ATCA®, AdvancedTCA®, xTCA®, AdvancedMC™, MicroTCA®, CompactPCI®, COM Express® are Trademarks of PICMG www.picmg.org VPX, VPX REDI, OpenVPX & VMEbus are Trademarks of VITA www.vita.com

ESW is a Global Publication of e2mos www.emb-sys-world.com January 2016

Automation - IoT - Communication - EnergyTransportation - Medical - Video - Mil/Aero

Modular Open Systems - Boards - PlatformsChips - Software - Tools - T&M

Covering all Embedded App’sEmbedded WorldSystemsTopics in this issue include:n Appliance with scalable x86 CPU performance with many off-the-shelf PCIE cards (P.2)n M&A: Intel/Altera - NXP/Freescale - GE Embedded/Veritas/Abaco - Kontron/Ennocom (P.2)n Functional verification productivity solutions for Automotive Ethernet & CAN (P. 4)n Leaders launches the "S3P" Major Collaborative Project & Alliance S3P Project for IoT (P. 7)n Farmertronics introduces the eTrac-20, a new GREEN concept small track tractor (P. 8)n High-performance embedded computing crucial enabler of bistatic Radar and Sonar (P. 8)

ADLINK to present New Boardsbased-on Latest CPUs

at Embedded World 2016Feb 23-25, Hall 1, Booth 1-540

Qseven™ & SMARC™ COMs based-on latest Intel® Pentium™ & Celeron™ CPUs

COM Express all versions

PC/104 SBC based-onVortex86DX3 System-on-Chip

Industrial ATX MotherboardMaximizing PCIe Connectivity based-on

6th Gen Intel® Core™ Processor

VPX & CompactPCI based-onCPUIntel® Xeon® D-1500

IoT Kits - GatewaysEnd-to-End Solutions

Features:

• 3U by 508 mm for 19” racks• Redundant 2200W from90-264VAC or -48VDC• Highest performance densityin 3U with 15 slots for ArtesynSharpServer™ microservercards, with a total of 30processors (two per card)• Redundant and hot-swappablecooling and power supply• Cable-less internal architecturefor microserver cards• Artesyn SharpServer Intel®Xeon® processor D microservercards• PCI Express and Ethernetnetworking infrastructures• 4 x 2.5” drive bays and 4x10GBaseT built-in• Designed for NEBS and ETSIcompliance• Multiple system configurationsare possible: Any mix ofmicroservers, Artesyn mediaprocessors and 3rd party PCIExpress cards

The Artesyn Embedded Technologies MaxCore™ platform offers a versatile and dense architecture to achieve maximum compute and media processing density. Through its use of Artesyn technology microserver cards, Artesyn media processing PCI Express cards and 3rd party PCI Express cards, it offers maximum flexibility, maximum density per rack unit (RU), and unmatched innovation in design for both datacenter and carrier grade applications.

The MaxCore platform enables you to build an economical and application focused appliance within a short time. Flexibility is achieved through its capability to perfectly balance I/O, compute and compute-associated accelerators within the same box. Economy comes through its ability to achieve a cost-effective framework for densely configurable content. It accelerates time to market by leveraging the vast market of COTS PCI Express cards available which can be used interchangeably on the MaxCore platform and other platforms.

Within the world of platform infrastructure, the MaxCore platform is unique in its ability to combine CPU-attached PCI Express cards with an extremely flexible communication network between all of the CPUs. Traditional single box server architectures either provide a single multi-core server that can be combined with a small number of PCI Express based I/O cards, or they offer multiple independent server nodes with no or minimal local I/O extension. The MaxCore platform supports both architectures while breaking down the individual limits and enabling any combination in-between.

MORE: Click Here

Mergers and Acquisitions (M&A) you need to knowfor the Embedded Market

Intel Completes Acquisition of AlteraSANTA CLARA, Calif., Dec. 28, 2015 – Intel Corporation (“Intel”) today announced that it has completed the acquisition of Altera Corporation (“Altera”), a leading provider of field-programmable gate array (FPGA) technology. The acquisition complements Intel’s leading-edge product portfolio and enables new classes of products in the high-growth data center and Internet of Things (IoT) market segments.

