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Gene A Frantz Principal Fellow Texas Instruments Personal and Portable: The technology that is making it happen

Gene A Frantz Principal Fellow Texas Instruments Personal and Portable: The technology that is making it happen

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Gene A Frantz

Principal Fellow

Texas Instruments

Personal and Portable: The technology that is making it happen

Decades of Digital Signal Processing

Decade Characteristic $/MIPS

’60s

’70s

’80s

’90s

Beyond

University Curiosity

Military Advantage

Commercial Success

Consumer Enabler

$100 -

$1,000

$10 - $100

$1- $10

10¢ - $1

1¢ - 10¢

Expected Part of Daily Life

Generations of DSP

Processing Processors

1980 1990

Technology Product Technology

What is DSP? How do I create a product?

How do I solve problems?

Before 1965: First tentative steps

1965: Rediscovery of the FFT

1965 to 1970: The potential becomes clear

1970 to 1980: Tools are developed

1980: VLSI makes it practical

Now: Incredible computational power opens up many new applications

Courtesy of Ron Schafer

Early DSP’ing Milestones

Courtesy of Ron Schafer

John Makhoul

John Markel, Steen Gray

Manfred Schroeder

Bishnu Atal

Some Early Contributors

The TX-2 Computer, Circa 1967

Courtesy of Ron Schafer

Jack Kilby

1st Integrated Circuit

Another Contributor

One View of DSP, Circa 1976

“That discipline which has allowed us to replace a circuit previously composed of a capacitor and a resistor with two anti-aliasing filters, an A-to-D and a D-to-A converter, and a general purpose computer (or array processor) so long as the signal we are interested in does not vary too quickly.”

Thomas P. Barnwell, III

Courtesy of Ron Schafer

Filter DSP FilterA/D D/A OUT

$50 $50 $500 $50 $50

=

IN

Early DSP’or Milestones

1978: TI “Speak and Spell” DSP synthesizer

1979: Intel 2920 “Analog Signal Processor”

1979: American Microsystems International S28211

1980: NEC µPD7720

1980: AT&T Bell Labs DSP-1 (captive)

1982: TI TMS32010

Courtesy of Will Strauss

0.01

0.1

1

10

100

1960 1970 1980 1990 2000 2010

"Min

imu

m F

eatu

re S

ize"

m)

1

10

100

1000

Glo

bal

IC

Sal

es (

$B)

ForecastHistory

The Key Drivers

PlottedAnnually

“Smaller Features Lower Cost/Function Larger Market”

5922% increase in dpw

Nano-meter 400nm

6"

80.7

310

350nm

6"

46.6

558

250nm

6"

19.2

1435

180nm

8"

10.7

2626

130nm

12"

6.7

12,186

90nm

12"

4.2

18,667Dies per

wafer

Die size (mm2)

Lithography AdvancementsFuel Growth

Shrinking Process: The Benefits

Device Year Transistors Process

32010 1983 50,000 3.0um NMOS

32020 1984 100,000 2.4um NMOS

320C30 1988 500,000 1.0um CMOS

320C50 1990 1,200,000 0.8um

320C5510 2000 22,000,000 0.18um

320C556x 2002 180,000,000 0.13um

Wafer Fabs

Greater than 10K wafers per month

Fab Space

Wafer size: 300mm

Final capacity: 35K+ wafers/month

Technology: 130nm copper 90nm copper

# Tools on floor: 320

1st full flow silicon: 2-15-01

130nm qualification: 2Q02

90nm customerprototypes: 2H02

90nm qualification: 2H03

Waffle table: 118K sq. ft.

Total mfg: 150K sq. ft.

