GLAST LAT ProjectMarch 24, 2003 1B Tracker Peer Review, WBS 4.1.4 1 GLAST Large Area Telescope: Tracker Subsystem WBS 4.1.4 1B: Schedule Summary; Critical

GLAST LAT Project March 24, 2003

1B Tracker Peer Review, WBS 4.1.4 1

GLAST Large Area Telescope:GLAST Large Area Telescope:

Tracker SubsystemWBS 4.1.4

1B: Schedule Summary; Critical Paths; Risks

Thomas BordenStanford Linear Accelerator CenterTracker Subsystem Engineer

[email protected]

Gamma-ray Large Gamma-ray Large Area Space Area Space TelescopeTelescope



AgendaAgenda

• Cost• Schedule and critical Path• Risks



CostCost

Carbon-Fiber Wall

• Total US Tracker Cost $10,688,475.26 (inflated)• Significant Collaborator contribution:

– Italy: purchase 5000 SSD’s, Fabricate, assemble and test Qualification, Flight and Spare towers

– Japan: purchase 6400 SSD’s and support testing of all SSD’s



ScheduleSchedule

+ Key Milestones

+ Tray Assembly Development

+ Tray Mechanical

+ Electronics Design

+ SSD Production

+ Flight Electronics Assembly

+ Flight Trays Sub-Assembly

+ Final Assembly of Flight Trays

+ Qualification Test

+ Flight Tower Assembly

+ Delivery of Flight Towers 15 and 16

FY01 FY02 FY03 FY04 FY05JULAUGSEPOCTNOVDECJANFEBMARAPRMAYJUNJULAUGSEPOCTNOVDECJANFEBMARAPRMAYJUNJULAUGSEPOCTNOVDECJANFEBMARAPRMAYJUNJULAUGSEPOCTNOVDECJANFEBMARAPRMAYJUNJULAUGSEPOCTNOV

PDR CDR LAT I&T Ship LAT

© Primavera Systems, Inc.

