Fico FSL The New Era in Singulation - Besi

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Fico FSL™: The New Era in SingulationBesi // Single Device Tracking According E142 on all Systems

Datacon // Overcoming Challenges in Image Sensor Manufacturing

2 // SpotlightS 2011-01

CONTENT

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iMpRiNtEDITORIAL OFFICE Esec ltd., hinterbergstrasse 32, 6330 Cham, Switzerland,tel: +41 41 749 58 47, Fax: +41 41 749 51 77, www.besi.com, [email protected] EDITOR-IN-CHIEF Frida C. hirt COPY EDITOR polyglotte Sàrl, 1167 lussy-sur-Morges,Switzerland LAYOUT & PRINT Victor hotz Ag, Steinhausen, SwitzerlandPHOTOGRAPHS BE Semiconductor industries N.V. (Besi) CIRCULATION 7,000

©2011 BE Semiconductor industries N.V. (Besi), the Netherlands. All rights reserved.Contents (text and pictures) may not be reproduced in whole or part without the written consent of Besi.

Fico: Initiating a New Era in Singulation // 4 – 5Fico launches its latest flagship FSl™ – the only integrated system for package singulation.

Corporate News // 6 – 7Besi reports record results // New Executive Managers // Esec launches the new soft solder Die Bonder 2009 fSE // Event Agenda 2011

Esec: Mass Production Flip Chip Bonding on Leadframes // 8 – 9the Esec Flip Chip Bonder 2100 FC offers high output at consistent high quality and at low investment cost.

Fico: Exposed Die Flip Chip Molding // 10in close collaboration with customers, Fico developed exposed die flip chip molding for pop technology.

Besi: Single Device Tracking with E142 // 11All Besi systems support single device tracking following the E142 protocol resulting in significant cost reduction.

Esec: The Secret of E-Dots© or E142 Substrate Mapping // 12 –13By implementing the Strip Mapping concept on the Die Bonder 2100 platform, Esec replaces ink dots by E-Dots© complying to E142 standards.

04 Integrated Singula-tion Solution Fico // Fico launches its new flagship Fico Sawing Line (FSL™) setting new industry standards.

Datacon: Challenges in Image Sensor Manufacturing // 14Datacon’s 2200 evo platform is the ideal fit in the image sensor production world.

Fico Tooling: Supporting Local Charity // 15Fico tooling in leshan actively supports local projects dedicated to the education and development of young talents.

Esec: Providing Outstanding Services with Added Value // 16 –17the Wire Bonder Service Center formally started ope-rations serving an installed base of more than 6,000 wire bonders worldwide.

Besi: Aligned Solutions for LED Manufacturing // 18 –19Besi offers leading-edge solutions along the value chain in the back-end of lED manufacturing.

SpotlightS 2011-01 // 3

MARKET COMMENT

Market Comment by J. K. park, Senior Vice president Sales & Customer Services in Apac

Author // J. K. Park

„When it comes to reliaBle leD manufacturing, Besi is your right partner”

Following the commendable business success achieved in 2010, Besi continues to focus on providing high-end technology for the iC manufacturing industry. Being well positioned in this market segment, Besi now takes a next step forward and moves into the lED market offering its high technology performance and productivity equipment. Besi has a long and proven track record: the company has been in the solder bump flip chip application area for a long time as well as in the gold material base intermetal-lic die attach process with its ggi. Besi also offers significant advantages through its high-speed bonding capabilities in both the solder and gold in-termetallic applications, which will generate shorter process times for lED manufacturers resulting in lower cost lED production and highest quality. Besi also has a technology that can do finer pitch

enabling high bright lED devices. For packaging and plating needs, Besi also offers leading-edge solutions, such as the latest generation in singulation ensuring the highest accuracy at high throughput levels, while in the plating field, Besi has vast expertise in high-speed spot plating.

We at Besi have always understood and anticipated our customer’s needs. our Sales & Customer Support teams in the Apac region and our dedicated technical teams are at your full disposal, to offer the best solutions for your current and future needs. We very much look forward to developing with you in 2011 and beyond.


PACKAGING – SINGULATION

With the launch of its new flagship Fico Sawing line (FSl™), Fico initiates the new era in singulation. the FSl™ is the only integrated singulation system currently available. Full parallel sawing and sorting processes, generate the highest output possible at lowest cost of ownership. having already proven its unique and innovative capabilities in the field, the FSl™ sets out to conquer the industry.

initiating the neW era in singulation: the fsl™

Fico singulation machines have a proven reputation for innovation, quality and high volume output. Each system has been designed to meet the challen-ges of today’s ever more demanding manufacturing processes as well as to anticipate future market needs. the Fico FSl™ was developed according to these principles resulting in an economically attracti-ve singulation system. the six processes incorporated in the integrated system are perfectly aligned and have a significant impact on quality: Seven integ-rated inspection cameras, combined with full array handling, automatically optimize the production process through a closed loop feedback system. therefore a package accuracy of ± 50 µm with a Cpk > 2.0 can be guaranteed. the innovative and unique upside down sawing process enables effec-tive scrap handling of high density substrates. the FSl™ runs six processes in parallel and independently of each other ensuring highest yield.

