FloTHERM XT Introduction FloTHERM v10 demonstration Agenda

FloTHERM XT Flotrend Seminar

23 May 2013 1

Voon Hon Wong, PhD.

FloTHERM®XT Introduction

FloTHERM v10 demonstration

Mechanical Analysis Division

www.mentor.com© 2013 Mentor Graphics Corp. Company Confidential

Agenda

IWC, FloTHERM XT Intro, April 2013

� Project Motivation

� FloTHERM XT Review

� FloTHERM XT Demo

� FloTHERM v10 introduction


23 May 2013 2


Mentor Graphics

� Founded in 1981

� Revenue last fiscal year > $1 billion

� Software and hardware products— Electronics Design and Simulation (EDA):

– IC– PCB– Electrical System Design– Embedded Software

— Mechanical Analysis:– Electronics Cooling Software– 1D & 3D General Purpose Computational Fluid Dynamics (CFD)

– Hardware for Thermal Characterization of Electronics and LEDs

Wilsonville, Oregon U.S.A. Headquarters



� 1D Thermo-Fluid CFD for Aero, Auto, Process and Power Generation Industries

� Flowmaster ® – fast and accurate simulation of fluid mechanics and pipe flow in complex systems

� Concurrent CFD for All Industries� FloEFD ™– a paradigm shift in CFD: fully embedded in

the mechanical design environment

� Heating and Ventilation in Buildings� FloVENT ® – optimizes airflow, temperature distribution

and contamination control in and around buildings

� Hardware for Thermal and Optical Testing� T3Ster ® – thermal testing of electronic parts and systems

� Thermal Analysis of Electronic Systems� FloTHERM® – CFD market leader in the electronics

vertical market (IC Packages, PCBs, Systems)� FloTHERM ® XT – Concept through verification electronics

cooling simulation

Mentor’s Mechanical Analysis Solutions



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Systems Design Division Heritage



Systems Design Division Today

PCB Development Solutions

BOARD SYSTEMS DIVISION

DxDesignerFPGA DesignHyperLynx SI & PIHyperLynx ThermalExpedition PCBXtremePCBECAD/MCADFabLink XEvisECADPADSHL 3D

PCB Assembly, Test, & Manufacturing Execution

VALOR DIVISION

Valor NPIVPLvPlanvManagevCheckValor MSS

Thermal Analysis & Fluid Dynamics

MECHANICAL ANALYSIS DIVISION

FloTHERMFloEFDT3SterTERALEDFlowmaster

Platform Engineering

INTEGRATED ELECTRICAL SYSTEMS DIVISION

CapitalVeSys


FloTHERM XT


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PROJECT MOTIVATION


Technology Trend - Integrated Circuits Increasing in Heat Dissipation

� Increasing IC power dissipation driven by speed and density— Boards exceeding 300W— Systems exceeding 1000’sW— Smaller form factors driving heat

density

Alcatel-Lucent >300W per bladeSource: Intel



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Technology Trend - PCBs & Systems: Denser, Faster, Hotter!

* Data based on Mentor Graphics Technology Leadership Awards (TLA) entry averages

3.5X

0.5X

7X increase in PCB Density



Customer Driven Development


http://mentorideas.brightidea.com/mechanical

� Mentor ‘IDEAS’ site allows software enhancement requests to be posted and voted on by users (under maintenance).

� Allows feature implementation decisions to be based on feedback from a wide portion of the user base.

� A transparent and accountable process that drives the product portfolio roadmap.


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Customer Driven Development


� The project addresses many issues reflected by the electronics cooling community over the last 10-15 years, including feedback relating to angled/complex geometry.

� Fundamental to the FloTHERM XTproject is addressing these issues while trying to retain as much as possible the original FloTHERM DNA and ethos.


Market Changes Require New SolutionsFor A Wider User Demographic

Mechanical Designers

Thermal Designers

Thermal Specialists

FloTHERM

MechanicalDesigners

Thermal Designers

Thermal Specialists

FloEFDFloTHERM

XT

MechanicalDesigners

Thermal Designers

Thermal Specialists

Product diversification drives wider user demographics

One size does not fit all



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FLOTHERM XT REVIEW


FloTHERM XT – From Concept to Verification Phases for Electronics Cooling

� Continuum supporting all phases from concept through verification/prototyping

� Interconnecting the EDA and MCAD design flows

� Targeted at the design engineer as well as thermal specialist

� Focused solely on electronics cooling

� Harnessing two successful DNAs:

� FloTHERM, and

� FloEFD as a CFD-enabling technology



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FloTHERM XT


Supports direct interfaces with all major CAD vendors

Full geometric and non-geometric SmartPart and Library functionality

Integrated solution progress and dynamic messaging window

CAD centric UI, geometry engine and controls

Stand-alone product, single application window

PDML import to support use of existing FloTHERM models


Design Centricity


� FloTHERM XT, designed with a CAD-centric UI and geometry engine, is designed to fit into the complex mechanical design environments and associated processes that exist in todays electronics companies.

� Use of FloEFD meshing and solver technology allows general non-aligned and complex geometry to be handled easily and efficiently.

� Multiple control volumes formed in any cell containing more than one material.— Shape of control volume

matches CAD geometry— Ensures that both surface

area and surface normal are correct

Fluid

Solid


23 May 2013 9


SmartPart and Library Technology


� Retains the power and simplicity of the SmartPart infrastructure in FloTHERM.

� Utilises the power and geometric flexibility of CAD and so have been extended to handle features and parts at angles and more complex shapes.

� Support for FloTHERM style libraries with full two-way, drag & drop controls.

� All geometry and associated attributes stored together.

� Provides a consistent and familiar focus on electronics parts and the needs of the electronics thermal designer.


Thermal Model Supply Chain


� Features and Benefits— Existing thermal models can be

imported via the PDML format.— SmartParts will be automatically

recognised and updated to the FloTHERM XT equivalents.

— Hierarchical structure in project will be retained.

— Supports both assembly and project-based PDML, enabling support for data from FloTHERM PACK, PCB and IC.

— Also direct support for FloTHERM user created material libraries


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EDA Support


� FloTHERM XT includes access to CircuitWorks for IDF and PADS support.

� The FloTHERM XT FloEDA Bridge module is developing into an unrivalled capability for interfacing with the EDA world –focussing initially on Expedition Enterprise.

� It currently supports a number of key features, including— Import of encrypted CCE data

from Expedition.— Filtering of thermally irrelevant

parts.— Importing of power lists— Automatic library swapping of

parts to enable appropriate thermal modelling in FloTHERM XT

— Auto-creation of 3-D PCB’s and Components.

— Edit and Update functionality, to easily remain concurrent with the Expedition design.

Expedition FloEDA Bridge

FloTHERM XT BoardFloTHERM XT System


FLOTHERM XT DEMONSTRATION


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Documents

FloTHERM XT Introduction FloTHERM v10 demonstration Agenda