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ECAL/HCAL Frond-End Board: tests at production site. Production flow. Aging. Flying probes. Boundary scan. All the PCBs and components are checked upon reception at the factory. SMC components are mounted first. - PowerPoint PPT Presentation
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PRR – March 31st 2006 D.BretonD.Breton
ECAL/HCAL Frond-End Board:ECAL/HCAL Frond-End Board:tests at production site.tests at production site.
Production flow.Aging.Flying probes.Boundary scan.
PRR – March 31st 2006PRR – March 31st 2006
Production flowProduction flow All the PCBs and components are checked upon reception at the factory. SMC components are mounted first. Right after the SMC oven, there is a visual control of each side of the board
plus a BGA Xray test for one out of 10 boards. The press-fit connectors are mounted with a dedicated tool. The other components are finally mounted and soldered on the wave. The analog input connectors have to be resoldered manually. There is a final visual control before powering the boards and checking the
power consumption. If this is OK, the boards are sent to the aging oven. The power consumptions are tested again at the exit of the oven to look for
potential component failure. Then the boards undergo the flying probe test … … followed by the Boundary Scan test. If everything is OK, the boards are sent to LAL. All the former step results are noticed in a report file. The production boards will be produced by lots of 32 boards every week.
PRR – March 31st 2006PRR – March 31st 2006
AgingAging Manufacturer will perform an
aging of groups of 16 powered boards in the same crate.
Goals :
• Detection of bad soldered components.
• Infant mortality. First trial with 8 boards
showed no disastrous effect: all boards were functional before and after the aging.
Power consumption is controlled before and after the aging.
Power supplies
PRR – March 31st 2006PRR – March 31st 2006
Aging ovenAging oven
Air fan
Tempprobeon thecentral
ADC
PRR – March 31st 2006PRR – March 31st 2006
Temperature cyclesTemperature cycles 8 cycles of 9 hours between 0 and 60 degrees. The upper temperature was fixed after measurements made on the central ADC (the
hottest component on the board): its package was at 90 degrees when air was at 60. The goal is not to pass over 150 degrees on the ADC die.
PRR – March 31st 2006PRR – March 31st 2006
Flying probesFlying probes Automatic test with a ‘ Takaya ‘ robot :
• Measures the impedance values of nets and components and checks the interconnections.
• Can diagnose a bad soldered BGA thanks to the ‘open checker’ tool.
• Footprints for probes have been implemented under the BGAs.
PRR – March 31st 2006PRR – March 31st 2006
Access to vias below the Access to vias below the BGAs BGAs
The varnish has been removed from all the vias not connected locally to another component..
PRR – March 31st 2006PRR – March 31st 2006
The flying probesThe flying probesFlying needles
Open checker:Hall effect
probe
PRR – March 31st 2006PRR – March 31st 2006
The FEB on the TakayaThe FEB on the Takaya
Onetest on
each side
PRR – March 31st 2006PRR – March 31st 2006
Boundary scan.Boundary scan. Partial Boundary Scan Test:
• Ability to drive 2 ACTEL chains independently.
• GluePGA and SeqPGA have to be programmed first (takes 10 min).
• Test of Actels’ interconnections => all BGAs.
PRR – March 31st 2006PRR – March 31st 2006
The JTAG chainsThe JTAG chains2 J ta g ch a in s : A x celera to r a n d P ro A sic
D ed ic a ted J tag p in s D ed ic a ted J tag p in sT C K T D I T D OT M S T C K T D I T D OT M S
G lu e p g aA P A 1 5 0
S eq p g a
A P A 3 0 0
IS P ( P roA sic p ro gram m in g C on n ecto r )
S ilicon E xp lorerjtag con n ecto r
F e p g aA x 2 5 0
D ed icat ed J t agp in s
T ckT m s
T d iT d o
T C K
T M S
T D I
T D O
TD I[n ]
TD I[n :0 ]
TD O [n]
TDO [n :0 ]
TD I
TD O
Tr ig p g aA x 5 0 0
T ckT m sT d i
T d o
T C K
T M S
T D I
T D O
TD I
TDO
TCK
TM S
Lem o
D ed icat ed J t agp in s
P rob e s
' h om e-m ade 'P ro bes
P rob e s
EC S
TDO [n -1 :0 ]
EC S
TD I[0 ]
TD O [0]
Pro
gram
mab
leO
utpu
t
P r o g r a m m a b leO u tp u t
V ersion 1 /0 3 /2 006
PRR – March 31st 2006PRR – March 31st 2006
Test setupTest setup
AX chainInput:scan +
explorer
APA chaininput:prog +scan
PRR – March 31st 2006PRR – March 31st 2006
Top viewTop view
BoundaryScan
controller
Neighbourcheck
from FEPGAon backplane
Testbackplane
PRR – March 31st 2006PRR – March 31st 2006
Test and repair report (1)Test and repair report (1)
Repère / Code défautLM 001 x RAS Sans JTAG
LM 002 27/02/2006 x J7 / BPV OK Testé avec ancien programme GLE
LM 003 08/03/2006 xJ1, J7, J9 / BPV - CC sous M21 (à
changer)OK Testé avec ancien programme GLE
LM 004 27/02/2006 xC132 / ADF - M63 / AHS - J7, J9 / BPV -
M63 / AHS OK Testé avec ancien programme GLE
LM 005 08/03/2006 x CC sous MN21 (changer) OK Testé avec ancien programme GLE
LM 006 08/03/2006 x J9 / BPV - CC sous MN21CC sous J6 cause blindage Action
corrective sur le lot - Testé avec ancien programme GLE
