次世代 銲線技術發展趨勢與現況

樂金公司 蔡幸樺

LED封裝製程步驟

四種高導電純金屬材料的物理特性比較

Ag-Au-Pd 合金銲線 (WT)

1. Manufacturing Method for Composite Alloy

Bonding Wire, US Patent 8,101,030B2(2012).

2. Composite Alloy Bonding Wire and

Manufacturing Method Thereof, US Patent

8,101,123B2(2012).

含大量退火孿晶結構之Ag-Au-Pd合金線晶粒組織：(a)

縱切面，(b)橫截面

INTERMETALLIC COMPOUNDS (IMC)

INTERMETALLIC COMPOUNDS(IMC)

INTERMETALLIC COMPOUNDS(IMC)

INTERMETALLIC COMPOUNDS(IMC)

Thermal Stability of Grain Structure at 600 ℃

0min

Annealing Twinned Ag-8Au-3Pd Conventional Ag-8Au-3Pd

3min

30min

Thermal Stability of Grain Structure at 600 ℃

60min

90min

180min

Annealing Twinned Ag-8Au-3Pd Conventional Ag-8Au-3Pd

Thermal Stability of Grain Structure at 600 ℃

4N Au Wire

0min

3min

30min

60min

90min

180min

Thermal Stability of Grain Structure at 600 ℃

Pd coated Cu Cu

0min

3min

30min

Heat Affected Zones after EFO of (a) Annealing Twinned

Ag8Au3Pd and (b) Conventional Ag8Au3Pd Wires

Electric Current Stressing Tests

Innovative Ag8Au3Pd

3248～7072 minutes

Conventional Ag8Au3Pd

969～1930 minutes

Wire Diameter 17.5 mm, Current 0.3 A

銀合金線在一般LED封裝打線接合作業後的第一球銲點(右)

與第二楔形銲點(左)

銀合金線與純金線在LED封裝之接合強度比較

純金線、銅鍍鈀線與銀金鈀合金線在LED封裝之打線接合製程良率(UPH)比較

銀合金線在IC半導體封裝特殊疊球打線接合技術應用

銀合金線在LED封裝特殊球/尾堆疊(BBOS)與

尾/球堆疊(BSOB)打線接合技術應用

退火孿晶結構Ag-8Au-3Pd合金線與純金線在0605 LED

封裝之打線接合驗證

純金線在0605 LED封裝驗證之打線接合作業參數(線徑0.8 mil)

退火孿晶結構Ag-8Au-3Pd合金線在0605 LED封裝驗證之打線接合作業參數(線徑0.8 mil)

退火孿晶結構Ag-8Au-3Pd合金線在0605 LED封裝打線接合驗證之第一球銲點與第二楔形銲點全貌

退火孿晶結構Ag-8Au-3Pd合金線在0605 LED封裝打線接合驗證之第一球銲點厚度與銲線弧高

純金線在0605 LED封裝驗證之打線接合強度(線徑0.8 mil)

退火孿晶結構Ag-8Au-3Pd合金線在0605 LED封裝驗證之打線接合強度(線徑0.8 mil)

退火孿晶結構Ag-8Au-3Pd合金線在0605 LED封裝驗證之打線接合品質檢測

退火孿晶結構Ag-8Au-3Pd合金線在0605 LED封裝驗證之可靠度試驗

銀合金線與純金線在 LED封裝之亮度（LOP）比較

LOP increase 3.2% !!!

Application in V-LAMP LED Package

Application in COB-LED Package

Applications in other LED Packages

Department of Materials Science and Engineering, National Taiwan University

Thank You for Your Attention !