NXP and Freescale Announce Completion of Merger EINDHOVEN, The Netherlands and AUSTIN, Texas, Dec. 07, 2015 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ:NXPI) and Freescale Semiconductor, Ltd. (NYSE:FSL) today announced the completion of the merger pursuant to the terms of the previously announced merger agreement from March 2015. The merger has created a high performance mixed signal semiconductor industry leader, with combined revenue of over $10 billion. The merged entity will continue operations as NXP Semiconductors N.V. (NASDAQ:NXPI) and has become the market leader in automotive semiconductor solutions and in general purpose microcontroller (MCU) products.

GE Embedded sold to Veritas Capital in 2015 is now Abaco Systems As per official PR December 07, 2015

Kontron to sell a 49% stake of its Communication Business to Ennoconn for US$ 57.3 million Ennoconn is a subsidiary of Foxconn Technology Group in Taipei, Taiwan. As per official PR January 22, 2016

Contact us see page 7

Daniel DierickxCEO & co-Founder

at e2mosActing Chief Editor

Embedded Systems World - January 2016 Page 2

MaxCore™ PlatformVersatile and Dense Compute & Media Platform

The MaxCore™ platform is a flexible appliancewith scalable x86 CPU performance in combination

with many off-the-shelf PCI Express cards

SharpServer™3U with 15 slots

SharpServer™ Intel®Xeon® Processor D

Microserver card

https://www.artesyn.com/computing/assets/maxcore_ds_11feb2016_1455248708.pdfhttps://www.abaco.com/news/abaco-systems-former-ge-embedded-technology-and-systems-business-launches-prioritizeshttp://www.kontron.com/about-kontron/news-events/detail/oaktree_adhoc-kommunikation_20160122https://newsroom.intel.com/news-releases/intel-completes-acquisition-of-altera/http://investors.nxp.com/phoenix.zhtml?c=209114&p=irol-newsArticle&ID=2120581

VadaTech Announces Plan for Industry's Largest Portfolio of COTS VPX Products

Henderson, NV – 18 January, 2016 – VadaTech, a leading manufacturer of embedded boards, enabling software and application-ready platforms, today announced a major new initiative to bring its existing commercially-developed designs to the 3U VPX form factor. This gives defense customers the opportunity to take field-proven designs in another standard format with strong market adoption. With over 300 relevant products, VadaTech could very quickly have the largest portfolio of commercial off-the-shelf (COTS) VPX products in the industry.

The company's initial product offerings will focus on its strength in data acquisition and sensor processing, followed by storage and networking. In addition, VadaTech's extensive FMC product base is also applicable in the VPX form factor. The company is presenting its VPX roadmap to customers and distributors in the USA, Europe and Asia, with initial products available during the first quarter of 2016. Preliminary datasheets for the first twelve products will be available to lead customers from next month.

Paul Kuepfer, sales and marketing vice president, VadaTech, said: "While VadaTech is fully committed to providing MicroTCA product into commercial, research and defense applications, we recognize that for some customers – especially those with military and aerospace applications - VPX is a corporate mandate for deployed systems. By providing designs in both AMC and VPX, we will offer a straight-forward migration route between the standards. Design re-use across the form factors will allow us to amortize development over larger volumes than other defense-centric COTS providers."

About VadaTech VadaTech provides innovative embedded computing solutions from board-level products, chassis-level platforms, to configurable application-ready systems. With a focus on AdvancedTCA, MicroTCA and VPX solutions, the company offers unmatched product selection and expertise. A unique combination of electrical, mechanical, software, and system-level expertise, enables VadaTech to provide customized commercial or rugged computing solutions to meet the most complex customer requirements. VadaTech also offers specialized product solutions for VPX/VME, CompactPCI, and other architectures. A member of PICMG and VITA, VadaTech has headquarters, design and manufacturing facilities in Henderson, NV with design, support and sales offices in Europe and Asia Pacific.

VadaTech, Inc. 198 N. Gibson Henderson, NV 89014 www.vadatech.com

Baikal « Russian Chips » joins Global Semiconductor Alliance

Moscow, Russia, December 16, 2015 — Baikal Electronics, a Russian semiconductor company, has joined the Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry.

“Baikal Electronics has been established as Russia's first development center for high-performance, globally competitive microprocessors. We work hard to ensure that our products feature top-notch technologies and the most recent interfaces. By joining many innovative companies within the GSA, we broaden our outlook into the world of perpetually evolving and emerging technologies,” said Svetlana Legostaeva, CEO for Baikal Electronics.

