Final ProgramMONDAY, 4 JUNE 2018

8:00 am–8:30 am Canyon BallroomBreakfast

8:30 am–10:00 am Mesa BallroomSession MA Opening Remarks and Next Generation Optical InterconnectsSession Chair Clint Schow, University of California–Santa Barbara, CA, USA

8:45 am–9:30 am (Plenary)MA1 The ARPA-E ENLITENED Program: Will Co-Packaged Integrated Photonic

Interconnects Transform Future Data-Centers?, Michael Haney, ARPA, MD, USA

Under the ARPA-E ENLITENED program, integrated photonic technologies are being developed to enable new networking architectures that overcome the approaching communications limits inhigh-density computing systems. The overall objective is to provide transformative energyefficiency enhancements in data centers. Program goals and status are reviewed.

9:30 am–10:00 am (Invited)MA2 High Speed, Low Energy, Low Latency, and Low Cost Optical Interconnect for

Servers and Data Centers, Daniel Kuchta, IBM T. J. Watson Research Center, USA

The Ethernet Standards have gone in a direction of higher speeds but without regards to energy,latency, and cost. This talk will focus on an ARPA-E project, MOTION, which aims to produce a low energy 16 × 56 Gb/s NRZ optical transciever mounted of the first level package.

10:00 am–10:15 am Canyon BallroomCoffee Break / Exhibits

10:15 am–11:45 am Mesa BallroomSession MB Advance Silicon Photonics Devices ISession Chair Harris Turk, US Government, USA

10:15 am–10:30 amMB1 Impact of Backscattering on Microring-Based Silicon Photonic Links, Meisam

Bahadori, Sébastien Rumley, Qixiang Cheng, and Keren Bergman, Columbia University,New York, NY, USA

The first quantitative analysis of optical power penalty due to the backscattering of silicon add-dropring resonators is presented. Simulated results based on experimentally retrieved data show theattributing power penalty from fabricated microrings is as high as 4.5 dB for 10 Gbps OOK links.

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10:30 am–10:45 amMB2 Improving Microresonators Reliability in Silicon Photonic Integrated Circuits,

Mahdi Nikdast, Colorado State University, CO, USA, Gabriela Nicolescu, PolytechniqueMontréal, Canada, and Odile Liboiron-Ladouceur, McGill University, Montréal, Canada

Exploring microresonators (MRs) design space, we demonstrate a design method (DeEPeR) to enhance MRs reliability in silicon photonic integrated circuits (PICs) under fabrication processvariations. DeEPeR is validated through fabricating several MRs. Moreover, simulation resultsindicate considerable optical signal-to-noise ratio improvements in PICs using DeEPeR.

10:45 am–11:00 amMB3 A Stable Ultrahigh Extinction Silicon Photonic Amplitude Modulator, Hong Cai,

Sheng Liu, Andrew Pomerene, Douglas C. Trotter, Andrew L. Starbuck, Christina Dallo, Dana Hood, Christopher T. DeRose, and Anthony L. Lentine, Sandia National Laboratories,Albuquerque, NM, USA

We demonstrate the ultrahigh extinction operation of a silicon photonic (SiP) amplitude modulator(AM) employing a cascaded Mach-Zehnder interferometer. By carrying out optimization sweepswithout significantly degrading the extinction, the SiP AM is robust to environment changes andmaintained >52 dB extinction for >6 hrs.

11:00 am–11:15 amMB4 Thermal Effect on Semi-Conductor and Metal Heaters in FP-Based Modulator Using

Thermal Simulation, M. Atif, Technische Universität Berlin, Berlin, Germany and SicoyaGmbH, Berlin, Germany and GC University, Lahore, Pakistan, S. Mahdi, TechnischeUniversität Berlin, Berlin, Germany, S. Kupijai, C. Theiss, H. Rhee, A. Al-Saadi, SicoyaGmbH, Berlin, Germany, M. Henniges, D. Selicke, Technische Universität Berlin, Berlin,Germany and Sicoya GmbH, Berlin, Germany, M. Vitali, L. Yan, D. Bronzi, Sicoya GmbH,Berlin, Germany, U. Woggon, Technische Universität Berlin, Berlin, Germany, and S. Meister, Sicoya GmbH, Berlin, Germany

In this paper, a comparison of semi-conductor and metal heaters have been presented. The thermo-optic influence is determined by using thermal simulation in Fabry-Pérot based modulator. Heaterswere used to stabilize shifted spectrum by controlling temperature. High efficiency 0.67 K/mW ofSi-heaters is computed.

