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元件電路計測實驗

Device and Circuit Characterization Lab.

Tuo-Hung HouDepartment of Electronics Engineering

& Institute of ElectronicsNational Chiao Tung University

Note 1Fall 2011

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Instructor & Teaching Assistants

Instructor侯拓宏 ED409 Ext.: #54261Email: thhou@mail.nctu.edu.tw

TAs羅文呈 ED309c Ext.: #54219邱柏硯 ED307 Ext.: #54215韓宗佑 ED613 Ext.: #54221謝博璿 ED629 Ext.: #54227

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Primary Goal

Familiar with DC, AC, and high frequency measurements for semiconductor devices.

Physical characterization of MOSFETs will be emphasized.

Basic understanding of semiconductor device physics is recommended.

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Evaluation

Experimental report : group reports, 20%

Operational examination : 4 examinations, 40%

Midterm examination : 20%

Final examination : 20%

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Course notes and supplemental literature.• http://web.it.nctu.edu.tw/~thhou/teaching

Semiconductor Material and Device Characterization, Dieter K. Schroder, 3rd Edition, Wiley.Operation manuals and application notes of instruments.Other related publications.

References

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週次 上課日期 負責助教 機台進度

第3週 9/26~10/2 羅文呈 Lab View software &分組名單確定

第4週 10/3~10/9 羅文呈 System Setup

第5週 10/10~10/16 謝博璿 Agilent 4140 Operation

第6週 10/17~10/23 羅文呈&謝博璿 1st 上機考

第7週 10/24~10/30

第8週 10/31~11/6謝博璿 Agilent 4156 Operation

第9週 11/7~11/13 羅文呈 Lab View Controller

第10週 11/14~11/20 羅文呈&謝博璿 2nd上機考

第11週 11/21~11/27 謝博璿 Tek 370 Operation

第12週 11/28~12/4 韓宗佑 Agilent 4284 & Split CV

第13週 12/5~12/11 謝博璿&韓宗佑 3rd 上機考

第14週 12/12~12/18 韓宗佑 Charge Pumping & Agilent 81110 & 8560E

第15週 12/19~12/25 邱柏硯 Agilent 8753 Operation I

第16週 12/26~1/1 邱柏硯 Agilent 8753 Operation II

第17週 1/2~1/8 韓宗佑&邱柏硯 4th 上機考

100學年度元件電路計測實驗實作進度表

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Announcements

選課優先順序為：電研所碩士班、電研所博士班、電工系大四學生、電研所甄試錄取生(以上有修過半導體元件物理者有優先權)、本校研究生、本校研究所甄試錄取生、外校研究生。

• 若到某順位超額，從該順位選修人抽籤至額滿為止。

• 如有特殊需求必須使用計測實驗室儀器，但未能選課，請詳述理由，由本人決定。

• 最後未能選課之同學可以旁聽教室課。

已選課同學請在9/26 前自行以3人為一組，並決定組長，向大助教羅文呈memorypoison@gmail.com 登記。• 非電研所同學請勿集中在同一組，如有分組困難，由大助教協助分組。

• 分組之後，不接受退選。

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計測實驗室上課規定

請不要將食物或飲料帶進計測實驗室以及在實驗室內吃東西。

實驗完畢，請將桌子整理乾淨且椅子歸位，自己的東西請記得帶走。

請不要亂動或是搬動量測儀器，尤其是有其他同學正在量測時。

請依照實驗課助教所訂定的約量測時間的規則來約量測時間，約好的量測時間，請一定要來量測。

弄壞量測儀器或是量測儀器本身自己出問題，請立即填寫記錄簿以及聯絡助教，才能作立即維修處理，不會作處分，除非是故意弄壞儀器。

進入計測實驗室，請將外面的門及裡面的門確實關上，等分完組決定組長後，組長的學生證會加到門禁系統以便進出實驗室，組員與組長間要互相知道彼此的聯絡方式。

實驗課上課的時間由各助教協調，上課時間會公告在BBS咕嚕火鍋站的EE-GRADUATE板。實驗上或是報告上的問題都要個別問當週上課的助教。

實驗報告請認真寫，報告內容不得有抄襲的行為，交報告的地點由各助教決定。

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Why Measurement?

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Lord Kelvin on Measurement (1883)

“When you can measure what you are speaking about, and express it in numbers, you know something about it…”“But when you cannot measure it, when you cannot express it in numbers, your knowledge is of a meager and unsatisfactory kind…”

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Measurement & Characterization

Measurement and characterization is the basis of all scientific activity. Without measurement, quantitative description on phenomenon becomes impossible.

The validity of measurement and characterization depends on the test structure, test method, and test system.• Test system can be purchased from venders but test

structures must be designed in-house because they depend on process and product strongly.

• Improper designed test structure not only results in false data but also misleads our judgment.

• Test system outputs data no matter test structure and test method are correct or not.

