35
PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT PAGE 24 Rectifier Diode / SiC-SBD PAGE 25 Small PIM PAGE 8 PIM PAGE 9 6-Pack PAGE 11 Standard 2-Pack PAGE 13 Standard 1-Pack/ Chopper PAGE 15 High Power Module PAGE 17 Note: PrimePACK™ is registered trademark of Infineon Technologies AG, Germany. FUJI Power Semiconductors IGBT / SiC Devices Selection Guide 25A2-E-0005

FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

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Page 1: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

PrimePACK™PAGE

18

T/I-typeNPC 3-level

PAGE

19 Small IPMPAGE

20 IPMPAGE

20 Hybrid SiC Module PAGE

23 Discrete IGBTPAGE

24Rectifier Diode /SiC-SBD

PAGE

25

Small PIMPAGE

8 PIMPAGE

9 6-PackPAGE

11 Standard 2-PackPAGE

13Standard 1-Pack/Chopper

PAGE

15 High Power ModulePAGE

17

Note: PrimePACK™ is registered trademark of Infineon Technologies AG, Germany.

FUJI Power Semiconductors

IGBT/SiC Devices Selection Guide

25A2-E-0005

Page 2: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

1

Page 3: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

Number of IGBT Switches

Page

Max VCE (VRRM) Rated Current

Products Category

IGBT Module DiscreteIGBT Diode

DiscreteSiC-SBD 600V 650V 1200V 1700V 3300VStandard

ModulePower IntegratedModule

IntelligentPower Module

7 Small-PIM 8PIM EconoPIM™ 9

106 11

122 Standard 2-Pack 13

141 Standard 1-Pack 15

Chopper 151,2 High Speed Module 16

High Power Module 1718

4,12 T/I-type NPC 3-level 19 Reverse-Blocking IGBTs are integrated.6,7 IPM 20

2122

2,6,7 Hybrid SiC Module 231 Discrete IGBT 24

25SiC-SBD 25

Note: PrimePACK™ is registered trademark of In neon Technologies AG, Germany. conoPI ™ is registered trademark of In neon Technologies AG, Germany. conoPACK™ is registered trademark of In neon Technologies AG, Germany.

Suffix 50 to 99 indicates RoHS compliance

Max VCE : 060 = 600V, 065 = 650V, 120 = 1200V, 170 = 1700V, 330 = 3300V

Package TypeIGBT Device Technology : X Series(7th Generation) / V Series(6th Generation) / U Series(5th Generation)

Rated current IC [A]

6 MBIGBT Module Production Number

I -300 X□…□ 120 - 50

Number of IGBT switches

Internal Configuration : I = Standard Module, R = Power Integrated Module, P = Intelligent Power ModuleIGBT Module type: MB = Si-IGBT+ Si-Diode, MS = Si-IGBT+ SiC-SBD

Diode Type: C or E = With Diode(Full rated), D = With Diode, Blank = Without Diode

Series: W = High Speed W series, H = High Speed V series, V = V Series, RB = RB series

Max VCE : 60 = 600V, 65 = 650V, 120 = 1200VPolarity: N = N-ch

Rated Current IC [A]

F GDiscrete IGBT Production Number

W 50 N 65 W D

Company Code : Fuji

Package Type : W = TO-247-P2, Z = TO-247-4-P2Device Code : G = IGBT

Series: L = Ultra Fast Recovery, J = Soft/Fast RecoveryMax VRRM : 60 = 600V, 65 = 650V, 120 = 1200V

Cofiguration : C = Dual (Cathode common), S or T = SingleRated Current IO [A]

F DRRectifier Diode Production Number

W 50 C 65 L

Company Code : Fuji

Package Type : P = TO-220, W = TO-247-P2Device Code : DR = FWD

Max VRRM : 65 = 650V, 120 = 1200V

Cofiguration : C = Dual (Cathode common), S or T = Single

Rated Current IO [A]

F DCSiC Schottky-Barrier Diode Production Number

P 10 S 65

Company Code : Fuji

Package Type : A = TO-220F, C = T-Pack(s), P = TO-220, W = TO-247-P2

Device Code : DC = SiC-SBD

2

Page 4: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

7MBR Ic IGBT series & Package type

Size PageV series X seriesSolder pins Solder pins

33. 62. mm56.7 62. mm

VW, VY XM□, XP□ XW□, XY□ 45 107.5mm 9,10EconoPIM™VB, VN, VR VX, VZ XN□, XR□ XX□, XZ□ 62 122mm 9,10

100

75

50

353025201510

80

150

Ic(A)

600V / 650V 1200V

VB

PIM(V series)PIM(X series)

PIM(V series)PIM(X series)

VPVY VB

VRVZ

VKAVKC

XKAXKC

VKBVKD

XKBXKD

VMVPVWVY

VA

XMAXWA

XP□XY□

XR□XZA

XM□XP□XW□XY□

XN□XR□XX□XZ□

VNVRVXVZ

XNAXXA

VKAVKC

XKAXKC

VKBVKD

XKBXKD VA

600V/650V 1200V

PIM (Power Integrated Modules) Products Map

Note:EconoPIM™ is registered trademark of In neon Technologies AG, Germany.

3

Page 5: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

6MBI Ic IGBT series & Package type

Size PageV/U series X seriesSolder pins Solder pins

VW 45 107.5mm 11EconoPACK™VB, U4B VX XB□ XB□, XX□ 62 122mm 11

V 150 162mm 12 EconoPACK™+Under development

6-Pack Products Map

600550

450

300

225200

180

150

100

75

50

0

Ic(A)

600V 1200V 1700V

600V 1200V 1700V

6-Pack(V series) 6-Pack(V series)6-Pack(X series)

6-Pack(V series)6-Pack(U series)

VAVW

VBVX

V

U4B

V

XB□XX□

VAVW

VBVX

XAE* VX

Note:EconoPACK™ and EconoPACK™+ are registered trademark of In neon Technologies AG, Germany.

Under development

4

Page 6: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

2MBI Ic IGBT series & Package typeSize PageV series X series34 94mm 13

Standard Pack

VB XBE 45 92mm 13VD XDE 62 10 mm 13VE XEE 0 110mm 13VH 62 10 mm 13VJ, VN, VX XN□ 62 150mm 14VG, VT - 140 130mm 17 High Power Module

9 172mm 1PrimePACK™VXB 9 250mm 1

PrimePACK™ is registered trademark of In neon Technologies AG, Germany Under development

2-Pack Products Map

600V/650V 1200V 1700V

600V / 650V 1200V 1700V

2-Pack(V series)2-Pack(X series)

2-Pack(V series)2-Pack(X series)

2-Pack(V series)2-Pack(X series)

1800160015001400

1200

1000900800650600550

450400300225200150100

750

Ic(A)

VB XBE

VD XDE

VA

VDVH

VB

XDE

XBE

XXB*XXF*

XXA*XXE*

XAA

VE

VXB

XEE

VAXAA

VAXAA

VE XEE

XHA VE

VHXHA

XEE

VXA

VG

VNVXVJ

XN□

XN□

XXA*XXE*

VN VX VJ

VXA

VTVG

VXB

XXB*XXF*

Under development

5

Page 7: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

1MBI Ic IGBT series & Package type

Size PageV/U seriesV 62 10 mm 15 Standard PackVC, VR, UG 140 130mm 17

High Powe ModuleVD, VS, UE 140 190mm 17

1-Pack Products Map

3600

2400

1600

1500

1200

1000

900

800

600

400

300

0

Ic(A)