11:15 am–11:45 am (Invited)MB5 Energy-Efficient Microsecond Silicon Photonic Switches, Ming Wu, University of

California, Berkeley, USA

Large-scale (128 × 128) silicon photonic switches with microsecond response time and low energyconsumption (<1mW) are made possible by integrating micro-electro-mechanical-system (MEMS)actuators with silicon photonics. In this talk, we will describe the principle and performance of suchswitches and discuss their applications in data centers.

11:45 am–1:30 pmLunch Break (on own)

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1:30 pm–3:15 pm Mesa BallroomSession MC Advance Optical Co-PackagingSession Chair Thomas Schrans, Rockley Photonics, CA, USA

1:30 pm–2:00 pm (Invited)MC1 The PhotonicPlug – Scaling Up Silicon Photonics Packaging, Hesham Taha, Teramount

Ltd., Jerusalem, Israel

The PhotonicPlug technology enables scalable silicon photonics packaging for datacom, telecom,on-board-optics and 2.5D interposer applications. It allows passive alignment of optics, includingsingle mode fiber, to silicon photonic channels with flip-chip packaging machines and supportshigh-volume and low cost packaging through standard CMOS flows

2:00 pm–2:15 pmMC2 Glass Tube Ferrule for Solder-Reflow-Compatible Embedded Optoelectronic

Interconnections, James S. Sutherland, Douglas L. Butler, Jeffery S. Clark, Clifford G.Sutton, Robin M. Force, Alexander L. Cuno, Karl Heise, Lars Brusberg, Alan F. Evans,Corning Research & Development Corporation, Corning, NY, USA, and Michael de Jong,Corning Optical Communications, Keller, TX, USA

A glass-tube-based MT-style fiber array ferrule and connector packaging are presented that provide acompact solder-reflow-compatible interface to PIC (Photonic Integrated Circuit) edge waveguides.Mate/demate experiments demonstrated IL (insertion loss) values across eight fiber array channelsof less than 1.5 dB without index matching fluid.

2:15 pm–2:45 pm (Invited)MC3 Transfer Printing for Silicon Photonics Transceivers and Interposers, G. Roelkens,

J. Zhang, A. De Groote, J. Juvert, N. Ye, S. Kumari, J. Goyvaerts, G. Muliuk, S. Uvin, G. Chen, B. Haq, Ghent University – imec, Ghent, Belgium, B. Snyder, J. Van Campenhout,imec, Leuven, Belgium, D. Van Thourhout, Ghent University – imec, Ghent, Belgium, A. J. Trindade, C.A. Bower, X-Celeprint Limited, Cork, Ireland, J. O’Callaghan, R. Loi, B. Roycroft, and B. Corbett, University College Cork, Cork, Ireland

We present transfer printing as an enabling technology to realize heterogeneous PICs. The approachenables a cost-effective and intimate integration of III-V lasers on advanced high-speed Si PICs. It also enables the integration of III-V and silicon-based opto-electronic components on a passiveSi/SiN interposer.

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2:45 pm–3:15 pm (Invited)MC4 Large-Scale, Automated, High-Throughput Photonic Packaging, Tymon Barwicz,

IBM T.J. Watson Research Center, Yorktown Heights, NY, USA, Ted W. Lichoulas, AFLTelecommunications, Duncan, SC, USA, Yves Martin, Yoichi Taira, IBM T.J. WatsonResearch Center, Yorktown Heights, NY, USA, Shotaro Takenobu, Asahi Glass Co.,Yokohama, Japan, Alexander Janta-Polczynski, IBM Bromont, Quebec, Canada, Eddie L.Kimbrell, AFL Telecommunications, Duncan, SC, USA, Jae-Woong Nah, IBM T.J. WatsonResearch Center, Yorktown Heights, NY, USA, Elaine Cyr, Richard Langlois, IBM Bromont,Quebec, Canada, Bo Peng, IBM T.J. Watson Research Center, Yorktown Heights, NY, USA,Robert Leidy, GlobalFoundries, Vermont, USA, Hidetoshi Numata, IBM Research – Tokyo,Kawasaki, Japan, Swetha Kamlapurkar, Sebastian Engelmann, IBM T.J. Watson ResearchCenter, Yorktown Heights, NY, USA, Paul Fortier, and Nicolas Boyer, IBM Bromont, Quebec,Canada

Silicon photonic chip fabrication exhibits a stark contrast in scalability and cost-efficiency tophotonic packaging. We address this challenge by moving photonic packaging complexity fromassembly to wafer and, by the same token, enabling photonic packaging in standard microelectronicassembly lines.

