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ELECTRICAL RESISTANCE OF SIC/SIC CERAMIC MATRIX COMPOSITES FOR DAMAGE DETECTION AND
LIFE-PREDICTION
Craig Smith, Zhenhai Xia Department of Mechanical Engineering, University of Akron, Akron, OH 44325
Gregory N. Morscher Ohio Aerospace Institute, Cleveland, OH44135
Ceramic matrix composites (CMC) are suitable for high temperature structural applications such as turbine airfoils and hypersonic thermal protection systems due to their low density high thermal conductivity. The employment of these materials in such applications is limited by the ability to accurately monitor and predict damage evolution. Current nondestructive methods such as ultrasound, x-ray, and thermal imaging are limited in their ability to quantify small scale, transverse, in-plane, matrix cracks developed over long-time creep and fatigue conditions. CMC is a multifunctional material in which the damage is coupled with the material’s electrical resistance, providing the possibility of real-time information about the damage state through monitoring of resistance. Here, resistance measurement of SiC/SiC composites under mechanical load at both room temperature monotonic and high temperature creep conditions, coupled with a modal acoustic emission technique, can relate the effects of temperature, strain, matrix cracks, fiber breaks, and oxidation to the change in electrical resistance. A multiscale model can in turn be developed for life prediction of in-service composites, based on electrical resistance methods. Results of tensile mechanical testing of SiC/SiC composites at room and high temperatures will be discussed. Data relating electrical resistivity to composite constituent content, fiber architecture, temperature, matrix crack formation, and oxidation will be explained, along with progress in modeling such properties.
https://ntrs.nasa.gov/search.jsp?R=20130013151 2018-05-13T18:53:13+00:00Z
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 1
Electrical Resistance of SiC/SiC Ceramic Matrix Composites for Damage Detection and Life-
Prediction
Craig Smith*, The University of AkronGregory Morscher, Ohio Aerospace Institute, Cleveland, OH
Zhenhai Xia, The University of Akron
*Funded under a GSRP scholarship from the Hypersonics Program at NASA Glenn Research Center
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 2
Why Electrical Resistance?
• Current nondestructive methods such as ultrasound, x-ray, and thermal imaging are limited in their ability to quantify small scale, transverse, in-plane, matrix cracks developed over long-time creep and fatigue conditions
• Electrical resistance of SiC/SiC composites is one technique that shows special promise towards this end– Both the matrix and the fibers are semi-conductive – Changes in matrix or fiber properties should relate to changes in electrical
conductivity along the length of a specimen or part, i.e., perpendicular to the direction of damage
– Resistance has been shown to be effective at monitoring damage in composites such as C/SiC and CFRP
σ σ
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 3
Objective
• To determine if and to what extent electrical resistance can be used as a self-sensing non-destructive evaluation technique for SiC-based fiber-reinforced composites– Composite characterization– Damage accumulation
• Analysis technique• Monitoring as an inspection or possibly on-board device
– Electro/Mechanical Modeling Performance and Life-modeling
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 4
Some studies in the literature(mostly w/C fibers in epoxy, glass, or CVI SiC)
• Many papers last 20 years on C fiber reinforced polymer, concrete and carbon matrix composites– Strain and damage monitoring
• Frankhanel et al., J. Euro. Ceram. (2001) – SiC-Fibre reinforced glasses – electrical properties and their application
• H. Mei and L Cheng., Mater. Let. (2005) & Carbon (2006) –Damage analysis of 2D C/SiC composites subjected to thermal cycling in oxidizing environments by mechanical and electrical characterization
• Recent measurement of conductivity of SiC/SiC for nuclear applications [e.g., Gelles & Youngblood (PNL); Shinavski, Katoh, and Snead, (Hyper-Therm & ORNL)]
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 5
What affects electrical resistivity?ρ = Resistance • (Area/Length)
• The content and structure of composite– Constituents (fiber, interphase and matrix) and their relative resistivities– Nature and amount of porosity– Fiber architecture
• Temperature• Stress• The damage state
– Already present (e.g., C/SiC) or as a result of stressed-oxidation (SiC/SiC)?
– Transverse and/or interlaminar cracking?• The oxidation and/or recession state• Lead attachment – on the face, on an edge, an extension from within
the structure?
