U. Mavric, M. Fenner, J. Branlard, H. Schlarb, DESY K. Czuba, WUT-ISE D. Makowski, A. Mielczarek, P. Perek, F. Makowski, TUL-DMCS

DeRTM-LOG1300

MicroRF Backplane Concept

Purpose

• The MicroRF Backplane extends the connectivity of RTMs and introduces eRTMs (extended

RTMs).

• The CLKs, LOs, REFs and Pilot Tone can now be distributed over the backplane

• It allows to make a better use of the available space in the crate

Features

• Extends the MTCA.4 board management to the rear

• Each RTM can be powered by rear power supplies

• 3 Additional slots for RF-related purposes (LO, CLK generation, signal generation etc.)

• Improves isolation between digital PICMG, AMC backplane and RF domain

Evaluation of the extension of the MicroTCA.4 board connectivity to the rear side of crates.

The contribution summarizes recent activities in the extension of the

MicroTCA.4 connectivity to the rear side of standard MicroTCA.4

crates. The need for such an extension started as a need for a

cleaner and more isolated environment from digital areas present in

the front side of the crate. Local-oscillator generation, clock

generation and their distribution were moved into a MicroTCA.4 crate

and they could benefit from the standard MicroTCA.4 board

management layer and connectivity. For this reason an RTM-

backplane manager which sits in the rear side of the management

carrier hub was used as a bridge from the front side to the rear. The

backplane manager provides power, management layer and PCIe

connectivity to the rear. Special emphasis was put on the layout of

the digital signals in the rear MicroRF-backplane in order to avoid the

possibility of pollution of high sensitivity signals. Finally an example

of practical usage of the new extension is presented.

This project is supported by Helmholtz Validation Fund HVF-0016 “MTCA.4 for Industry”.

Abstract

eRTM Modules

Purpose

• CLK, LO generation

• Used on 21 RF stations (42 crates)

in the Eu-XFEL

• REF, LO, CLK distribution

Features

• 9 LO Outputs, 9 REF outputs, 9 Pilot

Outputs, 22 diff. CLK outputs

• Active temperature control of the RF

sections

• Integration into MTCA.4 framework

LO/CLK generation module Rear backplane manager

J21 J21 J21 J21 J21 J21 J21 J21 J21 J21J21

J30

J31 J31

J30

# 15 # 14 # 13 # -1 # -2 # -3# 12 # 11 # 10 # 9 # 8 # 7 # 6 # 5 # 4 # 3 # 2 # 1

J14

J10

J10

J21 J21

FRU

J31

J11

J12

J30

RTM-PM(6HP)12 x uRTM (12 x 4HP)

MCH-RTM-BM (6HP)3 x eRTM (3 x 6HP)

J13

RT

M P

ow

er

Mo

du

le(R

TM

-PM

)

RTM-PM(6HP)

J11

J10 J10

J13

J14

J12

J10 J10 J10 J10 J10 J10 J10 J10 J10 J10

Zone 1

Zone 2Zone 3

RT

M P

ow

er

Mo

du

le(R

TM

-PM

)

DeRTM-CLK

Monitoring, Histories, Events,

Control, … System Integration

On-Board RF Temperatures

• The Peltiers regulate the

temperature of the circuit.

• The regulation efficiency is 0.05

deg (out-of-loop)

On-Board Rel. Humidity

• The PCB is not isolated against

humidity changes

• An on-board humidity sensor shows

rel. humidity changes in the crate

RF Power Monitoring

• CLK, LO and REF power is logged

PCB Hotspots

• The hottest areas of the PCB are

logged

DC Power

• DC power consumption of various

subsections is logged

• The picture shows the power

consumption of the Peltier

controllers

DOOCS Interface

• On the application level we can control the LO, CLK

generation, monitor the RF power, monitor various

temperatures, control the Peltier elements etc.

Board Management

• Standard MTCA.4 management

is extended to the rear and is

managed by the front MCH

Board Management

• The front MCH sees the rear eRTM similar as

the front AMC modules

/dev

• The LO, CLK generation module is

recognized as one of the devices in

the PCIe tree.

Purpose

• Universal CLK generation

• Dual PLL, External CLK, Internal

free-running CLK, CLK divider, CLK

fan-out\

• Fractional-N based

Features

• 22 diff. CLK outputs

• Integration into MTCA.4 framework

• Possible mounting of external mezz.

with external CLK generation