Coating Apparatus U.S. Pafenf 5772,764. June 30, 1998 M. Akimofo, assrgnor fo Tokyo Electron Ltd., Tokyo

A coating apparatus comprising a spin chuck for holding and rotating a substrate; a plurality of first nozzles included in the header unil for discharging coating liquids to the substrale held on the spin chuck: and at least one nozzle included in the header unit together with the lirst nozzles, for discharg- ing, to the substrate, a solvent for solving the coating liquids in order to wet the substrate with the solvent before coating

Device for Processing Flat Workpieces U.S. Patent 5,772,765. June 30. 1998 D. Hosten. assignor to Siemens S.A., Brussels, Be/glum

t\ device for immersion processing of flat workpieces, in particular printed circuit boards, which are conveyed in the vertical position on a horizontal transport path,

Vacuum Coating Apparatus U.S. Patent 5.772.771. June 30, 1998

S. Li et a/. assignors to Applied Materials Inc.. Santa Clara, Calif.

A deposition chamber for improved dep- osition thickness uniformity comprising a housing defining a single vacuum chamber: a substrate support: and a plurality of gas distributors.

Sputtering Device U.S. Pafent 5,772,8X June 30. 1998 A. Tepman, assignor to Applied Materials Inc., Santa Clara, Calif.

A method and apparatus for cleaning a tat-pet in 3 sputtering source.

High Purity Titanium Sputtering Targets U. S. Patent 5,772.860. June 30, 1998 S Sawada et al., assignors to Japan Energy Corp., Tokyo

A titanium sputterinp target having a plurality of crystal grains wherein the av- eqe crystal grain diameters at various portions of the sputtering surface of the target are 500 pm or less and the diaper-

sions of the average crystal grain diameters are within +20%.

Electrolytic Conversion Coating U.S. Pafenf 5,772.865. June 30, 1998 S. Tanaka et a/.. assignors to Dipsol Chemicals Co. Ltd.. Tokyo

An electrolytic conversion solution for metal surface Ireatment comprising a vana- date or a vanadium salt of an inorganic acid in an amount of 5 to SO g/L, an organic acid having a reducing ability in an amount of 0.1 to SO p/L, and a balance of water, having a pH of not less than 7 and being free of tellurium and selenium.

Process for Treating Aramid Surfaces to be Plated U.S. Patent 5773,089. June 30, 1998 RR. Burch and C.H. Hsu, assignors to E.I. du Pant de Nemours and Co., Wilmington, Del.

A process for preparing an aramid sur- face to be plal.ed with a durable metal coating wherein. during the entire course of the process, rhe .xamid surface is kept from contact with metal cations: the process con- sisting of comacting with a nonaqueous

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