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Di
Please disass before.
Ba C M T H O K W V K L 2n T M B
asse
follow the i mbly proce
SUS G7procedudetailed
The disa
ttery ModulU Modulemory ModTunerD Moduletical Driveyboard Mo AN
Modu A ModuleB cover MD Moduled VGA Mop Case Motherboardttom
Case
mbly
nformation ure of the
0S Seriesres for the cdisassembly ssembly pro
e
le
oduleulee
dule
uleuleoduleodule
Proc
rovided in otebook.
otebook omplete noprocedure ocedure consi
2 - 1
dure
this section Be sure to
onsists of ebook disasf individualsts of the fo
to perform se proper t
various msembly. In
odules willllowing step
Disas
he complete ools describe
dules. Thiaddition, inbe provide
s:
sembly Pro
d
chapterbetween prfor your se
Chapt
2cedure
escribes thcedures, th
vice needs.
r
ee
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A T T E R Y
C P U
Batt The il Remo 1. Tu
CPU The il 1. R
M
ery Mo
ustration
ving the b
rn the not
Modul
ustration
move 5 (
2*4(L)
ule
elow sho
t t e ry
book over.
elow sho
2*4L) scr
s how to r
. Unlock a
s how to r
ws, and th
2 - 2
move the
d hold the
move the
en remov
battery mo
latch, and
CPU mod
the CPU
Disas
dule.
remove th
le.
over.
sembly Pro
battery.
cedure
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2.
3. Di
4. T
isconnect
sconnect t
en remov
2 fan cabl
e DC-IN c
the fan m
s
able and r
odule.
2 - 3
move 2(
2*6) scre
Disas
s from ea
sembly Pro
h fan.
cedure
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5. R
6. Ta
M
move 4 (
ke the hea
*4(L)
M2
2*6L) scr
t sink awa
*6(L)
ws and 1 (
2 - 4
M2*4L) sc
rews from
Disas
the CPU
sembly Pro
heat sink
cedure
by order
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7. Tu
8. S
rn the non
ueeze the
-removabl
vacuum h
screw he
ndling pu
2 - 5
e 180 deg
p on the
rees count
PU and u
Disas
er-clockwi
se it to lift t
sembly Pro
e to loose
he CPU a
cedure
the CPU.
ay.
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M
M
R E
E M O R Y
O D U L E
M O V A L
Me For G It can
Remo 1. P
2. P
an
ory Mo
70S Serie upgrade t
ving Mem
p the mod
p the 2nd
gle.
dule
Noteboo e total me
ry Module
ule up to 4
memory
There i ory size
5 angles,
odule to
2 - 6
s two SO- p to 4 GB
and then p
45 angle
IMM sock ith a 2G
ulling out t
, and the
Disas
ets for inst module o
e module
n pulling o
sembly Pro
lling SO- each soc
in that ang
ut the mo
cedure
IMM RA
et
le.
ule in tha
.
t
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M
R E
W L A N
O D U L E
M O V A L
TV
The i noteb Remo 1. R
2. Rou
uner
lustrations ook
ving TV T
move the
move 2 (t at that an
M
below sh
ner Mod
antenna.
2*3L) scrgle.
*3(L)
w how to
le
ws to pop
2 - 7
remove t
the T V Tu
e TV Tu
er module u
Disas
er and W
p to up to
sembly Pro
AN modu
5 angles
cedure
le from th
,then pull i
t
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H D D HD RemoThe il 1. R
2. P
3. R
Modul
ving HDDustrations move 2 (
ll out the h
move 4 (
M
odulebelow sho 2*4L)scre
ard drive
2*4L) scr
2*4(L)
*4(L)
how to r s and tak
nd lift the
ws from 2
2 - 8
move the e away th
ard drive
d HDD m
HDD mod HDD cov
way.
odule.
Disas
le from th r.
sembly Pro
notebook
cedure
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4. P
5. R
ll out the 2
move 4 (
nd hard dr
3*3L) scr
M3*3(L)
ive and tak
ws from th
2 - 9
e it away.
e HDD ho
sing,and t
Disas
hen take a
sembly Pro
way the h
cedure
using.
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M
R E
O D D
O D U L E
M O V A L
OD The il 1.
2.
