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Elec
trop
latin
g of
PA
Lanx
ess
HK
Sem
i-Cry
stal
line
Prod
uct
Asi
a Pa
cific
Intr
oduc
tion
•E
lect
ropl
atin
g ca
n pr
ovid
e a
dura
ble,
hig
h qu
ality
fin
ishe
d fo
r va
riety
of a
pplic
atio
n.
•M
any
poly
mer
s ca
n be
ele
ctro
plat
ed,
but
only
few
can
pro
vide
go
od a
dhes
ion
and
appe
aran
ce r
equi
red
by h
igh
perfo
rman
ce
appl
icat
ion.
•S
peci
al p
latin
g A
BS
and
PA
gra
des
mee
ts th
e re
quire
men
t of
man
y de
man
ding
aut
omot
ive
and
appl
ianc
e ap
plic
atio
ns.
Elec
trop
latin
g Pr
oces
s
•P
rior t
o th
e el
ectro
plat
ing
proc
ess,
the
non-
cond
uctiv
e pl
astic
s su
rface
mus
t firs
t und
ergo
an
elec
trole
ss c
hem
ical
pro
cess
to
depo
site
a c
ondu
ctiv
e m
etal
laye
r.
•Th
e el
ectro
less
pro
cess
usu
ally
invo
lves
imm
ersi
ng th
e pa
rts in
se
ries
of s
peci
al fo
rmul
ated
, aqu
eous
bat
h an
d rin
ses
to c
lean
, et
ch a
nd a
ctiv
ate
the
part
surfa
ce.
•A
met
al la
yer,
such
as
copp
er is
che
mic
ally
dep
osite
d on
the
part
surfa
ce.
Afte
r thi
s tre
atm
ent,
mor
e co
nven
tiona
l met
al-p
latin
g m
etho
ds
appl
y ad
ditio
nal m
etal
to th
e no
w-c
ondu
ctiv
e la
yer,
like
nick
el.
Elec
trop
latin
g Pr
oces
s of
Pol
yam
ide
•Th
e el
ectro
plat
ing
prin
cipl
e fo
r PA
is s
imila
r to
plat
ing
AB
S.
•In
cas
e of
AB
S, t
he p
olyb
utad
ien
parti
cles
will
be
diss
olve
d or
rem
oved
by
ch
rom
ic
acid
, in
ca
se
of
PA
th
e pr
e-tre
atm
ent
rem
oves
th
e am
orph
ous
sect
ions
mai
nly
by g
lyco
l.
•Th
is r
equi
res
sem
icry
stal
line
surfa
ces
with
hig
h am
ount
of a
mor
phou
s se
ctio
ns.
•Th
e le
ss c
ryst
allin
e th
e su
rface
, the
bet
ter t
he p
latin
g re
sult.
•Fi
ller
cont
ent
(gla
ss f
iber
or
min
eral
) sh
ould
not
exc
eed
50%
(lo
wer
ad
hesi
on)
•B
lack
Pol
yam
ide
cann
ot b
e pl
ated
Met
alliz
atio
n
Act
ivat
ion
Che
mic
al
Pret
reat
men
t
Red
uctio
nR
educ
tion
Act
ivat
ion
Act
ivat
ion
Elec
trole
ss M
etal
Lay
erEl
ectro
less
Met
al L
ayer
Swel
ling
Swel
ling
Cle
anin
gC
lean
ing
Strik
e La
yer
Strik
e La
yer
elec
trole
ssel
ectro
less
galv
anic
galv
anic
Nic
kel
Nic
kel
Cop
per
Cop
per
Gol
dG
old
Cop
per
Cop
per
Nic
kel
Nic
kel
(esp
ecia
lly)
(esp
ecia
lly)
Bes
t met
alliz
atio
n re
sults
by
follo
win
g th
ese
rule
s:
Tool
ing
tem
pera
ture
s fro
m40
to 8
0 °C
N
oncr
ysta
lline
surfa
ce o
f the
pl
astic
par
t (no
mec
hnic
al
treat
men
t afte
r the
mol
ding
pr
oces
s)N
o us
e of
rele
asin
g ag
ent
Elec
trop
latin
g Pr
oces
s of
Pol
yam
ide
Chr
ome
Chr
ome
Elec
trop
latin
g Pr
oces
s of
Pol
yam
ide
•B
efor
e et
chin
g •
Afte
r etc
hing
Stan
dard
PA
Pla
ting
Sequ
ence
s -A
tote
ch
Mat
eria
l Sel
ectio
nG
lass
Fill
ed M
ater
ial
VS
. M
iner
al F
illed
Mat
eria
l•
The
min
eral
fill
er h
as n
o sp
ecia
l fun
ctio
n fo
r pl
atin
g. T
he m
echa
nica
l bo
nd b
etw
een
resi
n an
d m
etal
is p
rovi
ded
by d
isso
lvin
g/re
mov
ing
the
amor
phou
s ar
eas
at th
e P
A-s
urfa
ce o
f the
mol
ded
parts
. Thi
s cr
eate
s a
mic
ro-r
ough
sur
face
with
ver
y sm
all u
nder
cuts
, whi
ch a
llow
the
met
al to
fix
/bon
d to
the
resi
n.
