Digit Concept

SESAMEthermalTM

SESAMEmechanicalTM

SESAMEDUOLASERTM

SESAMEendptTM

SESAMEACIDTM

SESAMELASERTM

SESAMEplasmATM

SESAMEplaserTM

DECAPSULATION GUIDE

A GREEN WORLD WITH DC - LESS ACID - LESS CF4 - AND ALL FOR YOUR FUTURE IC PACKAGES

REALASE 1

OUR HISTORY IN SHORT Since 1992 DIGIT CONCEPT has been supplying tools for semiconductor Failure Analysis.

DIGIT CONCEPT invests considerable time and effort in the development of new and innovative tech-niques for the semiconductor industry, but also in developing new techniques and improvements for existing technologies.

DIGIT CONCEPT offers the following:Extensive knowledge of Failure Analysis:

- All techniques used before and after IC decapDecapsulation Knowledge:

- 12 years experience with LASER decapsulation- 20 years experience with ACID decapsulation - 20 years experience with PLASMA decapsulation- Worldwide Support: 7 Sesame Labs

Technology Leader:- 12 international scientific papers- German and USA quality and robustness

INNOVATIONWe do more than just develop new techniques or improve existing ones for the FA and reliability world. We scientifically verify results and share the data via the articles we publish with our clients at ISTFA, IPFA,ESREF,EPTC,IMAPS,etc ...

KNOWLEDGETo be closer to the needs of our Customers, we distribute the equipment and techniques needed both before and after Chip Access.

Do not hesitate to contact us concerning any unresolved cases you may have in your laboratories. To this end we have 7 expertise centers around the world READY to help you with the techniques we currently use and those that we continue to develop.

“We will have many othernew Sesame Productsin the near future.”

However, it is possible to be the best at understanding the actual needs for today’s decapsulations of IC packages, the needs of the future, as well as the needs for those tech-nologies that have been in existence for some time.

That is why we have become a fabless company, which allows us to focus on the techniques of decapsulation, devel-oping the equipment necessary for the task through collabo-ration with the leading manufacturers in each of the 4 ways of decapsulation.

With 20 years of experience in IC decapsulation, a young international team of experts, and an understanding of the needs of our clients, we have become the leader in decapsu-lation in just a few years.

It is not possible for one company to be the leader in chemical decapsulation, plasma, mechanical techniques, and laser ablation.

Veronique PoulainCEO2

SUMMARY

SESAMEACIDTM

S707 Acid Decapsulation system for traditional packages .................................................................P. 8

S777Cu Acid Decapsulation system for traditional packages and copper wired devices ................P. 9

SESAMElaserTM

S500BASIC SesameLASERBASIC TM (TableTop) ................................................................................................P. 14

S500ULTRA SesameLASERULTRA TM (TableTop) ...............................................................................................P. 15

S500GEL SesameLASERGEL TM (TableTop) ....................................................................................................P. 15

S1000 SesameLASER TM (TableTop) ............................................................................................................P. 16

S1000FS SesameLASERFS TM (Free-Standing) ..............................................................................................P. 16

SESAMEDUOLASERTM ...............................................................................................................................P.17

S3000 For SESAME1000FS TM Plus an additional UV LASER (355nm), or Green LASER (532nm), or other wavelengths and impulsion time (on demand).

SESAMEplaSMATM

FA2000P SesamePLASMADCAP TM ..................................................................................................................P. 24

S2001FS SesamePLASERFS TM Free-Standing................................................................................................P. 25

S210 SesamePLASERRIE TM .........................................................................................................................P. 26

OTHERSESAMESESAMECLEANER TM

S101 Spinner for the cleaning IC between backside processing steps ..........................................P. 28

SESAMEGASKETMAKER TM

S4101/410 GASKETMAKER and PLATEMAKER for Acid Decapsulation Systems ....................................P. 28

SESAMETHERMAL TM

S601 - SesameCOLDMOUNTPLATE™ .................................................................................................................P. 30

S610 - SesameHOTMOUNTPLATE™ ...................................................................................................................P. 31

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We support our FA industry

Since 1992 in Europe and since 2001 in USA and ASIA

Winner of the iPad ISTFA 2010Steve Chun from Boeing Company

Winner of the iPad ISTFA 2011Eugene Capito from Analog Devices

Winner of the Ipad IPFA 2012 Lau Chee Kiang INFINEON

Rep Trainning Shanghai March 2012

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Since 1992 in Europe and since 2001 in USA and ASIA

WORK TOGETHER

DO NOT FORGET Cannot access die with :

• Laser (backside or frontside)• Mechanical (frontside)

Use to reach the die :• Chemical wet (acid)• Chemical dry (plasma)

For power package :• Do a pocket with :

- Mechanical- Laser

For copper wires :• Do a pocket with laser and use

a special mixture @ 10°C

ELECTRICAL & THERMAL TESTS Artifacts… Do not forget to make electrical measurement before and after a decapsulation. With decapsulation you will have some possible artifact, acid, Plasma, Thermal reactions. But also Mechanical due to the relaxation of the die and wires. So an electrical test after a thermal curing at the temperature of the Acid or Plasma decap will help you to understand the artifact you can have.

The most important people, your Customer Service Team. So two more : Falk Donner for Europe and Peter Pan for Asia

TECH TIP

TECH TIP

7 EXPERTISE CENTERS22 INTERNATIONALDISTRIbuTORS & REPRESENTATIVES

COLLAbORATIONThis Guide is yours. Do not hesitate to send your comments and Tips. We will be happy to integrate it into this guide.

DC bLOGAn idea, a request to modify some part of DC Equipment, you have a special case you want to share with our community…

…Our Best DC Specialists and Manufacturers will answer you.

FAST SERVICESpeed is not limited in Germany, but we are also very fast for service in any other country

FuLL WORLDWIDE SERVICE- Preventive and Curative maintenance.

- Service centers in 3 continents.

- Maintenance Contract : light, Standard, Full

- To optimize your maintenance Budget, maintain all your DC equipment in one service visit.

