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Why When SI happens, the noise margin requirement will not be satisfied – logic errors, false switching, system collapses, etc. In high speed digital system, we are expecting a string that contains bits H(1) and L(0). A continuous voltage waveform. Receivers sample the signal by generating the rising and falling edge of the signal.
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SIGNAL INTEGRITY OF HIGH SPEED DIGITAL PCB DESIGNS
EECS 713 ProjectInstructor: Prof. Allen
Presented by: Chen Jia
Definition
Signal integrity (SI): is a set of measures of the quality of an electrical signal. We expect the signal can response time series, electrical level correspondingly.
Was not always a case in earlier days. Challenges for designers
Concerns: why, what, when, and how
Why
When SI happens, the noise margin requirement will not be satisfied – logic errors, false switching, system collapses, etc.
In high speed digital system, we are expecting a string that contains bits H(1) and L(0). A continuous voltage waveform. Receivers sample the signal by generating the rising and falling edge of the signal.
A Failure in catching rising or falling edge, or misreading an ambiguous logic state may result in an incomplete data transmission or even a failure of transmission.
Settle down to non-ambiguous before receiver kicks in
We want to see this
Not this
When
Delay
If the signal arrives its destination when it is supposed to.
Delay depends on the length of the transmission line and dielectric constant. In high speed digital system, the length of the transmission lines has the greatest impact of clock skew.
Clock skew: is the difference in the arrival time between two sequentially-adjacent registers
What
Parameters of PCB and components on it
The arrangement of components layout and high speed trace design
Reflection/crosstalk/power/ground noise
Electromagnetic Compatibility (EMC) Electromagnetic Interference (EMI)
How
Solution: crosstalk, reflection For crosstalk: 1. Reduce the coupling (a solid reference plane,
both ground and power plane will do) 2. Change the timing 3. Improve receiver noise margins (as we stated
before) 4. Downsize the aggressor nets (prevent large
voltages from affecting small ones, not always the case with digital logic)
5. 90 degree routing, avoid parallel layout (to minimize the impact)
6. More…
Solutions
For reflections: Happens when impedance changes
while the signal is transmitting. L> Tr/2Tpd Tpd: Transport Delay/unit length Impedance matching:
Matching
1. Parallel: load impedance matching (close to load side)
2. Series: source impedance matching (close to source side, R + Rs ≥ RL)
Summary
System requirements
Schematic
Interconnectioncomponents
selectionPhysical design
component placement
Constrain driven layout
PrototypePractical
measurementsMeet SI
requirement?
Production
Reference
http://www.csee.umbc.edu/csee/research/vlsi/
http://www.cc362.com/article/44852226.html
http://www.mr-wu.cn/signal-integrity-analysis-for-high-speed-digital-pcb/
http://www.sigcon.com/Pubs/news/6_01.htm
Thank you !