1200V 1700V 3300V

V

1200V 1700V 3300V

VC

VD

V

VCVR

VDVS

UE

UG

1-Pack(V series) 1-Pack(V series) 1-Pack(U series) 6

Page 8: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

6/7MBI Ic IGBT series & Package type Size

V series X seriesPage7 in 1 6 in 1 6 in 1

26 43mm 2049.5 70mm 2050.2 7mm 2055 90mm 20

4 12 .5mm 21110 142mm 22

IPM (Intelligent Power Modules) Products Map

400

300

200

150

100

75

50

3530252015100

Ic(A)

600V 1200V

600V 1200V

IPM(V series)IPM(X series)

IPM(V series)

VAA

VAA

VDN

VEA

VEA

VFN

VDA

VDNVDA

VBA

VFNVBA

XSFXSD

7

Page 9: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

Small PIM (Power Integrated Modules)600V 650V 1200V

Ic V series X series V series X series7MBR10VKA060-50 7MBR10XKA065-50 7MBR10VKA120-50 7MBR10XKA120-50

7MBR15VKA060-50 7MBR15XKA065-50 7MBR15VKA120-50 7MBR15XKA120-50

7MBR20VKA060-50 7MBR20XKA065-50

7MBR25XKA120-50

7MBR30VKA060-50 7MBR30XKA065-50V: M726, X: M730

7MBR15VKB120-50 7MBR15XKB120-50

7MBR25VKB120-50 7MBR25XKB120-50

7MBR35VKB120-50 7MBR35XKB120-50

7MBR50VKB060-50 7MBR50XKB065-50

V: M727, X: M731

With

NTC

, sol

der p

ins

7MBR10VKC060-50 7MBR10XKC065-50 7MBR10VKC120-50 7MBR10XKC120-50

7MBR15VKC060-50 7MBR15XKC065-50 7MBR15VKC120-50 7MBR15XKC120-50

7MBR20VKC060-50 7MBR20XKC065-50

7MBR25XKC120-50

7MBR30VKC060-50 7MBR30XKC065-50V: M72 , X: M732

7MBR15VKD120-50 7MBR15XKD120-50

7MBR25VKD120-50 7MBR25XKD120-50

7MBR35VKD120-50 7MBR35XKD120-50

7MBR50VKD060-50 7MBR50XKD065-50

V: M729, X: M733

mm

Thermistor

Thermistor

Thermistor

Thermistor

8

Page 10: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

PIM (Power Integrated Modules) EconoPIM™600V 650V 1200V

Ic V series X series V series X series

With

NTC

, sol

der p

ins,

PIM

7MBR25VA120-507MBR35VA120-50

7MBR50VA060-50

M711

7MBR25VM120-507MBR35VM120-50 7MBR35XMA120-50

7MBR50XMA065-50 7MBR50VM120-50 7MBR50XMA120-507MBR75XMA065-50 7MBR75XME120-50

M719

7MBR25VP120-507MBR35VP120-50 7MBR35XPA120-50

7MBR50VP060-50 7MBR50XPA065-50 7MBR50VP120-50 7MBR50XPA120-507MBR75VP060-50 7MBR75XPA065-50 7MBR75XPE120-507MBR100VP060-50 7MBR100XPE065-50

M719

7MBR35VB120-507MBR50VB120-50

7MBR75VB060-50 7MBR75VB120-507MBR100VB060-50

M712

7MBR50VN120-507MBR75XNA065-50 7MBR75VN120-50 7MBR75XNA120-507MBR100XNA065-50 7MBR100VN120-50 7MBR100XNA120-507MBR150XNA065-50 7MBR150VN120-50 7MBR150XNE120-50

M720

7MBR50VR120-507MBR75VR120-50 7MBR75XRA120-50

7MBR100VR060-50 7MBR100XRA065-50 7MBR100VR120-50 7MBR100XRA120-507MBR150VR060-50 7MBR150XRA065-50 7MBR150VR120-50 7MBR150XRE120-50

7MBR150XRE065-50M720

Note1: Pin assignment of output terminals changes within the range of colored position depending on output current.Note2: EconoPIM™ is registered trademark of In neon Technologies AG, Germany.

mm

R

B

TS

P

R S T UV

P

R B

P

TS

B

RS

TU

VW

P

P1

NN1

B

RS

TU

V

W

P1

PN

N1

RB

PN

UV

W

P1

ST

N1

Thermistor

R S T B

P1

N N1

P

U V W

Thermistor

R S T B

P1

N N1

P

U V W

Thermistor

R S T B

P1

N N1

P

U V W

Thermistor

R S T B

P1

N N1

P

U V W

Thermistor

R S T B

P1

N N1

P

U V W

Thermistor

R S T B

P1

N N1

P

U V W

9

Page 11: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

PIM (Power Integrated Modules) EconoPIM™600V 650V 1200V

Ic V series X series V series X series 7MBR25VW120-507MBR25VW120- 07MBR35VW120-50 7MBR35XWA120-507MBR35VW120- 0

7MBR50XWA065-50 7MBR50VW120-50 7MBR50XWA120-507MBR50VW120- 0

M721 7MBR75XWA065-50 7MBR75XWE120-507MBR25V 120-507MBR25V 120- 07MBR35V 120-50 7MBR35X A120-507MBR35V 120- 0

7MBR50V 060-50 7MBR50X A065-50 7MBR50V 120-50 7MBR50X A120-507MBR50V 060- 0 7MBR50V 120- 07MBR75V 060-50 7MBR75X A065-50 7MBR75X E120-507MBR75V 060- 07MBR100V 060-50 7MBR100X E065-50

M721 7MBR100V 060- 07MBR50VX120-507MBR50VX120- 0

7MBR75XXA065-50 7MBR75VX120-50 7MBR75XXA120-507MBR75VX120- 0

7MBR100XXA065-50 7MBR100VX120-50 7MBR100XXA120-507MBR100VX120- 0

7MBR150XXA065-50 7MBR150VX120-50 7MBR150XXE120-50M722 7MBR150VX120- 0

7MBR50VZ120-507MBR50VZ120- 07MBR75VZ120-50 7MBR75XZA120-507MBR75VZ120- 0

7MBR100VZ060-50 7MBR100XZA065-50 7MBR100VZ120-50 7MBR100XZA120-507MBR100VZ060- 0 7MBR100VZ120- 07MBR150VZ060-50 7MBR150XZA065-50 7MBR150VZ120-50 7MBR150XZE120-50