TRADE-IN OR uP-GRADE

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Selection guide for FA EquipmentPurpose Method Specification SESAME500 SESAME1000 CommentsEMC Laser Decap. Laser output : > 8W Table top Stand alone Platform

Y Y Various EMC removal(Power device, No damage on Cu metals, SI Cutting, PCB cutting, Ceramic decap, etc)

Y Y Laser power, Hatch, Speed, ablation depth reference

Normalized of the Laser output Pulse Y Y Remove of first irregular pulse

Laser beam scanner Y Y LSM(Laser scanning mirror) with 112mm x 112mm scan range

Vision system Manual Motorized 10X Zoom (Manual) OR 12X Programme Zoom (50mm x 50mm field)

Stage (Motorized focus) N Y Automatic

Stage (Motorized) N Y Automatic. In option XY + R Base with Removable Rotating Table

Extraction Suction of fumes and particles Y Y Small, Low Noise : < 65dB,easy to install and move

Industrial grade PC Y Y Robust

Hall decap. Y Y X-ray, SAT image insert and overlap for design

Laser X-section N O Second dedicated LASER in option

Safety Y Y Laser protection glass, Interlock, etc

Others N Y Upgrade possible for Plasma option, Cooling, End stop, etc

Pictures Clear edge Small sample

Purpose Method Specification LaserPLASER LaserPLASMA CommentsEMC Cleaning Plasma

Decap.Platform Integrated with Laser Standalone No Acid use

Etch gas Y Y 3 MFC ( CF4, O2, Ar)

Target materials Y Y EMC, Polymer removal

Filers Blast Y Y N2, CO2 gas

Plasma Source Y Y RF 13,56 MHz

RF Power & Matching Y Y 300W

Temperature control of the chuck Y Y Room temp to 100℃

Pictures Plasma cleaning after laser decap.No Chemical Si etch(SF6)

Purpose Method Specification SESAM707 SESAME777Cu CommentsEMC Cleaning Chemical

Decap.Chemical Mix Y Y Nitric and Sulfuric acid

Temperature control Ambiant~205°C 10°C℃~250°C 10℃ for Cu wire

Chemical injection Y Y From Bottom to Top

Recipe control Y Y Chemical mix, Temperature control, etch, Rinse, Purge

No. of recipe Y Y Up to 100 (1, 5:1, 4:1, 3:1, 2:1, 1:1 etc)

Dynamic etch Y Y Forward & Backward chemical flow

Chemical drain Y Y Automatic

Repeatability Y Y Very good, No residual chemical in the chemical path of the tools

Safety Y Y Leak detection sensor( 3 points)

Fume removal Y Y Automatic by recipe, Low pressure tank

Small foot print Y Y Possible to set up in the fume hood

Easy to use Y Y One touch

Pictures No Damage on Cu wires, Bondings

Purpose Method Specification FA2000RIE Option CommentsDeprocessing (Delayering)

Plasma etch Platform Standard Option

Etch gas 2(CF4, O2) 4 (CF4, O2, Ar, CHF3) Optionally up to 6 gas (???, Cl???)

Target materials Y Y Passivation(Si3N4, SiO2, polyimide)

Plasma Source Y ICP

RF Power & Matching Y 300W

Temperature control Y 0 - 125°C

Sample size 150mm 200mm

EPD option Y OES

DC bias Y

Separated pressure control Y

Oil trap Y

Vacuum pump Y Included

Pictures Comparison between before and after delayering of Passivation Layer

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Automated Dual Acid IC Decapsulator - innovative software - dynamic etch time adjustment - multiple acid rinse options - smallest footprint

SESAMEACIDTM

S707 (Ambiant tempeture to +250°C)

SESAME707, A NEW TOOL ?

Yes, and No! The first patent for decapsulation apparatus was granted to Burt Wensink in 1982. At that time he worked for National Semiconductor. This patent was in turn licensed

to Bert Wagner who developed the first commercial acid decapsulator. From his pioneering approach to IC package decapsulation until now there have been only a few minor improvements, but no real breakthroughs in decapsulator

design - until now.

Kirk Martin, now with RKD Engineering, has patented many tech-niques with IC decapsulation. His first patent was awarded in 1998.

The most recent patent is pending for current technology improve-ments (2010). Kirk Martin, from RKD Engineering, introduced the

EliteEtch early in 2000. This unit utilized new pump technology, de-veloped by Mr. Martin that achieved substantially greater turbulence

in the etched cavity, thereby reducing both process times and acid consumption. RKD Engineering also pioneered the use of a cooling system for the waste acid allowing the use of a single waste bottle.

This design has been in use for many years.

S777Cu (+10°C to +250°C)

ABOUT SESAME777Cu

As you may know DIGIT CONCEPT published its first technical paper at IMAPS2003 with the Freescale France Team researching

problems with Aluminium Corrosion following chemical decap-sulation. This was the beginning of our studies and the impetus

for exploring lower decapsulation temperatures. For a long time we used 44°C, then 27°C in order to preserve copper bond wires.

A few years ago we have been working on trials with sub room temperature acid decapsulation. The results were very promising.

The S777Cu Dual Acid Decapsulator is the result of our work in this area with Kirk Martin. RKD Engineering has patented this technique.

• More than 100 SesameACID in worldwide from 2007

• 3 Technical Paper and 5 WW Chapter event presented (ask for your free copy)

• In 7 years never a pump or a heat exchanger down.

• Ask for your application notes

20 years experience with ACID DECAPSULATION

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In collaboration with

SESAMEACIDTM

Versatile System Configuration

HANDHELD KEYPAD Operational simplicity results not only from software that continually checks and protects the system against opera-tor error, but control from the Handheld Keypad is simple and intuitive. Anyone who can use a mobile phone can run a S707 Decapsulator. The remote control can be placed outside of the Fume Hood increasing the life time of the electronics parts and increasing the safety of the operator.

Fume Hood space is always at a premium so we have designed the smallest footprint in the industry while enhanc-ing every possible safety feature. The incorpora-tion of a separate heat exchanger for cooling

waste acid below 90oC permits this size reduction. Now we only need a single waste bottle.

LookAhead software eliminates the danger of waste bottle overflow by preventing operation of the S 707 if the waste bottle does not have sufficient space in it for the pro-grammed etch process to complete.

FIXTuRES AND ACCESSORIESS707 can use all the accessory kits, gaskets and align-ment plates. However, for significant cost savings and the advantage of always having the ability to design and cut gaskets for each and every package type, we recommend to use our material sheet. You can easily produce your gasket with the SesameLASER, or by our large choice of standard Gaskets and alignement plates.

DIGITAL PERISTALSIS PuMPINGS707 employs an unique solution to ensure precise pumping of corrosive acids. This revolutionary design, of a multi-chamber fluid-metering module is protected by patents pending for its inventor Mr. Kirk Martin

SAFETY COVER PNEUMATIC RAM NOSEPRESSURE TRANSDUCER

SILICON CARBIDE ETCH HEAD

BOTTLE SAFETYCABINET

WASTE ACID HEAT EXCHANGER

LOW PRESSUREGAS RESERVOIR

NITROGEN GAS INLET55 to 75 Lbs

HEAT EXCHANGER

MULTI-SOURCE PUMPASSEMBLY

S707 Ambiant Temperature to +250°C

OpenSafety cover open to show ram nose linear motion of travel that eliminates the possibility of package/gasket movement so often found in other systems where the ram travels through an arc

SAFETY COVER The device hold down assembly (ram nose) is pneumati-cally activated and is designed for a large amount of travel. The ram nose is normally retracted and only ex-tends after the safety cover is fully closed. The vertical movement of the ram nose secures the device to the etch head thus eliminating movement of either the package or its fixturing.