Baikal Electronics develops energy-efficient microchips for computer systems and industrial applications. The world's first silicon implementation of the MIPS Warrior P-class P5600 kernel – Baikal-T – is the result of the company's commitment to innovation and high quality. Baikal's CPUs and SoCs will become the first original Russian contribution to the mass IT market, boasting highly competitive properties in terms of technology node, performance and compatibility.

“Baikal Electronics represents an ambitious startup with an exciting success story of advanced innovation,” said Sandro Grigolli, EMEA Executive Director for the GSA. “We are very proud to welcome them among our members, in the company of so many global semiconductor market leaders. Baikal allows us to expand GSA's footprint in a region always characterized by advanced engineering and intellectual prowess.”

About Baikal ElectronicsBaikal Electronics is a Russian fabless semiconductor company that develops and markets ARM-based and MIPS-based processors and SoC. The Baikal product line of multicore processors includes energy-efficient solutions for desktops and industrial computers with various levels of performance and functionality.Check the company's website for up-to-date information at www.baikalelectronics.ru

About GSAThe Global Semiconductor Alliance (GSA) mission is to support the global semiconductor industry and its partners by offering a comprehensive view of the industry. This enables members to better anticipate market opportunities and industry trends, preparing them for technology and business shifts. It addresses the challenges within the supply chain including IP, EDA/design, wafer manufacturing, test and packaging to enable industry-wide solutions. Providing a platform for meaningful global collaboration through efficient power networking for global semiconductor leaders and their partners, the Alliance identifies and articulates market opportunities, encourages and supports entrepreneurship, and provides members with comprehensive and unique market intelligence. Members include companies throughout the supply chain representing 30 countries across the globe. www.gsaglobal.org

Embedded Systems World - January 2016 Page 3

Avery, CAST, and Rianta Roll Together on Automotive Ethernet and CAN FD IP and VIP solutions

Avery Design Systems Inc., an innovator in functional verification productivity solutions, Rianta Solutions, Inc., a Verification IP provider and System-on-Chip (SoC) integration specialist, and CAST, Inc., a semiconductor intellectual property (IP) provider, today announced they are combining their strengths to develop and deliver superior solutions for the design and verification of automotive networking systems. The resulting set of verification IP (VIP) and IP cores for the CAN FD, LIN, and automotive Ethernet buses will support the latest developments in automotive industry standards and provide more complete integrated design and verification solutions for next-generation automotive sensors, microcontrollers, and Ethernet switch chips and subsystems.

Modern automotive platforms employ different in-car network domains—powertrain, chassis, Advanced Driver Assistance Systems (ADAS), human–machine interfaces (HMI), and future “connected car” systems—that all need to coexist and communicate. Designs are rapidly evolving to use a shared switched Ethernet network backbone with support for heterogeneous subnets and gateways for CAN Flexible Data (ISO 11898-2), LIN, and FlexRay (ISO 17458-1–5) based control systems. System designers need proven, reliable IP cores to integrate these complex functions in an efficient and cost-effective manner. Additionally, test and verification requirements for conformance, interoperability, performance, and security can be greatly enhanced through the use of commercial verification IP models, protocol checking, and compliance testsuite options.

About Avery Design Systemswww.avery-design.com

About Rianta Solutionswww.riantasolutions.com

About CASTww.cast-inc.com

ADLINK Extends Intel® Pentium™ & Celeron™ Processor N3000 Series Offerings to SMARC™ & Qseven™ Computer-on-Module Lines

Company offers broadest range of processors in modules based on SMARC form factor

San Jose, CA – January 20, 2016 – ADLINK Technology, Inc., a leading global provider of cloud-based services, intelligent gateways, and embedded building blocks for edge devices that enable the Internet of Things (IoT), today announced extended offerings based on the latest Intel® Pentium™ and Celeron™ Processor N3000 Series (codename Braswell) to include SMARC™ and Qseven™ computer-on-modules (COMs).