Modul
ustrations
emove th
ut the twe
M2*4(
below sho
rubber an
zers here
)
how to r
d 1 (M2*4
and push
2 - 10
move the
) screw fr
he ODD d
ODD mod
m the bott
rive out fro
Disas
le from th
om case.
m the NB.
sembly Pro
notebook
cedure
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K E Y B O A R D
KeyThe il 1. U
2. T
3. Di
oard Mustration
lock 4 key
rn over th
sconnect t
odulef below sh
board latc
keyboard
e keyboar
ws how t
es.
plate and
d FPC an
2 - 11
remove t
lay it on th
then rem
e keyboar
front side
ve the ke
Disas
d
board.
sembly Pro
cedure
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Remo1. Us2. Ca3. Lo
3.
1. Unloc
v ing Keyba flexible
efully pullk the conn
ard Cableconnectorout the keyector (no.
1. Un
2. Cable out
3
tool to unlboard cab) again to
lock
.
2 - 12
ck the cale (no. 2)avoid pos
le connecith a pairible break
Disas
or on bothf tweezersage.
sembly Pro
ends (no..
cedure
1).
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W L A N
M O D U L E
WL Remo 1. R
2. Rth
N Mod
ving WLA
move the
move 2 (t angle.
le
Module
tape here,
2*3L)scre
2*3(L)
and then d
s to pop t
2 - 13
isconnect
he WLAN
3 antenna
module up
Disas
.
to 45 an
sembly Pro
gles, then
cedure
ull it out at
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4. Tsi
ke away tk module he VGA cby pastern
rd softly..
2 - 15
lease noti
ice that th
Disas
VGA car
sembly Pro
is fixed
cedure
ith its heat
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K / B
C O V E R
M O D U L E
K /B
Remo 1. U
2. T
3. Di
COVER
ving LCD
e the plas
rn over th
sconnect t
Modul
odule
ic blade to
KB cover
e FPC, a
loosen t
and lay it
d remov
2 - 16
e KB cov
n the front
the KB c
r.
side. Don
ver.
Disas
t take it a
sembly Pro
ay yet.
cedure
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4. Di
5. R
6. Di
sconnect t
move 2 (
sconnect t
e FFC fro
2*3L) scr
e FFC fro
M2*3(L)
the pw s
ws from th
the insta
2 - 17
witch boar
e pw switc
nt key boa
d.
h board, a
rd.
Disas
nd take it a
sembly Pro
way.
cedure
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7. R move 2 (
M2*
2*3L)scre
(L)
s from th
2 - 18
instant k
y board br
Disas
acket, and
sembly Pro
take it aw
cedure
y.
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L C D
M O D U L E
LCD
The i modu brack Remo
1. R
2. R
Module
llustrations le contain et, Hinge c
ving LCD
emove 2 (
emove 2 (
below sh LCD pa
over, LCD
odule
2.5*8L) s
2.5*8L) s
ow how t el, Came front cove
crews of e
crews from
M2.
M2.
2 - 19
remove a module ,, LCD bac
ch side fr
the rear si
*8(L)
*8(L)
and disas Inverter cover
m bottom
ide.
Disas
emble th board, LE
case.
sembly Pro
LCD m module,
cedure
dule. Th CD Hing
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3. R
4. R
5. D
elax the a
move the
isconnect t
tennas fro
2(M2*4L)
he inverter
m their slot
crews .
cable and
2 - 20
s.
LVDS cab
le.
Disas
sembly Pro
cedure
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6. R
7. S
emove 2 (
eparate L
2.5*8L) s
D module
crews from
from botto
M
2 - 21
hinges.
case.
.5*8(L)
Disas
sembly Pro
cedure
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Disas 1. R
un
2. Pr
semble LC
move 6 rder them.
y the edg
D Module
und and
s of LCD
anomalo
bezel and
2 - 22
s rubber
then sepa
pads , the
rate it fro
Disas
remove
the LCD
sembly Pro
(M2.5*6L
cover.
cedure
) screws
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3. R
4. Di
5. R
move the
sconnect t
move the
tape.
he inverte
1(M2*6L)
2*6(L)
r cable fro
crew fro
2 - 23
m inverter
inverter
board.
oard.
Disas
sembly Pro
cedure
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6. Di
7. R
8. R
sconnect t
move 2 (
move the
he 2 pow
2.5*8L) s
lower LC
r cables fr
crews fro
bracket.