Another FSl™ highlight is the highly advanced vision system. Seven cameras throughout the machine identify, track, check orientation and alignment, and inspect the products. A further unique feature is the saw blade diameter camera that continuously checks the saw blade and its position. During sorting each individual product can be checked on more than 50 different defects.

Not only is the quality significantly improved, but so is the efficiency of the system. the FSl™ sub stan tially increases yields, at a low cost of ownership. on top of this, the Fico process knowledge helps to improve your current processes and supports you with the introduction of new packages.

Would you like to know what the FSl™ can mean for you? or have a demo on a running system? please contact the Besi sales department for more informa-tion or visit our website www.newfsl.com

Author // Henri in ‘t Veld

High Output• Fully parallel processing with dedicated units.• Balanced throughput with optimal process

performance.• high output up to 22,000 Uph.

Large Substrate Handling• Capable of handling substrate sizes of up

to 152.4 × 300 mm.• Fully prepared for future development of high

density substrate approach.

Fast Conversion• Fast & easy product conversion to different

substrate & product size.• No tools required and completely automatic

alignment of all product related parts.

Upside Down Sawing• Substrates and products are handled in a

“live bug” state (contacts down) throughout the system.

• End product is fixed from the top side.• Substrates are cut from below.• Cutting scrap falls automatically into the

waste bin.• Minimal risk of scrap hitting the saw blade.

High Accuracy• All substrates are fully analyzed with the

pre-alignment feature, operating in parallel with the sawing process (zero time loss).

• the sawing process is taking into account all specific substrate shape and geometry deviations.

• Final package accuracy of ±50 µm at Cpk > 2.0 (6-sigma process control).

FSL™ – THE NUMBER ONE INTEGRATED SOLUTION FOR PACKAGE SINGULATION

HENRI IN ’T VELDhas been product Manager Singulation at Fico in Duiven (the Netherlands) since 2005. his fields of expertise are mainly dicing and sawing.


the highly advanced vision system is one of the highlights

Final package accuracy of ±50 µm with a Cpk > 2.0 can be guaranteed

Fast and easy productconversion

FiCo FSltM – thE iNtEgRAtED SolUtioN FoR pACKAgE SiNgUlAtioN FUllY pARAllEl pRoCESSiNg With DEDiCAtED UNitS

Substrate Loading

Pre-Alignment

SawSingulation

VisionInspection

Clean &Dry

Sorting &Offloading


neW management team memBers

Besi reports recorD 2010 results2010 marked the most successful year in Besi’s history as a public company. “our ability to scale our business with an expanded portfolio of ad vanced packaging systems in the most recent industry upturn combined with our ongoing cost reduction efforts resulted in record revenue and

GUIDO SLUMP joined Besi in December 2010, taking over responsibilities of the Fico packaging business as Senior Vice president, based in Duiven, the Netherlands. Mr. Slump has 27 years of ex perience in capital goods manufacturing, development and sales.

net income of ' 351.1 million and ‹ 47.3 million, respectively” commented Richard Blickman, president & CEo. he continues: “our growth in 2010 represents the most visible evidence of the strategic progress we’ve made in transforming Besi into a broad based assembly equipment supplier efficiently serving both mainstream and niche as-sembly markets. our focus on developing a leading edge portfolio for use in array connect and wafer level packaging applications has positioned us to capita lize on opportunities resulting from increased demand currently for smart phones, tablets, personal productivity devices and automotive electronics. in addition, our restructuring efforts and ongoing transfer of production from Europe to Asia has significantly reduced our manufacturing costs and improved margins.”

Read the full announcement on the internet www.besi.com

JOE LIPPINCOTT is new Vice president Sales & Customer Support North America & Europe, based in Besi’s Chandler office (Arizona). Mr. lippincott has more than 25 years of experience in the semiconduc-tor packaging industry.

PETER PUBBEN is the new interim Manager for Meco, Besi’s plating business based in Drunen, the Netherlands. Mr. pubben is an approved expert in interim management and has vast experience in the high-technology industry.

BERTHOLD BUTzMANN will be designated Chief operating officer effective April 2011 and will be based at Besi’s production facilities in Malaysia. Mr. Butzmann will be responsible for the manage-ment and oversight of Besi’s global production activities, supply chain network and spare parts.

