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doc.: IEEE 802.11-10/0439r1 Submission May 2010 Slide 1 TGad Common Preamble Date: 2010-05-17 Author(s)/Supporter(s): Name Company Addres s Phone email Abu-Surra, Shadi Samsung [email protected] Ban, Koichiro Toshiba [email protected] Banerjea, Raja Marvell [email protected] Basson, Gal Wilocity [email protected] Blanksby, Andrew Broadcom [email protected] m Borges, Daniel Apple [email protected] Borison, David Ralink [email protected] m Cariou, Laurent Orange laurent.cariou@orange-ftgro up.com Chamberlin, Philippe Technicolor R&I philippe.chambelin@technico lor.com Chang, Kapseok ETRI [email protected] Chin, Francois I2R [email protected] .sg Christin, Philippe Orange philippe.christin@orange-ft group.com Chu, Liwen STMicroelectro nics [email protected] Chung, Hyun Kyu ETRI [email protected] Coffey, Sean Realtek [email protected] Cordeiro, Carlos Intel [email protected] Derham, Thomas Orange thomas.derham@orange-ftgrou p.com Dorsey, John Apple [email protected] Elboim, Yaron Wilocity [email protected] Fischer, Matthew Broadcom [email protected] Hongyuan Zhang, Marvell, et. al.

Doc.: IEEE 802.11-10/0439r1 Submission May 2010 Slide 1 TGad Common Preamble Date: 2010-05-17 Author(s)/Supporter(s): NameCompanyAddressPhoneemail Abu-Surra,

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Page 1: Doc.: IEEE 802.11-10/0439r1 Submission May 2010 Slide 1 TGad Common Preamble Date: 2010-05-17 Author(s)/Supporter(s): NameCompanyAddressPhoneemail Abu-Surra,

doc.: IEEE 802.11-10/0439r1

Submission

May 2010

Slide 1

TGad Common PreambleDate: 2010-05-17

Author(s)/Supporter(s):

Name Company Address Phone email

Abu-Surra, Shadi Samsung [email protected]

Ban, Koichiro Toshiba [email protected]

Banerjea, Raja Marvell [email protected]

Basson, Gal Wilocity [email protected]

Blanksby, Andrew Broadcom [email protected]

Borges, Daniel Apple [email protected]

Borison, David Ralink [email protected]

Cariou, Laurent Orange [email protected]

Chamberlin, Philippe Technicolor R&I [email protected]

Chang, Kapseok ETRI [email protected]

Chin, Francois I2R [email protected]

Christin, Philippe Orange [email protected]

Chu, Liwen STMicroelectronics [email protected]

Chung, Hyun Kyu ETRI [email protected]

Coffey, Sean Realtek [email protected]

Cordeiro, Carlos Intel [email protected]

Derham, Thomas Orange [email protected]

Dorsey, John Apple [email protected]

Elboim, Yaron Wilocity [email protected]

Fischer, Matthew Broadcom [email protected]

Hongyuan Zhang, Marvell, et. al.

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Submission

May 2010

Slide 2

Author(s)/Supporter(s):Name Company Address Phone email

Giraud, Claude NXP [email protected], Ron Peraso Technologies [email protected]

Golan, Ziv Wilocity [email protected], Michelle Intel [email protected]

Grandhi, Sudheer InterDigital [email protected], David Agilent [email protected]

Grodzinsky, Mark Wilocity [email protected], Christopher Broadcom [email protected]

Hart, Brian Cisco [email protected], Amer Microsoft [email protected]

Hong, Seung Eun ETRI [email protected], Kenichi NEC [email protected], Srinath Texas Instruments [email protected]

Hsu, Alvin MediaTek [email protected], Julan Samsung [email protected]

Hung, Kun-Chien MediaTek [email protected], Avinash Qualcomm [email protected]

Jauh, Alan MediaTek [email protected], Raymond Jararaj s/o I2R [email protected]

Jeon, Paul LGE [email protected], Sunggeun ETRI [email protected]

Jones, VK Qualcomm [email protected], Stacy Beam Networks [email protected]

Jun, Haeyoung Samsung [email protected], Harald Nokia [email protected], Padam Nokia [email protected]

Kakani, Naveen Nokia [email protected], Assaf Intel [email protected], Mika Nokia [email protected]

Hongyuan Zhang, Marvell, et. al.

