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Giantec Semiconductor
Sept, 2017
1
Corporate Overview
• Jan 2010, Giantec Semiconductor, Inc. was Spun Off from ISSI as a Fabless Company
• R&D and Operation Located in Shanghai, while Sales branches in US, Singapore, China, Taiwan, and Korea
• Product Offerings EEPROM and Smart Card, Plus New Products of MCU and Analog
• Giantec R&D team has exceed 15 years memory industry experience. We support customers standard & customized products all over the world.
HQ @ SH
RD
Admin
HR
Finance
Factory QA/RA
Sales
MKT
FAE
Giantec Operations
Shanghai San Jose
Shanghai
Mainland Taiwan
Mainland HK/TW USA Korea
Shanghai
Product Lines
EEPROM
•I2C/SPI/uWire bus Series •Both Automotive & Industrial Grade •TS/SPD for DIMM •Vcc=1.5-5.5V •Full line WLCSP •WW Top 5 supplier
Smart Card Lens Driver
•Driver Only •Small sieze PWM and Linear Driver •Driver+emmbedded EEPROM •Driver+EE+OIS Driver(TBD)
Smart Card Lens Driver
OPA
•Low Power Series •High Speed Series •High Precision •High Voltage
OPA EEPROM
•C/C-Less Secured memory Card •C/C-Less / Dual interface CPU card •Multi I/O Flash Card •NFC Forum Type 2 Tag(RF & RF+IIC) •C-Less Reader/ writer IC
Giantec EEPROM
• Position
– WW major supplier of EEPROM (~5% market share)
– Ranked #1 in China
– Accumulated 2.0Billion+Units EEPROM Shipment
– Full Line of 2-Wire (I2C), 3-Wire (µWire), and SPI/SPD devices
– VDD Minimum to 1.5V
– Complete Package Offering
• Strategies
– Keep Innovation to Provide Competitive Product to Customer
– Co-Work with Strategy Partner to keep Cost Effective continually
– Launch Low Power Consumption Product for Wearable/Portable
– Industrial and Automotive Temperature Offerings
– Certification for Intel Validation
5
Target Global Top 3 Supplier
EEPROM Roadmap
6
Giantec Smart Card/GTag
• Status – 10+ Years Smart Card R&D Experience
– Complete SC Products Series: CPU and Logic IC Card
– Diversity of Interface Offering of ISO/IEC 14443A/B/7816 and Dual interface
– Minimal Work Field Strength and long RF Work Distance
– NFC forum Type 2 Tag Compliant GTag offering (RF and Dual Interface)
– Ranked #1 Secured Memory IC Card Vendor in Asia-Pacific
– Ranked #2 C-less Logic Secured IC Card Vendor in Asia-Pacific
– Accumulated 1.5 Billion+ Units Shipment
• Strategies – WW Major Smart Card Vendor (Overseas Market Promotion)
– Financial IC Card Vendor
– COS + CPU Card “Total Solution” Offering
– CC EAL5+ and EMVCo Certificate Approval
– Full line New GTag Planning with Diversity of EEPROM density as well as Variety of Dual interface product offering (RF+IIC, RF+SPI)
– MCU+NFC Reader + SC/GTag Chipset Provider
7
Smart Card Roadmap
8
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
2Kbit EE memory, ISO/IEC7816 GT23SC4442
8Kbit EE memory, ISO/IEC7816 GT23SC4428
16Kbit EE memory, ISO/IEC7816 GT23SC1604
8kbit EE, ISO/IEC14443A, Mifare GT23SC4439A SR B-Ver
32kbit EE, ISO/IEC14443A, Mifare GT23SC4469
8051CPU,ISO/IEC14443A,4K EE GT23SC4455 ES A-Ver
8051CPU,ISO/IEC14443A,8K EE GT23SC4456A ES B-Ver
8051CPU,ISO/IEC14443A,16K EE GT23SC4458
8051CPU,ISO/IEC7816,32K EE GT23SC4432
80251CPU,ISO/IEC14443A/B,64K
EE,128K ROMGT23SC4467 ES ES B-Ver
80251CPU,ISO/IEC14443A/B and
7816,64K EE, 128K ROMGT23SC4466 ES ES B-Ver
