg• Allocation 12% above = 11 kg

– C.G. to be measured for the proto-flight unit only


4.1.7 DAQ & FSW V4 21

Thermal Vacuum TestThermal Vacuum Test

• Thermal Vacuum facility in Building 33 at SLAC– Thermal Vacuum Chamber Operating Procedure LAT-TD-

02541– PDU Thermal Vacuum Test-Procedure LAT-TD-03639– First PDU tested to proto-flight specifications (same

Temperatures as qualification, but 4 TV cycles versus 12 cycles)


4.1.7 DAQ & FSW V4 22

Proto-Flight and Flight Acceptance Thermal Proto-Flight and Flight Acceptance Thermal Vacuum TestVacuum Test

• See PDU Thermal Vacuum Test-Procedure LAT-TD-03639

+55C +2/-2C

PROTO-FLIGHT THERMAL VACUUM CYCLE TIMELINE

Hot Qualification Limit

4 Cycles Total

Open Chamber

CloseChamber

Start Pump Down

Chamber

Vent ChamberSetup Flight Unit

CPT

Start of Cycle 1

End of Cycle 12

Hot Survival Limit+60C +2/-2C

-40C +2/-2C Cold Survival/Cold Qualification Limit

EGSE Unit

Start Bake Out/Outgas

CPT

Open Chamber

Turn OFF+30C +2/-2C

CPTFlight Unit

Turn OFF

Verify End Bake Out O

N-O

FF

-ON

4Hrs

4Hrs

OF

FC

PT

LP

T

ON

-OF

F-O

N

CP

T

LP

T

4Hrs 4Hrs

4Hrs

4Hrs

OF

F-O

N

OF

F-O

N

OF

F-O

N

OF

F-O

N

ContinuePeriodic

LPT

CP

T

Continue Periodic

LPT

4Hrs

Cycles 2-3

CP

T

ContinuePeriodic

LPT

OF

F

CP

TO

FF

OF

F-O

N

Start Periodic

LPT

ContinuePeriodic

LPTOF

F-O

N

At < 10-5 Torr

X 4

+50C +2/-2C

ACCEPTANCE THERMAL VACUUM CYCLE TIMELINE

Hot Acceptance Limit

4 Cycles Total

Open Chamber

CloseChamber

Start Pump Down

Chamber

Vent ChamberSetup Flight Unit

CPT

Start of Cycle 1

End of Cycle 4

Hot Survival Limit+60C +2/-2C

-35C +2/-2CCold Acceptance Limit

EGSE Unit

Start Bake Out/Outgas

CPT

Open Chamber

Turn OFF+30C +2/-2C

CPTFlight Unit

Turn OFF

Verify End Bake Out O

N-O

FF-

ON

4Hrs

4Hrs

OF

FC

PT

LPT

ON-OFF-ON

CPT

LPT

4Hrs 4Hrs

4Hrs

4Hrs

OF

F-O

N

OF

F-O

N

OF

F-O

N

OF

F-O

N

ContinuePeriodic

LPTC

PT

Continue Periodic

LPT

4Hrs

Cycles 2-3

CPT

ContinuePeriodic

LPT

OF

F

CPT OF

F

OF

F-O

N

Start Periodic

LPT

ContinuePeriodic

LPT

-40C +2/-2CCold Survival Limit4Hrs

OF

F-O

N


4.1.7 DAQ & FSW V4 23

EMI/EMC TestEMI/EMC Test

• Proto-Flight = Qualification Test (Conductive & Radiative)– Sub-contracted to CK Labs– Statement of Work: LAT-PS- 04568

• CE102, CECN, CS102, CSCM, CS06, RE101, RE102, RS101, RS103

– Detailed EMI/EMC procedure provided by CKC lab (TP05-83489-0.doc, to be released?)