INSIDE BESI

CORPORATE NEwS


INSIDE BESI

EVENTS CALENDAR

esec launches neW soft solDer Die BonDer 2009 fsE

PV TECHNOLOGY SHOw5 – 7 April 2011Stuttgart, germany

IPC APEX EXPO USA12 – 14 April 2011 Booth No. 365Mandalay Bay Resort & Convention Center, las Vegas

SMT HYBRID PACKAGING3 – 5 May 2011Nurnberg, germany

SEMICON SINGAPORE11 – 13 May 2011 Suntec, Singapore

INTERSOLAR8 – 10 June 2011Munich, germany

SEMICON wEST12 – 14 July 2011 Booth No. 5867Moscone Center, San Francisco (USA)

(as per March 2011, subject to change)

RENEwABLE ENEGERGY INDIA10 – 12 August 2011Delhi, india

26TH EU PVSEC5 – 9 September 2011hamburg, germany

SEMICON TAIwAN7 – 9 September 2011 World trade Center, taipei, taiwan

IMAPS USA9 – 13 october 2011long Beach, California, USA

PRODUCTRONICA15 – 18 November 2011Munich, germany

one typical example for lowest cost of ownership is the significantly lower gas consumption of up to 50 percent relative to competing systems, which means massive savings inoperating costs every day.

the ever more demanding customer requirements for power packaging lead to the evolution of the new Esec Die Bonder 2009 fSE, the fastest soft solder die bonder in the industry with a broad application range. First to mention the point-to-line pick & place with stationary indexer, which enables increased throughput and productivity. Furthermore, the Esec Die Bonder 2009 fSE handles both, single row and matrix leadframes as well as a variety of applica-tions like Sot-23, Sot-223, Sot-89, to-92, to-126, to-220 and DpAK devices. the optional leadframe conversion kits offer an effective solution for future changes in the product mix.

the Esec Die Bonder 2009 fSE is based on the proven 2009 platform and will be presented to the public for the first time at Semicon China Show 2011 in Shanghai.


DIE ATTACH – FLIP CHIP BONDING

the market for Flip Chip on leadframe products practically exploded in the last one to two years. the established players in the subcontract assembly market are producing these devices in large quantities now and new companies started investing in high volume production equipment at an amazing pace. What happened?

mass proDuction flip chip BonDing on leaDframes

FELIX MEIERhas been head of product line Flip Chip at Esec in Cham (Switzerland) since 2008. in this function he introduced the Esec flip chip bonder 2100 FC into the market, comple-menting Besi’s established high-end flip chip offering with a lower Coo solution. An Esec veteran of many years, he held positions in product and technology management, sales, service and key account management.

Flip Chip is a chip interconnect technology intro-duced by iBM already in the early `60s. Since it allows spreading the electrical connections over the whole chip area, it was traditionally used for high i/o devices, e.g. microprocessors, graphic proces-sors and network switching circuits. Matching the high-end performance requirements that typically go hand in hand with high i/o count, flip chip offers the best electrical path (low resistance, capacitance and inductance) between chip and package. these mechanical and electrical properties of flip chip interconnects explain why we see such tremendous growth in flip chip on leadframe (FCol) packages.

Portable Devices at Low CostBattery-powered portable electronics such as Apple’s iphone and ipad require smaller devices that don’t waste precious electrical energy. Flip chip packages offer exactly this: maximum die size in small pack-ages (see Fig. 2) and excellent current conductivity. No wonder that more and more power management iCs (e.g. voltage regulators and converters) are offered in FCol packages. leadframe designs like high density QFN and Sot are replacing more expen-

sive laminate substrates. the number of i/os in these packages is typically very low, most often < 10. this allows very short flux dipping times so that the throughput (fluxing is in the critical path of a flip chip bonder) is high. the bumps connecting the chip surface to the metal leadframe are built in so called copper pillar technology; where a tiny amount of solder sits on top of a copper cylinder (see Fig. 1). it took some time to build up the neces-sary infrastructure, but now a lot of Cu bumping capacity is available at low cost. Further down-stream, process cost came down using molded underfill in QFN matrix leadframes, eliminating the capillary underfill dispensing step. the only “missing link” was the proper mass production flip chip bonder.

Mass Production Flip Chip Subcontract Assemblythe semiconductor assembly, packaging and testing services (SAtS) companies, typically located in Asia, have specific needs for their production equipment. they need best cost of ownership (Coo), which not only means high throughput and low investment cost. Equipment should be easy to set up and run,

Figure 1: An iC (about 1×1 mm) with six Cu pillars

Author // Felix Meier


requiring minimum operator interaction (and minimum operator skill level), and it must produce with consistent high quality.

the Esec flip chip bonder 2100 FC does just this. it is a member of the successful Esec 2100 family of epoxy and stacked die bonders, so it inherited their characteristics of recipe portability (recipes are created for the product, not for the machine), short time to yield (the time required to change from one product to the next and running it with high quality) and almost maintenance free operation. its compact de-sign is optimized for processing strip based products (leadframes as well as organic CSp substrates) with highest throughput. it runs sophisticated real-time software that makes sure no time is wasted waiting for one part of the machine to complete its job until another part can start. Most 2100 FC modules are shared with the epoxy version and are therefore produced in large quantities, allowing economies of scale also for the flip chip version. Similar synergies exist in R&D, service and spare parts.

