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Sam Palermo Analog & Mixed-Signal Center Texas A&M University ECEN720: High-Speed Links Circuits and Systems Spring 2019 Lecture 1: Introduction

ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

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Page 1: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

Sam PalermoAnalog & Mixed-Signal Center

Texas A&M University

ECEN720: High-Speed Links Circuits and Systems

Spring 2019

Lecture 1: Introduction

Page 2: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

Class Topics

• System and design issues relevant to high-speed electrical (and optical) signaling

• Channel properties• Modeling, measurements, communication techniques

• High-Speed link circuits• Drivers, receivers, equalizers, timing systems

• Link system design• Modeling and performance metrics

• Link system examples

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Page 3: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

Administrative

• Instructor:• Sam Palermo• 315E WEB, 845-4114, [email protected]• Office hours: Th 10:30am-12:00pm, F 1:00pm-2:30pm

• Lectures: TR 2:20pm-3:35pm, ETB 1035

• Lab: W 6:00pm-8:50pm, CVLB 324• Lab begins on January 30

• Class web page• http://www.ece.tamu.edu/~spalermo/ecen720.html

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Page 4: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

Class Material

• Textbook: Class Notes and Technical Papers

• Key References• Digital Systems Engineering, W. Dally and J. Poulton, Cambridge

University Press, 1998.• Advanced Signal Integrity for High-Speed Digital Designs, S. H.

Hall and H. L. Heck, John Wiley & Sons, 2009. • High-Speed Digital Design: A Handbook of Black Magic, H.

Johnson & M. Graham, Prentice Hall, 1993.• Design of Integrated Circuits for Optical Communications, B.

Razavi, McGraw-Hill, 2003.

• Class notes• Will post online before class

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Page 5: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

Grading

• Exams (50%)• Two midterm exams (25% each)

• Homework & Labs (25%)• Labs (Prelab + Report) and homeworks weighted equally• Collaboration is allowed, but independent simulations and write-ups• Need to setup CADENCE simulation environment• Due at beginning of lab or 5PM (HW)• No late homework will be graded

• Final Project (25%)• Groups of 1-3 students• Report and PowerPoint presentation required

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Page 6: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

Prerequisites

• This is a circuits AND systems class• Circuits

• ECEN474 or approval of instructor• Basic knowledge of CMOS gates, flops, etc…• Circuit simulation experience (HSPICE, Spectre)

• Systems• Basic knowledge of s- and z-transforms• Basic digital communication knowledge• MATLAB experience

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Page 7: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

Simulation Tools

• Matlab

• ADS (Statistical BER link analysis)

• Cadence

• 90nm CMOS device models• Can use other technology models if they are a

90nm or more advanced CMOS node

• Other tools, schematic, layout, etc… are optional

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Page 8: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

Desktop Computer I/O Architecture

• Many high-speed I/O interfaces

• Key bandwidth bottleneck points are memory (FSB) and graphics interfaces (PCIe)

• Near-term architectures Integrated memory controller with

serial I/O (>5Gb/s) to memory Increasing PCIe from 2.5Gb/s (Gen1)

to 8Gb/s (Gen3)

• Other serial I/O systems Multi-processor systems Routers

8

Page 9: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

Serial Link Applications• Processor-to-memory

• RDRAM (1.6Gbps), XDR DRAM (7.2Gbps), XDR2 DRAM (12.8Gbps)

• Processor-to-peripheral• PCIe (2.5, 5, 8Gbps), Infiniband (10Gbps), USB3 (4.8Gbps)

• Processor-to-processor• Intel QPI (6.4Gbps), AMD Hypertransport (6.4Gbps)

• Storage• SATA (6Gbps), Fibre Channel (20Gbps)

• Networks• LAN: Ethernet (1, 10Gbps)• WAN: SONET (2.5, 10, 40Gbps)• Backplane Routers: (2.5 – 12.5Gbps)

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Page 10: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

Chip-to-Chip Signaling TrendsDecade Speeds Transceiver Features1980’s >10Mb/s Inverter out, inverter in

1990’s >100Mb/s Termination Source-synchronous clk.

2000’s >1 Gb/s Pt-to-pt serial streams Pre-emphasis equalization

Future >10 Gb/s Adaptive Equalization, Advanced low power clk.Alternate channel materials

Lumped capacitance

…Transmission line

Lossy transmission line

h(t)

Channel noiseSampler SlicerRX

EqualizerTransmit

Filter

CDR

Slide Courtesy of Frank O’Mahony & Brian Casper, Intel10

Page 11: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

Increasing I/O Bandwidth Demand

Single Multi Many-Core Processors

Tera-scale many-core processors will aggressively drive aggregate I/O rates

*2006 International Technology Roadmap for Semiconductors

ITRS Projections*Intel Teraflop Research Chip

• 80 processor cores• On-die mesh

interconnect network w/ >2Tb/s aggregate bandwidth

• 100 million transistors• 275mm2

S. Vangal et al, “An 80-Tile Sub-100W TeraFLOPS Processor in 65nm CMOS," JSSC, 2008.

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Page 12: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