M722 7MBR150VZ060- 0 7MBR150VZ120- 0Note1: Pin assignment of output terminals changes within the range of colored position depending on output current.Note2: EconoPIM™ is registered trademark of In neon Technologies AG, Germany.Note3: - 0 : Pre-Applied Thermal-Interface-Material for -50

mm

Thermistor

R S T B

P1

N N1

P

U V W

Thermistor

R S T B

P1

N N1

P

U V W

Thermistor

R S T B

P1

N N1

P

U V W

Thermistor

R S T B

P1

N N1

P

U V W

10

Page 12: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

600V 1200V 1700Vmm Ic V series V series X series V / U Series

With

NTC

, sol

der p

ins

6MBI50VA-060-50 6MBI50VA-120-50

6MBI75VA-060-50 6MBI75VA-120-50

6MBI100VA-060-50 6MBI100VA-120-50 6MBI100XAE120-50

V: M636, X: M669 Solder pins

6MBI100VB-120-50 6MBI100XBA120-50 6MBI100U4B-170-50

6MBI150VB-060-50 6MBI150VB-120-50 6MBI150XBA120-50 6MBI150U4B-170-50

6MBI1 0VB-120-50

6MBI1 0VB-120-55

6MBI200XBA120-50V: M633, X: M66 Solder pins 6MBI200XBE120-50

6MBI50VW-060-50 6MBI50VW-120-50

6MBI75VW-060-50 6MBI75VW-120-50

6MBI100VW-060-50 6MBI100VW-120-50

M647 Press t pins

6MBI100VX-120-50 6MBI100XXA120-50 6MBI100VX-170-50

6MBI100VX-120- 0 6MBI100VX-170- 0

6MBI150VX-060-50 6MBI150VX-120-50 6MBI150XXA120-50

6MBI150VX-060- 0 6MBI150VX-120- 0

6MBI1 0VX-120-50

6MBI1 0VX-120- 0

6MBI1 0VX-120-55

6MBI1 0VX-120- 5

6MBI200XXA120-50M64 Press t pins 6MBI200XXE120-50

Note1: 6MBI1 0VB-120-55, 6MBI1 0VX-120-55 Premium type (Low Thermal Impedance Version) Under developmentNote2: Pin assignment of output terminals changes within the range of colored position depending on output current.

- 0 , - 5 : Pre-Applied Thermal-Interface-Material for -50 , -55Note3: EconoPACK™ is registered trademark of In neon Technologies AG, Germany.

UV

W

PN

UV

W

PN

UV

W

PN

UV

W

PN

Thermistor

P

N

U V W

Thermistor

P

N

U V W

Thermistor

P

N

U V W

Thermistor

P

N

U V W

11

Page 13: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

1200V 1700Vmm Ic V series V series

With

NTC

, Hig

h po

wer

6-P

ack 6MBI225V-120-50

6MBI300V-120-50 6MBI300V-170-50

6MBI300V-120- 0

6MBI450V-120-50 6MBI450V-170-50

6MBI450V-170- 0

6MBI550V-120-50

M629

Note1: EconoPACK™+ is registered trademark of In neon Technologies AG, Germany.Note2: - 0 : Pre-Applied Thermal-Interface-Material for -50

U+ V+ W+

C5 C3 C1

G5 G3 G1

T1 T2

U1 V1 W1U2 V2 W2

G6 G4 G2

E5 E3 E1

E6 E4 E2

U- V- W-

Thermistor

12

Page 14: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

Standard 2-Pack600V 650V 1200V 1700V

mm Ic V series X series V series X series V series X series

2-Pa

ck

75A 2MBI75VA-120-50 2MBI75VA-170-50 2MBI75XAA170-50100A 2MBI100VA-060-50 2MBI100VA-120-50 2MBI100XAA120-50 2MBI100VA-170-50 2MBI100XAA170-50150A 2MBI150VA-060-50 2MBI150XAA065-50 2MBI150VA-120-50 2MBI150XAA120-50 2MBI150XAA170-50200A 2MBI200VA-060-50 2MBI200XAA065-50 2MBI200XAA120-50

M263

150A 2MBI150VB-120-50200A 2MBI200VB-120-50 2MBI200XBE120-50300A 2MBI300VB-060-50 2MBI300XBE065-50 2MBI300XBE120-50400A 2MBI400VB-060-50 2MBI400XBE065-50

M274

300A 2MBI300VD-120-50400A 2MBI400VD-060-50 2MBI400XDE065-50 2MBI400VD-120-50 2MBI400XDE120-50600A 2MBI600VD-060-50 2MBI600XDE065-50 2MBI600XDE120-50

M275

150A 2MBI150VH-170-50 2MBI150XHA170-502MBI150VH-170-80

200A 2MBI200VH-120-50 2MBI200VH-170-50 2MBI200XHA170-502MBI200VH-120-80 2MBI200VH-170-80

300A 2MBI300VH-120-50 2MBI300XHA120-50 2MBI300VH-170-50 2MBI300XHA170-502MBI300VH-120-80 2MBI300VH-170-80

400A 2MBI400XHA170-50450A 2MBI450VH-120-50 2MBI450XHA120-50

2MBI450VH-120-802MBI450VH-120F-50*1

2MBI450VH-120F-80M276 600A 2MBI600XHA120-50

300A 2MBI300VE-120-50 2MBI300VE-170-50 2MBI300XEE170-502MBI300VE-120-80 2MBI300VE-170-80

400A 2MBI400VE-170-50 2MBI400XEE170-502MBI400VE-170-80

450A 2MBI450VE-120-50 2MBI450XEE120-502MBI450VE-120-80

600A 2MBI600VE-060-50 2MBI600XEE065-50 2MBI600VE-120-50 2MBI600XEE120-50M277 2MBI600VE-060-80 2MBI600VE-120-80

Note: “-80” : Pre-Applied Thermal-Interface-Material for “-50”

94

*1

92

13

Page 15: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

Standard 2-Pack1200V 1700V

mm IcV series V series With

1X series V series V series With

1X series

With

NTC

, sol

der p

ins

2MBI225VN-120-50 2MBI225VN-120S-50 2MBI225XNA120-50 2MBI225XNA170-502MBI225VN-120- 02MBI300VN-120-50 2MBI300VN-120S-50 2MBI300XNA120-50 2MBI300VN-170-50 2MBI300XNA170-502MBI300VN-120- 0 2MBI300VN-120S- 0 2MBI300VN-170- 02MBI450VN-120-50 2MBI450VN-120S-50 2MBI450XNA120-50 2MBI450VN-170-50 2MBI450XNA170-502MBI450VN-120- 0 2MBI450VN-120S- 0 2MBI450VN-170- 0

2MBI550VN-170-502MBI550VN-170- 0

2MBI600VN-120-50 2MBI600XNG120-50 2MBI600XNG170-50M254 2MBI600VN-120- 0

2MBI600XNE120-50 2MBI600XNE170-502MBI 00XNE120-50

M2 5 2

2MBI225VX-120-50 2MBI225XNB120-50 2MBI225VX-170-50 2MBI225XNB170-502MBI225VX-120- 0 2MBI225VX-170- 02MBI300VX-120-50 2MBI300XNB120-50 2MBI300VX-170-50 2MBI300XNB170-502MBI300VX-120- 0 2MBI300VX-170- 02MBI450VX-120-50 2MBI450XNB120-50 2MBI450VX-170-50 2MBI450XNB170-502MBI450VX-120- 0 2MBI450VX-170- 0