3:15 pm–3:45 pm Canyon BallroomCoffee Break / Exhibits

3:45 pm–6:00 pm Mesa BallroomSession MD Workshop on Co-Packaged OpticsSession Chair Chen Sun, Ayer Lab, CA, USA

Speakers Katharine Schmitdke, Facebook, USATymon Barwicz, IBM, USAFrank Flens, Finisar, USAKoichi Takemerura, PETRA, JapanPeter De Dobbelaere, Luxtera, USAKobi Hasharoni, DustPhotonics, IsraelThomas Liljeberg, Intel, USA

6:00 pm–7:00 pm Canyon BallromWelcome Reception

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TUESDAY, 5 JUNE 2018

8:00 am–8:30 am Canyon BallroomBreakfast

8:30 am–10:00 am Mesa BallroomSession TuA Silicon Photonics Volume ManufacturingSession Chair Ali Ghiasi, Ghiasi Quantum, CA, USA

8:30 am–9:15 am (Plenary)TuA1 Advanced Silicon Photonics for High-Speed Interconnect, Peter De Dobbelaere, Luxtera,

CA, USA

9:15 am–9:45 am (Invited)TuA2 Versatile Silicon Photonic Platform for Datacom and Computercom Applications,

Karim Hassan, Quentin Wilmart, Laeticia Adelmini, Vincent Reboud, CorradoSciancalepore, Daivid Fowler, Stéphane Malhouitre, Yvain Thonnart, Olivier Castany,Stéphanie Garcia, Stéphane Brision, Viviane Muffato, Olivier Lemonnier, Karen Ribaud,Philippe Grosse, Benoit Charbonnier, Stéphane Bernabe, Ségolène Olivier, Bertrand Szelag,and Christophe Kopp, CEA - LETI, Grenoble, France

We present the LETI CMOS silicon photonics platform and its technological add-ons to tacklecurrent silicon photonic and emergent applications. Core and add-on process modules as EIChybridization, multiple photonic layers, CMOS process compatible laser sources are described to provide a versatile photonic integration scheme.

9:45 am–10:00 amTuA3 Direct Frequency Locking of Lasers to RF Oscillators, Zhe Xuan, Lixiong Du, and

Firooz Aflatouni, University of Pennsylvania, Philadelphia, PA, USA

A hybrid-integrated frequency-locked loop is presented where an opto-electronic oscillator with a dispersive optical delay line is used to directly frequency lock a semiconductor laser to an RFsynthesized source. A tracking range of 4.1pm at a total power consumption of 33mW is achieved.

10:00 am–10:15 am Canyon BallroomCoffee Break / Exhibits

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10:15 am–11:45 am Mesa BallroomSession TuB Advance Silicon Photonics Devices IISession Chair Tomoo Takahara, Fujitsu, Tokyo, Japan

10:15 am–10:45 am (Invited)TuB1 Silicon Photonic Components for 400 Gb/s Transceivers, Yuliya Akulova, Intel, Santa

Clara, CA, USA

We will review recent advances in silicon photonic components towards higher channel count andbaud rate enabling cost-effective 400 Gb/s transceivers and establishing manufacturing platform forfurther scaling of datacenter optical interconnects to Tb/s.

10:45 am–11:00 amTuB2 Advanced Control for Crosstalk Minimization in MZI-Based Silicon Photonic

Switches, Yishen Huang, Qixiang Cheng, and Keren Bergman, Columbia University, NewYork, NY, USA

Key drivers of crosstalk in MZI switch elements are identified in terms of phase error, electro-absorption loss, and coupler variations. An advanced control method is introduced that coordinatesthermo-optic and electro-optic phase shifters to simultaneously mitigate these factors and improvecrosstalk limit beyond equalized push-pull.

11:00 am–11:15 amTuB3 Enhancing SOI Waveguide Nonlinearities via Microring Resonators, Thomas Ferreira

de Lima, Hsuan-Tung Peng, Mitchell Nahmias, Siamak Abbaslou, Chaoran Huang, Alexander Tait, Bhavin Shastri, and Paul Prucnal, Princeton University, Princeton, NJ, USA

Silicon photonics offers a suite of weak nonlinearities that can be exploited to engineer all-opticaldevices. Here, we study how microring resonators (MRRs) harness these nonlinearities, with atheoretical model and experimental validation. Free-carrier effects will practically always dominateover Kerr for MRR-loaded devices.

