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Gene A Frantz
Principal Fellow
Texas Instruments
Personal and Portable: The technology that is making it happen
Decades of Digital Signal Processing
Decade Characteristic $/MIPS
’60s
’70s
’80s
’90s
Beyond
University Curiosity
Military Advantage
Commercial Success
Consumer Enabler
$100 -
$1,000
$10 - $100
$1- $10
10¢ - $1
1¢ - 10¢
Expected Part of Daily Life
Generations of DSP
Processing Processors
1980 1990
Technology Product Technology
What is DSP? How do I create a product?
How do I solve problems?
Before 1965: First tentative steps
1965: Rediscovery of the FFT
1965 to 1970: The potential becomes clear
1970 to 1980: Tools are developed
1980: VLSI makes it practical
Now: Incredible computational power opens up many new applications
Courtesy of Ron Schafer
Early DSP’ing Milestones
Courtesy of Ron Schafer
John Makhoul
John Markel, Steen Gray
Manfred Schroeder
Bishnu Atal
Some Early Contributors
One View of DSP, Circa 1976
“That discipline which has allowed us to replace a circuit previously composed of a capacitor and a resistor with two anti-aliasing filters, an A-to-D and a D-to-A converter, and a general purpose computer (or array processor) so long as the signal we are interested in does not vary too quickly.”
Thomas P. Barnwell, III
Courtesy of Ron Schafer
Filter DSP FilterA/D D/A OUT
$50 $50 $500 $50 $50
=
IN
Early DSP’or Milestones
1978: TI “Speak and Spell” DSP synthesizer
1979: Intel 2920 “Analog Signal Processor”
1979: American Microsystems International S28211
1980: NEC µPD7720
1980: AT&T Bell Labs DSP-1 (captive)
1982: TI TMS32010
Courtesy of Will Strauss
0.01
0.1
1
10
100
1960 1970 1980 1990 2000 2010
"Min
imu
m F
eatu
re S
ize"
(µ
m)
1
10
100
1000
Glo
bal
IC
Sal
es (
$B)
ForecastHistory
The Key Drivers
PlottedAnnually
“Smaller Features Lower Cost/Function Larger Market”
5922% increase in dpw
Nano-meter 400nm
6"
80.7
310
350nm
6"
46.6
558
250nm
6"
19.2
1435
180nm
8"
10.7
2626
130nm
12"
6.7
12,186
90nm
12"
4.2
18,667Dies per
wafer
Die size (mm2)
Lithography AdvancementsFuel Growth
Shrinking Process: The Benefits
Device Year Transistors Process
32010 1983 50,000 3.0um NMOS
32020 1984 100,000 2.4um NMOS
320C30 1988 500,000 1.0um CMOS
320C50 1990 1,200,000 0.8um
320C5510 2000 22,000,000 0.18um
320C556x 2002 180,000,000 0.13um
Wafer Fabs
Greater than 10K wafers per month
Fab Space
Wafer size: 300mm
Final capacity: 35K+ wafers/month
Technology: 130nm copper 90nm copper
# Tools on floor: 320
1st full flow silicon: 2-15-01
130nm qualification: 2Q02
90nm customerprototypes: 2H02
90nm qualification: 2H03
Waffle table: 118K sq. ft.
Total mfg: 150K sq. ft.
TMS320C6416
600 MHz
Viterbi and Turbo hardware accelerators
Wireless Infrastructure
TMS320C6416
600 MHz
Viterbi and Turbo hardware accelerators
WirelessInfrastructure
6 DSP CPU @ 300MHz
3MB integrated memory
180M transistors
TMS320C5561
Wired Infrastructure
TMS320C6416
600 MHz
Viterbi and Turbo hardware accelerators
WirelessInfrastructure
6 DSP CPU
@ 300MHz3MB integrated memory 180M transistors
TMS320C5561
WiredInfrastructure
OMAP5910
DSP+GPP
Low power consumption
Voice, data, video
Wireless Client
TMS320C6416
600 MHz
Viterbi and Turbo hardware accelerators
WirelessInfrastructure
6 DSP CPU
@ 300MHz3MB integrated memory 180M transistors
TMS320C5561
WiredInfrastructure
OMAP5910
DSP+GPP
Low power consumption
Voice, data, video
Wireless ClientDigital Still Camera
TMS320DM310
DSP+GPP
Imaging accelerators
TMS320C6416
600 MHz
Viterbi and Turbo hardware accelerators
WirelessInfrastructure
6 DSP CPU
@ 300MHz3MB integrated memory 180M transistors
TMS320C5561
WiredInfrastructure
OMAP5910
DSP+GPP
Low power consumption
Voice, data, video
Wireless Client
TMS320DM310
DSP+GPP
Imaging accelerators
Digital Still Camera
225 MHz
Floating point
TMS320DA610
Performance Audio
TMS320C6416
600 MHz
Viterbi and Turbo hardware accelerators
WirelessInfrastructure
6 DSP CPU
@ 300MHz24Mbintegrated memory 180M transistors
TMS320C5561
WiredInfrastructure
OMAP5910
DSP+GPP
Low power consumption
Voice, data, video
Wireless Client
TMS320DM310
DSP+GPP
Imaging accelerators
Digital Still Camera
225 MHz
Floating point
TMS320DA610
Performance Audio
130 nm Copper Technology Today
Over 400 million transistors on a single chip
Functional integration to create entire system on one chip
Delivery Initial test chips in 90 nm process – 1H02 First device – 2H02 Fully qualified production – 2H03
Result Cost-effective, system-on-a-chip Unprecedented performance levels Significant power savings
37 nm
Transistor
90 nm
12" 6"
1
10
100
1000
10000
1975 1980 1985 1990 1995 2000 2005 2010
Po
lish
ed W
afer
Co
st [
$]
0.01
0.1
1
10
100
1975 1980 1985 1990 1995 2000 2005 2010
Waf
er F
ab C
ost
[$B
]
0.001
0.01
0.1
1
10
100
1980 1985 1990 1995 2000 2005 2010
Tra
nsi
sto
r C
ost
[m
¢]
100-mm150-mm
200-mm
300-mm
450 ?
0.1
1
10
100
1975 1980 1985 1990 1995 2000 2005 2010
Exp
osu
re T
oo
l Co
st [
$M]
?
1x scang-line
i-line
248-nm193-nm
157-nmEUV
What will it cost?
Technology (uM)
Transistors
MIPS
RAM (bytes)
Power (mW/MIPS)
Price/MIPS
3
50K
5
256
250
$30.00
1982
0.8
500K
40
2K
12.5
$0.38
1992
0.1
180M
5,000
3M
0.1
$0.02
2002
0.02
1B
50,000
20M
0.001
$0.003
2012
DEVICE CAPABILITIES
The Greatest DSP Products Haven’t Been Invented Yet
The Future of Integration
Transistors moving from microns to nanometers Gates per square millimeter going from tens of
thousands to hundreds of thousands Die sizes shrinking from tens of square millimeters
to units of square millimeters Wafer size moving to 300 millimeter Dies per wafer increasing from thousands per wafer
to tens of thousands per wafer Tooling costs going from hundreds of thousands of
dollars to millions of dollars Fab cycles increasing from weeks to months
Trends In Technology
1960s 1970s 1980s 1990s 2000s 2010s
TAM
$1B
$500B
$100B
$10B
MainframeMainframeTransistorsTransistors
MinicomputerMinicomputerTTL/LogicTTL/Logic
InternetInternetDSP & AnalogDSP & Analog
PCPCMicroprocessorMicroprocessor
The Age of Computing ????????