2MBI550VX-170-502MBI550VX-170- 0

2MBI600VX-120-50 2MBI600XNH120-50 2MBI600XNH170-50M2 2 2MBI600VX-120- 0

2MBI600XNF120-50 2MBI600XNF170-502MBI 00XNF120-50

M2 6 2

With

NTC

, spr

ing

cont

acts 2MBI225VJ-120-50

2MBI225VJ-120- 02MBI300VJ-120-502MBI300VJ-120- 02MBI450VJ-120-502MBI450VJ-120- 0

2MBI550VJ-170-502MBI550VJ-170- 0

2MBI600VJ-120-50M260 2MBI600VJ-120- 0

Note1: - 0 : Pre-Applied Thermal-Interface-Material for -50 Note2: 1 Low Thermal Impedance Version Note3: 2 Low thermal impedance and high tracking capability type

Thermistor

Thermistor

Thermistor

Thermistor

Thermistor

14

Page 16: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

Chopper600V 1200V

mm Ic U series V series U series V series50A 1MBI50U4F-120L-50

75A 1MBI75U4F-120L-50

100A 1MBI100U4F-120L-50

150A 1MBI150VA-120L-50M262 200A 1MBI200VA-120L-50

200A 1MBI200U4H-120L-50

300A 1MBI300U2H-060L-50

M259

400A 1MBI400VH-060L-50

M283

Standard 1-Pack

1200V 1700VV series V series

mm Ic Aluminium oxide DCB Aluminium nitride DCB Aluminium oxide DCB300A 1MBI300V-170-50

400A 1MBI400V-120-50 1MBI400VF-120-50 1MBI400V-170-50

600A 1MBI600V-120-50 1MBI600VF-120-50 1MBI600V-170-50

900A 1MBI900V-120-50

M153

94E1C2

Inverse DiodeFWD

G1 E1

NC

G2 E2

E2C1

E1C2

Inverse DiodeFWD

G1 E1

NC

G2 E2

E2C1

E1C2

Inverse DiodeFWD

G2 E2

E2C1

15

Page 17: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

High Speed Modules1200V

mm Ic High Speed IGBTC

hopp

er1MBI200HH-120L-50

1MBI300HH-120L-50

1MBI400HH-120L-50

M249

2-Pa

ck

2MBI100HB-120-50

M233

2MBI150HH-120-50

2MBI200HH-120-50

M249

2MBI100HJ-120-50

2MBI150HJ-120-50

2MBI200HJ-120-50

2MBI300HJ-120-50

M276

Thermistor

16

Page 18: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

High Power Modules

1200V 1700V 3300V

mm IcCu-baseplate Cu-baseplate

Low switching loss

1-Pa

ck

1MBI 00UG-330

1MBI1000UG-330 1MBI1000UG-330B

1MBI1200VC-120P 1MBI1200VC-170E 1MBI1200VR-170E

1MBI1600VC-120P 1MBI1600VC-170E 1MBI1600VR-170E

M151, M1551MBI2400VC-120P 1MBI2400VC-170E 1MBI2400VR-170E

1MBI1200UE-330

1MBI1500UE-330 1MBI1500UE-330B

1MBI2400VD-120P 1MBI2400VD-170E 1MBI2400VS-170E

1MBI3600VD-120P 1MBI3600VD-170E 1MBI3600VS-170E

M152, M156

2-Pa

ck

2MBI600VG-120P 2MBI600VG-170E 2MBI600VT-170E

2MBI 00VG-120P 2MBI 00VG-170E 2MBI 00VT-170E

2MBI1200VG-120P 2MBI1200VG-170E 2MBI1200VT-170E

M256,M27

Note: M151, M152, M256: Cu-baseplate M155, M156, M27 : AlSiC-baseplate

130140

190

140

130140

17

Page 19: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

1200V 1700VV series X series V series X series

mm Ic Low switching loss Soft turn off Low switching loss Soft turn off Low switching loss Soft turn off

2-Pa

ck

2MBI600VXA-120E-502MBI600VXA-120E- 02MBI600VXA-120E-54

2MBI650VXA-170E-50 2MBI650XXA170-502MBI650VXA-170E- 02MBI650VXA-170E-542MBI650VXA-170EA-502MBI650VXA-170EA- 0

M271 2MBI650VXA-170EA-542MBI900VXA-120E-50 2MBI900VXA-120P-50 2MBI900XXA120E-50 2MBI900XXA120P-502MBI900VXA-120E- 0 2MBI900VXA-120P- 02MBI900VXA-120E-54 2MBI900VXA-120P-54

2MBI1200XXE120E-50 2MBI1200XXE120P-50 2MBI1200XXE170-502MBI1000VXB-170E-50 2MBI1000XXB170-502MBI1000VXB-170E- 02MBI1000VXB-170E-542MBI1000VXB-170EA-502MBI1000VXB-170EA- 02MBI1000VXB-170EA-54

M272 2MBI1400VXB-120P-50 2MBI1400XXB120P-50 2MBI1400VXB-170E-50 2MBI1400VXB-170P-50 2MBI1400XXB170-502MBI1400VXB-120P- 0 2MBI1400VXB-170E- 0 2MBI1400VXB-170P- 02MBI1400VXB-120P-54 2MBI1400VXB-170E-54 2MBI1400VXB-170P-54

2MBI1 00XXF120P-50 2MBI1 00XXF170-50Note1: The products with suf x -54 on this page are labeled to specify the rank of Vsat and VF. Note3: The products with EA on this page have large FWD. Under developmentNote2: - 0 : Pre-Applied Thermal-Interface-Material for -54 Note4: PrimePACK™ is registered trademark of In neon Technologies AG, Germany.

1200V 1700VV series V series

mm IcC

hopp

er

1MBI650VXA-170EL-50 1MBI650VXA-170EH-501MBI650VXA-170EL- 0 1MBI650VXA-170EH- 01MBI650VXA-170EL-54 1MBI650VXA-170EH-54

1MBI900VXA-120PD-50 *1 1MBI900VXA-120PC-50 *1

1MBI900VXA-120PD-54 *1 1MBI900VXA-120PC-54 *1

M271 1MBI900VXA-120PD- 0 *1 1MBI900VXA-120PC- 0 *1

1MBI1000VXB-170EL-50 1MBI1000VXB-170EH-501MBI1000VXB-170EL- 0 1MBI1000VXB-170EH- 01MBI1000VXB-170EL-54 1MBI1000VXB-170EH-541MBI1400VXB-170PL-50 1MBI1400VXB-170PH-50

1MBI1400VXB-120PL-54 1MBI1400VXB-120PH-54 1MBI1400VXB-170PL-54 1MBI1400VXB-170PH-54M272 1MBI1400VXB-120PL- 0 1MBI1400VXB-120PH- 0 1MBI1400VXB-170PL- 0 1MBI1400VXB-170PH- 0

Note1: The products with suf x -54 on this page are labeled to specify the rank of Vsat and VF. Note3: PrimePACK™ is registered trademark of In neon Technologies AG, Germany.Note2: - 0 : Pre-Applied Thermal-Interface-Material for -54 Note4: *1: Antiparallel diode current rating is 120A. Application circuit is Boost/Buck chopper only.