M2.
2 - 24
om invert
lower L
5*8(L)
r cable, a
D bracket
Disas
nd take a
.
sembly Pro
ay invert
cedure
r board.
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9. R
10. S
11. Ra
move 2 (
parate L
move 4 (ay.
2*6L) scr
D panel fr
2*3L) scr
ews from
om LCD c
ews from
M2*
M
2 - 25
LCD brac
over.
both left a
(L)
*3(L)
et.
d right L
Disas
D bracket
sembly Pro
, and take
cedure
them
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12. Di
13. Rth
14. R
sconnect t
move 2 (hinges a
move 2
he LVDS
2.5*8) scway.
pieces of
able from
rews ,1 (M
tape as be
M2
M2
2 - 26
LCD pan
2*6L) scr
low.
.5*8(L )
*6(L)
l and tak
w from bo
Disas
it away.
th left and
sembly Pro
right hing
cedure
, and tak
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15. Di
16. Di
17. R
sconnect t
sconnect t
move the
he camer
he cable f
inverter c
cable fro
om LED
ble.
2 - 27
m camera
oard.
board.
Disas
sembly Pro
cedure
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18. R
19. Di
20. R
move the
sconnect
move 3 p
camera b
2 LED c
ieces of ta
ard.
bles from
pe from b
2 - 28
LED boar
th side.
.
Disas
sembly Pro
cedure
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21. R
22. Te
23. Ta
move the
ar the whi
ke away t
tape from
te tape fro
e LED ca
the LED
m both sid
ble.
2 - 29
able.
e.
Disas
sembly Pro
cedure
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24. Di
25. R
26. R
sconnect
move 2 (
move me
M2
embrane
2*4L) scr
mbrane 1
*4(L)
1 and me
ews from
and then
2 - 30
mbrane 2
LED boar
embrane
membr
membr
from LED
.
2.
ane 1
ane 2.
Disas
board.
sembly Pro
cedure
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27.
28. R
29. R
emove th
move 4 (
move the
e tape her
2*6L) scr
2 LCD ho
e.
ews and t
oks.
2 - 31
ke the to
LCD bra
Disas
cket away.
sembly Pro
cedure
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30. R
31. R
move 2 p
move the
ieces of ta
antennas.
pe from th
.
2 - 32
e antenna
s.
Disas
sembly Pro
cedure
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V G A
O D U L E2
N The il 1. R
2. R
3. R
VGA M
ustration
move 2 (
move 1(
move 1 (
M2*4(L)
odule
f below sh
2*4L)scr
2*4L) scr
2*4L) scr
M
ws how t
ws from t
w from th
ew from t
*4(L)
2 - 33
remove t
he top cas
e VGA left
e VGA br
e 2nd VG
e to relax
bracket,
cket, and
Disas
card mo
VGA brac
nd take it
take the b
sembly Pro
ule.
et.
away.
racket aw
cedure
ay.
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4. R
5. R
5. Rh
M
move 4(
move 1 (
move 1(Mat sink mo
*4(L)
2*6L) scr
2*4L) scr
2*4) scredule is fixe
M
ws from t
ew,1 (M2*
here andd with the
2*6(L)
2*4(L)
2 - 34
he top cas
6L) screw
remove thGA card
e to relax
and take t
VGA heay pastern.
Disas
VGA heat
he bracke
t sink mod
sembly Pro
sink.
t away.
le. Pleas
cedure
notice that
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6. R
7. Di
move the
sconnect t
2nd VGA
he coaxial
card.
cable fro
2 - 35
VGA car
d.
Disas
sembly Pro
cedure
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T O P
C A S ETop
The il 1. Dis
ca(M
Laun
case M
ustration
connect thle, the OL*4) screw
ch cable
odule
f below sh
e instant FED cables from mot
OLED cab
ws how t
C ,the topand the la
herboard.