The LEC-BW is a SMARC® Short Size Module with dual or quad-core Intel® Pentium™ and Celeron™ Processor N3000 Series System-on-Chip (SoC) from 1.46 up to 1.91 GHz and up to 8 GB on board DRAM. The graphics interfaces include LVDS, HDMI and DP supporting multiple independent screens. The module also offers 2x camera interfaces. The LEC-BW's additional rich I/O options include 1x GbE, 1x SDIO/SD/MMC, 2x SATA-III 6Gbit/s, 1x USB 3.0, 2x USB 2.0 (host), 1x USB 2.0 (client) 12x GPIO, 2x SPI, and 4x I2C. The LEC-BW features standard operating system support for Windows 7/8.1/10, Linux, and Android, and also offers optional support for QNX and VxWorks.

“ADLINK has the largest portfolio of SMARC modules in the market, with a model featuring an ARM or x86 processor from the major CPU vendors,” said Dr. Harald Schmidts, ADLINK´s product manager for SMARC and Qseven product lines. “We continue to work closely with SGeT to evolve the standards for SMARC and other COM in order to take advantage of the lower power, higher compute performance that is being introduced with each new processor.” ADLINK's Q7-BW is based on the Qseven Hardware Specification v2.0 and features a dual or quad-core Intel® Pentium™ and Celeron™ Processor N3000 Series System-on-Chip (SoC) from 1.46 up to 1.91 GHz and up to 8 GB onboard memory. Graphic interfaces include single/dual channel LVDS, HDMI/DP, and 2x eDP (optional) interfaces. I/O includes 3x PCIe x1 Gen2, 1x GbE, 1x USB 3.0, 5x USB 2.0 (host), and 1x USB2.0 (client), as well as storage support for 1-2x SATA3 6Gbit/s (1x onboard SATA SSD, optional) and 1x SDIO (4 bit). The option is also available for soldered, bootable eMMC flash storage from 4GB to 64GB. The Q7-BW features standard operating system support for Windows 7/8.1/10, Linux, and Android.All of ADLINK's computer-on-modules come equipped with SEMA (Smart Embedded Management Agent), enabling remote management and control of distributed devices. ADLINK's SEMA-equipped devices connect seamlessly to our SEMA Cloud solution to enable remote monitoring, autonomous status analysis, custom data collection and initiation of appropriate actions. All collected data, including sensor measurements and management commands, are available from any place, at any time via encrypted data connection.

MORE: http://www.adlinktech.com/Computer-on-Module

Embedded Systems World - January 2016 Page 4

http://www.cast-inc.com/

SYSGO certified according to ISO 9001:2015Mainz, Germany - December 02, 2015

• ISO 9001:2015 published on 09/27/2015 in a completely revised version• SYSGO receives the new ISO 9001:2015 certificate in November 2015 • High Level Structure well suited to SYSGO• High investment security for customers

SYSGO is one of the first companies to have its processes certified according to the new revision of ISO 9001:2015. The international standard for quality management has been completely revised. The new High Level Structure is now suited for mapping the complex processes in the development of safety- and security-critical software. SYSGO has strict in-house quality requirements in product development that could not be adequately covered with the old ISO:9001. The ISO 9001:2015 certificate provides SYSGO customers visible investment security. New ISO 9001:2015 supports in-house quality standards

SYSGO develops operating systems and basic software for safety- and security-critical systems such as for aircraft, cars and trains that are certified for their safety according to industry-specific standards, including DO-178B/C, ISO 26262 and EN 50128 as well as Common Criteria (ISO 15408). The old version of ISO 9001 did not suffice and was not flexible enough to provide SYSGO with a strict in-house quality assurance that meets the industry-specific requirements for functional safety and Cyber Security. The completely revised ISO 9001:2015 now enables linking of the requirements for industry-specific functional safety standards for the development of mission-critical software with a process-oriented quality standard. SYSGO has been tested and certified by the „Deutsche Gesellschaft zur Zertifizierung von Managementsystemen (DQS GmbH)“. “ The old version of the ISO 9001 was unsuitable for our very strict in-house standards,” explains Kai Sablotny, COO at SYSGO and board member responsible for certification according to the new standard. “The High Level Structure of the ISO 9001:2015 allowed us to integrate our quality standards, including risk and change management, which are based on the industry-specific certification requirements for functional safety and cyber security standards.”

The certificate can be viewed on the DQS website: bit.ly/1kRrua2

Securable investment securityProduct-specific safety and security standards provide information about the condition and production process of a particular product. ISO 9001:2015 provides a broader overview of the processes of the entire company in its context and includes risk management. The ISO 9001:2015 certificate provides customers, suppliers and institutions involved with the company visible proof of good corporate governance and investment security in their collaboration with SYSGO.