Successful Market Introductionthe first machine was shipped to a customer in Ma-laysia in october 2009 with the intention of getting first production feedback. the customer liked it so much that he used it for 7-by-24 mass production two weeks after the installation – and is still running it. of course we added more software features and made the machine faster in the mean time. And the news spread quickly and many more machines were ordered and installed in China and South East Asia in 2010 so that Esec achieved more than 85% market share in FCol.

FCOL Is Taking Off – with the 2100 FClow cost and high performance portable electronics are in everybody’s hands. one enabling iC packa ge technology is FCol. the Esec 2100 FC offers best Coo and is the fastest flip chip bonder in this mar-ket, with a maximum throughput of close to 8,000 units per hour (Uph) – not bad for a single bond-head system and full optical alignment of every die and bond position.

Figure 2 typical maximum die size of popular packages

FCOL wire Bond

QFN 4×4

3.6× 3.6

2.5 × 1.2

2.1 × 2.1

Die (mm)

1.3 × 0.9

SOT 23

ESEC DIE BONDER 2100 FC: POST BOND INSPECTION (PBI) AT FULL BONDING SPEED

As mentioned, mass production equipment must achieve consistent high quality and highest yield with minimum operator skill level and minimum operator interaction. post bond inspection (pBi) is an important machine feature enabling exactly this – if it doesn’t compromise bonding speed.

Classical flip chip bonders have their down-looking camera mounted on the bond head. in order to take a pBi picture, the bond head, after bonding, has to move the camera over the bonded die first. Depending on chip size and camera field of view, two pBi pictures of different corners have to be taken, which requires another bond head movement. All this takes time.

on the Esec Die Bonder 2100 FC, the down-looking camera has its own Y-shuttle to move it over the bonding area. Since the Esec Die Bonder 2100 family pick & place system is a “point-to-line” p&p, only a Y movement is ne-cessary. the camera has a 1 megapixel sensor, so the field of view captures the whole die, eliminating an additional camera movement even for larger dies. During the time the camera takes the picture, the bond head is already moving back to get the next die. therefore also with 100% post bond inspection the Esec Die Bonder 2100 FC is still bonding at full speed, ensuring high yield even if the operators have no time (or not enough skill) to detect misplaced die.

typical Maximum Die Size


the continuing growth of consumer and portable electronic products requires miniaturization and asks for new packaging technologies to achieve a reduced form factor. therefore existing packages must innovate to exploit the inte-gration of multiple components on the same package layout. Solution is the package on package (pop) technology for which Fico uses exposed die flip chip molding.

Author // Jeroen Kleyburg

exposeD Die flip chip molDing

the most common use of the pop technology is where the bottom package is reserved for the logic chip and the top package for memory. the number of stacked memory chips depends on the product requirements (e.g. tablet pC with 16 gB, 32 gB or 64 gB). this common set up allows full testing by memory suppliers before integration with the bottom logic package.

the connection between the top and bottom package is made by an array of pads located on the bottom package, using standard surface mount assembly. this production method has

several restrictions and requires an accurate process to maintain the high surface mount assembly yield. together with the current requirements to consumer and portable electronic products, this package type knows some critical issues:

• Connection pad contamination, by compound or liquid underfill.

• package warpage.• limited interface density.• thick package structure.• high temperature of the logic chip (caused by

insulation by the molding compound).

JEROEN KLEYBURGis product Manager Molding and group leader of process Development. he’s been with Fico in Duiven (the Nether -lands) for more than 12 years. Jeroen Kleyburg has a degree in construction engineering with specialization in ther mo-dynamics and Robotics.

to overcome these issues, Fico has worked closely together with several customers on R&D level, resulting in a new bottom package type using flip chip in combination with molded underfill exposed die. this package can handle the high pin count and specific i/o requirements of logic products, using a fine pitch ball grid array as second level interconnection to the system board.

Flip Chip Exposed Dieproduction of array type exposed die flipchip packages (EFC-MUF), requires a different molding process. the innovative Fico molding process combines high cavity vacuum with foil molding. this prevents air entrapment under the die and keeps the die top free from molding compound. With the AMS-W, Fico can handle array type packages of EFC-MUF with die sizes of 10×10 mm without bump deformation. For more information contact the Fico Sales department at [email protected]

FICO – MOLDING

the topfoil system is available on manual and automatic systems. the manual system is perfectly suited for small scale production and for new package developments. After qualification, molds can simply be transferred to automatic systems for mass productions.


liability makes it important to contin-uously track and trace your products throughout the production process. in an optimal process, that skips any unnecessary operations, tracking and tracing can save costs significantly. to keep track of the products, all Besi machines support single device tracking which seamlessly connects to the E142 protocol for substrate mapping.

single Device tracking With e142

Since the map lay-out of the wafer is already known, only the dies suitable for production are sorted out. the inkless production process e-dot of Esec, com-municates directly with the E142 protocol. After die attachment, wire bonding and molding, the trim & form and singulation machines use the tracking data to distinguish the good from the faulty products, and sorts them out accordingly.