ClOsed Safety cover closed, to show closure onto cover seal that eliminates the

problem so frequently found in less sophisticated designs.

SAFETY COVER ERROR

SCHEMATIC OF SYSTEM PLuMbING

GASKETS You need a specific gasket or alignment plate… But you do not own a SesameLASER and you do not want to wait 3 weeks ! See our SesameGASKET MAKER

TECH TIP

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S777cu +10°C to +250°C

THE FIRST ACID DECAPSuLATOR MADE FOR COPPER… buT NOT ONLY

The S777Cu is an Automated Mixed Acid Decapsula-tor based on S707, with advanced feature integration to enable high productivity. This Decapsulator rapidly and easily opens even the most delicate packages by delivering precise, micro-aliquots of nitric, sulfuric, or acid mixes to the package with no sample damage.

The delivery of each micro-aliquot is done with sufficient pressure to create extreme turbulence in the etched cavity that greatly accelerates the rate of encapsulant removal. Very low, precise acid temperatures, combined with high micro-aliquot delivery rates allow for the decapsulation of copper wired devices with no wire or metallization dam-age.

An exclusive acid delivery function can be selected that de-livers the highest pulse rate possible while consuming less than maximum acid volume. The specially designed acid heat exchanger can accurately control acid temperature down to 10°C and up to 250°C, with flow rates to 8 ml. per minute. The high acid pulse rates achieve reasonable etch times even at the lowest temperatures.

The monolithic etch head is machined from premium grade silicon carbide for unsurpassed acid resistance. The etch head is designed to reduce the fuming of any residual acids left on the etch head at the end of the process.

AbOuT THE uSE OF A LASER FOR PRECAVITATION

In order to reduce the chemicals etch time. We have co-pub-lished 9 articles on this subject (ISTFA, IPFA, ESREF, etc.).

As a result of our research, the required use of +250°C for decapsulation of thermal plastic parts 20 years ago has been reduced to +10°C today!

WHAT TEMPERATuRE DO I HAVE TO uSE FOR LASER PRECAVITATION?

IT DEPENDS ON THE FOLLOWING:

- EMC (Epoxy Molding Compound),- Percentage of Glass ball filler in the EMC (93% or more), - If the copper wires have Pd coating or not, - With or without prior LASER ablation, - Acid types Used such as HNO3 98%, H2SO4_20%SO3 ... - Residual water in the package and in the Acids used- The rinse recipe

As such, many parameters can affect the sample and the choice of decapsulation and precavitation techniques.

888 The goal is to remove the surface material (50μm) to either reduce the opening time at a given temperature, or decrease the temperature for the same opening time with less acid.• Use an 800 Grid Paper• Do a 8 with the side to open on the grid paper• Do this 8 times

888

TECH TIP

Tem

pera

ture

YearsIn the past

85°C

255°C

<65°C

44°C

27°C

15°C10°C

In 2003 Today

IMAPS2003 FREESCALE Digit Concept

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WARRANTY Subject to Engineerings Standard Terms and Conditionsof sale. All parts are warranted for a period of 24 months to be free of defects in material and workmanship when used under normal operating conditions and when recommended preven-tative maintenance is properly performed.

SESAMELASERBASIC f TableTop Equipmentf Sesame1000 LASER qualityf Cost-effective and Upgradeable

to 1000 or other

GENERAL SPECIFICATIONDImENSIONS - (W x D x H) Decapsulator 7.5 x 12.5 x 12 inch 190 x 318 x 305 mm Bottle Assembly 10 x 5 x 11 inch 254 x 127 x 279 mm

WEIGHT f approx. 35 lbs.(16 Kg) GAS f 5 bars 70 psi. (N2) or CDA dew point of -40°C

POWER SOURCE f 90 to 250 VAC ACID TEmP. RANGE f Sesame 707 f Room temp + 5°C to 250°C f Sesame 777Cu f + 10°C to 250°C

ACID TEmP. SET POINT f 1.0°C ± 0.1°C ETCH CAvITy (UP TO) f 22 x 22 mm

SOFTWARE OPERATIONAL SPECIFICATION

ACID SELECTION f fuming or concentrated sulfuric acid f fuming or concentrated nitric acid f mixed acids nOTe: All mix ratios are dynamically prepared within pumping assembly

ACID mIx RATIOS f 6:1, 7:2, 5:2, 9:2, (nitric to sulfuric ratios) other on request

POST ETCH RINSE OPTIONS f fuming sulfuric acid f fuming nitric acid f mixed acids f no rinse nOTe: Acid rinse temperature settings are automatically calibrated to etch temperature

ETCH TImES f 1 to 1,800 seconds, in 1 sec. increments nOTe: Etch time can be dynamically adjusted during etch process

ETCH mODALITIES f Pulse Etch, f Reciprocating Etch - Acid Pulsation nOTe: REAP is a superior approach to maximizing the carrying capacity for the etch acid(s) within the package volume. It allows superior etch characteristics when nitric acid or mixed acids are selected.

ETCH TEmPERATURE RANGES

Sesame 707 Sesame 777Cu f Room temp to 90°C f +10°C to 90°C (nitric acid) f Room temp to 250°C f +10°C to 250°C (sulfuric acid) f Room temp to 100°C f +10°C to 100°C (mixed acids)

ETCHANT vOLUmE f 2 to 8ml per minute in Pulse mode 1 to 4 ml per minute in REAP mode

OPERATOR PROGRAm f 100 programs STORAGE f stored to non-volatile memory

SOFTWARE UPGRADES f via RS232 or USB

SAFETY DESIGN FEATuRES EmO EmERGENCy POWER OFF SWITCH

ETCH HEAD SAFETy f over temperature sensor circuitry in standard

LEAk DETECTION SENSORS f Decapsulator Body

f Bottle Box Assembly

SECONDARy CONTAINmENT f Real Secondary Containment

ACID FUmE REDUCTION f Waste Acid Heat Exchanger to

minimize acid fuming

CERTIFICATIONS & f RoHSINDuSTRY COMPLIANCE f CE f SEMI S-2 f SEMI S-2, 93

SYSTEM MAINTENANCE

Routine system maintenance of the Sesame 707/777Cu is simplicity itself. By selecting maintenance routines from the handheld keypad controller most maintenance routines can be run, including f Temperature Calibration f Optical Leakage Sensor Calibration f Valve operation f Ram Nose operation f Low pressure gas supply and vent functions

Sesame 707/777Cu uses no pressure regulators at all, it just con-nects directly to a nitrogen gas line at 5 bars (70 psi.).