Fibers broken in some cracks
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 6
Room Temperature Damage Characterization
• 150mm specimens with contoured gage section• Resistance measured by four- point probe method
using an Agilent 34420 micro-Ohm meter• Conductive silver paste was used to improve
contact between specimen and voltmeter
dV
Constant current
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 7
Room Temperature Damage Characterization
• Load, unload, and reload in tension on an Instron Universal Testing Machine (4kN/min)
• Capacitance strain gage used with 1% range over 25mm (metal knife-edge contact extensometers were tried, but abandoned because of electrical interference)
• Resistance measurement made every second
• Acoustic emission monitored by 50kHz to 2MHz sensors just outside the gage section
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 8
Room Temperature Damage Characterization
Syl-iBN/CVI Matrix Woven Composite (f = 0.3)As damage progresses, the resistivity of the composite increases
– 60% increase in resistivity at failure – an order of magnitude higher than C fiber reinforced systems– In situ damage detection is possible
• Upon unloading, resistivity does not return to original– Inspection of damage is possible after unloading
0
20
40
60
80
100
120
0 100 200 300
Stress, MPa%
AE
or
% R
esis
tivi
ty
Zero StressResistance
Peak StressResistance
AE Energy
0
50
100
150
200
250
300
350
0 200 400 600 800 1000
Time, sec
Str
ess,
MP
a
0
10
20
30
40
50
60
70
80
90
100
% R
esis
tan
ce C
han
ge
% A
E E
ner
gy
Stress% Resistance Change% AE Energy
Smith, Xia, Morscher, Scripta Mater. 2008
As σ ↑, R ↑ due to:•Matrix cracking (follows AE)•Piezoresistivity of fibers•Fiber breaks
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 9
Elevated Temperature Set-up
• Copper wire leads brazed (CuSil-ABA) on face and ends of specimen
• Resistance measured by four- point probe method
• Stress-rupture at 1315oC in air
Hot Zone
Furnace Region
Epoxy Grip Tab
Epoxy Grip Tab
dV
Constant CurrentApplied
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 10
Elevated Temperature Set-Up
σ
σ
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 11
Elevated Temperature Damage Characterization
• Determine effects of temperature and time on resistivity:
0
0.005
0.01
0.015
0.02
0.025
0.03
0.035
0.04
0.045
0 0.5 1 1.5 2 2.5 3 3.5 4
Time, hr
Res
istiv
ity, Ω
-m
0
200
400
600
800
1000
1200
1400
Tem
p, C
4 Wire ResistivityTemp
Two hour hold at 1315oC:NO CHANGE IN RESISTIVITY
Temperature Ramp Up
Temperature Hold
Temperature Ramp Down
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 12
0
0.05
0.1
0.15
0.2
0.25
0 0.5 1 1.5 2 2.5Time, hr
% S
train
0
10
20
30
40
50
60
% R
esis
tivity
Cha
nge
Strain
Resistivity
0.0030.00320.00340.00360.0038
0.0040.00420.00440.00460.0048
0.005
0 50 100 150 200 250
Stress, MPa
Res
istivi
ty, Ω
-m
Elevated Temperature Procedure
EXPERIMENT:• Raise furnace temperature to
1315oC– Resistivity decreases with
temperature (SiC)• Raise stress to desired level
– Resistivity increases with stress
• Hold stress until failure– Resistivity increases with
time at stress
0
0.005
0.01
0.015
0.02
0.025
0.03
0 500 1000 1500Temp, °C
Resi
stiv
ity, Ω
-m
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 13
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0 2 4 6 8
Time, hr
% S
trai
n
0102030405060708090
% R
esis
tivity
Cha
nge
Strain4 Wire Resistivity
Elevated Temperature Damage Characterization
Syl-CVI SiC (Vendor 1); 1315C; 86 MPa
Syl-iBN-CVI SiC (Vendor 2); 1315C; 172 MPa
0
10
20
30
40
50
60
70
80
0 0.02 0.04 0.06 0.08 0.1
% Strain
% R
esis
tivity
Cha
nge
05
101520253035404550
0 0.1 0.2 0.3 0.4 0.5
% Strain
% R
esis
tivity
Cha
nge
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0 50 100 150 200
Time, hr
% S
trai
n
05101520253035404550
% R
esis
tivity
Cha
nge
Strain4 Wire Resistivity
(0.041Ω-m) (0.0188Ω-m)
What is occurring?•Matrix cracking & growth•Creep of matrix
•Load transfer to fibers
•Oxidation in matrix cracks•Fiber breaks
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 14
Elevated Temperature Damage Characterization(Extension to Time-Temperature-Stress Conditions)
• In principle, as unbridged cracks form and oxidizing species fill matrix cracks and/or pores and/or oxidation reactions cause recession of composite, resistance changes should occur. If they can be quantified, then this technique offers a way of health monitoring.