ISO 9001:2015 with High Level StructureThe new structure of ISO 9001 ensures identical definition and structure of all management systems and a unified use of key texts and concepts, thus facilitating the linking with other standards. The current ISO 27001 for information security management, for example, also uses a High Level Structure. ISO 9001:2015 requires anchoring in management and provides for better alignment with in-house business processes as well as self-defined product and service quality. The new flexibility of ISO 9001 enables resource-efficient, process-oriented quality management that takes into account the requirements of other standards.

PikeOS HypervisorPikeOS is a hypervisor especially made for embedded systems. With real-time, virtualization and partitioning, it provides all the features needed to build today's multi-functional and high-integrated devices. Its security architecture creates a foundation for critical systems allowing official approval by the authorities and certification according to international functional safety standards. PikeOS is the only European software platform for smart devices in the Internet-of-Things.

ELinOS Industrial Grade LinuxELinOS is an embedded Linux distribution purpose-built for the use in industrial applications. The integrated development environment is tailored to the specific requirements of embedded systems and comes with board support packages for the most successful hardware of the embedded market. ELinOS aims at the timesaving and cost-efficient use of Linux in the embedded field. The product is supplemented by training classes and project-oriented support by experienced developers.

About SYSGOSince 1991, SYSGO provides operating systems and services for embedded systems. In the late 90's, SYSGO pioneered the use of Linux in the embedded market with the ELinOS distribution. For safety and security critical devices, SYSGO offers PikeOS, the world's first SIL 4 certified hypervisor for multi-core processors, which builds the foundation for smart devices in the Internet-of-Things. With their product portfolio, SYSGO is the leading non-US RTOS-supplier with customers like Samsung, Airbus, Thales, Continental and many more. Markets include Aerospace & Defense, Industrial Automation, Automotive, Railway, Medical and Network Infrastructure. SYSGO is part of the Thales Group and has facilities in Germany, France, Czech Republic, UK and North America. It maintains a global distribution network and supports its customers in formal certification according to international safety and security standards. www.sysgo.com

Embedded Systems World - January 2016 Page 5

https://www.mydqs.com/kunden/kundendatenbank.html?aoemydqs[company_no]=521129&aoemydqs[action]=singleView&cHash=8a9c23070218b349d6b9ea37d6393ce3

ADLINK Introduces New Products Based Intel® Xeon® Processor D-1500 Product Family for Reliable, Dense and Rugged IoT Solutions

CompactPCI® and VPX blades combine advanced intelligence, high performance and low power consumption to address the needs of compute-heavy, small-footprint military and transportation applications

ADLINK Technology, Inc., a leading global provider of cloud-based services, intelligent gateways, and embedded building blocks for edge devices that enable the Internet of Things (IoT), today announced two new solutions based on the Intel® Xeon® Processor D-1500 Product Family. These latest ADLINK offerings are based on 14nm technology-based, server-class Intel® processors that bring intelligence to the edge for IoT applications, and include CompactPCI and VPX processor blades targeted at military and transport applications where ruggedness and compute requirements are intense and space is at a premium.

“The Intel® Xeon® Processor D-1500 Product Family will have extended temperature processors, which Intel will make available in the first quarter of 2016. These processors support extended temperature requirements that ADLINK sees with many of our customer applications, making possible a host of new embedded solutions for extreme environments,” said Yong Luo, general manager of ADLINK's Embedded Computing Product Segment. “In addition, this latest offering brings the performance and advanced capabilities of Intel® Xeon® technology to a dense, lower-power system-on-chip with integrated PCH technology and Intel® Ethernet and a ball-grid array package to meet thermal design power targets, all in a compact package.”

“The Intel® Xeon® Processor D-1500 Product Family delivers exceptional value and unmatched performance density per watt with enhanced reliability, availability, and serviceability capabilities (RAS) thermal design power (TDP) ranging from 19W to 45W," said Samuel Cravatta, product line director, Internet of Things Group. "Customers are able to achieve hardware and software scalability with existing development tools and processes, which are perfect for supporting a complete product line that meets a range of IoT requirements—all while saving valuable time and resources."