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Submission

Author(s)/Supporter(s):Name Company Address Phone email

Kim, Hodong Samsung [email protected], Yongsun ETRI [email protected], Rick Harman International [email protected], Edwin Samsung [email protected]

Kwon, Hyoungjin ETRI [email protected], Hyukchoon Samsung [email protected]

Laine, Tuomas Nokia [email protected], Ismail Tensorcom [email protected], Hoosung ETRI [email protected]

Lee, Keith AMD [email protected], Wooyong ETRI [email protected]

Liu, Yong Marvell [email protected], Hui-Ling Marvell [email protected], Brad Peraso Technologies [email protected]

Majkowski, Jakub Nokia [email protected], Janne Nokia [email protected]

Maruhashi, Kenichi NEC [email protected], Taisuke Panasonic [email protected]

Meerson, Yury Wilocity [email protected], Murat Broadcom [email protected]

Montag, Bruce Dell [email protected], Andrew Cisco [email protected]

Nandagopalan, Saishankar Broadcom [email protected], Chiu Samsung [email protected]

Nikula, Eero Nokia [email protected], DS Samsung [email protected]

Park, Minyoung Intel [email protected], Xiaoming I2R [email protected]

Pi, Zhouyue Samsung [email protected]

Slide 3

May 2010

Hongyuan Zhang, Marvell, et. al.

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Submission

Author(s)/Supporter(s):Name Company Address Phone email

Ponnampalam, Vish MediaTek [email protected], Narayan NEC [email protected]

Prat, Gideon Intel [email protected], Xuhong I2R [email protected]

Ramachandran, Kishore NEC [email protected], Yu Zhan Panasonic [email protected]

Roblot, Sandrine Orange [email protected], Roee Wilocity [email protected], Ohad Wilocity [email protected]

Sachdev, Devang NVIDIA [email protected], Ali Intel [email protected]

Sampath, Hemanth Qualcomm [email protected], Amichai Wilocity [email protected]

Sankaran, Sundar Atheros [email protected], Vincenzo STMicroelectronics [email protected]

Seok, Yongho LGE [email protected], Huai-Rong Samsung [email protected], Ba-Zhong Broadcom [email protected]

Sim, Michael Panasonic [email protected], Harkirat Samsung [email protected], Menashe Intel [email protected], Seungho SK Telecom [email protected], Simha Wilocity [email protected], Matt Atheros [email protected]

Stacey, Robert Intel [email protected], Ananth I2R [email protected]

Sutskover, Ilan Intel [email protected]

Slide 4

May 2010

Hongyuan Zhang, Marvell, et. al.

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Author(s)/Supporter(s):Name Company Address Phone email

Taghavi, Hossain Qualcomm [email protected], Kazuaki Panasonic [email protected], Jason Self [email protected], Solomon Intel [email protected]

Usuki, Naoshi Panasonic [email protected], Prabodh Nokia [email protected]

Vertenten, Bart NXP [email protected], George STMicroelectronics [email protected]

Wang, Chao-Chun MediaTek [email protected], Homber TMC [email protected], James MediaTek [email protected]

Wong, David Tung Chong I2R [email protected], James MediaTek [email protected]

Yucek, Tevfik Atheros [email protected], Su Khiong Marvell [email protected], Hongyuan Marvell [email protected]

Slide 5

May 2010

Hongyuan Zhang, Marvell, et. al.

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Submission

Proposal overview

• This presentation is part and is in support of the complete proposal described in 802.11-10/432r0 (slides) and 802.11-10/433r0 (text) that:– Supports data transmission rates up to 7 Gbps

– Supplements and extends the 802.11 MAC and is backward compatible with the IEEE 802.11 standard

– Enables both the low power and the high performance devices, guaranteeing interoperability and communication at gigabit rates

– Supports beamforming, enabling robust communication at distances beyond 10 meters

– Supports GCMP security and advanced power management

– Supports coexistence with other 60GHz systems

– Supports fast session transfer among 2.4GHz, 5GHz and 60GHz

May 2010

Hongyuan Zhang, Marvell, et. al.Slide 6

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Submission

Overview 1: SC and OFDM• Single Carrier (SC) vs. OFDM

– In favor of OFDM

• Robustness in higher delay spread environments.

• Scalability—higher achievable throughput.

– In favor of single carrier

• Low PAPR, efficient PA, lower power consumption (at low delay spread)

• Lower complexity.

• Dual-Mode PHY would be the best solution for TGad:– SC mainly targeted on low power applications with lower achievable throughput.

– OFDM mainly targeted on high throughput applications.

– SC and OFDM rates are defined in different MCSs in the same MCS table (starting from MCS1).