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 15
Coupled Electrical/Mechanical Model at Tow Level
(d) (e)
δR
V
σ
σ
(a)
(c)(b)
Electrical Model: Local resistances
Resistance vs. stress/strain/damage
Mechanical Model: Damage, local stresses
Stress vs. strain, failure
Z.H.Xia, et. al. Comp. Mater. Sic . Tech.. 2003
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 16
Random Fiber-Fiber contacts in composites
• Electric characteristic length: The average distance between electrical contacts
is measureable:
fL
Tce V
d4π
ρρβδ =
d---- diameter of fiberVf ----volume fraction of fiber
ρ------- Resistivity β------geometric contact factor
An analogy to mechanical characteristic length slip length δc : /c c yrδ σ τ=
fc = fiber contact densityNc = the number of fiber contactsN = the number of fibersL= length of composites
ceδ
ccce N
LNf 21
==δ
ceδ
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 17
3D Electrical/Mechanical Models
Force equilibrium :i
δ
j
δ
i
Vn,j
Vi,j-1
Ri,j
Vi,j+1
I8
I7
I6
I5
I4
I3I2
I1
I1+ I2 + I3+ I4 + I5+ I6 + I7 + I8 =0
Current equilibrium :
ith node
u n,j
u i,j-1
E
u i,j+1
F8
F7
F6
F5
F4
F3
F2
F1
F1+ F2 + F3+ F4 + F5+ F6 + F7 + F8 =0
From neighbors (contact current) From neighbors (shear forces)
I=(vi+1-vi)/RiAxial Force: F=AE(ui+1-2ui+ui-1)/δ
Shear force F=hG(ui-uin)/d
Electrical Model Mechanical model
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 18
σ
σ
R
Coupled Model at Laminate Scale
Matrixcrack
Electrical Model Mechanical model
Unit Cell model: • Single fiber bundle surrounded by matrix• Through-thickness matrix cracks bridged by fiber bundles • Matrix containing 90o fiber are conductive
Conductive matrix
Fiber tow
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 19
Mechanical Behavior of SiC/SiC Composites
0
50
100
150
200
250
300
350
0
50
100
150
200
250
300
350
0 0.1 0.2 0.3 0.4 0.5
Cum
mul
ativ
e A
E e
nerg
y (%
)
Stre
ss, M
Pa
Strain, %
Stresscum enPredicted stressPredicted Matrix crack density
Mat
rix c
rack
den
sity
Fitting stress-strain curve by adjusting matrix Weibull strength σ0 and interfacial shear strength τ
• τ=25 MPa, with the typical experimental range.•Predicted matrix crack density curve well matches cumulative AE energy.
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 20
Electrical Resistance of SiC/SiC Composites
0
10
20
30
40
50
60
70
0 0.1 0.2 0.3 0.4 0.5
Res
ista
nce
chan
ge (%
)
Strain, %
δce=300 µmLarger ρm
δce=100 µmSmaller ρm
δce=1000 µmLarger ρm
Experimental
By varying electrical parameters, the model should fit experimental data, but there is an unknown problem
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 21
Summary and Conclusions
• Electrical resistance in SiC-based CMCs is very sensitive to constituent content, fiber-architecture, and stress/strain history
• Electrical resistance offers a useful way to characterize SiC-based CMCs, both as-produced and after mechanical damage
• This technique offers potential as – a method of quality control for processing these composites– a method to monitor the health of SiC-based CMC
components in-situ or as an inspection technique• which can then be related to life-prediction models based on stress,
time, and damage accumulation and their relationship to electrical response
January 22, 2009 33rd International Conference on Advanced Ceramics and Composites 22
Future Work
• Compare different composites – varying composite constituents and fiber architecture
• Quantify elevated temperature microstructural change with resistivity change
• Determine lead attachment schemes for different applications and conditions
• Extend electro/mechanical model to:– Include high temperature properties– Include 90° tows