Fico machines can operate using the SECg/gEM protocol. this is a communi-cation protocol for semiconductor equipment communication through a host computer. that host computer can also be used to keep track of each individual product at a higher level. Each individual product is traceable at any time, either on the wafer or on a strip inside a machine or after sorting of the singu-lated products.

Cost savingproduct tracking and tracing with the E142 protocol results in a significant cost reduction. only good products are used for production. Since it is known which products have a failure, they are not used in the following production step and therefore not wasting valuable machine time and materials. the product tracking also saves time to hand mark products on a molded strip prior to the trim & form or singulation process. these faulty products do not have to be laser marked and they do not have to be tested on a test bench. Especially during production of system in package or package on package products the use of a reliable tracking and tracing system proves its strength.

this all results in a short time to market, with 100% functioning end products. Moreover, it allows you to intervene in the process when a certain process step shows more errors than usual. there is no need to wait until this is detected in the final product. As you can see, Besi machines can already be used with the E142 protocol, resulting in a significant cost reduction.

INSIDE BESI

Each individual device is tracked with E142


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Strip Mapping, Single Device traceability (SDt) and other expression float around the semiconductor industry since years but what are these expressions all about? iC’s are getting more and more complex, denser, smaller and quality critical with one little lack. By just looking at them you cannot recog-nise if they are usable or not, why they are like they are, what went wrong in case and what material it is built up from. that’s where Substrate Mapping E142 comes into play. E142 applies a virtual map like representation of the physical world to a lot of common substrates such as e.g. wafers, strips and trays. Esec did implement Strip Mapping based on E142 on the Die Bonder 2100.

the secret of e-Dots© or e142 suBstrate mapping

DIE ATTACH – DIE BONDING

E142 Strip Mapping concept view on Die Bonder 2100

Author // Adrian wyss


E-Dot Systembased on SEMi E142 Standard

Customer System






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The Big Picturelooking at a single iC device, and they can grow quite complex, there are a lot of substrates, tools, consumables and processes involved. Raw mate-rials such as e.g. wafers, strips, epoxy, wires, mold compound and more are fed into machines and hopefully some sellable units are dripping out at the exhaust. So far so good but after singulation or even earlier in the process the quality and build-up materials of such devices is not known and the quality is not obvious. So tracking and tracing the content of such devices might give a big deal of additional information.

SDT Single Device Traceability Describes the concept to gather and manage information about who is doing what with whom and where. Under technical aspects of course. in addition any failure which impacts the device quality can also be included. But to be clear, there is nothing like the holy grail of SDt. it is very much customer and device dependent. that’s where the SEMi E142 Standard for Substrate Mapping comes into play. one focus of this standard is the exchange of essential quantity, quality and position data between equipment and host application. Whereas a proces-sing equipment e.g. a DB 2100 is responsible of producing the strip as per download map and populate maps with quality (pass or fail), pick and place (transfer) and/or device iD information while the host application is the repository of all data and shall able to adequately bring those data in to

a meaningful relation. So the equipment is one part of the game while the host covers the other part. the host needs completely different capability then an equipment such as e.g. data storage, import & export data, extract and merge data just to mention some. Sounds complicated? in fact it is not simple. in my opinion this is the big braking force against the spread of E142. it needs a concept what data to collect, how to collect, where to store, how to con-dense and make meaning out of it. there are E142 communication compliant tools available but there is no complete of the shelf data management system available and it’s getting rather demanding in terms of time, money and resources.

E-Dots© on Die Bonder 2100 E-Dots© are the successors of the “ink Dots” and the “E” stands for Electronic, Economic, Ergonomic, Esec or bEsi. taking a look at the Die Bonder 2100 part is therefore only half the price and if the host is not defined and ready to rumble there is barely interest in the equipment capability. But if they start to go in this direction we are part of the game. the E142 on the Die Bonder 2100 is one of the few running in the field. We have it running on the Die Bonder 2100 at St in Malta. our target was to first create a sound, save and simple implementation based on the defaults of the E142 standard with little whistles and bells but within a concept which allows us to easily increase the E142 capabilities in different directions as desired by our customers.

ADRIAN wYSSjoined Esec in 1995 and holds a Bachelor in Electronics and a Diploma in Computer integra-ted Manufacturing. he started with the Esec Autoline (a material transport and Wip tracking/scheduling system) as product specialist and became later product architect with major responsibilities in requi-rements engineering, product and release management. his expertise later contributed to the Wire Bonder department as automation and integration expert with detailed of the SEMi standards. presently he is the Automation Expert in the Die Bonder unit responsible for requirements engineering, cus-tomer support and documenta-tion. he lately introduced E142 on the Esec Die Bonder 2100.


