Process FMEA DATA LIST-UP SP Production II Team 2001-04-18 Rev.0 Process Function Requirements Pattern of Defect Effect of Defect Cause of Defect Effect occurrence Defect RPN Remark Plating - Prevent Oxidation - Meet plating thickness spec. - Discoloration - 2nd W/B failed - Moisture on plating bar 5 3 5 75 - Make Wire bonding easier - No visual defect - Moisture absorbed at storage 5 2 5 50 - Contamination of bake oven 5 2 5 50 Chemical polishing - Meet Cu polishing spec. - unpolished - Bad Solder Ball Attaching - Unsuitable process 3 3 2 18 - overpolished - Cu thickness too thin conditions(Speed,temp,concentration) 3 3 2 18 PR Coating - Applying Photo resist for - No uncoated area - Uncoating - Open/pit after etching - Unsuitable coating condition&raw meterial 5 2 2 20 circuit developing before expos - Meet PR Coating thickness spec. - Pattern dimension changed aft - Spec out after etching - Unsuitable coating condition 3 2 2 12 Exposure - Applying UV on PR coated area - No foreign material on the pattern - Common defect(Short, Lead pro - O/S - Bad Artwork and storage 5 2 2 20 for circuit developing - Meet Alignment Spec - Bad P/T Alignment(Overlap Spe - Fail on Molding process - Bad Tool&Punching accuracy 4 2 2 16 - Unsatisfied Artwork&Alignment control 4 2 2 16 - Meet exposure intensity spec. - Wrong pattern dimension - Fail in dimension spec after etching - Unsuitable exposure condition 3 2 2 12 Developing - Removing UV exposed area - No undeveloped area - Short, Lead protusion - O/S - Unsuitable developing condition/rincing water contam5 2 2 20 using chemical for etching - Meet dimension spec after developi - Wrong pattern dimension - Pattern dimension changed after etchin - Unsuitable exposure intensity/developing condition 4 3 2 24 Back Coating - Applying PR on back side of t - No bubble - PI side Half etched after etc - Half Eg on Ball Land - Unsuitable BC thickness and dry condition 3 4 3 36 to protect from etching chemi - Meet B/Cthickness Spec - PI side etched - Fail in molding process - Unsuitable B/C condition(viscosity,speed) 3 4 2 24 - PI side foreign material/unst - Solder Ball Attch FAIL(Miss Ball) - Unsuitable B/C condition(viscosity,speed) 3 4 2 24 - No uncoated area - PI side etched - Fail in molding process - Unsuitable B/C condition(viscosity,speed) 3 4 2 24 SR Printing - No bleed to Bonding area - SR bleed out - W/B Fail - Poor Screen Mask design/making 4 3 2 24 attach process - Unsuitable printing condition(Alignment) 4 4 2 32 - Meet Width/Thick Spec - SR Spec out - Die Attach/Wire Bonding Fail - Poor Screen Mask design/making 3 4 2 24 - Unsuitable printing condition(Alignment) 3 3 2 18 - Strong adhesion between Ink and Ta - Plating chemical permeated - Delamiantion(SR and Tape) - Unsuitable printing condition 4 2 3 24 Tape Aging - Restoring Tape temp(room temp - No dew on Tape surface - Bad adhesion - Bubble at Cu Laminating - absorbing moisture 3 3 5 45 Punching - Punch function hole on PI fil - Accurate punching dimension - Defect at Soler Ball Attachin - Hole dimension error - Poor die manufacturing 5 2 3 30 - Visual control Vacuum dry - Dry moisture on tape - Minimize moisture in tape - Bad adhesion - Bubble at Cu Laminating - Poor vacuum 3 3 5 45 Cu Lamination - Laminating Cu foil on tape - Meet Alignment spec - Circuit open/short - Cu foil slanting to one side - Poor process control 3 2 2 12 - No transformation Cure - For strong adhesion strength - Securing adhesion - Bad adhesion - Delamination - Unsuitable Cure condition 5 2 2 20 Elastomer Attach - Attach elastomer tape for chi - No unattached area - Unattached Chip Crack - wrong attach condition(Temp.,Pressure,time) 5 2 1 10 Slitting - Slit multi rows to single row - Maintain dimention of Cutting widt - Cutting width Over - Wrong dimension control - Error in Gang Tool manufacuring 3 2 3 18 Adhesive Lami' Laminationg adhesive for Heat S - Meet spec by Adhesive materials - Error in laminating process - Delamination between Heat Sink & Circu - Error attach condition(temp,pressure,time) 5 2 5 50 Tape Lamination - Attaching carrier Frame for - Meet Alignment Spec Circuit&Carrier Frame Misalignm Chip attach Position Error - Die Setting Miss 5 1 3 15 package assembly - No transformation Warpage Chip Crack - Error attach condition(temp,pressure,time) 5 1 3 15 Debussing Busbar Punching/Singulation - Minimize Burr Burr Spec Over Wire Bonding Error - Bad punch die 4 3 3 36 Center Alignment - Removing anti-oxidation layer - Decreasing roughness for better Solder Ball Attaching - Making dam to prevent epoxy bleed to bonding area at die
DATAProcess FMEA DATA LIST-UPSP Production II Team2001-04-18
Rev.0ProcessFunctionRequirementsPattern of DefectEffect of
DefectCause of DefectEffectoccurrenceDefectRPNRemarkPlating-