TMS320C6416

600 MHz

Viterbi and Turbo hardware accelerators

Wireless Infrastructure

TMS320C6416

600 MHz

Viterbi and Turbo hardware accelerators

WirelessInfrastructure

6 DSP CPU @ 300MHz

3MB integrated memory

180M transistors

TMS320C5561

Wired Infrastructure

TMS320C6416

600 MHz

Viterbi and Turbo hardware accelerators

WirelessInfrastructure

6 DSP CPU

@ 300MHz3MB integrated memory 180M transistors

TMS320C5561

WiredInfrastructure

OMAP5910

DSP+GPP

Low power consumption

Voice, data, video

Wireless Client

TMS320C6416

600 MHz

Viterbi and Turbo hardware accelerators

WirelessInfrastructure

6 DSP CPU

@ 300MHz3MB integrated memory 180M transistors

TMS320C5561

WiredInfrastructure

OMAP5910

DSP+GPP

Low power consumption

Voice, data, video

Wireless ClientDigital Still Camera

TMS320DM310

DSP+GPP

Imaging accelerators

TMS320C6416

600 MHz

Viterbi and Turbo hardware accelerators

WirelessInfrastructure

6 DSP CPU

@ 300MHz3MB integrated memory 180M transistors

TMS320C5561

WiredInfrastructure

OMAP5910

DSP+GPP

Low power consumption

Voice, data, video

Wireless Client

TMS320DM310

DSP+GPP

Imaging accelerators

Digital Still Camera

225 MHz

Floating point

TMS320DA610

Performance Audio

TMS320C6416

600 MHz

Viterbi and Turbo hardware accelerators

WirelessInfrastructure

6 DSP CPU

@ 300MHz24Mbintegrated memory 180M transistors

TMS320C5561

WiredInfrastructure

OMAP5910

DSP+GPP

Low power consumption

Voice, data, video

Wireless Client

TMS320DM310

DSP+GPP

Imaging accelerators

Digital Still Camera

225 MHz

Floating point

TMS320DA610

Performance Audio

130 nm Copper Technology Today

Over 400 million transistors on a single chip

Functional integration to create entire system on one chip

Delivery Initial test chips in 90 nm process – 1H02 First device – 2H02 Fully qualified production – 2H03

Result Cost-effective, system-on-a-chip Unprecedented performance levels Significant power savings

37 nm

Transistor

90 nm

12" 6"

1

10

100

1000

10000

1975 1980 1985 1990 1995 2000 2005 2010

Po

lish

ed W

afer

Co

st [

$]

0.01

0.1

1

10

100

1975 1980 1985 1990 1995 2000 2005 2010

Waf

er F

ab C

ost

[$B

]

0.001

0.01

0.1

1

10

100

1980 1985 1990 1995 2000 2005 2010

Tra

nsi

sto

r C

ost

[m

¢]

100-mm150-mm

200-mm

300-mm

450 ?

0.1

1

10

100

1975 1980 1985 1990 1995 2000 2005 2010

Exp

osu

re T

oo

l Co

st [

$M]

?

1x scang-line

i-line

248-nm193-nm

157-nmEUV

What will it cost?

Technology (uM)

Transistors

MIPS

RAM (bytes)

Power (mW/MIPS)

Price/MIPS

3

50K

5

256

250

$30.00

1982

0.8

500K

40

2K

12.5

$0.38

1992

0.1

180M

5,000

3M

0.1

$0.02

2002

0.02

1B

50,000

20M

0.001

$0.003

2012

DEVICE CAPABILITIES

The Greatest DSP Products Haven’t Been Invented Yet

The Future of Integration

Transistors moving from microns to nanometers Gates per square millimeter going from tens of

thousands to hundreds of thousands Die sizes shrinking from tens of square millimeters

to units of square millimeters Wafer size moving to 300 millimeter Dies per wafer increasing from thousands per wafer

to tens of thousands per wafer Tooling costs going from hundreds of thousands of

dollars to millions of dollars Fab cycles increasing from weeks to months

Trends In Technology

1960s 1970s 1980s 1990s 2000s 2010s

TAM

$1B

$500B

$100B

$10B

MainframeMainframeTransistorsTransistors

MinicomputerMinicomputerTTL/LogicTTL/Logic

InternetInternetDSP & AnalogDSP & Analog

PCPCMicroprocessorMicroprocessor

The Age of Computing ????????

The Perfect Roadmap

FewerDevices

OneDevice

Lots ofDevices

Even Fewer

Devices

Time

Quiz

Who is the only DSP Guru with their pictureon a Nation’s Currency?

Who is the only DSP Guru with their pictureon a Nation’s Currency?

Quiz