In cooperation with : Your Rep in Americas :

SESAMEACIDTM

S707 S777cu System Specification

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Your Rep in Americas :

SESAMElaserTM

S500BASIC SesameLASERBASIC 500

(TableTop)

S500GEL SesameLASERGEL 500

(TableTop)

S500ULTRA SesameLASERULTRA 500

(TableTop)

S1000 SesameLASER 1000

(TableTop)

S1000FS SesameLASERFS 1000FS

(LASER IR)

SESAMEDUOLASERTM

S3000 An SESAME1000FS Plus an additional

UV LASER (355nm), or Green LASER (532nm),

or other wavelengths and impulsion time (on demand).

12 years experience with LASER DECAPSULATION


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SESAMElaserTM

LASER decapsulationThe SesameLASER is the standard LASER ablation system that enables pre-decapsulation of packages.

Security is not in option for us. The suction unit we deliver in standard is a very good one with many protections for the Users and very quiet.

Our experience with laser decap dates back to 2001, al-lowing us to confidently say that there will be no damage to bond wires (Au, Al, Cu) and no artifacts during LASER decapsulation. Many papers describing this have been written by our Customers.

OTHER uPGRADE OPTIONS INCLuDE:A plasma option can be integrated (if requested) turning the SesameLASER into a SesamePLASER for which we have a Worldwide patent.

SesameDUOLASER (second LASER wavelength for Cross Section, other ablation material like Glass, PCB …). The option SesameENDPT (End point detection) will also be adaptable to the S1000 in the near future. The option SESAMECOLDMountPLATE (Temperature Control with a TEC). And other… see options.

Many other LASER ablation recipes have been developed for all types of applications from the manufacturing of gaskets for JetEtcher, to the ablation of ceramic packages in the case of IC prototype, etc.

KEY APPLICATIONS FOR THE SESAMELASER. WHY GO TO LASER• Reduce time to opening• Reduction of the consumption of acid and the related risks.• Allows removal of all the resin on the surface of a package (BGA for

instance) which is impossible with wet chemistry.• Lower temperature final clean up with chemical decapsulation. This is

done at 40°C, or even 27°C and now 10°C ! which induces much lower thermal stresses.

• No more “wrapping in aluminum sheet” during manual opening and no more specific gaskets (opening shape).

• Single bonds can be revealed (Gold, Cu, Aluminum)• Marking and machining of other materials• Pre-thinning in Back-Side of ceramic packages• Numbering of the samples• Pre-cavitation of power devices• Circuitry can often be revealed without acid• Complex-shaped cavities can be made• Exposure of components without damage of Al, Cu, Au bondings• For applications requiring subsequent acid clean-up, low temperature, low corrosion conditions can be used.• Glob top removal (flip chipped or wired dies on PCB or ceramic)• Gaskets Maker• Cross section preparation• Bonding cut• Thin PCB cut• Small cavity allowing visual check on a wire or on PCB or on stitch• Full BGA/QFN... decap down to PCB• Glued cover glass removal (ceramic package)• Silicon frame preparation (polishing preparation to decrease edge effect)• Disassembling of complex mechanical assembly by surgical cuts (motorized lens in front of ccd sensor, MEMS...)• All bonding access for shear test• Allows reduced temperatures for wet decap and shorter

opening times for Dry decap.• Decap onto Hybrid Module• … a real Swiss knife

Contact revealed on a memory stick (still active)

Pre-decapsulation of a package . The remaining 100μm of resin on the Die will be removed with a mixture of H2SO4/HNO3 at 44°C.

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SESAMElaserTM

In collaboration with :

THE NEW FEATuRES INCLuDED :Hardwares

• Programmable XY table• Holding Fixture W/ Tilt Feature• Real Time Color Vision System W/ 12X

Programmable Zoom• High Resolution Camera• Cold Plate and Cool Blast• Auto-Stop Vision System• Gel Removal

Software• New failure Analysis Pro Software• Fully automatic Calibration routine• Teach mode create a sequence inside a program

The two leading manufacturers in the world of decapsulation by LASER ablation equipment are uniting their R&D efforts in order to present the new range of SesameLASER™ 2013.

The new range of SesameLASER™ integrates the best of hardware and software from CLC and DC, employing the same LASER source used for all the studies carried during the past 12+ years by DC, with 12 technique papers published at ISTFA, ESREF, IPFA, EPTC, IMAPS, …

The SesameLASER are protected by the patents 7,271,012 • 4,843,488 • ZL200480022971.0 • 1-2006-500131 • 2008090281A1 1

UPGRADE As always, we take care about your previous investissement. You can upgrade your previous SesameLASER generation if elegible… or… trade-in.

TECH TIP

• 132 SesameLASER in WW from 2007• 11 Technical Paper and 5 WW

Chapter event presented (ask for your free copy)

• ask for your application notes

ALL SESAME LASERFAILURE ANALYSIS FIRMWARE SUPPLIED, CONTROL UNIT

- Machine vision of component prior to ablation- Data import function (X-Ray or Sam images, co-ordinates)- Functions for alignment (right, left, symmetrical, or justified)- Mirror effect, extend, compress, shift and free choice

of the positioning angle- Multi-GB HD / DVD Read-Write / USB Port

LASER SOURCE, BEAM DÉFLECTION SYSTEM- Sealed IR Laser Module enclosed in a CDRH Class I Workstation - High accuracy galvanometric system with variable focal distance,

interchangeable- Marking area dimension : 112 x 112 mm. Motorized Z-axis

LASER RADIATION SAFETY CABINET, DRAW UP DEVICE FOR INORGANIC AND METAL PARTICLES

- Compact design, small footprint (conforms to Class 1 LASER)- Draw-up Included: pre- filter and main filter for floating particles with

automatic dust removal through the filter.

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S500BASIC

KEY APPLICATIONS- Encapsulant removal from ALL types

of packaged device- Decapsulation and Cross-sectioning of PCB’s- Pre-cavitation of power devices- Multi decap on IC Tray

PRODuCT HIGHLIGHTS- Circuitry can often be revealed without acid- Complex-shaped cavities can be produced- Exposure of components without damage of Al, Cu, Au- In subsequent acid clean-up operations, low tempera-

ture, low corrosion conditions can be used.

SOT-223

SESAMElaserTM

3 STEPS• pre decap, • decap, • post decap.

All these steps are important. Do not undervalue any of them !

TECH TIP

S500 Laser Ablation System has been specifically designed for effective de-capsulation of IC packages, containing either a single die or multiple die.

At the system’s heart is a Sealed IR Laser Module enclosed in a CDRH Class I Workstation.LASER, which is housed inside a chamber to provide full protec-tion from LASER radiation, in compliance with applicable VBG 93, DIN EN, and CE standards.

The integrated optical vision system provides constant sample monitoring. A previously- taken X-Ray or an Acoustic Microscope image can be superim-posed onto the SESAME’s live component image to provide additional data for successful decapsulation.

SESAME 500’s intuitive Failure Analysis software incorporates drawing tools for definition of the material to be removed which can be draw onto the component image. The actual amount of material removed can be mea-sured by camera focal-depth techniques or by using an external mechanical indicator.