•G
lass
fibe
rs p
rovi
de a
dditi
onal
mic
ro-r
ough
und
ercu
ts, a
llow
ing
the
met
al to
bon
d be
tter.
Ther
efor
e, g
lass
fibe
r rei
nfor
ced
grad
es te
nd to
sh
ow b
ette
r adh
esio
n th
an m
iner
al fi
lled
grad
es.
Impa
ct m
odifi
er•
Impa
ct m
odifi
ed g
rade
s pr
ovid
e be
tter a
dhes
ion
than
sta
ndar
d gr
ades
.•
It is
per
sum
ed th
at th
e im
pact
par
ticle
s ac
t lik
e P
olyb
utad
ien
in A
BS
.
Lanx
ess
Poly
amid
e G
rade
s fo
r Ele
ctro
plat
ing
•D
uret
han
BK
V11
5 (P
A6-
GF1
5, im
pact
mod
ified
)
•D
uret
han
BK
V13
0 (P
A6-
GF3
0, im
pact
mod
ified
)
•D
uret
han
BM
240
(PA
6-M
40)
Serv
ice
Prov
ider
for E
lect
ropl
atin
g Po
lyam
ide
•K
eim
Wer
dohl
/Ger
man
y (h
ttp://
ww
w.k
eim
-gm
bh.d
e)
•D
GM
(ht
tp://
ww
w.d
gm-g
mbh
.de/
wir.
htm
)
•S
axon
ia(h
ttp://
ww
w.s
axon
ia.d
e/U
nser
e_P
rodu
kte/
Gal
vano
te/g
alva
note
.htm
l )
•A
HC
•M
c D
erm
id H
ong
Kon
g (M
r. Je
ff B
rass
ard)
•P
AL
Hon
g K
ong
(con
stru
ctio
n of
pla
ting
lines
)
•S
hipl
ey
•S
chaa
l
•A
tote
ch
Com
posi
tion
of G
alva
nic
syst
em
Com
posi
tion
of G
alva
nic
syst
em
•C
hem
ical
Nic
kel
0.01
-0.1
µm
•N
icke
l Stri
keab
out 0
.1 µ
m
•G
loss
y C
oppe
rab
out 2
0-30
µm
•G
loss
y N
icke
lab
out 1
0-15
µm
•G
loss
y C
hrom
ium
up to
0.3
µm
A
bove
0.3
µm
Chr
omiu
m s
houl
d be
app
lied
with
mic
ro-c
rack
ed
surfa
ce
Typi
cal G
alva
nic
Syst
em in
Aut
omot
ive
Fact
ors
Affe
ctin
g El
ectr
opla
ting
Res
ult
•D
esig
n
•In
ject
ion
mol
ding
pro
cess
ing
•E
lect
ropl
atin
g pr
oces
sing
•M
ater
ial S
elec
tion
Des
ign
Con
side
ratio
ns
•E
lect
ric c
urre
nt d
ensi
ty d
istri
butio
n ov
er th
e pa
rt su
rface
de
term
ine
plat
ing
thic
knes
s.
•H
igh
curre
nt a
t edg
e, n
otch
and
out
side
cor
ner c
an le
ads
to
exce
ss p
latin
g bu
ildup
.
•R
eces
s ar
ea a
t low
er c
urre
nt d
ensi
tyie
s an
d te
nds
to p
late
th
inne
r tha
n ot
her a
reas
.
Des
ign
Con
side
ratio
n –
Plan
ting
Bui
ldup
Des
ign
Con
side
ratio
ns•
App
ly a
radi
us o
f at l
east
0.0
1 in
ch in
to p
late
d ed
ge.
•In
lcud
e a
min
imum
1/1
6 in
ch m
inim
um ra
dius
on
all o
utsi
de c
orne
rs.