The ADLINK cPCI-6940 Series is a 6U CompactPCI processor blade in single/dual-slot (4/8HP) width form factor and features the Intel® Xeon® processor D-1500 product family and 16GB DDR4-2133 ECC soldered memory plus 2x SODIMM supporting up to 32GB of DDR4-2133 ECC socket type memorywith a total memory of up to 48GB. The cPCI-6940 is ideal for applications requiring high performance and good value per watt, as well as a virtualization environment and a high level of flexibility through peripheral and expansion slots.

Front panel I/O for the cPCI-6940 includes 2x GbE, 1x DisplayPort and 1x VGA, 2x USB 3.0 ports and 1x DB-9 COM port. The cPCI-6940D also offers 2x 10G SPF+ supported by the Intel® Xeon® Processor D-1500 Product Family SoC and XMC expansion on selected SKUs. Rear I/O signals include two GbE for PICMG 2.16, 2x DVI-I, 1x VGA (switched from front), 4x USB 2.0 and two USB 3.0, PS/2 keyboard/mouse, 3x COM, HD Audio, and 4x SATA.

ADLINK also provides a selection of rear transition modules (RTMs) for customers to choose from based on application needs. The cPCI-6940 Series' extended temperature range, vibration resistance, and high computing power make it ideal for mission critical applications.

The ADLINK VPX3010 Series is a rugged, conduction-cooled 3U processor blade featuring the Intel® Xeon® Processor D-1500 Product Family and DDR4-2133 soldered ECC SDRAM up to 16GB. The design of the VPX3010 conforms to numerous VITA standards, including the VITA 46.0 VPX Base Standard and VITA 65 OpenVPX architecture framework for VPX.

The VPX3010 includes one 10GBASE-KX4 and up to three 1G Ethernet ports; up to PCIe x16 Gen3 interfaces supporting non-transparent bridge; and one XMC expansion slot (PCIe x8 Gen3) with rear I/O to P2. Soldered SLC NAND flash 32GB SATA 6Gb/s storage comes standard, with expansion options available using an RTM. An extended temperature range of -40°C to +85°C is also supported. For more information please visit www.adlinktech.com

Embedded Systems World - January 2016 Page 6

Events

Key Whitepaper

About us

Industrial IoTWireless Connectivity

WhitePaper

Request your copy mgt@e2mos.com

IoT World

Embedded WorldSystems

ATCA World

Telecom WorldCOTSBroadband Broadcast IoT Convergence

Editor/Publisher: e2moswww.e2mos.com

mgt@e2mos.comContact: 4 FREE e-magazinesClick on the Logo’s

Consortium of Industry Leaders launches the "S3P" Major Collaborative Project and Alliance S3P Project aims at developing a Smart, Safe and Secure Software Development and Execution Platform for IoT

PARIS, France — December 8th, 2015

Esterel Technologies (Consortium Leader, wholly owned affiliate of ANSYS),

and Technology Platform Partners: • CEA Tech, • Krono Safe• MicroEJ • Prismtech (now part of ADLINK)• Prove & Run• SYSGO• Telecom ParisTech • TrustInSoft

and Industrial Users Partners: • Airbus• Alstom• Altran Connected Solutions (World Class Center of Altran)• Axa France• Continental• Eolane• NXP Semiconductors (including Freescale Semiconductor acquired by NXP)• Sagem• Schneider Electric• Sorin• STMicroelectronics• SurTec• Thales

Together are creating the S3P Consortium to develop an IoT Software Development and Execution Platform, S3 Platform. The S3P Platform aims at enabling the rapid development and exploitation of IoT-capable devices and applications, combining unprecedented safety, security, agility and portability.

The S3P Consortium also creates with the support of the Embedded France Association, the Cap'tronic Association and the Eclipse Foundation the S3P Alliance ecosystem to foster the wider national and international deployment of its initiative with the aim at further expanding its usage by other leading consumer and industrial brands.

The development of the S3 Platform is supported by the S3P Project, a 45 M€ investment project, that is financially supported by the S3P Consortium members and by the French Government "Nouvelle France Industrielle" initiative with a 18.3 M€ government funding, under the "Programme d'Investissements d'Avenir".