Early Bar

Target Bar

Progress Bar

LT-RV Summary Schedule13MAR03 14:09

414 Tracker



ScheduleSchedule

LS400010SSD Prodn & Test(Jpn,Ity,SLAC) -Q,C-FM16

03APR03

LS400020SSD Ladder Assembly(Ity) - Q,C-FM16

26JAN04

LS400030Tray Panel Fab,Test(SLAC,Hytec,Ity) -Q,C-FM16

23DEC03

LS400040

ASIC Proc, Test & Dicing(UCSC,SLAC) -Q,C-FM16

29MAY03

LS400050PWB Proc & Flex Attach(UCSC,SLAC) -Q,C-FM16

29MAY03

LS400060

MCM Assy, Test &Burn-in (UCSC,SLAC) -Q,C-FM16

20OCT03

LS400070Tray Assembly and Test(Ity) - Q,C-FM16

21MAY04

LS400080Readout Cable Fab &Assy (UCSC) -Q,C-FM16

20JUN03

LS400085Sidewall Fabrication(SLAC/Hytec) -Q,C-FM16

12FEB03A

LS400090Tower Assembly (Ity) -Q,C-FM16

14JUN04

LS400100Tower Testing (Ity) -Q,C-FM16

17AUG04

LS400110Modules RFI -Q,C-FM16

24AUG04

Tracker Work Flow Summary - QA/B, C1/2 - FM16

Tracker Work Flow Summary - Qual Units A & B


Start Date 03APR00

Finish Date 02NOV06

Data Date 01MAR03

Run Date 18MAR03 09:19 Driving relationship

Nondriving relationship

Critical color

ACT

DES

EF

LAT3

Gamma Ray Large Area Space Telescope

Tracker Work Flow Overview

Sheet 1 of 3

Date Revision Checked Approved



ScheduleSchedule

LS4Q0010SSD Prodn & Test(Jpn,Ity,SLAC) - QA/B

28SEP01A

LS4Q0020SSD Ladder Assembly(Ity) - QA/B

13NOV02A

LS4Q0030Tray Panel Fab & Test(SLAC,Hytec,Ity) - QA/B

02APR03

LS4Q0040

ASIC Proc, Test & Dicing(UCSC,SLAC) - QA/B

29MAY03

LS4Q0050PWB Proc and FlexAttach (UCSC,SLAC) -QA/B

29MAY03

LS4Q0060

MCM Assy, Test &Burn-in (UCSC,SLAC) -QA/B

29JUL03

LS4Q0070Tray Assembly and Test(Ity) - QA/B

17OCT03

LS4Q0080Readout Cable Fab &Assy (UCSC) - QA/B

20JUN03

LS4Q0085Sidewall Fabrication(SLAC/Hytec) - QA/B

12FEB03A

LS4Q0090Tower Assembly (Ity) -QA/B

07NOV03

LS4Q0100Tower Testing (Ity) -QA/B

27JAN04

LS4Q0110Modules RFI - QA/B

27JAN04

Tracker Work Flow Summary - Qual Units A & B

Tracker Work Flow Summary - Cal Units 1 & 2


Start Date 03APR00

Finish Date 02NOV06

Data Date 01MAR03



Critical color

ACT

DES

EF

LAT3



Sheet 2 of 3




ScheduleSchedule

LS4C0010SSD Prodn & Test(Jpn,Ity,SLAC) - C1/2

02MAY02A

LS4C0020SSD Ladder Assembly(Ity) - C1/2

18APR03

LS4C0030Tray Panel Fab & Test(SLAC,Hytec,Ity) - C1/2

05MAY03

LS4C0040

ASIC Proc, Test & Dicing(UCSC,SLAC) - C1/2

29MAY03

LS4C0050PWB Proc and FlexAttach (UCSC,SLAC) -C1/2

29MAY03

LS4C0060

MCM Assy, Test &Burn-in (UCSC,SLAC) -C1/2

29JUL03

LS4C0070Tray Assembly and Test(Ity) - C1/2

02DEC03

LS4C0080Readout Cable Fab &Assy (UCSC) - C1/2

20JUN03

LS4C0085Sidewall Fabrication(SLAC/Hytec) - C1/2

12FEB03A

LS4C0090Tower Assembly (Ity) -C1/2

19DEC03

LS4C0100Tower Testing (Ity) - C1/2

01MAR04

LS4C0110Modules RFI - C1/2

08MAR04

Tracker Work Flow Summary - Cal Units 1 & 2


Start Date 03APR00

Finish Date 02NOV06

Data Date 01MAR03



Critical color

ACT

DES

EF

LAT3



Sheet 3 of 3




MilestonesMilestones AV Activity

ID ND Activity

DescriptionAV: Early

FinishFloat-2m

Float-1m

Float BaselineFinish

EarlyFinish

4.1.4 Tracker4.1.2 System Engineering

4 2S201070 2 Tracker CDR 05/28/03 -93 01/14/03 05/28/03

4 2S201440 2 Sub System ProductionReadiness Review-TRKR

05/28/03 -93 01/14/03 05/28/03

4 2S201190 2 Sub System QualReadiness Review-TRKR

11/07/03 -5 10/31/03 11/07/03

4 2S201250 2 Sub System QualReview-TRKR

01/27/04 -5 01/20/04 01/27/04

FY03 FY04 FY05 FY06


Run Date 03/13/03 09:51

Data Date 03/01/03

GLAST LAT PROJECTLevel 3 Milestones

AV: Float

LT-L8: AV: Float to Level 3 MilestonesFL-L8: Level 3 MilestonesAV: Up Triangle, L3: Down Triangle

Report #9Sheet 1




ID ND Activity


FinishFloat-2m

Float-1m


EarlyFinish

4.1.7 Electronics

4 1M1000550 7 (9) MCM's from Tracker toElec

10/31/02 -29 09/20/02 10/31/02A

4 1M1000910 7 (36) MCM's for EM2 fromTracker to Elec

07/25/03 -5 07/18/03 07/25/03

FY03 FY04 FY05 FY06


Run Date 03/13/03 09:51

Data Date 03/01/03


AV: Float


Report #9Sheet 2




ID ND Activity


FinishFloat-2m

Float-1m


EarlyFinish

4.1.9 I&T

4 1M1001280 9 As-Built dwgs for EMTKR-TKR to I&T

12/06/02 -1 12/05/02 12/06/02A

4 1M1001430 9 Delv of TKR EM to SLACI&T/MGSE

04/11/03 -80 12/09/02* 03/03/03*

4 1M1000200 9 Tracker Modules A & B RFI (for Calibration)