Java Card GT23SCXXXX
8051CPU, ISO/IEC7816, Muti GPIO,
160Kbyte FlashGT23SC55160
SWP-SIM GT23SC55260
0.18um Process 0.13um Process 0.35um Process
Product line Features2015
Secure
Memory IC
Card
C-less logic
card
C-less CPU
card
High end
CPU card
Mobile
Payment
P/N2017
TBD
TBD
2016
SR: Sample Release; ES: Estimted SR
GTag/Reader Roadmap
9
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
48byte user memory, ISO/IEC4443A GT23SC4479
144byte user memory, 3DES, ISO/IEC4443A GT23SC4489
144byte user memory, ISO/IEC4443A GT23SC4499
1Kbyte Type Mifare Classic Tag GT23SC6699-1
4Kbyte Type Mifare Classic Tag GT23SC6699-2
144/504/888/1904byte user memory, 32bit
psswd, ISO/IEC4443AGT23SC8899-1/2/3/4 ES
144byte user memory, ISO/IEC4443A GT23SC4499C
144/888/1904byte user memory, 32bit psswd,
ISO/IEC4443AGT23SC8899C-1/3/4 ES
144byte user memory, ISO/IEC4443A, 32kbit
separated EEPROMGT24CN32B
144byte user memory, ISO/IEC4443A, 128kbit
separated EEPROMGT24CN128B
144byte user memory, ISO/IEC4443A, 512kbit
separated EEPROMGT24CN512A
Dual interface, ISO/IEC14443A, IIC, 1Kbyte EE GT23SC6699I-1 ES
Dual interface, ISO/IEC14443A, IIC, 2Kbyte EE GT23SC6699I-2 ES
Reader Chip GT23SC55460 SR
15693 GT23SC4419 ES
0.18um Process 0.13um Process
Product Line Features2015
HF RF Tag
(GTag)
HF Tag with FD
pin
(GTag)
HF Tag with FD
(GeeTag)
P/N
RF Reader/Writer
HF Tag with IIC
(Dual interface)
* All GTag are NFC forum compliance SR: Sample Release; ES: Estimted SR
15693
2016 2017
Giantec Lens Driver ICs
• Market Status
– Driving and Focusing the Lenses of Cameras of Smart Phones and Tablet
– Resolution Increases (Pixel size: 5M –> 8M –> 13M/16M+) • Auto-Focus Function - (VCM driver IC needed) in pixel size >5M camera
• 90% Cameras with 500M+ Units have Auto Focus Function
– Technical Trend • Uni direction to Bi direction driver, then OIS.
– High Performance: • AF – AF with Fast Focus – Closed Loop – Optical Image Stabilization (OIS);
– Currently Fast Focus with EE Driver
• Giantec Offerings
10
Uni direction Drive
•GT9712
•GT9720
•GT9762
•GT9760
Uni direction with EE
•GT9766
•GT9768
•GT9767
Bi direction Driver
•GT9764
Bi direction with EE
•GT9767 GT9761 GT9763 GT9764
Lens Driver Roadmap
11
Giantec OPA ICs
• Market Status – Qualified by Industry control market.
– Qualified by Mobile medical instruments.
– Qualified by Video amp market.
– Qualified by Sensor application market.
– Qualified High Performance: • High precise OPA performance are better than international company.
– Leading OPA supplier in China.
• Giantec Offerings
12
General Purpose
•GT7321
•GT7358
•GT7359
•G7324
Supper low power & low power
•GT7041
•GT7042
•GTV321
•GTV358
High precise
•GT7131
•GT7132
•GT7161
•GT7162
High Speed
•GT7121
•GT7122
•GT7124
•GT7111
•GT7112
•GT7182
•GT7172
OPA Roadmap
13
Package Roadmap
Smaller and
Thinner
14
Quality is Designed in from Product Inception to Delivery. GT applies Total Quality Management in every part of our Company.
Giantec Quality Policy:
• Customer Satisfaction - GT places customer satisfaction first, knowing that our success depends
on our ability to satisfy our customers.
• Continuous Improvement - All GT employees understand that we must continue to improve our
competitive advantage over our competitors.