High-Speed Electrical Link System

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Page 13: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

13

Electrical Backplane Channel

• Frequency dependent loss Dispersion & reflections

• Co-channel interference Far-end (FEXT) & near-end (NEXT) crosstalk

Page 14: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

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Channel Performance Impact

Page 15: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

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Channel Performance Impact

Page 16: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

A 10Gb/s 5-tap DFE / 4-Tap FFE Transceiver in 90nm CMOS Technology

Mounir Meghelli, Sergey Rylov, John Bulzacchelli, Woogeun Rhee, Alexander Rylyakov, Herschel Ainspan, Ben Parker, Michael Beakes, Aichin Chung, Troy Beukema, Petar Pepeljugoski, Lei Shan, Young Kwark, Sudhir Gowda and Dan Friedman

IBM T. J. Watson Research Center, Yorktown Heights, NY

Backplane Link Example

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Page 17: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

Transmission Channel Impairments

The ChannelTx IC

Pkg Line cardtrace

Edge connector

Backplane16” trace

Edge connector

Line cardtrace

Rx IC

Pkg

Edge connector

Packaged SerDes

Line card trace

Backplane trace

Via stub

-100ps 100ps-50ps 0ps 50ps-500mV

500mV

-400mV

-300mV

-200mV

-100mV

-0.0mV

100mV

200mV

300mV

400mV

500mV

Eye FFE1 10.0Gb/s [OPEN,1e-8] No Xtalk

Time

Sign

al A

mpl

itude

Vpd

DATA = RAND Tx 600mVpd AGC Gain -5.48dBXTALK = NONE AGC 5.0GHz 0.00dBPKG=0/0 TERM = 5050/5050 IC = 3/3

HSSCDR = 2.3.2-pre2 IBM ConfidentialDate = Sat 01/21/2006 12:00 PMPLL=0F1V0S0,C16,N32,O1,L80 FREQ=0.00ppm/0.00usFFE = [1.000, 0.000]

-100ps 100ps-50ps 0ps 50ps-500mV

500mV

-400mV

-300mV

-200mV

-100mV

-0.0mV

100mV

200mV

300mV

400mV

500mV

Eye FFE1 10.0Gb/s [OPEN,1e-8] No Xtalk

Time

Sign

al A

mpl

itude

Vpd

DATA = RAND Tx 600mVpd AGC Gain -6.02dBXTALK = NONE AGC 5.0GHz 0.00dBPKG=0/0 TERM = 5050/5050 IC = 3/3

HSSCDR = 2.3.2-pre2 IBM ConfidentialDate = Sat 01/21/2006 12:01 PMPLL=0F1V0S0,C16,N32,O1,L80 FREQ=0.00ppm/0.00usFFE = [1.000, 0.000]

INPUT

OUTPUT

0Hz 10GHz2.0GHz 4.0GHz 6.0GHz 8.0GHz-90

10

-80

-70

-60

-50

-40

-30

-20

-10

0

10

[OPEN,1e-8] Channel Response

Frequency

|SD

D21

|

-40

60

-30

-20

-10

0

10

20

30

40

50

60

|S11

|,|S

22|

S21

-24.6dB @ 5GHz

17[Meghelli (IBM) ISSCC 2006]

Page 18: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

10Gb/s SerDes Main Features

Tx with 1 baud-spaced 4-tap FFE

Rx with 5-tap adaptive DFE and digital clock recovery

LC-VCO based PLL for low noise clock generation

90nm CMOS technology

18[Meghelli (IBM) ISSCC 2006]

Page 19: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

Transmitter Architecture

“A Low Power 10Gb/s Serial Link Transmitter in 90-nm CMOS” A. Rylyakov et al., CSICS 2005

L

L L

L

L

L

L

L

L

1x 4x 2x 1x

1/4 1 1/2 1/4IDACs

&Bias

Control

sgn-1 sgn0 sgn1 sgn2

50Ω

Out-P

Out-N

4:2MUX

2

2

2

21

D0

D1

D2

D3

VDDA=1.2VVDD=1.0V

VDDIO=1.0V

VDDA=1.2V

1

1

1

C2 (5GHz)From on-chip PLL

2

(2.5

Gb/

s)

(10Gb/s)

(5Gb/s)

ESD

Key Features:- Half-rate CML design- 4-tap FFE- Tap polarity control- ESD protection- 70mW (24mA main tap, no FFE)

FFE Taps Full Scale DAC bits

Pre-cursor 25% 4

Cursor 100% 6

1st Post-cursor 50% 5

2nd Post-cursor 25% 4

19[Meghelli (IBM) ISSCC 2006]

Page 20: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

20

Tx Output Eye Diagram @ 10Gb/s

No FFE, 24mA on main tap

SimulatedMeasured

FFE 4=[0, 85%, -15%, 0, 0]

100psps 0ps 50ps

Eye FFE4 10.0Gb/s [OPEN,1e-8] No Xtalk

Time

00mVpd AGC Gain -6.02dBAGC 5.0GHz 0.00dB

5050 IC = 3/0

nfidentialQ OFS = 0.00ppm/0.00us D/E OFST 137, 0.000]

