BENCHTOP TEMPERATURE FORCING SYSTEM FOR THERMAL CYCLING OF DUT’S FROM -55C° TO +250C°

Flex TC

Fluid Free OperationFast Thermal Cycling 50°C/minCompact & Portable Design

No Compressed Air RequiredUltra Quiet Operation 40dBALow Cost of Ownership

A Technological Breakthrough

Temperature range of -55°C to +250°CCompact Footprint – Fits easily on a bench topSelf-Contained – No external chiller and no compressed air requiredRapid Temperature Cycling Rates (50°C/min Max, not on the entire range)Fluid-Free OperationLow cost of ownershipMaintenance-Free systemEnvironmentally Friendly OperationESD-SAFEIntegrates into production test handlersTcase and embedded thermal diode temperature sensingEthernet (TCP/IP) Remote InterfaceSuitable for testing soldered devices and devices in socketsIntegrates with every existing socket on the marketPackages Supported: •BGA •FCBGA •LGA •QFN •QFP

•CSP •WLCSP •Bare Die and more

Features

Very convenient and compact.(FlexTC operating in a customer’s lab)

Specifications

Mechanical Dimensions System Enclosure mm / (inch)System WeightThermal Head (mm)Thermal Head Hose 2 meter (6.5ft )standard/ 3 meter (10ft) max.

System RequirmentsElectrical

Ambient Temperature Ambient Humidity

L 420 (16.5) x W 320 (12.5) x H 220 (8.5)22 KG80mm Diameter

100/115/120/220/230/240 VAC ±10%50/60 Hz, single phase, 10A Max.5°C to 35 °C (40 to 95°F)20% to 95% RH

System General Maximum TemperatureMinimum TemperatureTemperature AccuracyTypical Transition RatesTemperature Sensor

Remote Interface Ports Ethernet (TCP / IP) System Indicators and Fail-safes Operating UnitsDUT Pressure ForceDUT DimensionsDB RatingMTBF

250 °C -55°C< 0.2° C25°C to -40°C in, < 2 minutesTcase PT100 Thermisor/ K-type thermocouple/Thermal-Diode through the Ethernet or Analog ports

Thermal head overtemperature, Fans operation,Cooling units operation, °C2 - 100 Kg / Force 2 x 2 mm40 d BA70,000hr

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Developed for Laboratory Environments Experienced thermal engineers designed FlexTC to meet the stringent standards required for failure analysis or device characterization within vertically integrated semiconductor companies, chip debugging

and testing laboratories, semiconductor startups and fabless companies. FlexTC provides a reliable self-contained system that is compact and extremely economical to own and operate. The system requires a 10A wall outlet and clean dry air or nitrogen for frost and humidity free operation. For additional flexibility the system can be controlled remotely through the Ethernet communication port.

Fast & Powerful Cooling CapacityFlexTC offers unmatched cooling speed and capacity achieving -40°C within 2 minutes. In addition, this is the only system robust and

powerful enough to cool high power devices. FlexTC stimulates DUT’s to the desired temperature by direct conduction between the thermal head’s plunger and the DUT. FlexTC can then maintain that temperature for an extended period of time.

Benefits of Fluid Free OperationOne of the biggest advantages of FlexTC is its fluid free operation. By eliminating the coolant fluid you eliminate any risk of fluid leaks that would severally damage expensive test equipment located anywhere near the spill.

Temperature set points Preset temperature key buttons Ramp/Soak/Cycle profile programming, save & upload Ramp rate increment controls Stand-by operation mode Temperature is displayed and recorded Temperature overshooting control LabVIEW/C++/MATLAB /Visual Basic /Perl / Tickle command interfaces

Operator Interface

Humidity and Frost Free Control

Software screen temperature graph

The FlexTC thermal head includes nozzles for dry air or dry nitrogen purgingPurging is software controlled via the access line on the rear back panelA constant flow creates a frost and humidity free shield around the DUTFlow is diverted away from the test area to avoid unwanted thermal losses

90-14050-10010-60-30-+20

20.015.010.05.00.0-5.0-10.0

-15.0-20.0-25.0-30.0

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USER SYSTEM TC control Temp Graph

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FlexTC is operated by a robust PLC, controlled by a full color 7” touch-screen with a menu driven graphical user interface that is intuitive and easy-to-use.

Thermal head interface optionsFlexTC creates a direct mechanical contact with the DUT using one of the following interface options:

1. Custom Adaptor plate - for sockets and soldered device applications2. Universal Adaptor plate - for sockets and soldered device applications3. Thermocouple inserted Lids - for sockets applications4. Open Frame thermal lids - for sockets and soldered device applications5. Boom Stand Arm - For soldered device applications6. Pneumatic Head Assembly - for sockets applications7. FlexTC ready sockets - eliminates the need for a mechanical Interface, consult with your sockets manufacturer

Universal adapter plate attched to board

Inserting device plunger into thermal head

Device Plungers are installed in the FlexTC thermal head by operators in the field , their selection determines the temperature range and the cooling power performances of the FlexTC. Device plungers are constructed of Nickel-plated copper.

Interchangeable Device Plungers

PN# Temp Range *Thermal Load (Watt) DUT Dimensions

MDDT-485 -55C to +155C 21Watt @ -40C

MDDT-486 -45C to +155C 45watt @ -30C

MDDT-488 Up to +250C *Thermal Load = Device Power Dissipation + Board Thermal Mass + Purge influences

2 x 2 mm 2 x 2 mm 2 x 2 mm

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Device plungerBack panel purge inlet