• Effective Communication - Every level of the company know well our policy and participates in
building the quality of products and services
15
Giantec Quality Policy
• Dedicated Foundry/Subcontractor Management Team
• Foundry/Subcontractor Audit Annually
• Foundry/Subcontractor Ranking System and Biz Review (QTR)
• Quality Review (MO) & QC Online Monitor
• Strong QRE & QA Team
16
ISO 9001:2008
ISO 14001:2004
TS 16949:2009
(Compliance)
Quality Management System
• Full Characterization “Shmoo” each parameter of product
specification Over limits @ Hi-Temp, Low-Temp, Room-Temp
• After Assembly FT ensure every device met AC/DC
specification with margin
17
Product Qualification and Reliability
Device Item Test Condition Standard Sample Size RA ORT
EEPROM
1)Endurance
Cycling
Program/erase with 00,FF
patterns
at room temp. 1000K cycles
JESD22-A117 128pcs/Lot 3Lots 3Month
2)Data
Retention
T=150C
No bias 1000 hrs baking JESD22-A117 128pcs/Lot 3Lots 3Month
3)HTOL
(High Temp.
Operating Life)
T=125C
Stress Voltage=6V
1000 hrs baking
JESD22-A108 128pcs/Lot 3Lots 3Month
4)ESD:HBM Pass +/-5000V JESD22-A114 3 per voltage
level/1 lot 1Lot 3Month
5)ESD:MM Pass+/-300V JESD22-A115 3 per voltage
level/1 lot 1Lot 3Month
6)ESD:CDM Pass 1100V JESD22-C101-D 3 per voltage
level/1 lot 1Lot 3Month
7)Latch-up Pass+/-500mA
Pass 10V JESD78 3 per test /1 lot 1Lot 3Month
Device Qualification
Product Qualification and Reliability
18
Device Item Test Condition Standard Sample
Size RA ORT
EEPROM
7)Solderability Test
Step1:Steam aging 8hrs.
Step2:Dipping into
solder,245°C,5sec
JESD22-B102 15pcs 1lot 3Month
8)HTST
(High Temperature Storage Test) 150°C, 1000Hrs JESD22-A103 45pcs 1lot 3Month
9)MSL1 Precondition
Step1:TC(-
65~150°C,5cycles)
Step2:Bake(125°C,24hrs)
Step3:T/H
L1(85°C,85%RH,168hrs)
Step4:Reflow(260°C(+5/0),3c
ycles)
J-STD-020
231pcs
(以下3项总和)
1lot 3Month
10)TCT
(Temperature Cycling Test) -65~150°C,1000cycles JESD22-A104 77pcs 1lot 3Month
11)PCT
(Pressure Cooker Test)
121°C,100%RH，2ATM，168hrs
JESD22-A102 77pcs 1lot 3Month
12)HAST
(Highly Accelerated Temperature
and Humidity Stress Test)
130°C,85%RH,100hrs JESD22-A110D 77pcs 1lot 3Month
Package Qualification
Product Qualification and Reliability
19
Giantec Logistics Supports
• Guaranteed on-time delivery
−Have FG (Finished Goods) inventory →2 weeks
−Have wafer inventory →4~6 weeks
−No inventory →12~16 weeks
Note: The leadtime is based on the PO receiving date.
• Lead-time for on-time delivery
−On-time delivery according to OSD (Original Schedule Date) schedule
−Monthly worldwide forecast review and daily package plan adjustment
−Daily lot by lot production monitor in all foundries and sub-contractors
20
Key Cooperative Partner
21
Foundry Partners
2008 2010
2013
Process Roadmap
0.35um 0.18um 0.13um
Capacity: 5K Wafers/Mo
Assembly and Test
Capacity: 150M-200M Units /Mo
Reference Design Partner
22
Key Customers (I)
23
Key Customers (II)
24
Appendix I
EEPROM in Low Power
Application
25 25
Low Power EEPROM Solution
26
• Market Trend
– Wearable/IoT Need Small Size Need Smaller Battery
– Longer Battery Standby Time and Life Lower Power Consumption
– Low Power Consumption Lower Power Supply Voltage
• How to Support Market Request
Solution 1 Solution 2
Ultra Low Power Product
Giantec EE
Typical Isb < 200nA
1. Connect VDD of EE to PIO
2. Shut Down EE if not used
by PIO
Lower Power Supply
Voltage Product
Giantec EE
VDD ≥ 1.5V
Appendix II
EEPROM in CCM
Application
27 27
Giantec CSP Advanced Offering • Completely Product Portfolio
- 4K-1024K I2C Product Offering
- 8K-256K SPI Product Offering
• Continual Improvement
- Smaller Die Size with advanced process
- Larger Ball Size and Ball Pitch
- Back Side Coating to Improve SMT yield
- 4/6/8 Balls Options
- Different Thickness Solution 440um-->340um-->280um
• Supporting Customized Requirement • Trusty Product Quality and World Class Customer Base
• Demo Board Support
28 28
Key CCM Customers
Accumulated Giantec CSP EEPROM shipment to CCM Market ~700Mpcs
29 29
2016 Estimated 350Mpcs shipment
Key End Customers
30 30
More EEPROM On Same I2C Bus
• How to hook several EEPROM on same I2C bus?