89

172

89 250

Low Side High Side

89

172

89 250

Inverter Thermistor

Inverter Thermistor

18

Page 20: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

mm600V 1200V 1700V

Ic V series RB-IGBT V series RB-IGBT V series RB-IGBT

3 Pha

se W

ith N

TC,

sold

er p

ins

12MBI50VN-120-50 600V12MBI75VN-120-50 600V12MBI100VN-120-50 600V

M1203

3 Pha

se W

ith N

TC, 12MBI50VX-120-50 600V

12MBI75VX-120-50 600V12MBI100VX-120-50 600V

M1202

1 Ph

ase

4MBI220VG-170R2-50 1200V4MBI300VG-120R-50 600V4MBI300VG-120R1-50 900V4MBI340VF-120R-50 600V

4MBI400VG-060R-50 600V 4MBI400VF-120R-50*1 600V4MBI450VF-120RD-50*2*3 600V

M403

1 Ph

ase

4MBI450VB-120R1-50 900V 4MBI450VB-170R2-50 1200V4MBI600VB-170R2-50 1200V

4MBI650VB-120R1-50 900V4MBI900VB-120R1-50 900V

M404

Note: AT-NPC (Advanced T-type Neutral-Point-Clamped) 3-level Module integrates RB-IGBT (Reverse Blocking-IGBT) in addition to ordinary IGBT and FWD in single package.*1: Particular for Inverter of UPS or PCS *2: Particular for Converter of UPS *3: Under development

I-type NPC 3-level Module mm600V 1200V 1700V

Ic V series V series V series

1 Ph

ase

4MBI600VC-120-50

M404

110

80

89250

T1w

WVT2w

U

T1vT1u

M

N

P

T2vT2u

T3u

T4u

T3v

T4v

T3w

T4w

T1w

WVT2w

U

T1vT1u

M

N

P

T2vT2u

T3u

T4u

T3v

T4v

T3w

T4w

RB-IGBT

T1

T2

T3

T4

RB-IGBT

T1

T4

T2

T3

89250

T1

T2

T3

T4

19

Page 21: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

IPM (Intelligent Power Modules)600V 1200V

mm Ic V series V series

With

out

Bra

ke-C

hopp

er - -

6MBP10VAA120-506MBP15VAA120-50

6MBP20VAA060-506MBP25VAA120-50

6MBP30VAA060-50P629 6MBP50VAA060-50

6MBP25VBA120-506MBP35VBA120-50

6MBP50VBA060-50 6MBP50VBA120-506MBP75VBA060-50

P626

With

out

Bra

ke-

Cho

pper

6MBP25VFN120-506MBP35VFN120-50

6MBP50VFN060-50 6MBP50VFN120-506MBP75VFN060-506MBP100VFN060-50

With

Bra

ke-

Cho

pper

7MBP25VFN120-507MBP35VFN120-50

7MBP50VFN060-50 7MBP50VFN120-50P636 7MBP75VFN060-50

7MBP100VFN060-50

Small IPM (Intelligent Power Modules)600V

mm Ic X series

Smal

l IPM

with

H

igh

Volta

ge

Driv

er-I C

with

out

Bra

ke-C

hopp

er

- -

6MBP15XSD060-506MBP20XSD060-506MBP30XSD060-506MBP35XSD060-50

6MBP15XSF060-506MBP20XSF060-50

P633A 6MBP30XSF060-506MBP35XSF060-50

P-side fault status output (Alarm)N-side fault status output (Alarm)

Under voltage protection (self shutdown)Over current protection (self shutdown)Overheating protection (self shutdown)

Temperature sensor output (Vtemp, out)

Built-in protection functions

P-side fault status output (Alarm)N-side fault status output (Alarm)

Under voltage protection (self shutdown)Over current protection (self shutdown)Overheating protection (self shutdown)

Temperature sensor output (Vtemp, out)

Built-in protection functions

High-side Drv. High-side Drv. High-side Drv.

Low-side Drv.

GND COMPower supply VCCL

IN(LU)IN(LV)IN(LW)

Fault output VFO

Low sidePWM

signal input

Power supply VCCH

GND COM

IN(HU)IN(HV)IN(HW)

High sidePWM

signal input

N(W)

N(U)N(V)

UVW

P

IS OC sensingvoltage input

Temperature sensor output TEMP

VB(U) VB(V) VB(W)

High side bias voltage for IGBT driving

7049.5

8750.2

9055

W

GND

VinYVinX

GND U

VinZ

VU

P

N

RALM

Signal inputfor low side

Supply voltage VCCU

Supply voltage VCCL

Signal input VinUGND V

VCCVVinV

GND W

VCCWVinW

PreDriver

Pre-Driver

PreDriver

PreDriver

Tj-sensor

IC-sensorAlarm output ALM

GND U

VCCUVinU

GND V

VCCVVinV

GND W

VCCWVinW

PreDriver

PreDriver

PreDriver

PreDriver

PreDriver

PreDriver

Tj-sensor IC-sensor

W

GND

VinYVinX VinZ

VU

N

Alarm output ALMRALM

RALM RALM RALM

Supply voltage VCCL

P

Alarm output U Alarm output V Alarm output W

GND U

VCCUVinU

GND V

VCCVVinV

GND W

VCCWVinW

PreDriver

PreDriver

PreDriver

PreDriver

PreDriver

PreDriver

Tj-sensor IC-sensor

W

GND

VinYVinX VinZ

VU

N

Alarm output ALMRALM

RALM RALM RALM

Supply voltage VCCL

P

Alarm output U Alarm output V Alarm output W

W

GND

VU

N

Alarm output ALM

Signal input VinB

Supply voltage VCCL

P

B

RALM

PreDriver

PreDriver

PreDriver

PreDriver

PreDriver

PreDriver

RALM RALM RALM

Alarm output U Alarm output V Alarm output W

GND U

VCCUVinU

GND V

VCCVVinV

GND W

VCCWVinW

VinYVinX VinZ

Tj-sensor IC-sensor

PreDriver 20

Page 22: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

IPM (Intelligent Power Modules)                  mm600V 1200V

Ic V series V series

With

out B

rake

-Cho

pper

6MBP25VDA120-50

6MBP35VDA120-50

6MBP50VDA060-50 6MBP50VDA120-50

6MBP50VDN120-50

6MBP75VDA060-50 6MBP75VDA120-50

6MBP75VDN120-50

6MBP100VDA060-50 6MBP100VDA120-50

6MBP100VDN060-50 6MBP100VDN120-50

6MBP150VDA060-50

6MBP150VDN060-50

6MBP200VDA060-50

6MBP200VDN060-50

With

Bra

ke-C

hopp

er

7MBP25VDA120-50

7MBP35VDA120-50P630 7MBP50VDA060-50 7MBP50VDA120-50

7MBP50VDN120-50

7MBP75VDA060-50 7MBP75VDA120-50

7MBP75VDN120-50

7MBP100VDA060-50 7MBP100VDA120-50

7MBP100VDN060-50 7MBP100VDN120-50

7MBP150VDA060-50

7MBP150VDN060-50

7MBP200VDA060-50

7MBP200VDN060-50Note1: The products with VDN on this page have high heat dissipation characteristics.

