EPO-TEK® Epoxies for Haptic Touch Displays

Innovative Epoxy Adhesive Solutions for Over 45 Years

Front End Assembly

EPO-TEK® 301-2, 301-2 FL and OG142-87 deliver low Water Vapor Transmission Rate (WVTR) and excellent clarity for glass to glass lamination. These products are excellent for capacitive and resistive display types.

EPO-TEK® OG116-31, OG159-2 and B9021-14 provide gasket sealing; along with OG116-31and OG142 for plug sealing when creating the liquid crystal (LCD) display.

Back End Fabrication

EPO-TEK® EJ2189 and H20E provide electrical conductivity for the Indium Tin Oxide (ITO) connections. EJ2189 allows for a low stress, RT cure; H20E offers a faster heat cure.

For piezoelectric and EAP (Electro Active Polymer) based movement, EPO-TEK® products are well established and deliver a seamless integration. EPO-TEK® 301, 353ND, and H70E-1 will laminate piezo and EAP stacks, while providing a ruggedized composite capable of handling with both high frequency and high strain vibration.

From front end assembly... to back end display manufacturing, Epoxy Technology provides specialized epoxy adhesives for the haptic display market with exceptional quality and reliability.

EPO-TEK® EJ2189EPO-TEK® H20E

EPO-TEK® OG116-31

EPO-TEK® OG133-8

EPO-TEK® T7109-17

EPO-TEK® T7109-19

EPO-TEK® OG116-31

EPO-TEK® OG159-2

EPO-TEK® B9021-14

EPO-TEK® OG116-31

EPO-TEK® OG142

Liquid CrystalGlass

ITO

Flex Circuit

EPO-TEK® 301-2

EPO-TEK® 301-2 FL

EPO-TEK® OG142-87

ITO Connections

Glass-to-Glass Lamination

Gasket Sealing

Glob Top

Plug Sealing

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The Information, Statements and Recommendations contained herein are based on information, data, reports or tests believed to be reliable. However, Epoxy Technology, Inc. makes no warranty or guarantee of accuracy or completeness in connection therewith, nor, with respect to any Epoxy Technology, Inc. products involved, any warranty or merchantability or fitness for a particular purpose or use.

Innovative Epoxy Adhesive Solutions for Over 45 Years

Please consult our Application Experts at Epoxy Technology to find the most suitable adhesives for specific technical challenges at: techserv@epotek.com.

www.epotek.com

Epoxy Technology Inc. • 14 Fortune Drive • Billerica, MA 01821phone 978-667-3805 fax 978-663-9782 techserv@epotek.com

EPO-TEK® FRONT END ASSEMBLY ADHESIVESGlass to Glass Lamination

301-2 Two component, low viscosity, optically clear epoxy with a long pot life. Excellent yellowing resistance with continuous UV light exposure.

301-2FL Two component, very low viscosity, optically clear epoxy with a long pot life. Excellent yellowing resistance with continuous UV light exposure. More flexible version of 301-2.

OG142-87 Single component, low viscosity, UV curable with excellent moisture resistance and bond strength.

Plug Sealing

OG116-31 Single component, high viscosity, UV curable epoxy with high strength and low stress. Will not damage the liquid crystal.

OG142 Single component, medium viscosity, UV curable epoxy with high Tg, high bond strength. Will not damage the liquid crystal.

Gasket Sealing

OG116-31 Single component, high viscosity, UV curable epoxy with high strength, low stress. Will not damage the liquid crystal.

OG159-2 Single component, high viscosity, UV curable epoxy with 1 mil glass beads for bond line control. Provides excellent moisture resistance, low stress. Will not damage the liquid crystal.

B9021-14 Single component, medium viscosity, b-stage epoxy paste that is able to screen print. Provides a low Tg and low stress. Will not damage the liquid crystal.

EPO-TEK® BACK END ASSEMBLY ADHESIVESITO Connections

EJ2189 Two component, high viscosity, electrically conductive epoxy paste with low or room temperature curing capability. Provides excellent bond strength and low stress.

H20E Two component, low viscosity, electrically conductive, thixotropic epoxy paste with excellent bond strength and proven reliability.

Glob Top

OG116-31 Single component, high viscosity, UV curable epoxy with high strength and low stress.

OG133-8 Single component, thixotropic, UV curable epoxy with low stress and low Tg.

T7109-17 Two component, flexible, thermally conductive epoxy with low stress and low Tg.

T7109-19 Two component, flexible, thermally conductive epoxy with low stress, low outgassing and low Tg.