(4 balls CSP)
– Gigantic’s solution: Different slave address
For example( Default:1010000)
GT24C08H-2CLI 1 0 1 0 1 0 0
GT24C32CH-2CSLI 1 0 1 0 1 0 0
More Options
GT24C64A 1 0 1 0 0 0 0
I2C Master
GT24C64ASS 1 0 1 0 0 0 1
GT24C64AH 1 0 1 0 1 0 0
SDA
SCL
Vcc
Vss
31 31
CSP Product Portfolio
32 32
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
4k 4 Balls, 440um Die Height GT24C04-2CLI default
4 Balls, 440um Die Height GT24C08-2CLI default
4 Balls, 280um Die Height GT24C08S-2CLI default
4 Balls, 440um Die Height GT24C08H-2CLI 1 0 1 0 1 0 0 r/w (A2=1)4 Balls, 440um Die Height GT24C16-2CLI default
4 Balls, 340um Die Height GT24C16M-2CLI default
4 Balls, 280um Die Height GT24C16S-2CLI default
8 Balls, 440um Die Height GT24C32A-2CLI default
4 Balls, 280um Die Height GT24C32AS-2CLI default
4 Balls, 340um Die Height GT24C32A-2C4LI default
4Balls, 280um Die Height GT24C32C-2CLI SR default
4Balls, 280um Die Height GT24C32C-2CSLI SR default
4Balls, 280um Die Height GT24C32CH-2CSLI SR 1 0 1 0 1 0 0 r/w (A2=1)4Balls, 340um Die Height GT24C64A-2CLI default
4Balls, 280um Die Height GT24C64AS-2CLI SR default
4Balls, 280um Die Height GT24C64A-2CSLI SR default
4Balls, 280um Die Height GT24C64ASS-2CLI SR 1 0 1 0 0 0 1 r/w (A0=1)4Balls, 280um Die Height GT24C64AH-2CSLI SR 1 0 1 0 1 0 0 r/w (A2=1)4 Balls, 340um Die Height GT24C128B-2CLI default
4 Balls, 280um Die Height GT24C128BS-2CLI SR default
4 Balls, 280um Die Height GT24C128B-2CSLI SR default
4 Balls, 280um Die Height GT24C128BL-2CSLI SR 1 0 1 0 0 0 1 r/w (A0=1)256K 6 Balls, 280um Die Height GT24C256A-2CLI SR default
512K 8 Balls, 340um Die Height GT24C512A-2CLI default
1M 8 Balls, 440um Die Height GT24C1024-2CLI default
SR: Sample Release; ES: Estimted SR; 0.35um 0.18um 0.13um
2015 2016 2017 Slave Address
(default: 1 0 1 0 0 0 0 r/w)
I2C
8K
16K
32K
64K
PC Density Features P/N VCC
128K
1.7V~5.5V
CSP Product Order Information
33 33
Key CCM Customers LD
Accumulated Giantec LD shipment to CCM Market > 70Mu
34 34
Key LD End Customers
35 35
Appendix III
EEPROM in Automotive
Application
36
Automotive EEPROM Portfolio
Ordering Information Scheme
Foundry Partner--SMIC
Subcon Partner—ASE (PassedTS16949)
TS16949 Certified Subcontractor
Automotive Product Qualify Criterion
Item Area Major Gap
Item Reference Automotive parts Regular parts
1
Reliability
Latch-Up AEC-Q100-004 high temp test Room Temp
2 ESD-CDM JESD22-C101 1000V optional
3 ELFR AEC-Q100-008 125C,48Hr N/A
4 HTOL AEC-Q100-005 125C,1000hr 125C,1000hr
5 TCT JESD22-A104 500cycles 500cycles
6 Data Retention test AEC-Q100-005 High and Low temp Room temp
7 Endurance Cycling AEC-Q100-005 Pattern (00/FF)
Pattern(00)
8
Test
CP Test Spec AEC-Q001 PAT Depends on Application
9 CP Yield Flag AEC-Q002 SYL,SBL Depends on Application
10 CP Test Temp AEC-Q100 Both high and low
temp No low temp
11 FT Test Spec AEC-Q001 PAT Depends on Application
12 FT Yield flag AEC-Q002 SYL, SBL Depends on Application
13 FT Test Temp AEC-Q100 Both high and low
temp No low temp
42
Strictly Test per AEC-Q100 Standard
Wafer Probe full-functional test on 100% die and bits (@high temp.)