The system’s firmware controls all process parameters such as power, fre-quency, scan speed, focal distance…

All process parameters can be stored by specific component and product family for easy recall.

Following laser ablation, the die surface can be revealed with a low temper-ature wet etch, applied either manually (with a suitable dropper) or auto-matically (with an automated acid decapsulation machine), avoiding electric and mechanical alteration of the component.

LASER Ablation of a power device.The 100μm of resin will be removed

with H2SO4 at 80°C

Ceramic backside opening

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SESAMElaserTM

S500ULTRA

S500GEL

The S500Ultra utilizes and incorporates industry standard testing methods to solve the problems faced everyday in the Semiconductor Industry. The S500Ultra utilizes a patent pending multi wavelength Laser process in conjunction with the latest Alpha Spectrometry. The S500 Ultra provides a multitude of safe and economical processes.

The operator can remove the entire compound, individual layers (operator determines layer thickness) or sections of the mold compound (operator defined).

Laser decapsulation system engineered with a patent process specifically for the removal of different types of gel encapsu-lants from the surface of an integrated circuit.

Unlike anything on the market today, the S500GEL laser decapsulation system will remove just about any type of gel-based mold compound found on even the most durably-built samples. Seen frequently in the automotive manufacturing industry and United States Military and Defense sectors for its robust and hermetic-sealing properties, historically speaking gel encapsulant has been notoriously difficult to remove by other means. The S500GEL decapsulation system puts an end to this problem with its proprietary gel removal tech-nique not seen in any other system; only the S500GEL laser decapsulation system can perform this elite function. In liter-ally seconds, the S500GEL can remove that pesky gel mold compound so that you can be on your way with your testing. Whether that testing comprises failure analysis or counter-feit detection, the die will retain complete functionality and remain in perfect condition — as if it had just been scribed from its wafer.

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SESAMElaserTM

S1000

S1000FS


Based on S1000 FS with more space inside for all options available such as plasma end decap (SESAME PLASER), additional LASER source for efficient cross sectioning (S3000) and automatic LASER end stop (S4000). All these options can be integrated into SESAME 1000 FS, making it a turnkey system for TOTAL DECAPSULATION.

Imagine an equipment with all the future techniques available. S1000 is the one. The single wavelength will be your only limitation.

Many options will be fully retrofittable at your site.

- PLASMA OPTION.Incorporates Mutual Patents and IP developed by CNES, DIGIT CONCEPT SA and BSET EQ

- THE MOST uSED AND MOST PubLISHED

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WHAT ARE THE DIFFERENCES bETWEEN ?

SESAMEDUOLASERTM

S3000

ALL WAVELENGHTS, AND PuLSE DuRATION ARE AVAILAbLE

CHOOSE YOUR SECOND LASER WAVELENGTH FOR... - IC Cross-Sectioning - Bond and PCB Cutting

An S1000 FS with an additional UV LASER (355nm), Green LASER (532nm), or other wavelengths and impulsion time at the begenning.

SESAME LASER ON REQUESTYou need a special one… we can do it!

TECH TIP

S500BASIC S500GEL S500ULTRA S1000 S1000FS S3000High Accuracy Frame N/A O N/A y y y

FS (Freestanding with legs) O O O y y y

10X Zoom (Manual) y y N/A N/A N/A N/A

12X Programmable Zoom (50mmx 50mm field) O O y y y y

X -Y Automatic Tables N/A N/A N/A O O y

Programmable Z (Laser moves) 200mm N/A N/A y y y y

Programmable Z (Part moves) O O N/A N/A N/A N/A

Cross Section Module (Req. Prep for 2nd Laser) N/A N/A N/A N/A O y

High Res (5X) Imaging N/A O O O O O

Prep for 2nd Laser N/A N/A N/A N/A O y

Intelligent Vision System (Auto Stop) N/A N/A O O O O

N/A Non Applicable O Option y Included 17

VISUALIzATION BY MPIxEL CAMERA

A very accurate system of aiming enables to positionon the electronic component, the area that will be decapsulate. Real Time Color Vision System W/ 12x Programmable zoom.

x AxIS CONTROL & x-Y SAMPLE HOLDER (SESAME1000 ONLY)

Programmable z-AxisHolding Fixture W/ Tilt Feature

STANDARD EquIPMENT FOR SESAmE 1000

SESAMElaserTM

The workstation support base is of a solid mechanical construction; fabricated from rugged aluminum components. Combination vibration/isolation/leveling mounts support the base at each corner.

A universal chip holding fixture is mounted in the work handling area. The Z-axis provides approximately 3” of vertical adjustment, allowing the chip being processed to be positioned at the focal point of the laser.

A vision system is mounted to the laser scan head, which will provide a co-focal, co-axial view through software. The camera is positioned to view an area which is on the same center line as the focused laser beam.

The work handling area is enclosed to comply with CDRH specifications for Class I laser systems. In compliance with CDRH specifications the laser assembly and work handling area are totally enclosed.

A door provides an opening, for access to the working area; for convenient parts loading, unloading, access for maintenance and part alignment. The enclosure door is electrically interlocked to the laser, inhibiting the lasing action when opened.

The CDRH enclosure contains an exhaust port and the associated plumbing required for the extraction of fumes and particles created by the lasing process. Plumbing originates at the lasing area and terminates at a 3” diameter port, located on the rear of the enclosure and connected to the suction unit.

SYSTEM

- Sealed IR Laser Module enclosed in a CDRH Class I Workstation.- 175mm X 175mm Scanning Area- 38mm X 38mm Processing Area- Manual Z-Axis- Self Centering Holding Fixture - Real Time Color Vision System W/ 10X Manual Zoom

COMPUTER & SOFTWARE SYSTEM

- Computer Based Controller- Multi-GB HD / DVD Read-Write / USB Port- Microsoft Windows Operating Environment- Flat Panel Display, Keyboard and Mouse- Failure Analysis Pro Software™- Decapsulation Module

SUCTION UNIT FOR INORgANIC AND METALLIC PARTICLES IS STANDARD

Effective and powerful removal of particles coming from the processed material after decapsulation operations.

f incl: pre-filter element and aerosol filter

f Suction capacity: 20 – 250 cbm/h

f Electrical connection: 100-240 V (50/60 Hz) / 1,2 kW

f Noise emission: 64 dB(A)

f Weight / color: 26 kg / RAL 7035

f Dimensions (LxWxH): 350 x 350 x 690 mm

VISION MODUL

Real Time Color Vision System

STANDARD EquIPMENT FOR SESAmE 500 & 1000

18

SESAMElaserTM

All SesameLASER comes standard with Failure Analysis Pro Software, which is a comprehensive Windows based software package that enables a user to control all functions through simple easy to use graphical interface. Users have the abil-ity to quickly and easily locate different shapes for defining the area for decapsulation. These results provide increased throughput and quality plus flexibility for multiple operations.

