EPD 8-11 8-page WEB Version 4-4-2012Power Electronics
Industrial Electronics
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Heat Pipes are passive two-phase devices that transfer heat
very efficiently over relatively long distances. Heat pipes can be bent and flattened into a variety of geometries making them ideal for removing heat from high power, densely packed electronics. They can isothermalize multiple devices or transfer heat from high flux components, minimizing junction temperatures and improving device reliability.
Proven Reliability Versatile Form Factor
Custom Features Ruggedized Designs
Optimizing Engineering Resources
Heat pipes designed and built correctly will reliably operate in a broad range of harsh operating environments for over 20 years. Our online resources can be used to help generate a preliminary design of a heat pipe assembly for your system.
Visit www.1-ACT.com for detailed design documentation and interactive tools: ACT Design Guide, ACT Interactive Heat Pipe Calculator and Heat Pipe Reliability Guide.
Board Chassis System
www.1-ACT.com
Large Heat Transport Capability With Minimal Size Weight & Power (SWAP)
Design Flexibility
HiK or High Conductivity plates are heat spreader plates with embedded heat pipes. They are used to passively spread or transfer heat from discrete components to larger areas for heat dissipation. HiK plates can be used to improve heat spreading in standard conduction cooled cards, in wedge locks in standard chassis, and in natural or forced convection heat sinks. In some designs, thermal performance can be enhanced by 6X.
Card Chassis
Radar Electronics
Portable Electronics
Power Electronics
1200 W/m-K
3
Copper
Manufacturing to High Standards ACT manufactures all of our products to ISO9001 and AS9100 quality standards. HiK plates are designed to meet even the most demanding thermal and mechanical specs found in military applications.
Shock/Vibration
ACT's Electronics Products Group is dedicated to providing quality thermal management solutions that meet the demanding operating environments of today's electronics. We design, analyze and manufacture thermal solutions for diverse applications from ruggedized military electronics to sensitive medical electronics to high power industrial electronics. We strive to meet or exceed our customers' expectations in every aspect.
Military Electronics
Industrial Electronics
Medical Electronics
Embedded Computers
Power Electronics
Our company has a broad range of engineering know-how, technical skills, applications experience and manufacturing infrastructure which deliver:
Markets
Our engineers work closely with our customers to create the best possible
solutions for the specific applications. We can help at any point in the
product development process.
www.1-ACT.com4
Optimal Heat Transfer
Easy System Integration
(6) Static Temperature
ACT’s thermal management products are designed to meet our customers’ specific thermal and mechanical requirements in a broad range of applications. Our electronic cooling products include but are not limited to the following:
Products
SWAP out your current thermal design
Our engineered thermal products create benefits in Size, Weight and Power (SWAP).
Heat Pipe Assemblies HiK Plates Vapor Chambers HiK Wedge Locks
Cold Plates Power Electronics Heat Sinks Conduction Cooled Frames Custom Thermal Assemblies
Size
Weight
Power
Better heat transfer reduces surface area for heat dissipation. This leads to less overall volume required for heat transfer.
More efficient thermal paths lead to trimming of unnecessary materials and reduction of the overall weight of the system.
Advanced Cooling Technologies, Inc. 5
Heat pipes are totally passive heat transfer devices, which not only increases the system reliability but also reduces the system power requirements.
Advanced Cooling Technologies Capabilities
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Vapor Chambers minimize the overall system thermal resistance by using highly efficient two-phase heat transfer to spread heat from small high power components to a larger area heat sink. This enhanced heat spreading allows for smaller heat sinks and reduced junction temperatures.
Vapor Chamber - High Performance Heat Spreaders
2 Can Accept Heat Flux up to 700 W/cm
Thermal Resistance < 0.08 °C/W
Scalable
Temperature Uniformity
Application Benefits
Fan / Pump Selection
Micro / Mini Channels Heat Sinks
Power Electronics cooling has become more challenging as the push for higher power and smaller packaging continues. ACT's thermal solutions maximize cooling performance while minimizing the system volume and weight. Examples of our power electronics cooling products include both heat pipe based heat sinks and liquid cooled cold plates.
IGBTs
Thyristors
IPMs
Effective Heat Transfer at the Component and Board Level
System Level Solutions
ACT routinely designs, develops and manufactures system level cooling solutions, moving heat from the electronics chassis to the ultimate sink. We have extensive experience with a variety of potential solutions including: Optimized Fin Geometries, Thermo-Electric Coolers, Heat Pipe Assemblies, and Liquid Cooled Cold Plates.
Design: ACT's design engineers perform
engineering analysis to optimize the thermal path
from heat source to sink, and design proper
thermal solutions to address your primary
challenges.
solutions working within existing geometries and accommodating a variety of features
from cabling, connectors, I/O's to mechanical features and mounting holes.
Plating/Finishes: ACT offers a variety of plating finishes addressing harsh installation
environments and meeting system specifications.
Reliability: Enhanced heat transfer with proven, reliable thermal technology increases reliability and extends service life.
Low Profile
The Industry’s Thinnest Embedded Heat Pipe Assemblies
Analyzing all thermal resistances in the thermal path and determining which have the largest impact on the overall power dissipation are key to understanding and improving thermal solutions. Whether it is removing heat from a few key high power components, minimizing the interface between an Line Replaceable Unit and the chassis, or improving the efficiency of an air or liquid cooled heat sink, ACT can assist in addressing and solving thermal challenges at all levels in the system.
Conduction and Air-Cooled Frame Enhancements- ACT Works to VITA/VME Standards
Component Level Cooling - Optimizing the Thermal Path From the Device to the Board to the Chassis
Detailed Device Level Modeling
ISO 9001 & AS9100 Certified ITAR Registered
THERMAL MANAGEMENT EXPERTS Advanced Cooling Technologies, Inc. is an internationally respected designer and supplier of heat pipes, loop heat pipes, cold plates and other thermal management products. Our products provide reliable thermal management for military/Industrial electronics, HVAC energy recovery, biomedical, aerospace and other sophisticated devices on the ground, in the water, in air and in space. In addition to our expertise in heat pipes, we are also experts in other thermal technologies including pumped liquid and two-phase cooling, thermal storage, catalytic reaction and nanotechnology. This combination of in-depth expertise in heat pipe design and manufacturing and active participation in emerging thermal technologies enables us to provide our customers with the best performing, most effective thermal solutions.cost
Advanced Cooling Technologies, Inc., 1046 New Holland Avenue, Lancaster, Pennsylvania 17601
Ph:717-295-6061, Fax:717-295-6064, www.1-ACT.com