11:15 am–11:30 amTuB4 A Microring-Based Time-Division Demultiplexer with Differential Signaling,

Ming Gong, Francis Smith, and Hui Wu, University of Rochester, Rochester, NY, USA

We propose a new electronic-photonic integrated circuit for time-division demultiplexing based ontime-interleaved sampling by microring couplers. The quasi-differential circuit design overcomesthe issue of input signal feedthrough due to the extinction ratio limitation of microrings.

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11:30 am–11:45 amTuB5 Highly Efficient Polarization Rotation in Laterally Tapered 1D PhC Si Nanowire, Md Rezwanul H Khandokar, University of Melbourne, Parkville, Australia, Masuduzzaman Bakaul,University of Melbourne, Parkville, Australia and Monash University Malaysia, Selangor, Malaysia,Md Asaduzzaman, Stan Skafidas, and Thas Nirmalathas, University of Melbourne, Parkville,Australia

New structural designs by introducing 1D-PhC structure and novel approach of lateral tapering are proposed in Si nanowire polarization rotator. This shows rotator length of <7 μm with more than 90% efficiency and high operational bandwidth of >700 nm which covers long and short haultelecommunication bands.

11:45 am–1:30 pmLunch Break (on own)

1:30 pm–3:15 pm Mesa BallroomSession TuC Silicon Photonics Interconnects and FabricsSession Chair Ashkan Seyedi, Hewlett Packard Enterprise, CA, USA

1:30 pm–2:00 pm (Invited)TuC1 PINE: An Energy Efficient Flexibly Interconnected Photonic Data Center Architecture

for Extreme Scalability, Keren Bergman, Columbia University, New York, NY, USA, John Shalf, George Michelogiannakis, Lawrence Berkeley National Laboratory, Berkeley, CA, USA, Sebastien Rumley, Columbia University, New York, NY, USA, Larry Dennison, NVIDIA, and Monia Ghobadi, Microsoft Research

Cost and complexity of existing data-movement solutions prevent designing datacenter rackstailored to specific applications. We introduce the PINE concept (Photonically Interconnecteddatacenter Elements), in which compute, memory or storage modules can be flexibly combined thruone-model-fits-all embedded photonic connectivity and prevent stranded resources.

2:00 pm–2:15 pmTuC2 Wavelength Locking of Multicast Signals Using Photo-Conductive Effect in Silicon

Photonic Platform, Alexander Gazman, Ziyi Zhu, Meisam Bahadori, and Keren Bergman,Columbia University, New York, NY, USA

We develop an automated wavelength locking of microring resonators for routing optical signals in unicast and multicast modes. The locking algorithm utilizes the photo-conductive effect of theintegrated microheaters for tapless monitoring of the optical power coupled to the microring.

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2:15 pm–2:30 pmTuC3 Microring-Based Si/SiN Dual-Layer Switch Fabric, Qixiang Cheng, Liang Yuan Dai,

Meisam Bahadori, Columbia University, New York, NY, USA, Padraic Morrissey, UniversityCollege Cork, Cork, Ireland, Robert Polster, Sebastien Rumley, Columbia University, NewYork, NY, USA, Peter O’Brien, University College Cork, Cork, Ireland, and Keren Bergman,Columbia University, New York, NY, USA

The first microring-based Si/SiN dual-layer switch fabric is fabricated, packaged and characterized.The 4 × 4 thermally-actuated switch fabric implements the switch-and-select architecture in an ultra-compact footprint. It leverages the Si/SiN dual-layer structure achieving a crossing-free design,showing great potential for ultra-low loss and crosstalk switching applications.

2:30 pm–2:45 pmTuC4 Characterization of Low Loss Photonic Waveguides Using Arrayed Waveguide

Structure, Nicholas Boynton, Michael Gehl, Christina Dallo, Andrew Pomerene, Andrew Starbuck, Dana Hood, Douglas Trotter, Anthony Lentine, and Christopher T.DeRose, Sandia National Laboratories, Albuquerque, NM, USA

We present a new method of accurately characterizing waveguide loss using an arrayed waveguidegrating measured in a swept wavelength interferometer. Using this method we can extract thewaveguide propagation loss which is independent of insertion loss with an uncertainty of less than0.1 dB/cm.

