Upload
merilyn-dixon
View
248
Download
3
Embed Size (px)
Citation preview
EE415 VLSI Design
DYNAMIC LOGIC
[Adapted from Rabaey’s Digital Integrated Circuits, ©2002, J. Rabaey et al.]
EE415 VLSI Design
Dynamic CMOS
In static circuits the output is connected to either GND or VDD via a low resistance path.» fan-in of n requires 2n (n N-type + n P-type)
devices
Dynamic circuits use temporary storage of signal values on the capacitance of high impedance nodes.» requires on n + 2 (n+1 N-type + 1 P-type)
transistors
EE415 VLSI Design
Dynamic Gate
In1
In2 PDN
In3
Me
Mp
Clk
Clk
Out
CL
Out
Clk
Clk
A
BC
Mp
Me
Two phase operation Precharge (Clk = 0) Evaluate (Clk = 1)
on
off
1
off
on
((AB)+C)
EE415 VLSI Design
Conditions on Output
Once the output of a dynamic gate is discharged, it cannot be charged again until the next precharge operation.
Inputs to the gate can make at most one transition during evaluation.
Output can be in the high impedance state during and after evaluation (PDN off), state is stored on CL
EE415 VLSI Design
Properties of Dynamic Gates
Logic function is implemented by the PDN only» number of transistors is N + 2 (versus 2N for static complementary
CMOS)
Full swing outputs (VOL = GND and VOH = VDD) Non-ratioed - sizing of the devices does not affect
the logic levels Faster switching speeds
» reduced load capacitance due to lower input capacitance (Cin)
» reduced load capacitance due to smaller output loading (Cout)
» no Isc, so all the current provided by PDN goes into discharging CL
EE415 VLSI Design
Properties of Dynamic Gates
Overall power dissipation usually higher than static CMOS» no static current path ever exists between VDD and GND
(including Psc)» no glitching» higher transition probabilities» extra load on Clk
PDN starts to work as soon as the input signals exceed VTn, so VM, VIH and VIL equal to VTn
» low noise margin (NML)
Needs a precharge/evaluate clock
EE415 VLSI Design
Issues in Dynamic Design 1: Charge Leakage
CL
Clk
Clk
Out
A
Mp
Me
Leakage sources
CLK
VOut
Precharge
Evaluate
Leakage is dominated by the subthreshold current
EE415 VLSI Design
Solution to Charge Leakage
CL
Clk
Clk
Me
Mp
A
B
Out
Mkp
Same approach as level restorer for pass-transistor logic
Keeper
EE415 VLSI Design
Issues in Dynamic Design 2: Charge Sharing
CL
Clk
Clk
CA
CB
B=0
A
OutMp
Me
Charge stored originally on CL is redistributed (shared) over CL and CA leading to reduced robustness
EE415 VLSI Design
Charge Sharing Example
CL=50fF
Clk
Clk
A A
B B B !B
CC
Out
Ca=15fF
Cc=15fF
Cb=15fF
Cd=10fF
EE415 VLSI Design
Charge Sharing
Mp
Me
VDD
Out
A
B = 0
CL
Ca
Cb
Ma
Mb
X
CLVDD CLVout t Ca VDD VTn VX – +=
or
Vout Vout t VDD–CaCL-------- VDD VTn VX
– –= =
Vout VDD
CaCa CL+----------------------
–=
case 1) if Vout < VTn
case 2) if Vout > VTnB0
Clk
X
CL
Ca
Cb
A
Out
Mp
Ma
VDD
Mb
Clk Me
as CL VDD=CL VOUT + Ca VOUT
VOUT = VDD CL / (CL+Ca)
Vx increases up to VDD-VTn
when Ca is small comparing to CL
Vx increases less up to VOUT
when Ca is larger
Assume that initial voltage Vx=0 and Vout=VDD
EE415 VLSI Design
Solution to Charge Redistribution
Clk
Clk
Me
Mp
A
B
OutMkp
Clk
Precharge internal nodes using a clock-driven transistor (at the cost of increased area and power)
EE415 VLSI Design
Issues in Dynamic Design 3: Backgate Coupling
CL1
Clk
Clk
B=0
A=0
Out1Mp
Me
Out2
CL2 In
Dynamic NAND Static NAND
=1
When In goes up from 0 to VDD, output of static NAND gate (Out2) goes down from VDD to 0 and pulls down Out1 through the capacitive coupling
EE415 VLSI Design
Issues in Dynamic Design 4: Clock Feed Through
CL
Clk
Clk
B
A
OutMp
Me
Coupling between Out and Clk input of the precharge device due to the gate to drain capacitance. So voltage of Out can rise above VDD.
The fast rising (and falling edges) of the clock couple to Out.
EE415 VLSI Design
Clock Feed Through
-0.5
0.5
1.5
2.5
0 0.5 1
Clk
Clk
In1
In2
In3
In4
Out
In &Clk
Out
Time, ns
Vol
tage
Clock feed through
Clock feed throughMore noise is generated as a result of clock coupling
EE415 VLSI Design
Other Effects
Capacitive coupling between output wires pulls down prestored charges
Substrate coupling Minority charge injection Supply noise (negative ground bounce
may discharge the output)
EE415 VLSI Design
Cascading Dynamic Gates
Clk
Clk
Out1
In
Mp
Me
Mp
Me
Clk
Clk
Out2
t
V
Clk
In
Out1
Out2V
VTn
Only 0 1 transitions allowed at inputs!So do not connect these gates directly
Output signal loss
EE415 VLSI Design
Domino Logic
In1
In2 PDN
In3
Me
Mp
Clk
ClkOut1
In4 PDN
In5
Me
Mp
Clk
ClkOut2
Mkp
1 11 0
0 00 1
Here we guarantee proper 0 to 1 transitions between gates
EE415 VLSI Design
Why Domino?
Clk
Clk
Ini PDNInj
Ini
Inj
PDN Ini PDNInj
Ini PDNInj
Like falling dominos!
EE415 VLSI Design
Properties of Domino Logic
Only non-inverting logic can be implemented Very high speed
» static inverter can be skewed, only L-H transition so make PMOS of inverter stronger» Input capacitance reduced
so smaller logical effort
EE415 VLSI Design
Designing with Domino Logic
Mp
Me
VDD
PDN
Clk
In1
In2
In3
Out1
Clk
Mp
Me
VDD
PDN
Clk
In4
Clk
Out2
Mr
VDD
Inputs = 0during precharge
Can be eliminated! but be aware of the short circuit path from delayed clock
EE415 VLSI Design
Footless Domino
The first gate in the chain needs a foot switchPrecharge is rippling – short-circuit currentA solution is to delay the clock for each stage
VDD
Clk Mp
Out1
In1
1 0
VDD
Clk Mp
Out2
In2
VDD
Clk Mp
Outn
InnIn3
1 0
0 1 0 1 0 1
EE415 VLSI Design
Differential (Dual Rail) Domino
A
B
Me
Mp
Clk
ClkOut = AB
!A !B
MkpClk
Out = ABMkp Mp
Solves the problem of non-inverting logic
1 0 1 0
onoff
EE415 VLSI Design
np-CMOS
Only 0 1 transitions allowed at inputs of PDN Only 1 0 transitions allowed at inputs of PUN
In1
In2 PDN
In3
Me
Mp
Clk
ClkOut1
In4 PUN
In5
Me
MpClk
Clk
Out2(to PDN)
1 11 0
0 00 1
Possible coupling in longer runs to dynamic node