•A
void
ext
rem
e re
cess
es th
at c
ould
lead
to in
adeq
uate
pla
ting
thic
knes
s.
•A
void
feat
ures
that
may
trap
air
durin
g im
mer
sion
in th
e ba
ths,
or h
inde
r rin
sing
afte
rwar
ds.
•D
esig
n cl
ampi
ng p
oint
s th
at s
ecur
e th
e pa
rt on
the
rack
with
out f
lexi
ng it
.
•Th
e w
all t
hick
ness
sho
uld
be b
etw
een
1.5
mm
and
3 m
m to
pre
vent
hig
h m
olde
d-in
stre
ss
•A
void
hol
es o
r rec
esse
s w
hich
can
car
ry li
quid
es fr
om o
ne c
hem
ical
bat
h to
th
e ot
her
•A
void
gat
ing
poin
ts in
or n
ear v
isib
le a
reas
with
cos
met
ic re
quire
men
ts
Mol
ding
Con
side
ratio
ns•
The
mol
ds m
ust b
e ab
solu
tely
cle
an. N
o de
mol
ding
age
nts,
gre
ases
or o
ils
are
allo
wed
.
•M
oldi
ng p
roce
ss a
ffect
s th
e pl
atin
g ad
hesi
on a
nd e
nd-u
se p
erfo
rman
ce
dire
ctly
.
•H
igh
mol
ded-
in-s
tress
es o
n th
e pa
rt su
rface
can
redu
ce a
dhes
ion
and
lead
s to
cra
ckin
g, b
liste
ring
and
war
ping
in th
e pl
ated
par
ts.
•P
rope
r dry
ing
prev
ent m
oist
ure-
rela
ted
surfa
ce d
efec
ts th
at c
ould
app
ears
w
orse
afte
r pla
ting.
•R
elat
ivel
y lo
w
mol
d te
mpe
ratu
res
are
reco
mm
ende
d.
If th
e m
old
tem
pera
ture
is h
igh,
ther
e w
ill b
e to
o le
ss a
mor
phou
s m
ater
ial a
t the
sur
face
w
hich
will
affe
ct th
e ad
hesi
on.
•R
ecyc
led
mat
eria
l can
not b
e us
ed.
Elec
trop
latin
g C
onsi
dera
tions
•S
wel
ling
time
shou
ld n
ot b
e to
o lo
ng,
othe
rwis
e, t
oo m
uch
mat
eria
l is
diss
olve
d an
d th
e ad
hens
ion
will
be
low
er.
PA
, afte
r 7 m
in s
wel
ling
PA
, afte
r 15
min
sw
ellin
g
Ano
ther
def
ect c
ause
d by
ove
r-sw
ellin
g pr
oces
s is
the
form
atio
n of
hol
es a
nd b
ubbl
es.
Elec
trop
latin
g C
onsi
dera
tions
Oth
er C
onsi
dera
tions
•A
ssur
ing
that
all
mol
ded
part
surfa
ces
are
free
from
oil,
gre
ase
and
cont
amin
atio
n.
•D
esig
ning
par
t and
mol
d to
faci
litat
e th
e pa
rt ej
ectio
n w
ithou
t m
old-
rele
ase
agen
ts, e
spec
ially
sili
cone
.
•U
sing
sel
f-lub
ricat
ing
ejec
tor p
in to
oil
cont
amin
atio
n.
•D
esig
ning
and
mai
ntai
ning
mol
d an
d pa
rting
line
car
eful
ly to
pr
even
t sha
rp a
nd ra
gged
edg
es th
at c
ould
exa
gger
ated
by
the
plat
ing
proc
ess.
•P
ositi
on th
e ga
te o
ut-o
f-sig
ht a
nd tr
imm
ing
gate
cle
anly
.
•A
pply
ing
a lig
ht s
atin
-fini
sh to
the
mol
d ca
vity
sur
face
to
enha
nce
plat
ing
adhe
sion
on
the
mol
ded
surfa
ces.
Segr
egat
ion
Failu
re
•P
reva
lent
afte
reffe
ct is
apo
or a
dhes
ion
ofth
e m
etal
laye
rto
the
poly
mer
surfa
ce
•R
easo
n m
ostly
“ove
r-ac
tivat
ion“
caus
ed b
y ca
rryi
ngof
fact
ivat
or s
ubst
rate
into
the
chem
ical
Ni-b
ath
Failu
re C
ause
d by
the
pollu
tion
of C
u B
ath
Cro
ss H
atch
Tes
t
Adh
esio
n Te
st
Adh
esio
n Te
st
Than
k Yo
u.