• A low rate common mode is necessary for any device to build up the beamformed links before transmitting regular higher rate SC/OFDM MCSs (refer to [3]).

– Named as “Control MCS”, which is MCS0 (see next slide)

• SC and OFDM modulation details refer to [1][2].

Slide 7

May 2010

Hongyuan Zhang, Marvell, et. al.

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Submission

Overview 2: Control MCS• Beamforming is necessary in 60GHz systems [3], and Control MCS (MCS

0) is required for SC/OFDM/Dual-Mode devices to communicate with each other before setting up beamforming connections.

• Main usage of Control MCS:– Beacons– Beamforming training.

• Control MCS Design Aspects:– SNR sensitivity (or effective rate) targeted for ~15 dB lower than the sensitivity

point of 1Gbps data rate (i.e. the beamforming gain).– Use single carrier with much lower rate.– Refer to [1].

Slide 8

May 2010

Hongyuan Zhang, Marvell et. al.

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Submission

Common Preamble Introduction

• Preamble is the beginning part of a PPDU—used for packet detection, AGC, frequency/timing synchronizations, channel estimation, and signaling of PSDU modulation (SC/OFDM/CtrlMCS).

• Regular SC and OFDM MCSs share a common preamble:

– Better support of the coexistence between various types of devices

– Each device (especially Dual-Mode device) need implement only one packet detection/synchronization/channel estimation mechanism.

– Appropriate auto-detection and re-sampling mechanism are required.• Given that OFDM and SC Data portion uses different sampling rates.

• PPDU with Control MCS uses a longer preamble with similar design as SC/OFDM MCSs:

– Target on lower SNR sensitivity.

– Appropriate auto-detection between Control MCS and regular SC/OFDM preambles is needed.

Slide 9

May 2010

Hongyuan Zhang, Marvell, et. al.

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Submission

I. Common Preamble for SC and OFDM

• PPDU and Common Preamble general frame formats:

May 2010

Hongyuan Zhang, Marvell, et. al.Slide 10

Preamble Header Payload

SC or OFDM Mod

Short Training Field (STF) Channel Estimation Field (CEF)

• Preamble is composed by STF and CEF:– STF used for packet detection, AGC, frequency/timing synchronizations.– CEF used for channel estimation and SC/OFDM mode auto-detection.– Details see subsequent slides.

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Submission

Preamble Composed by Golay Complementary Sequences

• Preamble is composed by repeated 128-chip complimentary Golay sequences, denoted as Ga128/Gb128.– GU512/GV512//GV128 are composed by Ga128/Gb128.

– Golay sequence is used due to its good auto-correlation property, and simple correlator structure.• Composed by adders and shifters, no complex number multipliers

required.

– Chip-level π/2-BPSK modulation achieve constant envelope with appropriate filter design.

Ga128 -Ga128

STF, 15 periods (1920 chips) CEF, 1152 chips

… GU512 GV128GV512Ga128Ga128Ga128 Ga128

Hongyuan Zhang, Marvell, et. al.Slide 11

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Submission

STF

• Packet detection, AGC convergence, frequency synchronization and timing synchronization need to be conducted through STF.– Appropriate symbol timing accuracy and frequency offset is required

before entering channel estimations.

• 15 repetitions of Ga128 is a good tradeoff between PPDU efficiency and preamble detection/synchronization sensitivity.– Preamble det/sync SNR sensitivity matches those for decoding Header,

and Payload with MCS1.

Ga128 -Ga128

STF, 15 periods (1920 chips) CEF, 1152 chips

… GU512 GV128GV512Ga128Ga128Ga128 Ga128

Hongyuan Zhang, Marvell, et. al.Slide 12

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Submission

CEF

Ga128 -Ga128

STF CEF

GU512 GV512

… -Ga128 Gb128 -Ga128-Gb128 Ga128 -Gb128 -Gb128-Ga128-Gb128

Gv128

Postfix of GV512

Prefix of GU512Prefix of GV512 Postfix of GU512

SC:

OFDM:

Ga128 -Ga128

STF CEF

GU512 GV512

… Ga128 -Gb128 -Ga128-Gb128 Ga128 Gb128 -Gb128Ga128-Gb128

Gv128

Postfix of GV512

Prefix of GU512Prefix of GV512 Postfix of GU512

Hongyuan Zhang, Marvell, et. al.Slide 13

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Submission

CEF—Discussions • Frame Delimiter can be realized by either detecting the sign flip at the end of STF,

or detecting GU512 in CEF.

• GU512/GV512 are a pair of Golay complementary sequences, and are composed by Ga128/Gb128.