The following functions are available :

f Alignment functions (flush left or right as well as centered or justified)

f Mirroring, stretching, compressing, scaling and free choice of positioning angle

f Possibility of consecutively numbering and incremental marking

f Integration of all Windows True Type fonts

f Importation of data from external CAD/CAM software like ArtCAM Type 3, or other common graphic software.

f Many decapsulation parameters for typical semiconductor package are supplied.

19

• INTELIGENT VISION SYSTEM Auto-Stop - Provides the ability to stop the lasing process by recognizing contrasting features, such as wires to the mold compound. Auto - Calibration

OPTIONAL EquIPMENT FOR SESAmE LASER

• COOLpLaTE ChIp hOLdING FIxTurE

• auTO – CaLIbraTION

• bENCh FOr S500 aNd S1000

• GaSkET MakING MOduLE

• prOGraMMabLE 150MM x 150MM x-Y TabLE

• hIGh rESOLuTION COLOr CaMEra SYSTEM

• rEaL TIME COLOr VISION SYSTEM W/ 12x PROgRAMMABLE zOOM

• LarGE FILLEr dIFFuSEr

• CrOSS - SECTIONING

SESAMElaserTM

Many of these options will be fully retrofittable at your site,with no need for return to DIGIT CONCEPT.

20

Specially designed for decapsulation by Plasma with FillerBlast™ has been inte-grated into your SESAME1000FS allowing complete decapsulation without acid. Included :f Plasma Chamber with automatic doorf FillerBlast™f Vaccum pump and Filter for particlesf 3 Mass Flow Controllers for O2 and CF4f RIE and ICP (Inductive Coupled Plasma)f RF300W generatorf Control Unit with automatic RF tune & Baratron vacuum gaugef Thermal regulation of the sample stage (20/100°C)f Mechanical parts for adaptation on SESAME1000

S2000 PLASER optional (version 2012)

OPTIONAL EquIPMENT FOR SESAmE LASER

SESAMElaserTM

JEDEC TRAY Do all ablation decap in one shot.

SESAME PLASER Turn your S1000 FS into a complete decap equip-ment with this option.

ApplICATIOns• Encapsulant removal from aLL types of packaged

device• Complete decapsulation down to die

KeY BeneFITs- Passivation can be reached without damage- Excellent selectivity to keep copper wires

and/or metal layer- Only one tool: cost, time, footprint reduction

LASER Ablation of ICon JDEC tray

SESAME Technology incorporates Mutual Patents and IP developed by CNES, DIGIT CONCEPT SA and BSET EQ


21

is ALSO EUROPEAN EXCLUSIVE DISTRIBUTORfor the following brands

f pACKAGe pRepARATIOn TeCHnIQUes:

f Mechanical Backside thinningf LASER package access

f InspeCTIOn:

f IR, UV, LASER, ARC, AFP

f THeRMAl / eleCTRICAl AnAlYsIs:

f LC, FMI, MOIRÉ, PHOTOEMISSION, SIFT, LASER Scan, AFP

f pHYsICAl AnAlYsIs:

f Delayering by Plasma, Mechanical, Polysaccharidesf Cross section

f pACKAGe deCApsUlATIOn TeCHnIQUes:

f Acids, Plasma, Mechanical, LASER Ablation

f FA ACCessORIes And COnsUMABles

AsAp-1s UC & IpsBack-side preparationand pre-decapsulation

ARC-lITeARC coating system

UlTRApOl AdVAnCe UC Submicronic parallel Polisher

with ULTRACOLLIMATOR

UlTRAslICePrecision Saw Cross-section

ATOMIC FORCe pROBe (AFp II)Nano-Probing

sIFT, lAseR sCAn, eMMI BACK-sIde, MOIRe, FMI, THeRMAl Suitable according to the requirements

nT3Plasma Cleaner

sp8Plasma Cleaner

22

SESAMEPLASMATM

FA2000P TableTop Plasma Decapsulation

S2010 SesamePLASER FS

S210 SesamePLASmA RIE

RIE TableTop

15 years experience with PLASMA DECAPSULATION

23


SESAMEplasmaDCAPTM

FA2000P

DECAPSuLATION - Industry leader and I.P. forerunner - First and only qualified system to interface with patented laser decapsulation technology - Etch rates for many compounds more than 1 mil per hour - Fastest removal of epoxy and plastic molding materials - Uses unique Fillerblast® technology

KEY FEATuRES - Industrial computer running win XP - Hard drive storage - 9.5” display - IR keyboard w/pointer - 8 quick keys at front panel - Easy setup of advanced features - Display of all parameters simultaneously - Unlimited process storage with multi stepping - Process notes for every process or step - Error checking with diagnostics - Storage transfer via usb or ethernet

Versatile Onboard User Interface

THE BSET USER INTERFACE IS THE RESULT OF MORE THAN 12 YEARS OF DEVELOPMENT. The interface was developed through our custom-ers requests and almost all modifications were per-formed free of charge. We seldom have any requests for change anymore which indicates a well designed inteface.

The results are conclusive, bset tools have an unsur-passed onboard interface with features found nowhere else in our class. The interface appears in English, French and Japanese languages.


24

S2001FS - Plasma Final Decapsulation Unit for Plastic IC Packages

PLASER offers final decapsulation for precavitated plastic IC packages of most types and sizes. Proven to work with copper and other technologies, PLASER al-lows final ‘dry’ decapsulation, down to the die surface, without the use of acid. PLASER uses a novel design incorporating BSET EQ’s Plasma recipes, and Filler-Blast™ technology

PLASER is available in a standalone format, that can be added to any decapsulation lab toolkit.

PLASER is also available as a fully integrated system into the S1000 LASER. The combined tool is dubbed S2000.

PRODuCT HIGHLIGHTS - Available in STAND-ALONE or INTEGRATED versions - Adds Final Decapsulation Capability with no acid required - Enables Turnkey decapsulation -- in a single footprint (SESAME2000) - Large Chamber Size -- allows for multiple

parts to be processed simultaneously for higher volume decapsualtion.