– SLAC engineers present at vendor for tests– Vendor supplies test-report– LAT QA at SLAC present for tests

• Flight Acceptance Test (Conductive)– Performed at SLAC– LAT-TD-03637

• Only CE102, CS102– SLAC supplies test-report– LAT QA at SLAC present for tests


4.1.7 DAQ & FSW V4 24

Manpower & Quality AssuranceManpower & Quality Assurance

• Test man-power – PDU: Patrick Young– Test Support: J. Ludvik– Thermal Cycle and TV support: R. Williams, P. Hart– TV shift support: 2 contractors– EMI support: D. Nelson – Vibration support: D. Tarkington

• Quality assurance: Joe Cullinan– QA representative (Y.C. Liew) present during tests, review

of test-procedure and results– Required changes to documentation are red-lined and

included in new revisions– NCR are created for non-conformance (e.g. exceeding of

min/max test limits) and submitted for disposition


4.1.7 DAQ & FSW V4 25

Problem Failure Report/ Configuration Problem Failure Report/ Configuration ManagementManagement

• Problem Failure Reporting– Via standard SLAC LAT Non-Conformance Reporting (NCR)

System• NCR is entered• Reviewed/accepted/resolved

– LAT engineering

– LAT QC

• Already exercised during pre-conformal coat PDU assembly

• Configuration Management– Via standard LATDOC system


4.1.7 DAQ & FSW V4 26

Planned TestsPlanned Tests

• Function/Performance Tests (LAT-TD-01744)– Verifies all requirements in LAT-SS-06988 except below

• Thermal Vacuum Tests– Verifies performance/function over temperature

• Mass/C.G.– Verifies/measures mass and C.G.

• Vibrations test– Verifies vibration performance requirements

• EMI/EMC– Verifies EMI/EMC performance

• Note to margin testing– External Voltage margin testing is performed at all stages (28V +/-1V)– Internal Voltage margin testing (3.3V/2.5V) is only performed at pre-

conformal coat stage while using internal EGSE harness– No internal voltage margin testing once flight harness is used. Respective

tests in TD-01744 are omitted at that stage as will be documented in work-order

– Frequency margin tested pre-conformal coat as well as on final PDU– Temperature testing performed during TV testing


4.1.7 DAQ & FSW V4 27

Equipment CalibrationEquipment Calibration

• Electrical Functional Test Equipment– EGSE Test-Stand documented at

• http://www-glast.slac.stanford.edu/Elec_DAQ/EGSE/I&TPDU/TESTSTAND_1164/teststand1164docs.htm

• EMI/EMC Test Equipment– Quantitative measurement equipment (sensors, antennas, etc)

calibrated to NIST standards– Calibration performed annually

• All item are (will be) within calibration at time of testing• Vibration Test Equipment

– Accelerometers calibrated against a standard accelerometer traceable to NIST

– Signal conditioners calibrated annually• TVAC Equipment

– Thermocouples calibrated against standard temperature; calibrated prior to test

– Thermocouple reader calibrated very 2 years


4.1.7 DAQ & FSW V4 28

Sub-System SafetySub-System Safety

• EGSE– Safe-to-mate– Configuration control– Calibration verification– Functionality verification with “golden” EGSE PDU prior to

test with flight hardware• MGSE

– No custom MGSE• Environment

– Temperature controlled in all test-facilities– Cleanliness actively controlled in clean-room; hardware

bagged and purged when required• Training

– ESD training completed– Clean room training completed


4.1.7 DAQ & FSW V4 29

Risk AssessmentRisk Assessment

• Schedule– Pressure to deliver flight hardware could force less than

complete characterization and analysis of modules, could result in replicating a problem in the second module

• Performance– None known

• Software to support TV test is still in development


4.1.7 DAQ & FSW V4 30

Test-ScheduleTest-Schedule

• Estimated as follows, order subject to EMI/TV availability• First PDU

– 7/25: functional test – 7/28: vibration test– 7/29: functional test – 8/1: TC – 8/2: functional test– 8/3: EMI start– 8/17: EMI end– 8/18: mass, c.g. property – 8/9: TV start – 8/29: TV end

• 2nd PDU– Lags first PDU by about 8 weeks


4.1.7 DAQ & FSW V4 31

Status of Main Test ProceduresStatus of Main Test Procedures

• All procedures must be released before respective test• Procedures to be released

– Mass/CG procedure to be written/released– EMI vendor procedure to be released– CPT and TV modified, revisions are in review– Vibration procedure released?


4.1.7 DAQ & FSW V4 32

Issue & ConcernsIssue & Concerns

• Schedule– Tight

• Vibration test– Concern that harness/connectors pass vibration tests

• (should be ok, but is concern)

Documents

GLAST LAT ProjectPDU TRR, July, 2005 4.1.7 DAQ & FSWV4 1 GLAST Large Area Telescope: Presented by P. Young SLAC [email protected] (650) 926-4257