" The creation of S3 Platform, Project and Alliance is a key contribution to building a smart, safe and secure software development and execution platform for the worldwide deployment of IoT", said Eric BANTEGNIE, CEO of Esterel Technologies and Vice President of ANSYS, Inc., "it also contributes directly to the objectives of building a comprehensive "Digital Trust Solution" for the development of the economy, a key objective of the French government".

embeddedworldNuremberg, Germany

Feb 23-25

&

MWGBarcelona, Spain

Feb 22-25

... they again managedto have their event

during the same week

Embedded Systems World - January 2016 Page 7

http://www.iotworld.be/http://www.telecomcots.com/http://www.emb-sys-world.com/http://www.atcaworld.com/http://www.esterel-technologies.com/news-events/press-releases/consortium-industry-leaders-launches-s3p-major-collaborative-project-alliance/

Œ

Ž

‘

’

Œ Battery - Pack GPSŽ Structural Backbone Hydrogene Tanks (2x) In-Wheel Engines‘ Fuel Cell’ PTO (Power Take-Off)

Farmertronics introduces the eTrac-20, a new concept small track tractor

Farmertronics has planned to start engineering and building the eTrac-20 very soon.

This is a complete new concept small track tractor for the fruit cultivation market.

This vehicle won’t be propelled by a diesel engine anymore but by 3 independant electrical hub motors. The first version will be equiped with a 30 kWh battery pack and the successor will be equiped with a hydrogen fuel cell for range extension.

The pictures are giving a first impression of this advanced tractor.

TECHNOLOGYPrecision farmingRenewable energyCrop managementFleet management

MORE: www.farmertronics.comFarmertronics - Reusel 8, 5751 WG Deurne, The Netherlands - Phone +31-611335661, email: info@farmertronics.com

High-performance embedded computing could be crucial enabler of bistatic RADAR & SONAR

Two surveillance technologies that have been in common use for more than half a century -- radio detection and ranging (radar) and sound navigation and ranging (sonar) may undergo substantial enhancements with the addition of remote transmitters.

These offboard transmitters could create a new generation of bistatic radar and sonar that not only could enhance the performance of these systems, but also could preserve the stealthiness of weapons platforms like jet fighter aircraft and fast attack submarines.

Radar and sonar, in their essence, represent relatively simple concepts: they both transmit energy that bounces off objects nearby and detects targets by receiving energy from the return signals. Radar bounces radio waves off targets, while sonar does the same with sound waves.

An added benefit of radar and sonar is the ability to estimate the target's distance from the transmitter, based on the time it takes for the transmitted signal to bounce back. They detect potential enemies and give reasonably accurate estimates of how far away the enemies might be.

MORE: see John Keller article (26-Jan-2016), John is editor at Military & Aerospace Electronics CLICK HEREIt includes related items with LINKS:• DARPA eyes bistatic sonar with UUV-based pingers to preserve stealth of attack submarines• Stealth-detecting bistatic radar is back in the news• Navy reaching out to industry for expertise in bistatic sonobuoys for wide-area airborne ASWThis third point in the surveillance chain complicates the sonar signal processing challenge, and adds difficulties of time lag, potential uncertainty of the relative positions of transmitter and receiver, and a host of other factors that would require sonar systems with supercomputer-like power.

Such challenges, however, may be getting a solution with today's high-performance embedded computing (HPEC) technology. Embedded versions of the Intel Xeon processor, as well as other high-performance processors, could provide that kind of supercomputer power to deployed aircraft and submarines, and perhaps even new generations of UAVs and UUVs.

Embedded Systems World - January 2016 Page 8

http://www.militaryaerospace.com/articles/2016/01/bistatic-radar-sonar.html?cmpid=EnlEmbeddedComputingFebruary82016&eid=295595503&bid=1304088

Page 1ESW_2016-Nr601_P2_MaxCore_M&A_v02.pdfPage 1

ESW_2016-Nr601_P3_Vadatech VPX--Baikal Russia GSA_v02.pdfPage 1

ESW_2016-Nr601_P4_Avery Cast Rianta Auto Ethernet CAN -- Adlink Q7 Smarc_v06.pdfPage 1

ESW_2016-Nr601_P5_SYSGO New ISO9001_v01.pdfPage 1

ESW_2016-Nr601_P6_Adlink VPX cPCI_v01.pdfPage 1

ESW_2016-Nr601_P7_S3P Consortium_v02.pdfPage 1

ESW_2016-Nr601_P8_Farmertronics - DARPA Submarine UUV _v04.pdfPage 1