100ps0ps 0ps 50ps

e FFE1 10.0Gb/s [OPEN,1e-8] No Xtalk

Time

x 600mVpdAGC Gain -6.02dBAGC 5.0GHz 0.00dB

= 5050/5050 IC = 3/0

IBM ConfidentialEQ OFS = 0.00ppm/0.00us

000]

[Meghelli (IBM) ISSCC 2006]

Page 21: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

Receiver Architecture

Key Features:- Half-rate design- 5-tap continuously adaptive DFE- Variable gain amplifier- Digital CDR- ESD protection (HBM & CDM)- 130mW (with DFE and CDR logic)

T-Coil CompensationNetwork

50Ω

In_PIn_N

(10G

b/s)

ESD

VGA

Vcm

PI PI

Phase rotator

2:8 DMUX

8:16 DMUX

CDRlogic

I-Clock control

Q-Clock controlI Q

DFElogic

Tap weights

C2-I C2-Q

Edge

DataAmp

From on-chip PLL (5GHz)

CML CMOS logic VDDA=1.2V

8

2

D0

D1

D2

D3

2

2

2

(2.5

Gb/

s)

1

1

1

1VDDIO=1V

DFEBlock

Phasedetector

VDD=1.0V

DataAmpEdgeClock

21[Meghelli (IBM) ISSCC 2006]

Page 22: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

DFE Approach

Key Features:- Half-rate DFE with H1 speculation and dynamic H2-H5 feedback allows 2UI for settling- DFE algorithm maximizes vertical eye opening at the data slicing instant- Offset adjustment at all the slicer inputs

Received eyeISI

Σ L L L

Σ L L L

Tap-feedbackand weightingH1-5

TapweightsData

I

I

I

II I I

I I I

ΣI

Offset

Deven

Dodd

Amplitude

On-chipDFELogic

(+H1)

(-H1)

(+H1)

(-H1)

DFE Taps Resolution

H1 6 bits

H2 5 bits

H3, H4, H5 4 bits

22[Meghelli (IBM) ISSCC 2006]

Page 23: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

CDR Loop

DataZ-1

Z-1

DMUX XORs

D

E

D

E

Early

Late

DigitalFilter

I Rotator Control

Q Rotator Control

PID/A

PID/AC2-I

C2-Q

From

on-

chip

PLL

Data Clock

Edge Clock

Key Features:- Fully digital loop- Can handle up to +/- 4000ppm frequency offset- Independent I,Q control

Jitter Tolerance

0

0.2

0.4

0.6

0.8

1

1.2

1.4

1.00E+05 1.00E+06 1.00E+07 1.00E+08 1.00E+09

Modulation Frequency

Sine

Jitt

er (U

I pp)

Receiver Jitter tolerance curve ( BER<1e-9)

Tracking bandwidth ~9MHz

23[Meghelli (IBM) ISSCC 2006]

Page 24: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

24

Chip-to-Chip Link Experiments

Trace Length

5GHz losses(Tx module + board trace + Rx module)

Number of vias3.8mm via stub / 1.8mm via stub / 1.8mm via through

10” (#1) 12dB 2 / 0 / 010” (#2) 10dB 0 / 2 / 015” 25dB 4 / 2 / 020” 15dB 0 / 0 / 2

Module Module

SerDes1 SerDes2

Board

TraceVia stub

SerDes1

SerDes2

Trace

[Meghelli (IBM) ISSCC 2006]

Page 25: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

25

0.00%

10.00%

20.00%

30.00%

40.00%

50.00%

60.00%

10" (#1) 10" (#2) 15" 20"Link

Hor

izon

tal E

ye O

peni

ng (1

e-9

BER

)

DFE+FFEDFEFFE

Chip-to-Chip Measurement ResultsTrace Length

5GHz losses

(Tx module + board trace + Rx module)

Number of vias

3.8mm via stub / 1.8mm via stub / 1.8mm via through

10” (#1) 12dB 2 / 0 / 0

10” (#2) 10dB 0 / 2 / 0

15” 25dB 4 / 2 / 0

20” 15dB 0 / 0 / 2

DFE

+ F

FE

DFE

+ F

FE

DFE

+ F

FE

DFE

+ F

FE

DFE

ON

LY

DFE

ON

LY

FFE

ON

LY

FFE

ON

LY

Horizontal eye opening of the equalized eye at the receiver slicer input

[Meghelli (IBM) ISSCC 2006]

Page 26: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

26

Preliminary Schedule

• Dates may change with reasonable notice

Page 27: ECEN720: High-Speed Links Circuits and ... - ece.tamu.eduece.tamu.edu/~spalermo/ecen689/lecture1_ee720_intro.pdf · Administrative • Instructor: • Sam Palermo • 315E WEB, 845-4114,

Next Time

• Channels• Components

• Chip packages, PCBs, Wires, Connectors

• Modeling• Wires, Transmission Lines

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