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8/12/2019 Fatigue Mechanisms
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Single primary slip system
S
S
II Fatigue Mechanisms
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Current Theory of Fatigue
3. Intrusions,
extrusions
2. Persistent
slip bands
4. Stage I
(shear) fatigue
crack
5. Stage II
fatigue crack
1. Cyclic
slip
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Outline
n 1. Cyclic slip
n 2. Persistent slip bands (PSB)
n 3. Intrusions and extrusions
n 4. Stage I crack growth
n 5. Stage II crack growth
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Process of fatigue
3. Intrusions,
extrusions
2. Persistent
slip bands
4. Stage I
(shear) fatigue
crack
5. Stage II
fatigue crack
1. Cyclic
slip
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1. Cyclic slip
First cycle
Many cycles
later - cyclic
hardening
Cyclic slip occurs within agrain and therefore operates on
an atomic scale and are thus is
controlled by features seen at
that scale.
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1. Cyclic slip
d =G b2 b3( )
2
Material Stacking Fault Energy ergs cm-2
Aluminum 250
Iron 200
Nickel 200
Copper 90
Gold 75
Silv er 25
Stainl ess Steel
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1. Cyclic slip
Planar
slip in
Cu-Al
Wavy
slip insteel
Cu-Al alloys, Cu-Zn, Aust. SS
Ni, Cu, Al Fe
n Stacking-fault energy effects
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1. Cyclic slip
Wavy slip materials Planar slip materials
n Planar and wavy slip materials
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1. Cyclic slip
= 10-3
=10-5
Dislocation cell structures
in copper
n Development of cell structures
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Example
5m
60 cycles
1,000 cycles
5,000 cycles
20,000 cycles
80,000 cycles
(failure)
OM surface OM etch pit
TEM
Stress range = 25 ksi.
n Fatigue of an Fe single crystal
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Outline
n 1. Cyclic slip
n 2. Persistent slip bands
(PSB)
n 3. Intrusions and extrusions
n 4. Stage I crack growthn 5. Stage II crack growth
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2. Persistent slip bands (PSB)
Development of cell structures (hardening)
Increase in stress amplitude (under strain control)
Break down of cell structure to form PSBs
Localization of slip in PSBs
PSB
Cyclic hardening Cyclic softening
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Outline
n 1. Cyclic slip
n 2. Persistent slip bands (PSB)
n 3. Intrusions and extrusions
n 4. Stage I crack growth
n 5. Stage II crack growth
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3. Intrusions and extrusions
Intrusions and
extrusions on the
surface of a Ni
specimen
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3. Intrusions and extrusions
Cyclically hardened material
Extrusion
Cyclically hardened material
Intrusion
Cyclically hardened material
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3. Intrusions and extrusions
Fatigue crack initiation at an inclusion
Cyclic slip steps (PSB)
Fatigue crack initiation at a PSB
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Outline
n 1. Cyclic slip
n 2. Persistent slip bands (PSB)
n 3. Intrusions and extrusions
n 4. Stage I crack growth
n 5. Stage II crack growth
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4. Stage I crack growth
Single primary slip system
individual grain
near - tip plastic zone
S
S
Stage I fatigue cracks are the sizeof the grains and are thus
controlled by features seen at that
scale: grain boundaries, mean
stresses, environment.
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4. Stage I crack growth
rc = 1 KI
2y'
2
Cyclic plastic zone is the region ahead of a growing fatigue crack
in which slip takes place. Its size relative to the microstructure
determines the behavior of the fatigue crack, i.e.. Stage I and
Stage II behavior.
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4. Stage I crack growth
n Short Cracks, Long Cracks
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Cracks growing from notches
dont know that that stress
field they are experiencing isconfined to the notch root.
4. Stage I crack growth
n
Crack Growthat a Notch
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4. Stage I crack growth
Here the ?K is the remote stress intensity factor based on remote stresses.
n Growth of Small Cracks
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Outline
n 1. Cyclic slip
n 2. Persistent slip bands (PSB)
n 3. Intrusions and extrusions
n 4. Stage I crack growth
n 5. Stage II crack growth
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5. Stage II crack growth
Plexiglas
Stage II fatigue cracks much largerthan the grain size and are thus
sensitive only to large scale
microstructural features - texture,
global residual stresses, etc.
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Example
n Stage II fatigue crack in a weldment
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5. Stage II crack growth
Scanning electron
microscope image -
striations clearly visible
Schematic drawing of
a fatigue fracture
surface
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5. Stage II crack growth
Plastic wake New plastic deformation
S
S
RemoteStress,
S
Time, t
Smax
S , Sop cl
S
S
R
emoteStress,S
Time, t
Smax
S , Sop cl
a.
b.
S = 0
S = Sop
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5. Stage II crack growth
Plastic wake New plastic deformation
S
SR
emoteStress,S
Time, t
Smax
S , Sop cl
S
S
R
emoteStress,
S
Time, t
Smax
S , Sop cl
c.
d.
S = Smax
S = 0
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Elastic stresses near a crack tipS
c
x
y
xy
x
y
R
x =S c
2Rcos
2
1 sin2
sin32
=
KI2R
f1 ( )
y = S c2Rcos 2 1+ sin 2 sin 32 = KI
2Rf2 ( )
xy =S c
2Rcos
2
sin2
cos2
sin32
=
KI2R
f3 ( )
The magnitude stress field near a crack tip depends upon the stress intensity factor (KI).
Wouldnt it be nice if this quantity correlates with the speed with which fatigue cracks
grow? Lets see if it works! Rather, lets see if we can MAKE it work!
KYS aRange of stress intensity factor
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Geometry correction factor (Y)
2c
2c2c
c
S S
S S
S
SS
S
Y=1
Y=1.12
Y=2/p
W
Y = secc
W
Infinite width
center cracked
panel
Finite width
center cracked
panel
Edge
cracked
panel
Disc
shaped
crack in an
infinitebody
B
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Crack growth
rate (da/dN) is
related to the
crack tip stress
field and is thusstrongly
correlated with
the range of
stress intensity
factor:
(? K=Y? Svpa).
da
dN= C K( )n
Paris power law
5. Stage II crack growth
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5. Stage II crack growth
n Crack
ClosureMechanisms
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5. Stage II crack growth
da
dn= C K( )m Kmax( )
p Extrinsic
Intrinsic
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Example
Orientation of microstructural texture
Grain size
Strength
Environment n Aluminum - crack
growth
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5. Stage II crack growth
A. Dissolution of crack tip.
B. Dissolution plus H+
acceleration.
C. H+ acceleration
D. Corrosion products mayretard crack growth at low
?K.
A B
C Dn Effects of
Environment
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The fatigue crack growth rates for Al and Ti are much more rapid than steel for a
given ?K. However, when normalized by Youngs Modulus all metals exhibit
about the same behavior.
Example
n Crack Growth Rates of Metals
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Summary
n Fatigue is a complex process involving
many steps but it may be broken down
into the initiation and growth of fatigue
cracks.
n The growth of fatigue cracks is often
considered to be the most important
feature of fatigue from an engineeringperspective.