Toucle
2 - 36
remove t
speaker cunch cabl
hpad FFC
M2*6
e top cas
able ,the t, then re
Card rea
(L)
M2*4(L)
Disas
module.
uchpad Fmove 7 (M
er cable
sembly Pro
C ,the car2*6) scre
Instant key
Speaker cab
cedure
d readers and 4
cable
le
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2. Rear
3. Se
M2*3(L)
ove 13 (a, and 3 (
arate top
M2*6L)
2*6) scre2*3) scre
ase from
s ,2(M2*4s from th
ottom cas
2 - 37
) screws frleft side.
e.
om HDD a
Disas
rea,8 (M2*
M
sembly Pro
) screws f
2*4(L)
cedure
rom batter
-
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4. Re
5. Dis
6. Re
ove 2 (M
connect th
ove 4 (M
*3L) scre
e card rea
*6L) scre
2*3(L)
2*6(L)
s from O
er cable fr
s ,and t
2 - 38
ED board,
om its boa
en remov
and take i
rd and tak
the card
Disas
t away.
it away fr
eader.
sembly Pro
m its hoo
cedure
.
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7. Dis
8. Re
9. Re
connect
ove 8 (M
ove the t
FFC from
*3L) scre
uchpad fr
touchpad
s from to
m top cas
2 - 39
board.
chpad bo
e and disc
rd and tak
onnect the
Disas
e it away.
FFC from
sembly Pro
touchpad.
cedure
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10. R
11. Di
12. T
move 5 (
sconnect t
ar the myl
M2*3(L)
2*3L) scr
he launch
ar .
ws from l
able from
2 - 40
unch boar
its board.
d, and tak
Disas
the board
sembly Pro
away.
cedure
-
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13. R move 2(
2*3L) scre
ws from e
M2
2 - 41
ch top sp
*3(L)
aker.
Disas
sembly Pro
cedure
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M O T H E
M O
R
R B O A R D
D U L E
M / B
E M O V A L
MotThe il Remo1. R
2. Dim
3. Di
erboar lustration ving Mothmove 2
sconnect btherboard
sconnect
d modubelow sh rboard Mieces of t
lue tooth c.
SATA cab
lew how to odulepe here.
able, botto
le and aud
2 - 42
remove a
m speaker
io cable.
d disass
cable and
Disas
mble the
2 LED cab
sembly Pro
otherboa
les from
cedure
rd module
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4. R
5. R
move 4 (
move 2 (
2*6) scre
2*4L) scr
2*4(L)
2*6(L)
s from th
ws from b
M2
2 - 43
mother b
ttom case
*6(L)
ard and 1(
.
Disas
M2*6) scr
sembly Pro
w from M/
cedure
B bracket.
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6. S
Disas1. R
2. R
parate mo
sembing Mmove 2 (
move 2 (
M2
M2
ther board
otherboar 2*3L) scr
2*4L) scr
*3(L)
*4(L)
from botto
d Modulews from I/
ws and 2(
2 - 44
m case.
bracket ,
M3*6L) sc
and then
rews from
M2*
Disas
emove the
I/O board.
4(L)
sembly Pro
DC-IN ca
cedure
le.
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3. R
4. Di
5.
move the
sconnect t
emove th
I/O bracke
e cable h
tape here
t.
re.
, and disco
2 - 45
nnect the DC cabl
Disas
.
sembly Pro
cedure
-
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6. R
7. Rth
move 2(M
move 1 st angle.
M
2*3L) scre
rew here t
M2*3(
2*3(L)s and tak
o pop the r
)
2 - 46
e away th
oboson mi
modem
nicard up t
Disas
odule.
o 45 angl
sembly Pro
es, then p
cedure
ll it out at
-
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B O T T O
M O
M C A S E
D U L E
Bott 1. R
2. R
3. Di
om Cas
move 2 (
move 2 (
sconnect t
M2
M
e Modu
2*6L) scr
2*6L) scr
e audio c
6L)
2*6(L)
le
ews from
ws from a
ble from it
2 - 47
SATA bo
dio board
s board.
rd, and ta
, and take
Disas
e the boar
he board
sembly Pro
d away.
way.
cedure
-
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4.
5. Di
6. R
emove th
sconnect t
move 5 pi
tape here
e Bluetoo
eces of tap
, and remo
h cable fro
e.
2 - 48
ve the Blu
m its boar
tooth mo
.
Disas
ule.
sembly Pro
cedure
-
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7. R
8. T
9. R
move 2 (
ke the LE
move bott
2*3L) scr
cable aw
om speak
ws as bell
ay.
rs.
w.
Disas
sembly Pro
cedure