LM 007 x M17 / ANC (changer le 27/02/06) PB test infra JTAG - en expertise
LM 008 27/02/2006 RAS OK Testé avec ancien programme GLE
LM 009 27/02/2006 RAS OK Testé avec ancien programme GLE
LM 010 27/02/2006 J4 / BPV OK Testé avec ancien programme GLE
LM 011 27/02/2006 RAS OK Testé avec ancien programme GLE
LM 012 27/02/2006 J9 / BPV OK Testé avec ancien programme GLE
LM 013 27/02/2006 RAS OK Testé avec ancien programme GLE
LM 014 08/03/2006 RAS OK Testé avec ancien programme GLE
LM 015 27/02/2006 RAS OK Testé avec ancien programme GLE
LM 016 27/02/2006 J1 / BPV OK Testé avec ancien programme GLE
Test Sondes mobilesLivraison Test JTAGRAYON XOF
N° de série
CNR/F10/01
PRR – March 31st 2006PRR – March 31st 2006
Test and repair report (2)Test and repair report (2)
LM 001
LM 002
LM 003
LM 004
LM 005
LM 006
LM 007
LM 008
LM 009
LM 010
LM 011
LM 012
LM 013
LM 014
LM 015
LM 016
OFN° de série
CNR/F10/01
+3,3V +5V -5V +3,3V +5V -5V
X M21 et M30 inversé (Changé Zevac)
XM21 et M30 inversé (Changé Zevac) + Pose isolant sous blindage
M21 et M30 inversé (Changé Zevac)M21 et M30 inversé (Changé Zevac) + Pose isolant sous blindage
X M21 et M30 inversé (Changé Zevac) + Pose isolant sous blindageM21 et M30 inversé (Changé Zevac)
X
X Essai mesure de température en statique sur U2B à 89,8°C
X
XPrise de température lors du déverminage dynamique 72H sur l'ADC du milieu (carte au centre du rack) + pose isolant
sous blindage
X
DIVERS
Mesure consommationAvant Après
Déverminage
PRR – March 31st 2006PRR – March 31st 2006
Coding of the defaults.Coding of the defaults. Codes défauts utilisés dans les relevés de défauts
A : Article (composant). ANC - Non conforme vis à vis de la nomenclature. Le composant ne correspond pas à l'article prévu à cet emplacement,(désignation, valeur, tolérance, fabricant, boîtier) Pour 2 composants mis l’un à la place de l’autre noter 2 articles ANC. Un composant en trop à un emplacement normalement vide est aussi ANC. Pour une reprise de réglage utiliser le défaut ANC en indiquant "Réglage" à la place du repère de composant. Pour une carte non vernie noter ANC avec comme repère le nom de la carte. AHS - Hors service (Tout composants défectueux ). - résistance ou autre composant coupée électriquement - CI non fonctionnel AMI - Mal implanté (surélevé, mal plaqué, de travers, patte pliée, mal cambré,...) AMT - Manquant (Manquant pour un emplacement donné) Le composant AMT peut-être un chevron de soudure, une modif filaire,…) AIN - Inversé ( polarité: diode, condo polarisé,... sens: circuit intégré, connecteur,..). ADF - Détérioré en fabrication (mauvaise manip, salissure, brûlure, déformation) Utiliser ce code lors de défaut sur le cuivre occasionné par la fab ou l’opérateur. AHT - Composant hors tolérance B Brasage (soudure au fer ou en machine :vague, four,...) BPS - Pont de soudure coté surfusion BPV - Pont de soudure coté vague BNS - Non soudé ou manque de soudure coté surfusion BNV - Non soudé ou manque de soudure coté vague BNC - Non soudé ou manque de soudure dû à la colle Z CI, carte, support ZCP - coupure de piste du au fabricant du cuivre. ZCC - court circuit du au fabricant du cuivre. RAS Rien à signaler (Le défaut trouvé par le testeur n'aboutit pas à une intervention sur la carte) - Problème dû au moyen de test, - Article changé par erreur. - Dépassement de la tolérance jugé acceptable par le
réparateur.
PRR – March 31st 2006PRR – March 31st 2006
Main problems encounteredMain problems encountered When the first series of 24 PCBs was launched for the preseries of 16
boards, only 7 passed the checking procedure. The problem was the width of some conductors which shrinked below
70µm (which is the absolute limit). So only 7 boards could be mounted, and the 9 remaining PCBs had to
be reproduced. Then the 2 APAs were mounted in place of each other except on the first
board (shared responsibility) => we ended up with only ONE good board => Jacques almost got depressed ...
=> BUT this was a good practice for replacing BGAs ! Unsoldering and resoldering a BGA isn’t an easy job !
One prototype board was damaged during such an operation. There were shorts after the operation in a few early cases. New specific tools were developped for the ZEVAC machine. Seems operational now …
Shortcut below one of the press-fit HM connector shields and one line => solved by inserting a little piece of capton below the shield to isolate.
PRR – March 31st 2006PRR – March 31st 2006
SummarySummary The production chain is now perfectly defined and operational. Our experience with the factory has now become long and is very
effective and satisfactory. All the boards will undergo:
A 72-hour aging A flying probe test A partial boundary scan test.
All test softwares were developped by the factory. The failure coverage is at the level of ??% ... Up to now, no board declared « OK » by the factory test was found
bad at LAL, except for certain component failures which they cannot detect without a functional test (2 occurrences).
we’re confident for the production overall quality.
We’re in the starting blocks !!!