DIE ATTACH – ADVANCED PACKAGING

Conventional camera vs. wafer level camera.Use & ownership. © Copyright 1996-2010 tessera, inc., All Rights Reserved.

image sensors convert visual images to electric signals for use in a wide range of applications. When looking at the current shipments, miniature cameras inside handphones by far outnumber all other applications like consumer digital cameras, computer web cams, automotive, medical, and security/defense/ space applications. While an estimated number of 60 mill. units of image sensors for consumer cameras (DSC & SlR) will be shipped in 2011, the expected 2011 number for cell-phone cameras will be more than 1,700 millions.

initially cell-phone cameras consisted of a flex print with a sensor chip and an optical assembly with lenses and plastic parts; today a system with similar function uses a stacked wafer-level or chip-to-wafer package containing the image sensor, lens, and cap. the lenses are composed of glass substrates carrying optical polymer material. Some times even an autofocus function is included. the main driver of this miniaturisation is to remove design limitations for the cell phone while at the same time reducing manufacturing cost.

Datacon’s 2200 evo die bonder for advanced packaging applications is used for a number of different tasks in the image sensor value chain. in the traditional package type 2200 evo is used for epoxy dispensing and placing the lens as sembly. the epoxy process is done with constant high ac-curacy to guarantee a tight sealing of the camera package. For a high image quality the accurate place-ment as well as the perfect planarity of the placed lens assembly is a prerequisite. the requ irement to protect the optical assembly from particle contami-nation is achieved by a specially designed hEpA filter system.

Following the technology shift to wafer-level pack-a ges or chip-to-wafer technology, the use of 2200 evo changed to placing the final package on a carrier or on a heat sink. Mirroring the fast progress of the packaging technology, 2200 evo is also constantly improved regarding accuracy and speed to keep pace with industry demands and provide a good cost of ownership to our customers.

Author // Christian Pichler

Driven by cost and size, the development of image sensors is advancing at a fast pace. Starting from the “conventional” CMoS or CCD sensor, mounted on a flex substrate together with an optical lens array, and progressing to-wards today’s wafer-level optics with extremely small dimensions for low-end cell phone applications, Datacon’s 2200 platform is an ideal fit in the image sensor production world.

challenges in image sensor manufacturing

CHRISTIAN PICHLERcurrently works as product Marketing Expert in the Advanced packaging group. Christian joined Datacon in 1999 as product Specialist for die bonders and holds a M.Sc. in physics.


Fico tooling leshan was established in leshan, China as a joint venture by Besi Semiconductor industries and leshan Radio Company in 2002. Ftl designs and manufactures micron level precision tooling, mainly used in the semiconductor industry.

in 2007, Fico tooling donated practical living necessities such as washing machines, dryers, water dispensers, etc. to elderly and children in the leshan Social Welfare house. the leshan Social Welfare house nurses more than 200 children and elderly. peter: “our donation activities are not just tempo-rarily, Fico tooling will continue in the long-term charity work. i do hope more companies in leshan will join in the charity work, to support the less fortunate amongst us.”

A year later it was an extremely cold snowy day when the leshan Social Welfare house was visited again. this time Fico donated winter clothing, caps and scarfs for the more than 200 residents. “When i first came to the leshan Social Welfare house, i saw the staff taking very good care of the elderly and children to provide them a warm home environment. With our practical help i hope we can make it even warmer.” peter said during his visit.

Author // Peter Gregoor

While making great achievements, Fico tooling in leshan (China) does its best to create values to return to society. general Manager peter gregoor – a person of benevolence – cares about, and attaches great importance to local charity work. Already for many years, he supports the local charity house and orphanages. Fico tooling leshan (Ftl) not only donated goods of daily necessity, but also built classrooms for handicapped children, set up scholarships for the University of technology and donated money for reconstruction after the earthquake.

fico tooling supports local charity

A new project every yearin 2009, Fico tooling donated 10 computers and set up an “Ftl Classroom” in the leshan Special Education School. this school has special classes for 200 handicapped students. gregoor: “Fico tooling always donates durable goods. this way we have a physical relation between our efforts and the results. it is very heartwarming to see that the materials are received well, instead of just handing over a cheque. the grateful response of the people motivates us to continue with it each year.”

on January 18, 2011, peter visited leshan Special Education School again. this time Ftl donated another 10 computers to the school, which are also used in the “Ftl Classroom”. After a visit to the new dormitory and attending a lesson, the students expressed their gratitude with sign language. Mr. luo, the headmaster from the school, spoke high-ly of Ftl’s contribution. the students´ smiling faces are a warm confirmation for Fico to continue the charity in the future.