Built-in protection functionsP-side fault status output (Alarm)N-side fault status output (Alarm)

Under voltage protection (self shutdown)Over current protection (self shutdown)Overheating protection (self shutdown)

Temperature sensor output (Vtemp, out)

84 128.5

GND U

VCCUVinU

GND V

VCCVVinV

GND W

VCCWVinW

PreDriver

PreDriver

PreDriver

PreDriver

PreDriver

PreDriver

Tj-sensor IC-sensor

W

GND

VinYVinX VinZ

VU

N

Alarm output ALMRALM

RALM RALM RALM

Supply voltage VCCL

P

Alarm output U Alarm output V Alarm output W

W

GND

VU

N

Alarm output ALM

Signal input VinB

Supply voltage VCCL

P

B

RALM

PreDriver

PreDriver

PreDriver

PreDriver

PreDriver

PreDriver

RALM RALM RALM

Alarm output U Alarm output V Alarm output W

GND U

VCCUVinU

GND V

VCCVVinV

GND W

VCCWVinW

VinYVinX VinZ

Tj-sensor IC-sensor

PreDriver

21

Page 23: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

IPM (Intelligent Power Modules)                     mm600V 1200V

Ic V series V series

With

out B

rake

-C

hopp

er

6MBP100VEA120-50

6MBP150VEA120-50

6MBP200VEA060-50 6MBP200VEA120-50

6MBP300VEA060-50

6MBP400VEA060-50

With

Bra

ke-

Cho

pper

7MBP100VEA120-50

7MBP150VEA120-50P631 7MBP200VEA060-50 7MBP200VEA120-50

7MBP300VEA060-50

7MBP400VEA060-50

Built-in protection functionsP-side fault status output (Alarm)N-side fault status output (Alarm)

Under voltage protection (self shutdown)Over current protection (self shutdown)Overheating protection (self shutdown)

Temperature sensor output (Vtemp, out)

110 142

GND U

VCCUVinU

GND V

VCCVVinV

GND W

VCCWVinW

PreDriver

PreDriver

PreDriver

PreDriver

PreDriver

PreDriver

Tj-sensor IC-sensor

W

GND

VinYVinX VinZ

VU

N

Alarm output ALMRALM

RALM RALM RALM

Supply voltage VCCL

P

Alarm output U Alarm output V Alarm output W

W

GND

VU

N

Alarm output ALM

Signal input VinB

Supply voltage VCCL

P

B

RALM

PreDriver

PreDriver

PreDriver

PreDriver

PreDriver

PreDriver

RALM RALM RALM

Alarm output U Alarm output V Alarm output W

GND U

VCCUVinU

GND V

VCCVVinV

GND W

VCCWVinW

VinYVinX VinZ

Tj-sensor IC-sensor

PreDriver

22

Page 24: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

Hybrid SiC Modules600V 1200V 1700V

mm Ic V series V series V series

2-Pa

ck

2MSI200VAB-120-53

M274

2MSI300VAH-120C-53

M276

2MSI400VAE-170-53

M277

2MSI300VAN-120-532MSI450VAN-120-53

2MSI550VAN-170-532MSI600VAN-120-53

M254

2MSI1200VAT-170PC *1

2MSI1200VAT-170EC *2

M27

PIM

7MSR35VAB120-507MSR50VAB060-50 7MSR50VAB120-507MSR75VAB060-507MSR100VAB060-50

M712

6-Pa

ck

6MSI100VAB-120-50

M633

*1: Low VCE(sat) type *2: Low switching losses

92

130140

B

RS

TU

VW

P

P1

NN1

UV

W

PN

Thermistor

R S T B

P1

N N1

P

U V W

Thermistor

P

N

U V W

Thermistor

23

Page 25: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

Discrete IGBTIc

600V 650V 1200VV series High speed V series RB series High speed W series V series High speed V series High speed W series

TO-247-P2 15A FGW15N120H25A FGW25N120W30A FGW30N120H35A FGW35N60H40A FGW40N65W FGW40N120H FGW40N120W50A FGW50N60H FGW50N65W60A FGW60N65W75A FGW75N60H FGW75N65W15A FGW15N120VD FGW15N120HD25A FGW25N120VD FGW25N120WD/WE30A FGW30N60VD FGW30N120HD35A FGW35N60HD/HC40A FGW40N65WD/WE FGW40N120VD FGW40N120HD FGW40N120WD/WE50A FGW50N60VD FGW50N60HD/HC FGW50N65WD/WE60A FGW60N65WD/WE75A FGW75N60HD/HC FGW75N65WE5A FGW 5N60RB

TO-247-4-P2 40A FGZ40N120WE50A FGZ50N65WD/WE75A FGZ75N65WE

Recommended operating frequency~10kHz ~20kHz ~100kHz

V/RB

High speed V

High speed W

24

Page 26: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

Diode

Ic

Soft Recovery

600V 650V 1200V

TO-220 15A FDRP15S60L25A FDRP25S60L35A75A

TO-247-P2 12A FDRW12S120J15A FDRW15S60L20A FDRW20S120J25A FDRW25S60L30A FDRW30S120J35A FDRW35S60L40A FDRW40C120J50A FDRW50C60L60A FDRW60C120J70A FDRW70C60L

TO-247-2-P2 60A FDRW60T60L75A FDRW75T65L

SiC-SBD

Ic

600V 1200V

T-Pack(s) 10A FDCC10S6520A FDCC20C6525A FDCC25S65

TO-220-2 10A FDCP10S6525A FDCP25S65

TO-220 20A FDCP20C65

TO-220F 20A FDCA20C65

TO-220F-2 10A FDC 10S6525A FDC 25S65

TO-247 10A FDC 10S651 A FDC 1 S12020A FDC 20C6525A FDC 25S6536A FDC 36C12050A FDC 50C65

TO-247-2-P2 1 A FDCW1 T120

25

Page 27: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

Package Outlines, mmM151

M156

M254

M152

M233

M256

M153

M249

M259

M155

M250

M260

150137110

94.5 4- φ5.5

625022

23176.5

Depth 9.8 mm min.4-M6

13011461.5

18

29.5

6-φ7

4-M83-M4Screwing depth 16 max.Screwing depth 8 max.

38 2810

40

45.2124

140

20

405

20

15

2048.810.55 10.35

15

8-φ7

6-M83-M4

124

45.24020

140

20.2541.25

79.4

171

13

61.561.557

38 2810

29.5

190

Screwing depth 16 max.Screwing depth 8 max.

540

2020

4-φ6.52024 29

48 62

93

108

36

Depth 7 min. Depth 13 min.2-M4 2-M6

E

C

CGE20

625.7

13011461.5

18

29.5

6-φ7

4-M83-M4

Screwing depth 16 max.Screwing depth 8 max.

38 2810

40

45.2124

140

20

405

20

15

20

48.810.55 10.35

4020

15

20

8-φ7

6-M83-M4

124

45.24020

140

20.2541.25

79.4

171

13

61.561.557

38 2810

29.5

190

Screwing depth 16 max.Screwing depth 8 max.

5

23 23

525

Tab type terminals3-M5Depth 10 min.