Prevent Oxidation- Meet plating thickness spec.- Discoloration- 2nd
W/B failed- Moisture on plating bar53575- Make Wire bonding easier-
No visual defect- Moisture absorbed at storage52550- Contamination
of bake oven52550Chemical polishing- Removing anti-oxidation layer-
Decreasing roughness for better Solder Ball Attaching- Meet Cu
polishing spec.- unpolished- Bad Solder Ball Attaching- Unsuitable
process33218- overpolished- Cu thickness too
thinconditions(Speed,temp,concentration)33218PR Coating- Applying
Photo resist for- No uncoated area- Uncoating- Open/pit after
etching- Unsuitable coating condition&raw meterial52220circuit
developing before exposure- Meet PR Coating thickness spec.-
Pattern dimension changed after etching- Spec out after etching-
Unsuitable coating condition32212Exposure- Applying UV on PR coated
area- No foreign material on the pattern- Common defect(Short, Lead
protusion, etc)- O/S- Bad Artwork and storage52220for circuit
developing- Meet Alignment Spec- Bad P/T Alignment(Overlap Spec
out)- Fail on Molding process- Bad Tool&Punching accuracy42216-
Unsatisfied Artwork&Alignment control42216- Meet exposure
intensity spec.- Wrong pattern dimension- Fail in dimension spec
after etching- Unsuitable exposure condition32212Developing-
Removing UV exposed area- No undeveloped area- Short, Lead
protusion- O/S- Unsuitable developing condition/rincing water
contaminated52220using chemical for etching- Meet dimension spec
after developing- Wrong pattern dimension- Pattern dimension
changed after etching- Unsuitable exposure intensity/developing
condition43224Back Coating- Applying PR on back side of tape- No
bubble- PI side Half etched after etching- Half Eg on Ball Land-
Unsuitable BC thickness and dry condition34336to protect from
etching chemical- Meet B/Cthickness Spec- PI side etched- Fail in
molding process- Unsuitable B/C condition(viscosity,speed)34224- PI
side foreign material/unstripped- Solder Ball Attch FAIL(Miss
Ball)- Unsuitable B/C condition(viscosity,speed)34224- No uncoated
area- PI side etched- Fail in molding process- Unsuitable B/C
condition(viscosity,speed)34224SR Printing- Making dam to prevent
epoxy bleed to bonding area at die- No bleed to Bonding area- SR
bleed out- W/B Fail- Poor Screen Mask design/making43224attach
process- Unsuitable printing condition(Alignment)44232- Meet
Width/Thick Spec- SR Spec out- Die Attach/Wire Bonding Fail- Poor
Screen Mask design/making34224- Unsuitable printing
condition(Alignment)33218- Strong adhesion between Ink and Tape-
Plating chemical permeated- Delamiantion(SR and Tape)- Unsuitable
printing condition42324Tape Aging- Restoring Tape temp(room temp)-
No dew on Tape surface- Bad adhesion- Bubble at Cu Laminating-
absorbing moisture33545Punching- Punch function hole on PI film-
Accurate punching dimension- Defect at Soler Ball Attaching- Hole
dimension error- Poor die manufacturing52330- Visual controlVacuum
dry- Dry moisture on tape- Minimize moisture in tape- Bad adhesion-
Bubble at Cu Laminating- Poor vacuum33545Cu Lamination- Laminating
Cu foil on tape- Meet Alignment spec- Circuit open/short- Cu foil
slanting to one side- Poor process control32212- No
transformationCure- For strong adhesion strength between tape and
cu- Securing adhesion- Bad adhesion- Delamination- Unsuitable Cure
condition52220Elastomer Attach- Attach elastomer tape for chip
attach- No unattached area- UnattachedChip Crack- wrong attach
condition(Temp.,Pressure,time)52110Slitting- Slit multi rows to
single row- Maintain dimention of Cutting width- Cutting width
Over- Wrong dimension control- Error in Gang Tool
manufacuring32318Adhesive Lami'Laminationg adhesive for Heat Sinker
attach- Meet spec by Adhesive materials- Error in laminating
process- Delamination between Heat Sink & Circuit film- Error
attach condition(temp,pressure,time)52550Tape Lamination- Attaching
carrier Frame for- Meet Alignment SpecCircuit&Carrier Frame
MisalignmentChip attach Position Error- Die Setting
Miss51315package assembly- No transformationWarpageChip Crack-
Error attach condition(temp,pressure,time)51315DebussingBusbar
Punching/Singulation- Minimize BurrBurr Spec OverWire Bonding
Error- Bad punch die43336Center Alignment
PlanProcess FMEA Action PlanTeam : SP Production IIRecorder :
H.I. LeeRev. 0NOPrecessPattern of DefectFMEA NOStart dateCompletion
dateEngineerControl or
notRemark1PrecessDiscoloration01-PLAT-00101.01.2501.04.20Y. K.
ChoControlled2InspectionDiscoloration01-CUIN-00101.01.2501.04.20Y.
K. ChoControlled3Back coatingHalf EG on Back
side(tape)01-BKNT-00101.05.0101.05.24J. M.
ShimControlled4PrintingSR Bleed out01-PRNT-00101.05.0101.05.24J. M.
ShimControlled
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