ECE 477 Design ReviewTeam 01 Fall 2012

BrennanTran

Jonah Ea

BenPluckebaum

KevinMeyer

Outline• Project overview • Project-specific success criteria• Block diagram• Component selection rationale• Packaging design• Schematic and theory of operation• PCB layout• Software design/development status• Project completion timeline• Questions / discussion

Project Overview

• Interactive sound board• LED button matrix to receive input and

display feedback• Adjust volume and BPM• Save and load configurations to flash• Save music sample to midi file on SD card• (Flash Application: Tone Matrix)

Project-Specific Success Criteria

• An ability to poll an array of pushbuttons to manipulate the musical configuration and display a visual pattern using LEDs.

• An ability to output multi-tone audio.• An ability to adjust the volume and BPM of the

output audio.• An ability to save and load musical configurations to

and from flash memory.• An ability to save a configuration as a MIDI file to an

SD card.

Block Diagram

Component Selection Rationale

• Microcontroller: TM4C123GH6PM (Tiva C)– 80 MHz Operating Frequency– 256 KB Flash Memory– Floating Point Unit– 4 SPI Modules– 43 Max GPIO pins

Component Selection Rationale

• RGB LED Matrix– Multiple LED colors– Breakout boards for easy interface– SN74HC595 shift registers

• 35 mA max source current• 22 mA constant current required for

eight LEDs in parallel

Component Selection Rationale

• DAC8571 Digital-Analog Converter– I2C Interface for reduced pin count– 16 bit resolution (same as CD’s)

• Amplifier– LM324 Quad Op Amp (1.5 gain)– LM4902 Audio Amplifier under

consideration

Component Selection Rationale

• LM317M Adjustable Regulator– Simple for 5V voltage regulation– Over 500 mA output current

• TPS73633 Low-Dropout Regulator– 400 mA output current– Fixed 3.3 output voltage

Packaging Design

• 23 x 33 x 10 cm(9 x 13 x 4 in)

• RGB LED Matrix (8x8)

• 2 Speakers• 1 LCD• 4 Pushbuttons• 2 Rotary Encoders

Packaging Design

• Reset Switch• Power Switch• SD Card Slot

• Power Jack– 1.35 mm ID– 3.5 mm OD– 6.2 mm depth

Schematic – Power Circuit

Schematic – Microcontroller

Schematic – LED Matrix

Schematic – Button Matrix

Schematic – Audio Circuit

Schematic – LCD

Schematic – Function Controls

Schematic – SD Card

PCB Layout

PCB – Power Circuit

PCB – Microcontroller

PCB – Audio Circuit

PCB – LED Matrix

PCB – Button Matrix

PCB – LCD

Software Development Status

• Utilizing Code Composer Studio to prototype with the TI Stellaris LaunchPad

• Testing SPI using 74HC595 shift registers to output to LEDs

• Interfacing DAC using I2C• Begin interfacing with flash memory• Outlined a flowchart for basic behavior

Software Design – Flowchart

Project Completion Timeline

Documentation

Product Testing/Debugging

Packaging/Assembly

PCB Soldering/Testing

Peripheral Assembly/Testing

Software Development/Testing

Schematic/PCB

Part Ordering

3/2/2014 3/12/2014 3/22/2014 4/1/2014 4/11/2014 4/21/2014 5/1/2014

Questions / Discussion