2-φ5.545

30 6

822

5

8092

4-φ6.514 14 14

28 28 21

G2

G1

E2

E1

62 48 176

6

2525 2593108

Tab type terminals3-M6Depth 10.5 min.

822.43.70.5

630

150137110

4-φ5.5

6257.5

20.5

5017

PN22

6.5

94.5122

Depth 10.0 min.4-M6

OUT

13011455.2

11.85

29.5

6-φ757534440

4-M86-M4

38

2810

30124

140

15

20

5

3511.514

20

16 18

E1

Screwing depth 16 max.Screwing depth 8 max.

5

150137110

94.5122

4-φ5.5 4-M6Depth 9.5 min

625022

23176.5

0.1min.

Depth 10.5 min.

G2E2

E1G1C1

C2E1

E2

3.7

617

6

4862

93108

4-φ6.5

22.48

0.5

630

Tab type terminals3-M6

28 28 21

Solder pins 26

Page 28: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

Package Outlines, mmM262

M274

M278

M263

M275

M282

M271

M276

M283

M272

M277

M285

DETAIL A(NTS)

Tab type terminalsDepth 9.5 min3-M5

2.7max.

306

C1E2

C2E1 G2E2

E1G1

23 2334174

422.38

8094

2-φ6.5

0.5

94

34174

4

23 23

Depth 9.5 min3-M5 Tab type terminals

22.38

0.5

306

802-φ6.5

53 141111

237

10-φ5.5M8Screwing depthmax. 16

M4Screwing depthmax.8

18

39 14

12

4 5

6

10

9

7

8

3

24.5

7389

39 39 39 39172

21.5

37

12.5

21 2.5

25.5

3

38

11

14-φ5.514116711

5339114 37

111212

3 4 5

8

69

7

10

11

12

24.57389

39 39 39 39 39 39250

21.5

3737371812.5

21 2.5

25.538

M4Screwing depthmax.8

M8Screwing depthmax. 16

3

4522.5

7.55

25

Tab type terminals

C1E2C2E1

G1

E1

E2

G2

2-φ5.5

3-M5Depth 10 min.

30

8092

65

23 23 17

93108

30.5

Depth 10.5min.3-M6 Tab type terminals

C1C2E1 E2

25 25

E2G2

E1G1

23.5

615

6

4-φ6.5

48 6222.1 30.98.8

6

28 28 20

93108

4-φ6.5

156

6

630.5 4

Depth 10.5min.3-M6 Tab type terminals

4862

E2G2

E1G1

C1C2E1 E2

22.1 30.98.8

Depth 10.5min.3-M6 Tab type terminals

G2

E2

E1

G1

C1C2E1 E2

2525 21.5

6280

93110

156

6

307 21.2

8.5

4-φ6.5

13011455.2

11.85

29.5

6-φ757534440

4-M86-M4

38 2810

30124

140

15

20

5

3511.514

20

16 18

Screwing depth 16 max.Screwing depth 8 max.

5

4-M6Depth 10.0 min.

A

6257.55022OUT 39.9

6.517 20.5

94.5110122137150

4-φ5.5

99.6

28 28 20

93108

4-φ6.5

67.5

62330.5 4

Depth 10.5min.3-M6 Tab type terminals

48 62

E2G2

E1G1

C1C2E1 E2

22.1 30.98.8

4-M6Depth 10.0 min.

6257.55022OUT 39.9

7

17 20.5

94.5110122137150

4-φ5.5

99.6

Solder pins

Solder pins

Press fit pins 27

Page 29: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

Package Outlines, mmM286

M403

M647

M404

M633

M648 M668 M669

M636

M629

DETAIL A(NTS)

12211094.5

99.6

8-R2.25

4-φ5.5

62 57.5

50

39.9

20.5

1.5

1

17

2.5

6.5

(3.5)

107.5

93

69.6

4-φ6.1

2-φ5.5

27.645 32 11

20.5

17 2.5

1.5

(3.5)

6.5

4-M6Depth 10.0 min.

A

6257.55022OUT 39.9

717 20.5

94.5110122137150

4-φ5.5

99.6

8.5

Depth:10.5min

C

U N M PT3GE

T2GE

T1T4

G

E

G

8.5

30

21.2

4-M5

7

Tab type terminals

10.2

62 80

9.5 9.5 1919

10

16

93110

4-φ6.5

559595

14-φ5.5±0.2

89 73 2112.5

325.538

14 11 67 6711 11

21.5

39

37373755

250

58

3911111418106

24.5

11-M4screwing depth max. 8

ø0.5position tolerancebase plate holes

6-M8screwing depth max. 16

(30.11)φ

122

110

94.5

99.6

8-R2.25

4-φ5.5

62 50 39.9

57.5

20.5

17(3.5)

1.5

2.5

6.5

1

2-φ5.5

4-φ6.1

1

17

324521.3(4.3)

1.5

2.5

6.5

93

107.5

27.6

69.6

2-φ5.5

4-φ6.1

1

39.9

99.6

57.5

(4.3)

2.5

1.5

6.51721.3

110122

5062

8-R2.254-φ5.5 94.5

Solder pins

Solder pins Solder pins

Solder pins

Press fit pins Press fit pins

Press fit pins

28

Page 30: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

Package Outlines, mm

M722 M726

M719

M727

M730 M731

M720

M728

M721

M729

M711 M712

Solder pinsSolder pins

93

107.54-φ6.1

2-φ5.5

69.6

27.6

45 32 11

20.5

17 2.9

1.1

6.5

1122

110

94.5

99.6

8-R2.254-φ5.5

62 50 39.9

57.5

20.5

17

2.9

1.1

6.5

1

3.5

4-φ6.1

2-φ5.5

2.5

1.5(3.5)

1

4-φ5.5

1

1721.3(4.3)

1.5

2.5

6.5

93107.5

45

69.6

2-φ5.5

32

4-φ6.1

27.6

1

39.9

99.6

57.5

(4.3)

2.5

1.5

6.51721.3

110122

5062

8-R2.25

4-φ5.594.5

62.8534842.5

33.8

16.4

1228.1

2-4.5×5.0

56.7

62.8

16.4

12

53 48 42.5

51

2-4.5×5.0

62.8534842.5

33.8

15.5

1228.1

2-4.5×5.0

56.7

62.8

15.5

12

53 48 42.5

51

2-4.5×5.0

62.8534842.5

28.1

33.8

1.61216.4

2-4.5×5.0

5156.7

42.5485362.8

1.61216.4

2-4.5×5.0

Solder pins

Press fit pins

Solder pins

Press fit pins Press fit pins Press fit pins

Press fit pins Press fit pinsSolder pins Solder pins 29

Page 31: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

Package Outlines, mm

P630

P636

P631

TO-247-P2P633A TO-247-2-P2

P626 P629

M732 M733 M1202 M1203

62.8534842.5

28.1

33.8

1.61215.5

2-4.5×5.05156.7

42.5485362.8

1.61215.5

2-4.5×5.0

1

39.9

99.6

57.5

(4.3)

2.5

1.5

6.51721.3

110122

5062

8-R2.254-φ5.5 94.5

2.5

1.5(3.5)

1

4-φ5.5

15.2415.2415.246.77

15.2426.65

21.2515.24

0.8

2.5

77

87

50.2

0.5

U V WN

P

1 5 9 13 19

66

18

30.7

4.49.5

2217

22.5

4-φ2

2-φ4.5

9.5

2

4-φ2

2-φ4.5

31.5

16.5

47.3

0.7

70

57.6

20.513.813.812.3

20.8

4.1

18

P W N

1 4 7 10 15

U V

64

49.5

60

0.5

0.8

2.5

149 7

2-φ2.5

10.9

125

5.9

107.4

2-φ4.5

84

1.85

14.3

2121

18.35

25222222252116

1 5 9 13 19

N

P

B U V W

128.5

119.5

6-M4Depth 8 min. 0.64

19

P1

N1

P2

N2

B

U V W

1

67.4121136142

4624.5

1.51.5

954.5

110

0.5

262634.51.5

24.5

2323

92427

9.5

38.5

6-M5Depth 8.5 min.

