Fatigue Mechanisms

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    Single primary slip system

    S

    S

    II Fatigue Mechanisms

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    Current Theory of Fatigue

    3. Intrusions,

    extrusions

    2. Persistent

    slip bands

    4. Stage I

    (shear) fatigue

    crack

    5. Stage II

    fatigue crack

    1. Cyclic

    slip

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    Outline

    n 1. Cyclic slip

    n 2. Persistent slip bands (PSB)

    n 3. Intrusions and extrusions

    n 4. Stage I crack growth

    n 5. Stage II crack growth

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    Process of fatigue

    3. Intrusions,

    extrusions

    2. Persistent

    slip bands

    4. Stage I

    (shear) fatigue

    crack

    5. Stage II

    fatigue crack

    1. Cyclic

    slip

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    1. Cyclic slip

    First cycle

    Many cycles

    later - cyclic

    hardening

    Cyclic slip occurs within agrain and therefore operates on

    an atomic scale and are thus is

    controlled by features seen at

    that scale.

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    1. Cyclic slip

    d =G b2 b3( )

    2

    Material Stacking Fault Energy ergs cm-2

    Aluminum 250

    Iron 200

    Nickel 200

    Copper 90

    Gold 75

    Silv er 25

    Stainl ess Steel

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    1. Cyclic slip

    Planar

    slip in

    Cu-Al

    Wavy

    slip insteel

    Cu-Al alloys, Cu-Zn, Aust. SS

    Ni, Cu, Al Fe

    n Stacking-fault energy effects

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    1. Cyclic slip

    Wavy slip materials Planar slip materials

    n Planar and wavy slip materials

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    1. Cyclic slip

    = 10-3

    =10-5

    Dislocation cell structures

    in copper

    n Development of cell structures

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    Example

    5m

    60 cycles

    1,000 cycles

    5,000 cycles

    20,000 cycles

    80,000 cycles

    (failure)

    OM surface OM etch pit

    TEM

    Stress range = 25 ksi.

    n Fatigue of an Fe single crystal

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    Outline

    n 1. Cyclic slip

    n 2. Persistent slip bands

    (PSB)

    n 3. Intrusions and extrusions

    n 4. Stage I crack growthn 5. Stage II crack growth

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    2. Persistent slip bands (PSB)

    Development of cell structures (hardening)

    Increase in stress amplitude (under strain control)

    Break down of cell structure to form PSBs

    Localization of slip in PSBs

    PSB

    Cyclic hardening Cyclic softening

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    Outline

    n 1. Cyclic slip

    n 2. Persistent slip bands (PSB)

    n 3. Intrusions and extrusions

    n 4. Stage I crack growth

    n 5. Stage II crack growth

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    3. Intrusions and extrusions

    Intrusions and

    extrusions on the

    surface of a Ni

    specimen

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    3. Intrusions and extrusions

    Cyclically hardened material

    Extrusion

    Cyclically hardened material

    Intrusion

    Cyclically hardened material

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    3. Intrusions and extrusions

    Fatigue crack initiation at an inclusion

    Cyclic slip steps (PSB)

    Fatigue crack initiation at a PSB

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    Outline

    n 1. Cyclic slip

    n 2. Persistent slip bands (PSB)

    n 3. Intrusions and extrusions

    n 4. Stage I crack growth

    n 5. Stage II crack growth

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    4. Stage I crack growth

    Single primary slip system

    individual grain

    near - tip plastic zone

    S

    S

    Stage I fatigue cracks are the sizeof the grains and are thus

    controlled by features seen at that

    scale: grain boundaries, mean

    stresses, environment.

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    4. Stage I crack growth

    rc = 1 KI

    2y'

    2

    Cyclic plastic zone is the region ahead of a growing fatigue crack

    in which slip takes place. Its size relative to the microstructure

    determines the behavior of the fatigue crack, i.e.. Stage I and

    Stage II behavior.

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    4. Stage I crack growth

    n Short Cracks, Long Cracks

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    Cracks growing from notches

    dont know that that stress

    field they are experiencing isconfined to the notch root.

