A physical vapor deposition chain- ber comprising a target having a front sput ter ing surface and a back surface; a magnet mounted to the back surface of the target; a susceptor for supporting a sub- strate to be processed mounted parallel to and spaced from the target; and a shield tha t is spaced from and surrounds the target and extends in the direction of the susceptor.

BARRIER COATING OF PLASTIC U.S. Patent 5,824,198. Oct. 20, 1998 J.L. Williams et al., assignors to Becton, Dickinson and Co., Franklin Lakes, N.J.

A method of sequentially deposit- ing a film on the surface of a plas- tic subst ra te in an evacuation chamber comprising cleaning the surface with a first energy inert

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Sn: Acid Brass: Cyanide

Phosphates: Zinc, Iron and Magnesium Chromates: Blue, Clear, Yellow,

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ion beam; sputtering metallic ni- trides, metallic borides, or metal- lic carbides by a second ion beam; simultaneously with the sputter- ing exposing the substrate to a third energy ion beam to concur- ren t ly s tr ike the subs t ra te to cause growth of a first layer hav- ing a thickness of 10 to 2,000 .~ on the substrate; removing and/or re- distributing foreign surface parti- cles from the first layer; and re- peat ing, t he reby depos i t ing a second layer.

PROTECTIVE COATING U.S. Patent 5,824,205. Oct. 20, 1998 J. Fostel, assignor to Praxair S.T. Technology Inc., Danbury, Conn.

A method of producing a coating on a substrate, which comprises first aluminizing, chromizing, or siliconizing; depositing, by elec-

THE OLD J ON WITH THE NEW I IN SECONDS Ii D ISPOSABLE, SL IP 'ON i D A N G L E R HEADS. . .

~SAVE PLATING TIME ~PROLONG CABLE LIFE

AND ~rPERFORM FOR PENNIES

trolytic or electroless deposition, a metal matr ix M] from a bath containing particles of CrA1M2, said bath having a particle dis- tr ibution of 25% between 15 and 12 microns, 45% between 12 and 10 microns, and 30% of less than 10 microns, to codeposit the par- t ic les w i th the m a t r i x as MICrA1M2, where in M 1 is at least one element selected from the group consisting of Ni, Co, and Fe and M2 is at least one element selected from the group consisting of Y, Si, Ti, Hf, Ta, Nb, Mn, Pt, and rare ear th ele- menUs.

DEPOSITION OF D I A M O N D FILM U.S. Patent 5,824,367. Oct. 20, 1998 J-I. Park and K-J. Park, assignors to National Institute of Technology and Quality, Kwacheon, Rep. of Korea

N O LOST PLATI N O TIM E. Slip off built-up heads, and slip on fresh, new heads without removing Dangler Assembly from barrel. LONGER CABLE LIFE. Removing heeds before the plating build-up is excessive, prolongs the life of the Dangler Assembly. INEXPENSIVE, Field studies have shown that using our disposable heads costs just pennies per barrel load to use.

CHANGE HEADS IN SECONDS NEW DANGLERS LEAD THE WAY TO

IMPORTANT PRODUCTION ECONOMY.

~ A U.S. Pat. #4,111,781 • [ ]

NGLERS 3 5 O a k d a l e A v e n u e , J o h n s t o n , R i 0 2 9 1 9

P h o n e ~ F a x : ( 4 0 1 ) 2 7 4 . 7 7 4 2 *Danglers are patented in the United States, Foreign Rights reserved.

D i s t r i b u t o r I nqu i r i e s I nv i t ed

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I

March 1999 97

The method for the deposition of a diamond film comprising immers- ing a metallic or nonmetallic sub- s t ra te in an electroless nickel plating bath containing a reduc- ing agent to form a nickel layer on the substrate; and depositing a diamond film on the electroless nickel-plated substrate.

R A D I A T I O N C U R I N G OF POWOER C O A T I N G S U.S. Patent 5,824,373. Oct. 20, 1998 K.M. Biller and B.A. Mac Fadden, assignors to Herbert's Powder Coatings Inc., Hilliard, Ohio

A method for applying a powder coating to a wooden subs t ra te comprising electrically ground- ing the wooden substrate; elec- t rostat ical ly charging a powder coating comprising a radiation- curable resin mixture of acrylo-

u re thane resin and an unsa tur - ated polyester resin, wherein the polyester resin is chosen from the group consisting of maleate containing resins and fumara te containing resins, a photoinitia- tor, and a plasticizer to cause the flow t empera tu re to be less than approximate ly 200°F; directing the charged powder onto the sub- strate; and curing.

C A T I O N I C ELECTRODEPOSlTABLE C O A T I N G C O M P O S I T I O N U.S. Patent 5,824,424. Oct. 20, 1998 H. Haneishi et al., assignors to Kansai Paint Co. Ltd., Japan

A coat ing me thod compr i s ing coating by electrodeposit ion, a cationic electrodepositable coat- ing composi t ion compr is ing a p o l y u r e t h a n e - m o d i f i e d epoxy resin-amine adduct and a non-

ionic film-forming resin, and con- t a in ing s u b s t a n t i a l l y no pig- ment, followed by hea t curing; then coating, on the cured elec- t rodeposi ted coating, an aqueous coat ing con ta in ing a meta l l i c pigment, a coloring pigment or mixture thereof, as a first top- coat, followed by heat curing the first topcoat; and then coating, on the cured first topcoat, a pow- der coating containing substan- tially no pigment, as a second topcoat, followed by heat curing the coated powder coating.

COPPER INTERCONNECT U.S. Patent 5,824,599. Oct. 20, 1998 Y. Schacham-Diamand et al., assignors to Cornell Research Foundation Inc., Ithaca, N.Y., Intel Corp., Santa Clara, Calif., and Sematech Inc., Austin, Texas

The Amazing In-Tank Four-in-One System! Pumps • Filters • Agitates • Treats

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98 Metal Finishing