2-φ2.5

4-φ5.5

0.64

A18x1.778 (=32.004)

14x2.54 (=35.56)

1.6

3.2

4.2

149.5

Solder Plating

6.4 1725.5

2.547.62 7.62 7.62 7.62 7.62 7.62 15.24

69

15.24

15.24

21.05

3

3

25.55

55

23.68

15.24

15.24 15.24 15.24

0.64 3

80

90

4-φ2

2-R5

2-φ4.5

5.03±0.15

15.9±0.15

2.23±0.19

3.71±0.29

4.32±0.18

6.17±0.15

20.95±0.15

20.17±0.15

5.62±0.15

5.45±0.254

5.45±0.254

1.98±0.15

2.4±0.15

0.6+0.09-0.05

2.03+0.4-0.13

3+0.4-0.13

1.2±0.13

φ3.61±0.115.9±0.15

φ3.61 ±0.1

φ7.19±0.15

5.45±0.254

1.2±0.13

2.4±0.15

4.32±0.18

20.95±0.15

3.71±0.29

0.2MAX

20.17±0.15

16.69±0.15

5.45±0.254

2.23±0.19

5.03±0.15

1.98±0.15

14.02±0.136.17±0.15

5.62±0.15

0.6+0.09 -0.05

2.03+0.4 -0.13

Solder Plating

① ③

Solder pins Solder pins Press fit pins Press fit pins

30

Page 32: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

Package Outlines, mm

TO-220F-2 T-Pack(s)TO-220F

TO-247 TO-220-2TO-220TO-247-4-P2

0.5 +0.2 0

9.5

+0.

3−

0.5

15.9±0.15

φ3.61 ±0.1

φ7.19±0.15

5.08±0.254

1.25±0.13

2.4±0.15

4.32±0.18

20.17±0.15

3.71±0.29

20.95±0.15

17.47±0.15

5.08±0.2542.54±0.127

2.23±0.19

5.03±0.15

1.98±0.15

14.02±0.136.17±0.15

5.62±0.15

0.6+0.09 -0.05

2+0.4 -0.13

Solder Plating

④① ② ③

31

Page 33: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

Package Outlines, mm

32

Page 34: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

1. This Catalog contains the product speci cations, characteristics, data, materials, and structures as of December 2017. The contents are subject to change without notice for speci cation changes or other reasons. When using a product listed in this Catalog, be sure to

obtain the latest speci cations.

2. All applications described in this Catalog exemplify the use of Fuji s products for your reference only. No right or license, either express or implied, under any patent, copyright, trade secret or other intellectual property right owned by Fuji Electric Co., Ltd. is (or shall be deemed) granted. Fuji Electric Co., Ltd. makes no representation or warranty, whether express or implied, relating to the infringement or alleged infringement of other s intellectual property rights which may arise from the use of the applications described herein.

3. Although Fuji Electric Co., Ltd. is enhancing product uality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your e uipment, you are re uested to take ade uate safety measures to prevent the e uipment from causing a physical injury, re, or other problem if any of the products become faulty. It is recommended to make your design fail-safe, ame retardant, and free of malfunction.

4. The products introduced in this Catalog are intended for use in the following electronic and electrical e uipment which has normal reliability re uirements.

Computers OA e uipment Communications e uipment (terminal devices) Measurement e uipment Machine tools Audiovisual e uipment Electrical home appliances Personal e uipment Industrial robots etc.

5. If you need to use a product in this Catalog for e uipment re uiring higher reliability than normal, such as for the e uipment listed below, it is imperative to contact Fuji Electric Co., Ltd. to obtain prior approval. When using these products for such e uipment, take ade uate measures such as a backup system to prevent the e uipment from malfunctioning even if a Fuji s product incorporated in the e uipment becomes faulty.

Transportation e uipment (mounted on cars and ships) Trunk communications e uipment Traf c-signal control e uipment Gas leakage detectors with an auto-shut-off feature Emergency e uipment for responding to disasters and anti-burglary devices Safety devices Medical e uipment

6. Do not use products in this Catalog for the e uipment re uiring strict reliability such as the following and e uivalents to strategic e uipment (without limitation).

Space e uipment Aeronautic e uipment Nuclear control e uipment Submarine repeater e uipment

7. Copyright 1996-2017 by Fuji Electric Co., Ltd. All rights reserved. No part of this Catalog may be reproduced in any form or by any means without the express permission of Fuji Electric Co., Ltd.

. If you have any uestion about any portion in this Catalog, ask Fuji Electric Co., Ltd. or its sales agents before using the product. Neither Fuji Electric Co., Ltd. nor its agents shall be liable for any injury caused by any use of the products not in accordance with instructions set

forth herein.

WARNING

Page 35: FUJI Power Semiconductors IGBT/SiC Devices Selection Guide · PrimePACK™ PAGE 18 T/I-type NPC 3-level PAGE 19 Small IPM PAGE 20 IPM PAGE 20 Hybrid SiC Module PAGE 23 Discrete IGBT

Fuji Electric (China) Co., Ltd.26F, Global Harbor Tower B,1188 North KaiXuan Road, PuTuo District,Shanghai 200062, P.R.ChinaTel: +86-21-5496-1177

Fuji Electric Corp. of America50 Northfield AvenueEdison, NJ 08837, USATel: +1-732-560-9410

Fuji Electric Europe GmbHGoethering 58, 63067 Offenbach, am Main, F.R. GERMANYTel: +49-69-6690290

Fuji Electric Hong Kong Co., Ltd.Suites 1911-13, 19/F., Tower 6, The Gateway, Harbour City, Tsim Sha Tsui, Kowloon, Hong KongTel: +852-2664-8699

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Fuji Electric Asia Pacific Pte. Ltd. 151 Lorong Chuan, #03-01/01A New Tech Park, SINGAPORE 556741Tel: +65-6533-0014

Information in this catalog is subject to change without notice. 2017-12 L26 FOLS Printed in Japan

Power Semiconductors GroupURL http: //www.fujielectric.com/products/semiconductor/

Head Office:Gate City Ohsaki, East Tower, 11-2 Osaki 1-chome,Shinagawa-ku, Tokyo 141-0032, Japan