01/27/04 14 02/17/04* 02/17/04*

4 2S201320 9 Sub System-TRKR RFI's--1st Article

02/17/04 0 02/17/04 02/17/04

4 1M1000220 9 Tracker Modules 1 & 2 RFI (for Calibration)

03/08/04 5 03/15/04* 03/15/04*

4 1M1000250 9 Flight Tracker Tower 3, 4RFI

04/05/04 50 06/15/04* 06/15/04*


05/03/04 51 07/15/04* 07/15/04*


06/01/04 41 07/29/04* 07/29/04*


06/14/04 42 08/12/04* 08/12/04*


06/28/04 42 08/26/04* 08/26/04*


07/21/04 36 09/10/04* 09/10/04*


08/24/04 22 09/24/04* 09/24/04*

FY03 FY04 FY05 FY06


Run Date 03/13/03 09:51

Data Date 03/01/03


AV: Float


Report #9Sheet 3




ID ND Activity


FinishFloat-2m

Float-1m


EarlyFinish

4.1.7 Electronics4.1.4 Tracker

7 1M1000920 4 EM2 TEM for Qual TowersA,B from Elec to Tracker

08/25/03 37 10/16/03* 10/16/03*

FY03 FY04 FY05 FY06


Run Date 03/13/03 09:51

Data Date 03/01/03


AV: Float


Report #9Sheet 4




ID ND Activity


FinishFloat-2m

Float-1m


EarlyFinish

4.1.9 I&T4.1.4 Tracker

9 1M1001514 4 EM1 EGSE WS-S/W R2I&T to TKR

12/13/02 -6 12/05/02 12/13/02A

FY03 FY04 FY05 FY06


Run Date 03/13/03 09:51

Data Date 03/01/03


AV: Float


Report #9Sheet 5



Critical PathCritical PathActivity

IDActivity

DescriptionRemDur% Early

StartEarlyFinish

Tracker 1st Most Critical Path4T007000 SSD Lot 15-16 (JAPAN) 03FEB03A 03APR03

4T045200 Assemble SSD Ladders Lot15-16

02DEC03* 26JAN04

4T046250 Assemble ladders to tray lot15 - 16

27JAN04 02MAR04

4T046255 Wire bonding Ladders totray and test 15 - 16

03MAR04 23MAR04

4T046260 Incapsulation of Wire bonds15 - 16

24MAR04 09APR04

4T046265 Thermal Test 15 - 16 12APR04 23APR04

4T046275 Final Electrical Test 15 - 16 26APR04 14MAY04

4T046280 Ship to INFN lot 15-16 17MAY04 21MAY04

4T046282 IA: Ship Flight Trays lot 15 -16 to INFN

21MAY04

4T052550 Assemble Tower 15 - 16 24MAY04 14JUN04

4T052555 Vibration test 15 - 16 15JUN04 06JUL04

4T052565 Thermal Test 15 - 16 07JUL04 27JUL04

4T052570 Final Electrical Test 15 - 16 28JUL04 17AUG04

2003 2004 2005FEBMARAPRMAYJUNJULAUGSEPOCTNOVDECJANFEBMARAPRMAYJUNJULAUGSEPOCTNOVDECJANFEBMARAPRMAYJUNJULAUGSEP


Start Date 03APR00

Finish Date 02NOV06

Data Date 01MAR03

Run Date 11MAR03 16:23

Early Bar

Target Bar

Progress Bar

CRIT


Tracker Critical Path

Sheet 1 of 4


First Critical Path



Critical PathCritical Path

Sheet 2 of 4

ActivityID

ActivityDescription

RemDur% Early

StartEarlyFinish

4T052572 Ship to SLAC 15 - 16 18AUG04 24AUG04

4T052575 AV: Deliver Flight Towers 15-16 to I & T

24AUG04*

1M1000310 Flight Tracker Tower 15, 16RFI

24SEP04*

Tracker 2nd Most Critical Path4T038512 Ready to Fabricate TMCM's 11APR03*

4T038600 Bond Kapton right angleinterconnect

11APR03 24APR03

4T038700 Load SMT parts 25APR03 08MAY03

4T038800 QC hybrid PC boards 09MAY03 04JUN03

4T038900 Load IC's and Wire BondHybrid Boards

05JUN03 01JUL03

4T039000 (PR) Clean, Test, burn-in,encap Load Bds Lot 1

02JUL03 02JUL03

4T039002 (REC) Clean, Test, burn-in,encap Load Bds Lot 1

30JUL03 30JUL03

4T039100 (PR) Ship lot 1 to Pisa 31JUL03 31JUL03

4T039102 (REC) Ship lot 1 to Pisa 04AUG03 04AUG03

4T045404 Assemble TMCMs to tray lotA - B

05AUG03 02SEP03

4T045504 Assemble TMCMs to tray lot1-2