2:45 pm–3:00 pmTuC5 Self-Organized Lightwave Network (SOLNET) Formed by Two-Photon

Photochemistry for 3-D Integrated Optical Interconnects, Tetsuzo Yoshimura, Shunya Yasuda, Hideaki Yamaura, and Yusuke Yamada, Tokyo University of Technology,Tokyo, Japan

Two-photon SOLNET, which enhances the self-aligned optical coupling capability in 3-D opticalwiring, is found by FDTD simulations to exhibit lateral misalignment tolerances more than 3 μmbetween 600 nm-wide waveguides and [3 μm-600 nm] mode size conversion functions. Two-photonR-SOLNET is experimentally demonstrated.

3:00 pm–3:15 pmTuC6 Cross-Layer Optimization for High-Radix Integrated Optical Switches in Data

Centers, Zhifei Wang, Peng Yang, Hong Kong University of Science and Technology, HongKong, Yi-Shing Chang, Intel Corp., Santa Clara, CA, USA, Jiang Xu, Xuanqi Chen, ZhehuiWang and Luan H. K. Duong, Hong Kong University of Science and Technology, HongKong

This work proposes a cross-layer framework to optimize high-radix optical switches and facilitaterapid initial system design explorations and evaluations. Case studies on 64-port switches show theframework can reduce as much as 93% laser energy consumption with optimized device parameters.

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3:15 pm–3:45 pm Canyon BallroomCoffee Break / Exhibits

3:45 pm–6:00 pm Mesa BallroomSession TuD Workshop on 100 G Signaling: Enabling Next Generation InterconnectsSession Chair Stephen Lessard, Ericson

Speakers Andreas Bechtolsheim, Arista, USAChris Cole, Finisar, USAMark Nowell, Cisco, USATom Palkert, Molex, USANathan Tarcy, TE Connectivity, USAJeff Twombly, Credo Semiconductors, USABrad Booth, Microsoft, USA

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WEDNESDAY, 6 JUNE 2018

8:00 am–8:30 am Canyon BallroomBreakfast

8:30 am–10:00 am Mesa BallroomSession WA Next Generation Hyperscale Data Centers ISession Chair Ali Ghiasi, Ghiasi Quantum, CA, USA

8:30 am–9:15 am (Plenary)WA1 The Road to 400G Optics, Andreas Bechtolsheim, Arista Networks, Santa Clara, CA, USA

This talk will discuss the impact of silicon interface speed transitions from 25 Gbps to 50 Gbps andto 100 Gbps on the packaging options for 400G optics, including the OSFP, QSFP-DD and COBOoptics module form factors.

9:15 am–9:45 am (Invited)WA2 Requirements for Next Generation Data Center, Hans-Juergen Schmidtke, Facebook,

Cambridge, MA, USA

9:45 am–10:00 amWA3 Technical Feasibility of New 200 Gb/s and 400 Gb/s Links for Data Centers, Yi Sun,

Robert Lingle, Jr., OFS Fitel, LLC, Norcross, GA, USA

The technical feasibility of new 200 G and 400 G PHYs over fewer MMF fiber pairs isdemonstrated from the literature, for application in cloud and large enterprise data centers.

10:00 am–10:15 am Canyon BallroomCoffee Break / Exhibits

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10:15 am–11:45 am Mesa BallroomSession WB Next Generation Hyperscale Data Centers IISession Chair Brian Taylor, Facebook, Cambridge, MA, USA

10:15 am–10:45 am (Invited)WB1 Requirements for Next Generation Networks in High Performance Computing,

Robert Senger, IBM TJ Watson Research Center, Yorktown Heights, NY, USA

We begin by overviewing current challenges building high-performance, scalable networks, and then discuss desirable network attributes for next generation high-performance workloads. We examine promising ideas and directions for addressing these challenges and attributes, in theareas of technology, topologies, and support for processor offloading.

10:45 am–11:15 am (Invited)WB2 Integrated Silicon Photonics for Future Data Center Applications, Drew Alduino,

Intel Corp., Santa Clara, CA, USA

11:15 am–11:45 am (Invited)WB3 Reconfigurable Integrated Photonics Based on Optical Phase Change Materials,

Tian Gu, Massachusetts Institute of Technology, Cambridge, MA, USA

We present novel photonic circuit architectures and device designs based on optical phase change materials. Ge-Sb-Se-Te integrated Si-photonics exhibit significantly improved switchingperformance over state-of-the-art GST-based approaches. The technology is scalable to non-blocking matrix switches with arbitrary network complexity, enabling high-performancereconfigurable photonics circuits.

