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FMD Facts – A Short Overview
Michael Töpper
The FMD combines the expertise and infrastructure of 13 research
institutes to deliver complete developments out of one hand.
The FMD is a One-Stop-Shop for developments from wafer
technologies to complete systems.
Within the FMD more than 2.000 scientists work together under
one single, virtual roof.
The central FMD office in Berlin organizes the cooperation.
The total investment of 350 Mio. EUR for additional
infrastructure and future developments is sponsored by the Federal
Ministry of Education and Research.
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FMD Offer for Customers
Michael Töpper
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6 Technology platforms along thevalue chain
2 Advanced system platforms
13 Member institutes of theFraunhofer-Gesellschaft and
Leibniz-Gemeinschaft all overGermany
6 Specific application topics withcollaborative advantage
FMD as a strong
Fundament
Technology Platforms
ApplicationSpecific
Solutions
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Extended CMOS
Optoelectronic Systems
Power Electronics
MEMS Actuators
Microwave and Terahertz
Sensor Systems
FhG ISIT
Technology Platforms of FMD
FhG IMS
FhG FHR
FhG IZM
Leibniz FBH
FhG IIS
FhG EMFTFhG IAF
FhG IISB
FhG ENAS
FhG IPMS
Leibniz IHP
FhG HHI
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The FMD offers a broad, interdisciplinary expertise to achieve
leading-edge optoelectronic devices and systems:
Realization of optoelectronic devices such as for communication
up to Tbit/s-speed
Complete signal chain from emitter to modulator and receiver to
fully integrated optoelectronic systems
Design of single devices, (integrated) circuits or even complete
systems, such as communication systems
In-depth knowledge in processing a wide variety of materials;
from Si to compound semiconductors and polymers
Optoelectronic Systems
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Manufacturing of passive structures, like anti-reflection
coatings and Laser; wide ranging portfolio of different laser
wavelengths: GaAs-based laser (wavelength 905 nm), InP-based laser
(~ 1.5 µm) and III-V-semiconductor laser with wavelengths in the
range of 2-11 µm
Integration of III-V-materials into Si-based technology;
heterogeneous integration: advanced packaging, wafer level capping
& advanced substrate/interposer technologies
Characterization of the designed, manufactured and assembled
optoelectronic systems and testing in multiple stress scenarios
(thermal or mechanical stress); performing reliability and
degradation assessments.
Optoelectronic Systems
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Example: Tunable Laser Module
Michael Töpper
Integrated tunable laser chip.© Fraunhofer IZM
Tunable Laser Module miniaturized optoelectronic systems
The board comprises an integrated tunable laser chip based on
Fraunhofer HHI’s photonic integration technology
The integrated tunable laser was assembled on an electronic
board designed and fabricated by Fraunhofer IZM
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© Fraunhofer IZM
Datum Name, Abteilung
FRAUNHOFER IZM
Requirements
Microelectronics
e.g. Design Rules
for Systemintegration
Peripherals
e.g. MEMS, Photonic, Power
Solution
DevelopmentTechnology Design Reliability
ICASIC
Assembly and
Manufacturing
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© Fraunhofer IZM
Datum Name, Abteilung
Intra Die | Die Die | Die Board | Board Backplane | Router
Router
Photonics - PhoxTroT
Photonic & Plasmonic Systems – Dr. Tolga Tekin
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© Fraunhofer IZM
Datum Name, Abteilung
40G VCSELs, PDs, Drivers, TIAs
Single mode oPCB
Single Mode
Platform
Optical and Electrical TSV,
Chip-to-Board, Board-to-Board coupling
Optical Routerchip
Specifications,
Layout, Simulations
Photonic interposer
Coupling element
Ultimate Single Mode Integration Platform
www.phoxtrot.eu
Photonic & Plasmonic Systems – Dr. Tolga Tekin
http://www.phoxtrot.eu/
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© Fraunhofer IZM
Datum Name, Abteilung
L3MATRIX : Silicon Photonics Matrix (Co-Package)
Source: www.L3matrix.eu
Towards 51.2 T switch
Underlying network technology must improve in areas such as
photonic switching, enabling scale performance whilst keeping power
consumption in control.
Photonic & Plasmonic Systems – Dr. Tolga Tekin
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© Fraunhofer IZM
Datum Name, Abteilung
Mass Manufacturing of Tb/s Data Center Transceivers
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© Fraunhofer IZM
Datum Name, Abteilung
PhotonicsPHOTONIC ANALYSIS PLATFORM FOR FAST DETECTION OF
BIOMARKERS
Project goal
Realization and validation of an optofluidic-based Point-of-Care
(PoC) system for early diagnosis of Lyme Borroliosis; This approach
will allow a rapid and early detection of a LB infection, thereby
enabling fast treatment and eliminating side effects
Contribution of the Fraunhofer IZM
Sensing platform based on photonic bottle micro-resonators
Manufacturing of smooth-glass-surface micro-bottles
3D-Printed package for temperature sensing
Gripping tool for assembly bio-coated micro-bottles on a
chip
Conceptual sensor chip
Microfluidic chip
Waveguide chip
Microbottle
in cooperation with: funded by:
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FMD – Cleanrooms all over Germany
Michael Töpper
4‘‘ Compound Materials200 mm GaN-on-Si
4‘‘ CompoundMaterials 4‘‘ InP100 to 200 mm andPanel Level
Packaging
200 mm MEMS200 mm GaN-on-Si
200 mm MEMS200 mm CMOS/Si
200 mm CMOS/Si150 mm SiC
200 mm CMOS/Si200 mm MEMS
200 mm MEMS
300 mm CMOS/Si200 mm MEMS200/300 mm Packaging
Over 2.200 equipment in 13 cleanrooms all over Germany
Over 10 Mio moves per year
Overall size: appr. 11.000 m2
Wafersizes: 2“ till 300 mm
200 mm (Bi)CMOS
Operation conceptsin alignment
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Dr.-Ing. Stephan GuttowskiHead of Technology Park
“Heterointegration”
Forschungsfabrik Mikroelektronik
DeutschlandAnna-Louisa-Karsch-Straße 210178 Berlin
stephan.guttowski@mikroelektronik.fraunhofer.dewww.forschungsfabrik-mikroelektronik.de
Your FMD Contact
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Dr. Andreas GrimmHead of Technology Park “Compound
Semiconductors”
Forschungsfabrik Mikroelektronik
DeutschlandAnna-Louisa-Karsch-Straße 210178 Berlin
andreas.grimm@mikroelektronik.fraunhofer.dewww.forschungsfabrik-mikroelektronik.de
Dr. Michael TöpperBusiness Development
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration
IZMGustav-Meyer-Allee 2513355 Berlin
[email protected]
