E. Frohnmeyer et al., assignors to International Business Machines Corp., Armonk, N.Y.

A method for producing a mag- netic disk comprising adjusting a dissolved oxygen content of a rins- ing liquid to a selected percentage range; rinsing a substrate with the rinsing liquid to allow the dis- solved oxygen to oxidize portions of the substrate surface to form oxide islands; sputtering a layer of metal atoms onto a surface of the substrate magnetic disk; and sputtering one or more thin films onto the surface of the substrate including a magnetic thin film.

SPUlTERING DEVICE U.S. Patent 6,203,677. Mar. 20, 2001 M. Ktinig, assignor to Leybold Systems GmbH, Hanau, Del.

A cathodic sputtering device for coating an essentially flat disk- like substrate.

PULSE REVERSE ELECTRGDEPGSITIGN FOR PLANARIZATIGN DC SEMICONDUCTOR SUBSTRATES U.S. Patent 6,203,684. Mar. 20, 2001 E.J. Taylor et al., assignors to Faraday Technology Marketing Croup LLC, Troy, Ohio

A method for depositing a smooth layer of a metal onto a microrough substrate compris- ing immersion in an electroplat- ing bath containing ions of a metal to be deposited; immers- ing a counter electrode in the plating bath; passing an electric current between the substrate and counterelectrode for an es- sentially continuous period of time until microscopic depres- sions on the microrough surface have been filled with the metal, wherein the electric current is a modulated reversing electric cur- rent.

SELECTIVE PLATING DEVICE U.S. Patent 6,203,685. Mar. 20, 2001 M. Acciai and S.L. Tisdale, assignors to International Business Machines Corp., Armonk, N.Y.

An apparatus and method for selective electrolytic metalliza- tionfdeposition utilizing a fluid

head.

FILLING APERTURES WITH REFLECTIVE METAL U.S. Patent 6,203,686. Mar. 20, 2001 U. Landau and J.J. D’Urso, assignors to Applied Materials Inc., Santa Clara, Calif

A method for electroplating cop- per onto a substrate having sub- micron feature comprising a plat- ing solution of water; copper at a molar concentration of 0.1 to 1.2,

wherein the copper ions are ob- tained from Conner sulfate. Conner

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94 Metal Finishing

fluoroborate, copper gluconate, copper sulfamate, copper pyro- phosphate, copper chloride, cop- per cyanide, copper citrate, or mixtures thereoc a polyether at a concentration from 0.1 to 2,500 ppm of the plating solution; a di- valent sulfur compound at a con- centration from 0.05 to 1,000 ppm of plating solution; and a substi- tuted thiodiazole at a concentra- tion of 0.1 to 50 ppm.

ELECTROPOLISHING APPARATUS U.S. Patent 6,203,689. Mar. 20, 2001 J.D. Kim and M.S. Choi, assignors to Korea Advanced Institute Science and Technology, Taejun, Rep. of Korea

An electropolishing method for polishing an inner face of a deep hole of an article comprising hold- ing the article with the hole facing upward in an electrolytic bath; supplying electric energy through an electrode adapted for insertion into the hole; forming a magnetic field in a zone including the arti- cle using a plurality of magnets arranged around the article; di-

recting an electrolyte through a hole drilled in the electrode longi- tudinally and through a gap lo- cated between an outer face of the electrode and the inner face of the hole; and removing an electrolysis coat from the inner face of the hole.

ELECTROLYTIC CLEANING U.S. Patent 6,203,691. Mar. 20, 2001 J.E. Hoffman, Jr., and R.A. Hoffman, assignors to Hoffman Industries International Ltd., Harrisburg, Pa.

A method of cleaning impurities and oxides from the surface of a conductive body comprising form- ing a basic electrolyte having a pH in excess of 7.0 and not more than 9.0 by dissolving disodium phosphate and baking soda in wa- ter and placing the electrolyte in a container; positioning an anode in the electrolyte; immersing a con- ductive body in the electrolyte; connecting the body to a negative terminal of a direct current source and connecting the anode to a pos- itive terminal of a direct current

source; and flowing current from the source through the electrolyte and the body to remove impurities and oxides.

PREVENTING CORROSION OF MlElAL SUBSTRATES U.S. Patent 6,203,854. Mar. 20, 2001 J.C. Affinito, assignor to Brent Znternational PLC, Bucks, U.K.

A method for coating a metal sub- strate comprising contacting with a treatment solution for a period of time of 2 seconds to 5 minutes, wherein the treatment solution is free of silane crosslinkers and comprises a partially hydrolyzed aminosilane and a fluorine-con- taining inorganic compound, and the coating provided by the treat- ment solution is present on the metal substrate at a weight of 10 to 14 mg/ft’.

COATING COMPOSITION FOR PLASTIC U.S. Patent 6,203,913. Mar. 20, 2001 C.A. Kondos et al., assignors to PPG Industries Ohio Inc., Cleveland

A coating composition comprising a crosslinkable film-forming sys-

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January 2002 95