11:45 am–1:30 pmLunch Break (on own)

1:30 pm–3:15 pm Mesa BallroomSession WC Advance Communication ISession Chair Frederick (Rick) McCormick, Sandia National Labs, Albuquerque, NM, USA

1:30 pm–2:00 pm (Invited)WC1 DSP-Free Coherent Interconnects for Data Center Networks, Joseph Kahn,

Anujit Shastri, and Jose Krause, Stanford University, Stanford, CA, USA

We review low-power DSP-free coherent receiver architectures for dual-polarization quadraturephase-shift keying (DP-QPSK). They exhibit performance comparable to their DSP-basedcounterparts in short-reach links, while consuming an estimated power of ~4 W for 200 Gbit/s DP-QPSK in 90-nm CMOS.

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2:00 pm–2:15 pmWC2 Clock and Data Recovery in High-Speed PAM-4 Transmission Systems,

Nebojsa Stojanovic, Fotini Karinou, Cristian Prodaniuc, Zhang Qiang, Zhang Liang, andJinlong Wei, Huawei Technologies Duesseldorf GmbH, Munich, Germany

We propose a novel clock and data recovery method for high baud rate four-level pulse amplitudemodulation format receivers without any digital signal processing. The new phase detector operateswith a single sample per symbol and uses only high-speed logical circuits.

2:15 pm–2:30 pm WC3 Opto-Electrical Hybrid Equalization for VCSEL-MMF Based Links, Chenyu Liang,

Wenjia Zhang, and Zuyuan He, Shanghai Jiao Tong University, Shanghai, China

In this paper, opto-electrical hybrid equalization for VCSEL-MMF based links is proposed to enhance 56-Gb/s PAM-4 transmission over 300-m MMF. Three order of magnitude BERimprovement has been achieved by applying the proposed approach, with the greatly reducedcomplexity needed for electrical equalization.

2:30 pm–2:45 pmWC4 Forward Error Correction-Free Low Latency Direct Detection DWDM Optical 100

Gb/s Transmission in a Pluggable Form Factor for Network Edge InterconnectApplication, S. N. ElAhmadi, S. ElAhmadi, and A. Puc, Menara Networks, Dallas, TX,USA

Low power pluggable CFP form factor is proposed and experimentally demonstrated over 200 km ofstandard G.652 fiber. Optical duo-binary (ODB) modulation and distributed Raman amplificationare used to achieve error-free, non-repeatered, 100 Gb/s transmission. By avoiding extensive signalprocessing system features very low latency.

2:45 pm–3:15 pm (Invited)WC5 100G VCSELs, Stephen Ralph, Georgia Tech, USA

3:15 pm–3:45 pm Canyon BallroomCoffee Break / Exhibits

3:45 pm–5:00 pm Mesa BallroomSession WD Advance Communication IISession Chair Jock Bovington, Cisco, CA, USA

3:45 pm–4:15 pm (Invited)WD1 Recent Advances of PAM4 Signaling for Data Center Optics, Frank Chang, Inphi, CA,

USA

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4:15 pm–4:30 pmWD2 A Pair of Integrated Optoelectronic Chips for Optical Interconnects, Kai Liu,

Yongqing Huang, Xiaofeng Duan, Qi Wang, Qi Wei, Xiaomin Ren, and Shiwei Cai, Beijing University of Posts and Telecommunications, Beijing, China

In this paper, a pair of integrated optoelectronic chips based on VCSEL and PIN-PD is proposed foroptical interconnects. One of the chips emits light at 848.1nm and receives light at 805.3 nm, whilethe other one emits light at 805.3.1 nm and receives light at 848.1 nm.

4:30 pm–5:00 pm (Invited)WD3 Transmission and Switching Technologies for 5G Transport Networks, Fabio Cavaliere,

Luca Giorgi, Ericsson Research, Pisa, Italy, and Luca Potì, CNIT, Pisa, Italy

5G is requiring higher capacity and performance to the optical transport network while demandinglower cost and energy consumption. This work illustrates new technologies (novel modulationformats, photonic integrated circuits) for cost effective high speed transmission and switching in 5G fronthaul and backhaul networks.

END OF PROGRAM

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