03SEP03 15SEP03


16SEP03 29SEP03


30SEP03 13OCT03


Sheet 2 of 4

Second Critical Path




Sheet 3 of 4

ActivityID

ActivityDescription

RemDur% Early

StartEarlyFinish


14OCT03 03NOV03

4T045850 Assemble ladders to tray lot7 - 8

04NOV03 17DEC03

4T045855 Wire bonding Ladders totray and test 7 - 8

18DEC03 09JAN04

4T045860 Incapsulation of Wire bonds7 - 8

12JAN04 26JAN04

4T045865 Thermal Test 7 - 8 27JAN04 17FEB04

4T045875 Final Electrical Test 7 - 8 18FEB04 02MAR04

4T045880 Ship to INFN lot 7-8 03MAR04 12MAR04

4T045882 IA: Ship Flight Trays lot 7 - 8to INFN

12MAR04

4T052150 Assemble Tower 7 - 8 15MAR04 02APR04

4T052155 Vibration test 7 - 8 05APR04 23APR04

4T052255 Vibration test 9 - 10 26APR04 07MAY04

4T052355 Vibration test 11 -12 10MAY04 21MAY04

4T052455 Vibration test 13 - 14 24MAY04 07JUN04

Tracker 3rd Most Critical Path4T014500 Assemble Flight Tray Panel

- Lot A03MAR03 02APR03

4T014505 Assemble Flight TrayPanels Lot -B

03MAR03 02APR03

4T014510 Assemble Flight TrayPanels Lot - 1

03APR03 05MAY03


Sheet 3 of 4

Third Critical Path




Sheet 4 of 4

ActivityID

ActivityDescription

RemDur% Early

StartEarlyFinish


03APR03 05MAY03


06MAY03 06JUN03


06MAY03 06JUN03


09JUN03 10JUL03


09JUN03 10JUL03


11JUL03 12AUG03


11JUL03 12AUG03


13AUG03 15SEP03


13AUG03 15SEP03


16SEP03 16OCT03


16SEP03 16OCT03


17OCT03 18NOV03


17OCT03 18NOV03


19NOV03 23DEC03


02JAN04 15JAN04


Sheet 4 of 4

Third Critical Path




• Critical Path Dates:– May 1, 2003 – Start tray panel fabrication– July 30, 2003 – SLAC deliver first lot of TMCM’s to INFN-Pisa– November 7, 2003 - Qualification Towers Assembled

• Flow from Qual tower and Spare defined by tower testing



Risks TKR-1Risks TKR-1

• Risk Description:– Low Tracker MCM yield. Each MCM holds 26 ICs. The MCMs are tested before encapsulation, to allow

for rework. However, rework is costly, and too much rework could make it impossible to hold the schedule and budget. We need it to be the exception, rather than the rule, but so far, in the EM run, rework involving IC replacement was needed on the majority of MCMs.

• Risk Mitigation:– Screening and handling procedures need to be improved according to the plan described here.

• Risk Impact Assessment:– Possible delay in tower assembly and increased labor cost at Teledyne.

• Risk Mitigation Implementation Plan:– 1. (Johnson, Sugizaki) Improve IC screening. The GTRC chips were not screened for the EM, some

features of the GTFE were not screened, and the screening was at only 2 MHz due to technical problems. These systems will be improved and tested. An inker is being added to the probe station to remove human error in die sorting. We also may need to reject dice close to the wafer edge. (end March) 2. (Johnson, Ziegler) Improve IC handling. Detailed procedures are being written. (end March) 3. (Borden) Improve testing of the MCM PWB prior to assembly and again prior to die attach. (Mid April) 4. (Johnson, Sugizaki) Improve the MCM test software to speed up localization, of a bed IC. (June 1) 5. Improve IC design (done), especially to remove the G-chip oscillation problem.