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Test System

Source : CascadeStage Wafer

ProbeOM

Control Panel

Chuck Unit

Meter

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Instrument SpecificationAgilent B1500 MPSMU

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Environment of Test SystemWafer temperature control < 1 °C.Light is shield by metal box. If needed, illumination is used.Probe station is electrically shielded by grounded metal box.Low noise is required, for example, tri-axial cable is needed for connection to terminals of the meter. Adequately dry ambient can be maintained in the box by directing a gentle N2 stream at the wafer. It eliminates undesirable leakage due to humidity.

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Test StructuresTest structures can be as simple as a sheet resistance structure or a large probe-able diode or transistor.The test structures are designed to provide a rapid analysis of a specific portion of the wafer fabrication process.Various test structures are designed to monitor the validity of each process step. Test structures with different layout rules are designed to reveal the process window and to check the validity of design rules.

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Test Sites

Test site/chip is a collection of devices that is manufactured along with product circuits on wafers.

The test site is composed of numerous device-like test structures that are measured by a variety of means to obtain information that is difficult, if not impossible, to obtain from product circuits.

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Automatic Testing

To shorten testing time, all test structures in the mass-production fab must be designed for automatic testing.• multi-function tester• automatic probe station• probe card

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Wafer Test

(from M. Quirk & J. Serda, Semiconductor Manufacturing Technology)

Leakages, VBR, VT, Leff, etc.

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Wafer TestIn-line parametric test (WAT: Wafer Acceptance Test):Performed right after the completion of the first metal layer patterning to gain early information of the process. (Usually 3~5 sites per wafer)

Wafer probe: Performed after the completion of the wafer fabrication to determine which chips on the wafer meet specifications and are acceptable for assembly & packaging. (100%)

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On-wafer Test Chip- 本晶片由國家奈米元件實驗室(NDL)製作

MOS capacitor

MOST MOST

MOST

MOST

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On-wafer Test Chip- MOS Capacitor

A B

C D E

F

G

A,B:

Width (um):

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On-wafer Test Chip- MOST

A B

C D E

F

G

D,E,F,G:

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GPIB Operation

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History of GPIB

HPIB – Hewlett Packard Interface Bus (1965)• HP began to standardize the interface of instrument.

IEEE-488 – IEEE Standard 488 (1975/1978)• IEEE standard digital interface for programmable

instrument.

GPIB – General Purpose Interface Bus (1987)• Tektronics, T. I., etc. use the term of GPIB.

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Electrical Aspect24 pinsTTL negative logic• Low level ≤ 0.2V, High level ≥ 0.8V

Transfer rate : 250K – 1M bytes/secMax. separation : 4mMax. average separation : 2mMax total cable length : 20 mMax devices : 15

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Pin Assignment3 handshake lines• DAV : DAta Valid• NRFD : Not Ready For Data• NDAC : Not Data ACcepted

5 interface management lines (ground lines)• IFC : InterFace Clear• ATN : ATteNtion• SRQ : Service ReQuest• REN : Remote ENable• EOI : End Or Identify

8 data lines1 signal ground & 1 shield lines

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Role of Members in a SystemController• Capability

– Address devices to talk and listen– Service instrument request– Manages the bus– Only one active controller at a time– In multiple controller system – only one system controller

• Example– Computer with GPIB interface card

Talkers• Capability

– Can be addressed to send data and messages– Each device has a unique talk address– Normal addressing : 31 addresses– Extended addressing : 961 addresses– Only one talker at a time can be addressed

• Example– Voltage meter, current meter, signal counter, etc.

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Role of Members in a SystemListeners• Capability

– Can be addressed to receive data and messages

– Each device has a unique listen address

– Normal addressing : 31 addresses

– Extended addressing : 961 addresses

– Multiple listeners can be addressed simultaneously (up to 14 without extenders)

• Example– Printer, power supply, signal generator

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Interface ManagementIFC• Places all devices into quiescent state• Asserted by system controller

ATN• Notifies devices of current data type• Asserted by controller-in-charge

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Interface ManagementREN (Remote Enable)• Enables devices for remote programming

• Asserted by system controller

SRQ (Service Request)• Signals to alert controller that service is needed

• Asserted by non-controller

EOI (End or Identify)• Signals end of data

• Signals the execution of a parallel poll

• Asserted by current talker

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Data TransferATN is asserted by controller signifying that command messages are to be sent over the GPIB.

The un-listen command message is sent to un-address all previous listeners.Addressing commands are sent to assign new talker and listener(s).

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Data TransferATN is un-asserted and data message are transferred.

ATN is re-asserted and devices are un-addressed.

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Handshake

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Handshake

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Handshake Timing

Primary GoalEvaluation計測實驗室上課規定 Why Measurement?Lord Kelvin on Measurement (1883)Instrument SpecificationEnvironment of Test SystemTest SitesAutomatic TestingWafer TestWafer TestHistory of GPIBElectrical AspectPin AssignmentRole of Members in a SystemRole of Members in a SystemInterface ManagementInterface ManagementData TransferData TransferHandshakeHandshakeHandshake Timing