    4. Stage I crack growth

    n

    Crack Growthat a Notch

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    4. Stage I crack growth

    Here the ?K is the remote stress intensity factor based on remote stresses.

    n Growth of Small Cracks

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    Outline

    n 1. Cyclic slip

    n 2. Persistent slip bands (PSB)

    n 3. Intrusions and extrusions

    n 4. Stage I crack growth

    n 5. Stage II crack growth

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    5. Stage II crack growth

    Plexiglas

    Stage II fatigue cracks much largerthan the grain size and are thus

    sensitive only to large scale

    microstructural features - texture,

    global residual stresses, etc.

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    Example

    n Stage II fatigue crack in a weldment

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    5. Stage II crack growth

    Scanning electron

    microscope image -

    striations clearly visible

    Schematic drawing of

    a fatigue fracture

    surface

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    5. Stage II crack growth

    Plastic wake New plastic deformation

    S

    S

    RemoteStress,

    S

    Time, t

    Smax

    S , Sop cl

    S

    S

    R

    emoteStress,S

    Time, t

    Smax

    S , Sop cl

    a.

    b.

    S = 0

    S = Sop

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    5. Stage II crack growth

    Plastic wake New plastic deformation

    S

    SR

    emoteStress,S

    Time, t

    Smax

    S , Sop cl

    S

    S

    R

    emoteStress,

    S

    Time, t

    Smax

    S , Sop cl

    c.

    d.

    S = Smax

    S = 0

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    Elastic stresses near a crack tipS

    c

    x

    y

    xy

    x

    y

    R

    x =S c

    2Rcos

    2

    1 sin2

    sin32

    =

    KI2R

    f1 ( )

    y = S c2Rcos 2 1+ sin 2 sin 32 = KI

    2Rf2 ( )

    xy =S c

    2Rcos

    2

    sin2

    cos2

    sin32

    =

    KI2R

    f3 ( )

    The magnitude stress field near a crack tip depends upon the stress intensity factor (KI).

    Wouldnt it be nice if this quantity correlates with the speed with which fatigue cracks

    grow? Lets see if it works! Rather, lets see if we can MAKE it work!

    KYS aRange of stress intensity factor

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    Geometry correction factor (Y)

    2c

    2c2c

    c

    S S

    S S

    S

    SS

    S

    Y=1

    Y=1.12

    Y=2/p

    W

    Y = secc

    W

    Infinite width

    center cracked

    panel

    Finite width

    center cracked

    panel

    Edge

    cracked

    panel

    Disc

    shaped

    crack in an

    infinitebody

    B

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    Crack growth

    rate (da/dN) is

    related to the

    crack tip stress

    field and is thusstrongly

    correlated with

    the range of

    stress intensity

    factor:

    (? K=Y? Svpa).

    da

    dN= C K( )n

    Paris power law

    5. Stage II crack growth

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    5. Stage II crack growth

    n Crack

    ClosureMechanisms

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    5. Stage II crack growth

    da

    dn= C K( )m Kmax( )

    p Extrinsic

    Intrinsic

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    Example

    Orientation of microstructural texture

    Grain size

    Strength

    Environment n Aluminum - crack

    growth

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    5. Stage II crack growth

    A. Dissolution of crack tip.

    B. Dissolution plus H+

    acceleration.

    C. H+ acceleration

    D. Corrosion products mayretard crack growth at low

    ?K.

    A B

    C Dn Effects of

    Environment

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    The fatigue crack growth rates for Al and Ti are much more rapid than steel for a

    given ?K. However, when normalized by Youngs Modulus all metals exhibit

    about the same behavior.

    Example

    n Crack Growth Rates of Metals

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    Summary

    n Fatigue is a complex process involving

    many steps but it may be broken down

    into the initiation and growth of fatigue

    cracks.

    n The growth of fatigue cracks is often

    considered to be the most important

    feature of fatigue from an engineeringperspective.