ITEm DESCRIPTIONMain Unit PLASER Plasma Chamber with automatic door

Material Removal Method Plasma and BSET FillerBlast™

Filtering vacuum pump and Filter for particles

Mass Flow 3 mass Flow Controllers for O2, CF4 and other gases

Plasma type ICP (Inductive Coupled Plasma) + RIE for stand alone

RF RF 300W generator

Control Unit Automatic RF tune and Baratron vacuum Gauge

Controls Independent color LCD touchscreen gathering all the controls

Sample Thermal control Thermal regulation of the sample stage (20/100°C) - option

Additional items mechanical parts for adaptation onto the SESAmE1000

FREE-STANDING SYSTEMPlease note that PLASER is also available as a free-standing floor unit, for use with

SESAmE and other pre-cavitation systems -- Footprint 32”W x 24” D x 42» Tall

SESAMEplasERFSTM


RELEASE 2013- Etch faster- Less damage- Less RF Power- Build in / Industrial Grade- Automated- Vision control- small % of CF4- Intuitive Use- 5 years research- ready to move to S2000LASER

The most faster one

(SESAME Technology incorporates Mutual Patents and IP developed by CNES, DIGIT CONCEPT SA and BSET EQ)

25

SESAMEPLASMARIETM

S210Anisotrophic etching offers the aspect ratios needed to preserve the functionality of the device being treated. The system is capable of using any non-corrosive gas and uses mass flow controllers with precise gas mixing. This is important to achieve selectivity and other issues requiring attention in the de-passivation of devices

Characteristiques- Baratron gauge- Microprocessor control withunlimited recipe storage- 9,5 SVGA display, parallel,serial,

and external SVGA port- Software and hardware safety interlocks- Anodized Aluminium Chmaber and fixtures- CE certified

DCVWR-RE104 : CHILLER- Maximum flow 1l/min, maximum pressure : 0,4 bars

FAILURE ANALYSIS FOR SEMICONDUCTORS- Passivation removal - Isotropic polyimide removal, anisotropic or isotropic

silicon nitride removal- Removal of interlayer dielectrics - packages and 150 mm or 200 mm

wafers accommodated- Unsurpassed tabletop performance in single wafer cleaning, stripping,

etching or reverse sputteringOTHER APPLICATIONS

- Research and development- Manufacture of wafer probe cards- Patterning and trenching in various materials- Material science

Product Highlights- Quad input manifold provides uniform conductance of process gases and

high etch uniformity on wafers- Operation within a wide pressure band enables fast isotropic etching at

higher temperatures and exceptionally clean anisotropic etching at lower temperatures

- Operation within a temperature range from 0 - 125°C enhances etch rates and selectivity

- I.C.P , endpoint detection and other advanced options

ICP OPTIONInductive Coupled Plasma

IPC OPTIONIndependent pressure controller. The IPC monitors and controls the vacuum level for have a stable pressure level for an reproducible recipe.

OIL FILTRATION OPTIONDCBS-OilFiltr : Oil Filtration with oil

ENDPT OPTIONDCJy-G50 : OPTION LASER INTERFEROmETER DIG-ILEm G50 mANUAL.

- CCD Camera, LASER Interferometer : magnification X50, LASER diode : 670nm spot size : about 50 micro millimeters.

- Controlled with a 15“ screen, keyboard, mouse, com-puter with HD

- Special software

- Modification of the FA2000 lid : addition of a sapphire window and mounting of the camera + all necessary securities

- Integration of a End of Etch in the software.

26


OTHER SESAMESESAMEcleanerTM

S101 SesameCLEANER

SESAMEMECHANICALTM

S401 SesameGASkETMAKER

S410 SesamePLATEMAKER

SESAMETHERMALTM

S601 SesameCOLDMOUNTPLATE

S610 SesameHOTMOUNTPLATE

20 years experience in SAMPLES PREPARATION

27

SESAMEcleanerTM

S101 is a spinner used for the cleaning of integrated circuit devices between backside processing steps.

A high-pressure dispensing pump sprays the device being cleaned with different cleaning solutions while the device is rotated at high speed. The force of the spray dislodges debris from the grinding, lapping, and polishing process while the rotation of the part removes this debris from the die surface.

Both waste liquids and debris drain into a waste bottle located on the side of the unit next to the solution source bottles.

A typical cleaning process has a source bottle contain-ing D.I. water and another containing a solvent e.g. isopropanol.

The part to be cleaned, while mounted to its holding fixture, is placed on the spindle and the safety cover closed. The part is spun at the programmed RPM and the pump dispenses the solvent for a programmed time. The device is then rinsed with D.I. water and fi-nally dried with either dry nitrogen gas or compressed air.

The entire process occurs in a closed chamber elimi-nating any safety issues resulting from an improperly mounted device.

The device and its holding fixture are always cleaned together, thus eliminating the need to re-mount the device. This of course reduces the chance of transfer-ring any diamond particles into the next “backside” processing step. A special process is included that al-lows for spinning of the device without any dispensing of cleaning liquids. This process can be used for ap-plying anti-reflective coatings on a die that has been completely polished.

PRODuCT HIGHLIGHTS - Effectively cleans devices during backside processing - Self contained - contains source and waste bottles - Part is cleaned on its holding fixture, cleaning both - Part does not need to be re-mounted - Easy to use operator interface - Special cycle for Anti Reflective coatings - Up to 30 stored process programs

Specifications :Spinner programming range RPM control accuracyRPM repeatabilityClean dispense rateRinse dispense rateDI clean process time Solvent clean process time Rinse timeBottle volumeSizeWeightFacilities requirements PowerCDA/nitrogen1000 to 6000 RPM+/- 5%+/- 2%7 ml per minute9.5 ml per minuteprogrammable from 0 to 60 seconds programmable from 0 to 60 seconds programmable from 0 to 60 seconds 250 ml11 inches high X 11 inches deep X 11 inches wide (280mm X 280 mm X 280 mm)22 pounds ( 10 Kg)95 to 260 Vac, 49-61 Hz 4 amps max 37to43PSIat10CFMmaxflowrate


28

SESAMEmechanicalTM

SesameGASKETMAKER S401 AND S410

why buy expensive gaskets and alignment plates when you can easily make them yourself now?

The S401/410 is a high precision, micro-machining tool designed for producing accessories and fixtures for dual acid decapsulation systems.

The S401/410 produces gaskets and alignment plates of any custom design.

Key measurements of the package to be decapsulated are entered into the controller. For advanced operations the S401/410 can be connected to a PC via a standard serial port. Complex gasket or various custom device machining operations can be performed through direct G code execu-tion from a PC.

The simple interface allows fast set up time to create these accessories. From set up into the controller interface to finished product, gaskets can be made in as little as 3 minutes.

The S401/410 comes complete with gasket holders for 1.00 inch (25.4mm) and 1.375 inch (34.9mm) diameter gaskets; a Tool Holder and Tool Height Gauge; Digital Pre-cision Caliper Software and a selection of gasket material.

Metric tool holders can be substituted for English measure-ment holders at no extra charge.

Benefits - Elimination of lead time in procuring gaskets and

other accessories for acid decapsulator systems - Increased productivity with various custom package for decapsulation - Flexibility in producing various accessories and capable

of device machining operation

Features - User friendly interface with various selection of defnition

and monolithic gaskets. - Precut defnition gaskets for RKD, Technology

and NSC decapsulators. - Special programmable mode for making complex gaskets

and/or device machining operations. - Removal of heat sinks - Cut standard and/or BGA alignment plates. - Second bond plastic removal. - Machine device holding fixture. - Selected Area Mechanical Decapsulation.

