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ELECTRONICS PRODUCT GUIDE
• FLIP CHIP UNDERFILLS
• CSP/BGA UNDERFILLS
• DAM & FILL ENCAPSULATION
• DIE ATTACH
• ENCAPSULANTS
• UV/VIS LIGHT CURE
• THERMAL GREASE
• THERMAL GAP FILLER
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FLIP CHIP UNDERFILL Flip Chip Underfill epoxies are insulating
materials used in mounting technologies involving
direct electrical connections. These materials flow by capillary
action into the gap between
the IC chip circuit with conductive bumps and the board.
Product Description Viscosity
(cPs)
Tg
(°C)
CTE
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DIE ATTACH (CONDUCTIVE) Conductive Die Attach adhesives are heat
cured, one part, silver filled epoxy or epoxy-hybrid
systems designed for high strength and high electrical
conductivity.
Product Description Viscosity (cPs)
Cure Schedule
Volume Resistivity (Ω·cm)
Storage Temp (°C)
EO-98HT High strength at high
temperatures
40,000 150°C/30min 3 x 10-4 25°C
EO-84M-1T Designed for screen
printing using 325 mesh.
40,000 150°C/60min 3 x 10-4 -40°C
EO-97M Fast cure, low viscosity 10,000 150°C/10min 2 x 10-4
25°C
EO-97M-2 Die stamping, screen
printing, stencil, or probe
47,000 65°C/30min 4 x 10-4 0°C
EO-93 Low resistivity, no bleed,
void free
39,000 165°C/10min 2 x 10-4 -40°C
DIE ATTACH (NON-CONDUCTIVE) Die Attach Adhesives are insulating
adhesives that are generally dispensed in a pattern and
is used to bond the opposite side of a circuit on an IC chip.
These IC chips have conductive
bumps and are bonded to the mounting substrate.
COB: DAM & FILL ENCAPSULATION Dam and Fill is a two-step
process for fully encapsulating high I/O count, wire bonded die.
Its
first step consists of dispensing a dam around device perimeter.
During the second step, fill
material is dispensed in dam center.
Product Description Viscosity
(cPs)
Tg
(°C)
CTE
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COB: ENCAPSULANTS Encapsulants are used to provide environmental
protection and add mechanical strength to
wire bonded devices. The most common types of encapsulants are
thermal cure epoxy and
UV/LED cure.
Product Description Viscosity
(CpS)
Tg
(°C)
Chemistry
Type
Storage Temp (°C)
EB-350-3LV Flowable, flame
retardant 60,000 125 Thermal Epoxy 25°C
EB-350-1LV-M2 Low viscosity, high Tg 15,000 125 Thermal Epoxy
25°C
EB-403-1LV Thermally conductive,
flowable
200,000 146 Thermal Epoxy 25°C
UV-8509R Acrylic, soft uv cure 8,000 35 UV Acrylic 25°C
UV-8701E High Tg, UV/LED epoxy
5,800 138 UV/LED epoxy 25°C
SILICONE THERMAL GREASE Silicone based thermal greases
engineered with special binding agents to reduce bleed and
oil separation. These compounds offers excellent wetting
properties, easy to spread and the
low viscosity formulation makes them easy to apply to thin bond
line.
Product Description Color Max Temp
(°C)
Density
(g/cc)
Thermal Conductivity
(W/mK)
STG-40 Low bleed, low cost White 205 2.2 0.8
STG-41 High conductivity, low bleed White 205 2.5 2.0
STG-45 Highest Conductivity Gray 205 2.2 3.7
STG-51TC Easily Spread, easy clean up Gray 205 2.2 3.2
UV/VISIBLE LIGHT CURE ADHESIVE UV/Visible light cure adhesives
offer an efficient curing method compared to traditional
polymers. Many UV and visible light cure systems will cure
within seconds and offer the
same characteristics as heat cure polymers.
Product Description Viscosity
(Cps)
Tg
(°C)
Chemistry
Type
Cure Method
UV-8509R Fast curing, soft, PET bonder
8,000 35 Acrylate UV/LED
UV-8315 Low viscosity, high hard-ness
200 65 Acrylate UV/LED
UV-6502CL Low viscosity, chemically resistance
300 135 Epoxy UV
UV-8504E Low shrinkage, low viscosity
750 140 Epoxy UV
UV-8701E High Tg, UV/LED epoxy 5800 138 Epoxy UV/LED
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HIGH TEMPERATURE THERMAL GREASES
THERMAL GAP FILLER Liquid gap filler is supplied as a
two-component, room or elevated temperature curing
system, resulting in a soft, thermally conductive, form-in-place
elastomer ideal for coupling
“hot” electronic components on PC boards with an adjacent metal
case or heat sink.
Product Description Color Viscosity
(cps)
Density
(g/cc)
Thermal Conductivity
(W/mK)
TGF-331 High conductivity, soft
elastomer, low stress
Blue 120,000 2.4 3.6
TGF-325 Soft elastomer, low stress Yellow 80,000 2.0 1.2
Product Description Color Max Temp
(°C)
Density
(g/cc)
Thermal Conductivity
(W/mK)
HTG-71 Low bleed, easily spread White 300 2.9 1.0
HTG-72 Highest max temperature White 360 3.0 0.8
HTG-72TC High max temperature &
conductivity
Gray 360 3.0 3.2
HTG-73 Easily spread, lowest cost White 250 2.3 1.2
High temperature stable thermal greases engineered with special
fluid technology to
eliminate compound "dry out" problems. This series of thermal
compounds has shown
outstanding heat transfer and high temperature stability for all
types of electronic and
industrial applications
NON-SILICONE THERMAL GREASE Non-silicone thermal greases are
unique synthetic thermal greases engineered to provide
low bleed and oil migration (Pump Out) to prevent component
contamination associated
with silicone greases.
Product Description Color Max
Temp (°C)
Density
(g/cc)
Thermal Conductivity
(W/mK)
TG-62 Low bleed, conductive grease White 200 2.4 2.0
TG-63 High conductivity, low bleed Gray 200 2.5 2.7
TG-66 Soft, easy to spread, low bleed Gray 200 2.2 3.2
TG-69 Easily Spread, easy clean up White 200 2.7 3.0
CTG-81 Silver filled, super thermally
conductive
Silver 200 3.1 7.2
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718 Park East Dr Woonsocket, RI 02895 www.epoxysetinc.com
Phone: (401)-726-4500 Toll Free: 1-877-EPOXYSET Email:
[email protected]
DISCLAIMER: Any technical content or product information given
in this catalog should be used strictly as a guide and not as a
guarantee of their performance. The user should evaluate product
suitability on its own. Properties are typical and should not be
used as specifications. Statements are not to be confused as
recommendations to infringe and patent, trademark, or legally
protected entity. For formalized product specification or specific
product end use, please contact Epoxyset.
Rev. 04
http://www.epoxysetinc.com/mailto:[email protected]
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