Retention Bake 250ºC up to 24 hours
2nd Wafer Probe full-functional screen on 100% die and bits (@25ºC)
Assembly Final Test
Final Test 1st @high temp.
Final Test 2nd @-40ºC
Tripe CP/FT Test
Full verification for the parameter and
function on die and package level
Screen out all manufacturing defects to
ensure highest quality and reliability
Final Test 3rd @25ºC
43
Success Story in Automotive (1)
IS24C128-3GLA3-TR
Be sold to
AEC-Q100 Assurance
Success Story in Automotive (2)
GT24C256 SO8/TSSOP8 GT25C256-2UDLI-TR
GT25C256-3UDLA1-TR
Be sold to
Success Story in Automotive (3)
GT93C56A-3ZLA2-TR
AEC-Q100 Assurance
Be Sold to
Hyundai and LGE 7 inch car panel
GT24C16A-3ZLA2-TR Local Brands Car 10 inch car panel
Rolls Royce
Success Story in Automotive (5)
GT24C32A-2ZLI-TR
GT24C256A-2ZLI-TR GT24C256A-2UDLI-TR
GT24C512-2ZLI-TR
Be sold to
47 Giantec Confidential
Appendix IV
EEPROM in DIMM
Application
SPD/TS Product Line
Notes: MP=Mass Production
Feature:
1. Full line EEPROM support DDR2/DDR3/DDR4
2. Wider power supply voltage range and temperature range
3. Lower Isb and Icc current; High reliability
4. Passed Intel Certification on DDR3/DDR4
49
Density Part Number Vcc Clock
Frequency Package Support Module Product status
2Kbit
GT34C02B 1.7-5.5V 400KHz TSSOP/UDFN DDR2/DDR3 MP
GT34TS02B 2.2-3.6V 400KHz TSSOP/UDFN DDR3 MP
4Kbit
GT34C04 1.7-5.5V 1MHz TSSOP/UDFN DDR4 MP
GT34TS04A 2.2-3.6V 1MHz TSSOP/UDFN DDR4 MP
Giantec DIMM Biz (2010-NOW)
• GT34C02/04
• More than 40Mpcs shipment from 2010 till now.
• GT34TS02/04(A)
• More than 8Mpcs shipment from 2010 till now.
• Key customer are:
• Nanya Technology Ltd.
• Kingston Technology Corp
• Legacy Electronics
• Ramaxel
• G.Skill
• Avant
– …
Giantec Passed Intel DDR4 DIMMs Certification
GT34TS04 @ DDR4
GT34TS04A @ DDR4
GT34C04 @ DDR4
GT34TS02B @ DDR3
GT34C02B @ DDR3
GT24C02A @ DDR3
Appendix V
EEPROM in LCD Panel
Application
58
GT LCD panel biz review 2010-2016 (Kpcs)
59
Region CTM 2010 2011 2012 2013 2014 2015 2016’1H 2016Fcst
China BOE/CSOT 1,368 504 10,368 20,393 42,898 32,327 25,792 50,000
Korea LGD 23,144 10,928 6,247 516 96 84 12 1,100
Taiwan AUO/CMI/CVT/
Hannstar 22,335 24,648 51,116 45,930 70,997 78,188 19,073 50,000
Japan CEC-Sharp 80 2,784 5,564 2,801
Sharp 408 440 312 512 28
Total 46,847 36,568 70,955 72,715 117,304 110,627 44,877 101,100
Accumulated Giantec shipment to Panel Market ~600Mu
Why Giantec?
• World Class Quality and Performance
• Robust Operation (Strong Financial Position) and
Sustainable Partnership
• Continuous Cost Down through innovation
• Enough & Flexible Capability
• We Focus!
60