WHAT KIND OF MATERIAL < 7 Treated (pronounced “sub7”) AFLAS gasket blanks are available in 1 and 1,3/8 inch diameters and in three thicknesses ~ 0.031, 0.062 & 0.094 inches.

TECH TIP

- S410 : Alignment plate for ACID and PLASMA Decapsulators


29


Is a specially designed hot plate used for wax mount-ing of integrated circuit packages in preparation for backside thinning and polishing.

The unit heats the sample holding fixture at a con-trolled rate thereby preventing thermal damage to the sample during mounting. When the programmed temperature is reached, the operator is prompted to mount and align the sample. After alignment and mounting the unit cools the sample and holding fix-ture at a controlled rate to harden the mounting wax.

When the sample is cooled to room temperature, the operator is prompted to remove the mounted device and holder.

SPECIFICATIONS- Temperature programming range 30 to 140 degrees C.- Hea@ng ramp rate Programmable from 0.1 to 0.8 degrees per second- Cooling ramp rate Programmable from 0.1 to 0.8 degrees per second- Soak @me Programmable from 1 to 60 seconds- Rest temperature 30 degrees C nominal- Temperature accuracy +/‐ 1.0 degrees C- Size 5.5 inches high X 6.5 inches deep X 11 inches wide - (140mm X 165 mm X 180 mm)- Weight 10 pounds ( 4.6 Kg)

SesameHOTMOUNTPLATE S610

SESAMEmechanicalTM

SESAMEthermalTM

S410 TO OPENER S420 CDIP OPENER

Do not forget these two tools

30


SESAMEthermalTM

SesameCOLDMOUNTPLATE S601

FEATuRES - Accurately controlled sample temperature - Controlled heating rate to minimize thermal stresses - Controlled cooling rate - Fast cycling - Easy to use operator interface - Special cycle for manual acid decapsulation - Low profile - can be placed under a microscope

Temperature Control with Thermoelectric Cooler (TEC).• Holds package with low mechanical stress• Reduces ESD• Cools down package during LASER ablation*

(See IPFA2010 Technical Paper from NTU Singapore)

INCLuDED:- Sample holder with a TEC- Temperature Controller 50/60Hz 150W

Temperature Control with a ThermoelectricCooler (TEC) during Laser Decapsulation of

Plastic Packages

H. B. Kor, A. C. K. Chang, and C. L. Gan

IPFA 2010

1

Temperature Control with a Thermoelectric Cooler (TEC) during Laser Decapsulation of

Plastic Packages

H. B. Kor, A. C. K. Chang and C. L. Gan Nanyang Technological University, School of Materials Science & Engineering,

50 Nanyang Avenue, Singapore 639798. Phone: (65) 65141035 Fax: (65) 67900920 Email: [email protected]

Abstract – Ablation was carried out on high voltage Schottky

rectifiers at 25°C and -5°C (with a thermoelectric cooler or TEC), at 1.0 W and 3.9 W of laser power. In-situ measurement of the reverse current was conducted and correlated to the device junction temperature. It was found that the usage of a TEC increases the number of laser scans to reach the set current compliance of 100 µA after exposing the die, for ablation at 3.9 W, although eventual damage to the device is still unavoidable. The incorporation of a TEC below the sample is also demonstrated to be effective in reducing the device junction temperature during laser ablation.

I. INTRODUCTION

With the continual shrinking of devices and the introduction of new materials such as copper bond wires [1], chemical, mechanical and plasma decapsulation [2] have nearly reached their limits. For instance, chemical decapsulation may damage the copper bond wires, the die or interconnections, since it is isotropic in nature [3, 4].

Laser decapsulation is a promising failure analysis (FA) technique, which works with high speed and precision. Besides, it minimizes the effects of corrosion and overetching of leadframes [2-4]. Apart from being able to alleviate some of the problems of chemical, mechanical and plasma decapsulation, laser decapsulation is not constrained by geometry and it provides a good selectivity of plastic ablation over metals [5].

However, laser decapsulation may cause thermal stresses [2], damages to metallization or passivation [4], and thermal elevation or electrostatic damages (ESD) [6] to devices. Therefore, the aim of this work is to investigate the effectiveness of incorporating a thermoelectric cooler (TEC) on a cooling plate below the sample during laser ablation to reduce the thermal effects.

II. EXPERIMENTAL DETAILS

A. Experimental Setup The laser decapsulation system used in this project is the

Sesame 1000 from Digit Concept, with a Nd:YAG laser (1064 nm) and a maximum power of 10 W. The sample is a high voltage power Schottky rectifier STPS80170C comprising two diodes, as shown in Fig. 1.

Fig. 1. High voltage Schottky rectifier comprising two diodes.

Figure 2 shows the linear relationship between the reverse

current and the junction temperature of one of the two diodes at an applied reverse voltage of 100 V, which was re-plotted from the graph of reverse leakage current versus applied reverse voltage (per diode), from the sample data sheet [7].

20 40 60 80 100 120 140 160100

101

102

103

104

Rev

erse

Cur

rent

(

)

Junction Temperature (C)

Fig. 2. Graph of reverse current vs junction temperature at an applied reverse voltage of 100 V for one diode.

The relationship of the reverse current versus junction

temperature at an applied reverse voltage of 100 V is obtained by a linear fit as given in Equation (1).

Log Ir = –0.0383 + 0.0322T. (1)

where Ir is the reverse current and T is the junction temperature in C.


Plastic Packages


IPFA 2010

1


Plastic Packages





I. INTRODUCTION










20 40 60 80 100 120 140 160100

101

102

103

104

Rev

erse

Cur

rent

(

)





Log Ir = –0.0383 + 0.0322T. (1)



Plastic Packages


IPFA 2010

1


Plastic Packages





I. INTRODUCTION










20 40 60 80 100 120 140 160100

101

102

103

104

Rev

erse

Cur

rent

(

)





Log Ir = –0.0383 + 0.0322T. (1)


31

7 Expertise Centers

22 INTERNATIONALDISTRIbuTORS & REPRESENTATIVESFA KNOWLEDGE

- 20 years in Wet Decap, - 12 years in LASER decap - 15 years in Plasma DecapASSuRED SAFETY - High level suction unit uPGRADE PATH - all Sesame optionsWORLDWIDE SuPPORT - 6 Sesame LabsLOW PRICE - Sesame500, Sesame707LASER - High Quality, High Pulse repitition rate TECHNOLOGY LEADER - 12 international scientific papersRECIPES AND PROTOCOLS - Best known techniques for most package types and bonding typesGERMAN quALITY AND RObuSTNESS

2, Chemin Saint Sulpice - 14740 SECquEVILLE EN bESSIN - FRANCE

+33 (0) 231 354 354 - [email protected] - www.digit-concept.com

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