wIRE BONDER

the Wire Bonder product line was transformed into a Service Center which formally started operations in January 2011. More than 100 years of Wire Bonder expertise offer high quality services to an installed base of more than 6,000 wire bonders ranging from the 3006 to the 3200 Esec Wire Bonder generation. located in Singapore and headed by Andreas Schopper, it offers Wire Bonding related services to all customers with its flexible and professional team.

proviDing outstanDing services With aDDeD value

ANDREAS SCHOPPER Andreas Schopper started his career with Esec in 1996 as a product Engineer Wire Bonder. in 2001, he relocated to Singapore assuming last the function of Senior Manager product Management Wire Bonder. Since January 2011 Andreas Schopper heads the Besi Wire Bonder Service Center as Director. he has a post-graduated Diploma in business administration and a Bache-lor of Science in Electrical Engineering from Swiss University.

interview with Andreas Schopper, Director Wire Bonder Service Center

Spotlights: how do customers benefit from the Wire Bonder Service Center?Andreas Schopper: We supply services to our customers comprising of installation, warranty and general service support. But we also offer custo-mization of parts and equipment, software support, expert level support, repairs, overhaul and services. in addition, we are available for trainings ranging from operator to Expert process level.

Besi’s Esec Wire Bonders are known for high quality and engineering level. how is support on high level ensured?At the Service Center, 10 experts with altogether more than 100 years of wire bonding experience offer their expert knowledge to Besi’s customers worldwide. local Service Engineers in taiwan, China and Europe ensure customer proximity and fast reaction times.

What are customers’ expectations and how do you meet those?our customers have high expectations in terms of service. to provide the right service at the right time at competitive price is crucial and indeed a challenge. Customers are only willing to pay for services if they are beneficial to their own production and if their competitive position is improved. We can meet those expectations by creating services which others cannot provide and add significant value for our customers.

Andreas Schopper Director Wire Bonder Service Center

Author // Andreas Schopper


fully committeD to excellent customer service“Customers’ goal is to fully utilize their installed equipment in the production line. With the expertise and competence of the Wire Bonder Service Center we can play an important part to achieve our customers goals. By providing value added services like application support, training and equipment upgrades on top of the normal service support we strive to form a win-win situation. We are fully committed to maintain the partnerships we have developed with our customers over many years.”

Jorg Hering, principle product Specialist, Singapore

“We can provide good service that lifts up machine performance to an excellence level from which customer can obtain a great benefit on our Besi- Esec machine.”

Arnold Fu, Service Engineer, taiwan

the Senior team based in Singapore (from left): Edward Nimbalker, Andreas Schopper (Director),Julius Ceasar, Jorg hering, Andy Bissig, Aniceto Rabilas Jr.

“We provide expert customer solutions for wire-bonding equipment & leading edge wirebonding processes. our group of highly skilled individuals delivers exceptional support for specific & custo mized wirebonding requests and other related back-end process.”

Julius Ceasar Juanier, Singapore

“Every customer world wide can purchase ‘Best in the World’ Wire Bonding services from our Service Center.”

Edward Nimbalker, Singapore

“the challenge for me is to develop and maintain the good working relationship between customers and the whole service team.”

Rolando Isip, China


BESI

When lED was developed in the early 1950’s, no one had expected the revolutionary impact of this unimpressive technology. initially intended for light and microwaves detectors, lEDs quickly found their way into devices of our every-day life such as on digital displays on phones, calculators or car dashboards, and are today to be found even in jewellery or clothing. As the developments in the manufacturing and packaging industries advance quickly, it is possible nowadays to produce wafers with a purity and uniformity required for high-end lED production but unheard of five years ago. the impact is the unprecedented triumphant ad-vance of lEDs which are to be found today in highly sophisticated electronics. Especially the optoelectro-nics industry is blossoming with the advent of ever improving processing technologies. For instance, with the availability of new materials and manufacturing technologies, fabrication of blue and white lED

with high illumination capabilities is no longer a challenge. in addition, the trend towards miniaturi-zation facilitates to incorporate more devices on a single chip thus broaden the usage of lED.

Nevertheless, the assembly and packaging of lED still poses various new challenges. long-lasting, reliable products at a consistent high level of quality are the crucial factors in manufacturing. this is where Besi comes into place: as a specialist in the development, manufacturing and service of assembly equipment for the global semiconductor and elec-tronics industries. Besi anticipated the requirements of the lED manufacturers in advance and offers outstanding, proven technologies covering the complete value chain in lED manufacturing.

to find out more about Besi’s products, contact your local Besi Sales representative or at [email protected]

Author // Vincent Chee

the lED market is experiencing tremendous growth driven by different industries such as automotive, building and street illumination, medical and electronic devices. lEDs are critical semiconductor technologies for energy efficiency, safety and next generation displays. Being a leader in advanced technologies, Besi is committed to collaborate on technology roadmaps and industry standards to reduce costs and spur innovation. in lED manufacturing, Besi offers leading-edge solutions along the complete value chain in lED manufacturing. Besi’s systems are designed and optimized to meet high yield and low cost of ownership.

aligneD solutions for leD manufacturing

VINCENT CHEEis Besi's Business Development Manager lED, based in Singapore. Vincent Chee commenced his career ten years ago with Esec‘s Wire Bonding product group. he holds a degree in electronic engineering and an MBA from Rutgers, the State University of New Jersey, USA.