• Current Status:– March 19, 2003: the GTRC probe card was built and is working well with updated test vector software.

The GTFE probe card was rebuilt and is working and currently being put through thorough tests. Both cards work at 20 MHz+. The wafer testing procedure is written and reviewed and in the release process. The cleanroom has been prepared and inspected. The inker is on order (end March). The new chips have been tested and the design improvements were successful.




• Risk Description:– MCM-SSD CTE mismatch. The Tracker MCMs and the SSDs are connected by wire bonds, which are

to be encapsulated. This interface is not yet tested. Since it goes the full width of a tray, there is a risk of damage from movement during thermal cycling.

• Risk Mitigation:– The flight MCMs are to be fabricated in Polyimide instead of FR4, to lower the CTE (Aramid was

considered but has other undesirable features). The encapsulation will be Nusil silicone, as in the ladders, which allows some movement with low stress. The interface needs to be tested on the EM.

• Risk Impact Assessment:– Critical Path Impact

• Risk Mitigation Implementation Plan:– Build a complete functional engineering-model tray by mid April(two MCMs) in addition to the ones in

the mini-tower, and put it through full qualification-level thermal-vacuum testing. (May) • Current Status:

– March 19, 2003: The tray panel is in hand, as are the two MCMs and the ladders. The procedure for encapsulating these bonds is being tested first on some mechanical/thermal EM trays.




• Risk Description:– Tray-panel fabrication start-up. Fabrication of tray panels at Plyform needs to start in early March (i.e.

pre-CDR) unless the rate can be made to exceed current predictions. We have not yet seen a plan from Italy/Plyform on how to accomplish this, nor have we seen any documentation.

• Risk Mitigation:– SLAC assistance to Pisa in getting documentation and materials in place.

• Risk Impact Assessment:– Critical path impact

• Risk Mitigation Implementation Plan:– Acquire Carbon-Carbon material early from SLAC (done). Procure cores from SLAC (in progress).

Tom Borden travel to Plyform in early February to assist with planning and documentation.• Current Status:

– March 19, 2003: 1. The cores were ordered and already received and shipped to Italy. 2. Tom traveled to Italy and helped prepared a draft procedure document. 3. We received a detailed schedule from Pisa for the flight build. It shows that the tray panel fab can start in May instead of March and the electronics will still be the critical path.




• Risk Description:– Procurement of MCM components. MCM production at Teledyne needs to start soon to have MCMs

ready to accept ASICs in late May. The design includes parts that are not yet approved but have 8-week lead times (the connectors), parts for which we have been working for a long time for approval without complete closure (polyfuses), and parts for which we do not have agreement on fabrication specifications (the PWB and flex). Furthermore, our success rate at SLAC for procuring these items for the EM was poor. We need Teledyne on contract to help us handle these procurements. The LAT parts specialist to date has never made any contacts with Teledyne.

• Risk Mitigation:– Increase manpower at SLAC on these procurements. Contract with Teledyne to do all of the parts

receiving. • Risk Impact Assessment:

– Critical path impact. • Risk Mitigation Implementation Plan:

– Have a meeting at Teledyne, including Nick Virmani, as soon as possible to iron out the contract and specifications to be used for MCM PWB and flex procurements and specifications to be used for MCM assembly. Action also needs to be taken on the Omnetics nano-connectors to get them approved for flight.

• Current Status:– March 19, 2003: 1. The meeting at Teledyne was held successfully, clarifying a lot of issues. 2. The

Omnetics connectors were approved and are on order. 3. The polyswitches were approved and are on order. 4. Final PWB and flex prototypes are in hand and being tested. 5. Jeff Tice and Jerry Clinton at SLAC are working the procurements and associated specifications. A quote for the PWBs was requested.

Documents

GLAST LAT ProjectMarch 24, 2003 1B Tracker Peer Review, WBS 4.1.4 1 GLAST Large Area Telescope: Tracker Subsystem WBS 4.1.4 1B: Schedule Summary; Critical