• GU512/GV512 are with 128-chip cyclic prefix and postfix in an overlapping format.– Interference free time or frequency domain channel estimations can be

realized.

• Zero side lobe of length 256 around the main tap.

• SC/OFDM Auto Detection.– Required for Header/Data processing.– Realized by swapping GU512/GV512 sequences in SC and OFDM PPDUs.

Hongyuan Zhang, Marvell, et. al.Slide 14

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Submission

Preamble Sampling

• The preamble defined above is based on SC chip rate (1760MHz [1]).

• OFDM Header and Data are sampled with clock rate 2640MHz (3/2 of SC clock) [2].

• Resampling of 3/2 is required for transmitting the common preamble in a OFDM modulated PPDU.– 3x upsampling go through a resampling filter hfilt 2x

downsampling– The TGad spec needs to define hfilt, so that receiver may recover

the appropriate channel estimations.• hfilt with a frequency response satisfying the OFDM transmit mask.

Hongyuan Zhang, Marvell, et. al.Slide 15

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Submission

II. Preamble for Control MCS

• Repeated Gb128 in STF (v.s. Ga128 in SC/OFDM preamble) for reliable auto-detection between Control MCS and regular SC/OFDM MCSs at low SNR.

– Control MCS needs to conduct a sync process different from regular SC/OFDM, for lower SNR target and longer delay channels.

• Longer STF for lower SNR sensitivity target and longer delay channels.– 40 periods is a good tradeoff between efficiency and preamble

detection/synchronization sensitivity.– The preamble detection/sync SNR sensitivity matches that for decoding CP

Header and Payload.

• CEF with the same format as in regular SC PPDU.

May 2010

-Gb128 -Ga128

STF, 40 periods (5120 chips) CEF, 1152 chips

… GU512 GV128GV512Gb128Gb128Gb128 Gb128

Hongyuan Zhang, Marvell, et. al.Slide 16

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Submission

III. Golay Complementary Sequences (GCS)

• Length-128 GCS and length-512 GCS are chosen for STF and CEF respectively, for the best tradeoff among efficiency, correlation complexity, signal acquisition sensitivity (especially for low rate packets), and channel estimation quality (especially for high rate packets).

• Choosing the GCS:– Prefer to choose Golay Code Ga128 with zero-DC after chip level π/2 rotation (i.e. the STF in

regular SC/OFDM MCSs).

– Prefer to choose GCP Ga128/Gb128 with large zero correlation zone (e.g. 64 taps) around the main tap.

– Delay units Dn are chosen to minimize the memory size.

– The GCP :

• D7 = [64 32 16 1 8 2 4], W7 = [1 1 1 1 -1 -1 1].

Hongyuan Zhang, Marvell, et. al.Slide 17

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Submission

Shorter GCS Choices

• A Ga64 code is needed for the GI insertions in SC MCSs [1]; and a Ga32 code is needed for data spreading in the Control MCS [1].

• Choosing the shorter GCS:– Use a subset of the delay vector D (reuse correlator hardware), with

different coefficient W vectors.

• To get Ga64, D6 = [32 16 1 8 2 4], W6 = [-1 1 1 -1 1 -1].

• To get Ga32, D5 = [16 1 8 2 4], W5 = [-1 -1 1 1 1].

– Guarantees good correlation properties between preamble and shorter GCS codes in SC data portion.

Hongyuan Zhang, Marvell, et. al.Slide 18

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STF Cross-Correlations (AWGN)

Regular SC/OFDM STF Xcorr with Ga128: Ctrl MCS STF Xcorr with Gb128:

Hongyuan Zhang, Marvell, et. al.

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CEF Cross-Correlations (SC@AWGN)SC CEF Xcorr with Gu512:

SC CEF Xcorr with Gv512:

Example CE Output (256 taps)

Hongyuan Zhang, Marvell, et. al.

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Submission

Conclusions

• A Common preamble proposed for different PHY modes.– SC and OFDM MCSs share the same preamble structure.– Control MCS uses a longer preamble with similar STF and CEF

structures.

• Complementary Golay spreading codes are applied in preamble to simplify receiver processing.

• Appropriate auto-detection among different modes are also proposed.

May 2010

Hongyuan Zhang, Marvell, et. al.Slide 21

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References

• [1] 11-10-0429-r0 “TGad SC PHY”

• [2] 11-10-0440-r0 “TGad OFDM PHY”

• [3] 11-10-0430-r0 “TGad Beamforming”

Hongyuan Zhang, Marvell, et. al.Slide 22