Meco RtR (Reel-to-Reel) for high speed spot plating

Plating

Datacon 2200 evo

Capillary UnderfillPhosphor AttachLense AttachFrame AttachBoard Assembly

Datacon DS11000

Die SortingPhosphor SortingPackage Sorting

Fico AMS-w

Molded Underfill

Fico AMS-i

Molding

Esec 2100 xP

Die Bonding

Fico Compact Line (FCL)

TrimmingFormingOffload to Bulk / Tube / Tray

Datacon 8800 CHAMEO

Flip Chip Bonding– Gold-Gold Interconnect (GGI)– Gold-Solder Interconnect (GSI)– Solder

Fico Sawing Line (FSL™)

Singulation

Esec 2100 FC

Flip Chip Bonding– Gold-Solder Interconnect (GSI)– Solder

Besi – Winning technologies for leD manufacturinggeneral illumination // Automotive // lCD Backlight // Flashlight // MedicalMobile Devices // photo Sensor

YOUR GLOBAL NETwORK

South East Asia

Esec (Singapore) pte. ltd.

1, Science park Road

Singapore Science park 2

#03-10, Capricorn Building

Singapore 117528

tel. + 65 6303 7000

Fax + 65 6873 1133

Meco Equipment Engineers

(Far East) pte. ltd.

40, Jalan pemimpin #04-06A

tat Ann Building

Singapore 577185

tel. +65 6255 2722

Fax +65 6255 6766

Besi Apac Sdn. Bhd.

3 Jalan 26/7

Section 26

40000 Shah Alam

Selangor Darul Ehsan

Malaysia

tel. +603 5191 1719

Fax +603 5192 9416

China

Esec (Shanghai)

trading Co. ltd.

2/F (east), No. 32

Standard Building

No. 76 Fu te Dong San lu

Road

Waigaoqiao Free trade Zone

Shanghai 200131

p. R. China

tel. +86 21 6093 0588

Fax +86 21 6093 0577

Esec (Shanghai)

trading Co. ltd.

1A0706, Singa plaza tower

8 Jin Ji hu Road

industrial park

Suzhou 215021

p. R. China

tel. +86 512 6767 1037

Fax +86 512 6767 1022

Esec (Shanghai)

trading Co. ltd.

Suite 801, galaxy Center

Building

Caitian Road, Futian District

Shenzhen 518026

guangdong province

p. R. China

tel. +86 755 8826 4058

Fax +86 755 8826 4067

Esec (Shanghai)

trading Co. ltd.

Suite 316, Building 2,

No. 8 KeXin Road

West park of Chengdu

hightech Zone

Chengdu 610731,

Sichuan province

p. R. China

tel. +86 28 879 581 59

Fax +86 28 879 581 59

Fico tooling leshan Co. ltd.

high tech Zone

leshan 614012, Sichuan

p. R. China

tel. +86 833 259 6385

Fax +86 833 259 6368

South Korea

Besi Korea ltd.

#1204 Downtown Building

22-3 Sunae-dong

Bundang-gu, Sungnam-si,

gyeonggi-do

Korea 463-825

tel. +82 31 718 9002

Fax +82 31 718 9003

Taiwan

Besi Singapore pte. ltd.

taiwan Branch

8F, 276 Minsheng Road

hsinchu 30043

taiwan

tel. +886 3 515 3488

Fax +886 3 515 2253

Europe

Datacon technology gmbh

innstrasse 16

6241 Radfeld

Austria

tel. +43 5337 6000

Fax +43 5337 600 660

Esec ltd.

hinterbergstrasse 32

6330 Cham

Switzerland

tel. + 41 41 749 5111

Fax + 41 41 749 5440

Fico B.V.

Ratio 6

6921 RW Duiven

the Netherlands

tel. +31 26 319 6100

Fax +31 26 319 6200

Meco Equipment

Engineers B.V.

Marconilaan 2

5151 DR Drunen

the Netherlands

tel. +31 416 384 384

Fax +31 416 384 300

Americas

Besi North America, inc.

33 East Comstock Drive,

Suite 7

Chandler, AZ 85225

USA

tel. +1 480 497 6404

Fax +1 480 497 9104

Online

[email protected]

www.besi.com

GLOBAL HEADQUARTERS

Besi

BE Semiconductor

industries N.V.

Ratio 6

6921 RW Duiven

the Netherlands

tel. +31 26 319 45 00

Fax +31 26 319 45 50

Documents

Fico FSL The New Era in Singulation - Besi