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DAQMB Production Status. S. Durkin The Ohio State University Florida EMU Meeting 2004. DAQMB Production. EMU Peripheral Crate ESR Nov. 6, 2003 Approved for Production. 8-layer PC Board, 2 Ball-Grid Array FPGAs 718 Components/Board. Production : Numbers. - PowerPoint PPT Presentation
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DAQMB Production StatusDAQMB Production Status
S. DurkinThe Ohio State University
Florida EMU Meeting 2004
S. Durkin, Jan. 9, 2004 2
DAQMB Production DAQMB Production DAQMB Production DAQMB Production
EMU Peripheral Crate ESRNov. 6, 2003
Approved for Production
8-layer PC Board,2 Ball-Grid Array FPGAs718 Components/Board
S. Durkin, Jan. 9, 2004 3
Production : NumbersProduction : NumbersProduction : NumbersProduction : Numbers
ME 1/2, 1/3, 2/1, 2/2, 3/1, 3/2 360
ME 1/1 72
ME 4/1 36
SubTotal 468
10% spare boards 47
Total boards producing 515
10% spare parts
•10% of spare boards will be built for anticipated swapping,
•10% spare parts will be ordered for board repair
All Parts Ordered, 99% of Parts in Hand
S. Durkin, Jan. 9, 2004 4
Production Production Production Production
PC boards will be etched and stuffed commerciallyBoards will be measured and debugged on computerized tester before and after burn-in at OSU
Each board will have a unique ID
Board tracking: Microsoft Access
S. Durkin, Jan. 9, 2004 5
-Testing Station checks all input and output signals by computer-Exercise 5 CFEB’s and LVMB-CCB,TMB signals mimicked by FPGA on backplane
Test Station Built and Working
Production Test and DebuggingProduction Test and DebuggingProduction Test and DebuggingProduction Test and Debugging
S. Durkin, Jan. 9, 2004 6
Production Test SoftwareProduction Test SoftwareProduction Test SoftwareProduction Test SoftwareProduction Test Software written and tested.
S. Durkin, Jan. 9, 2004 7
Production preparation: Burn inProduction preparation: Burn inProduction preparation: Burn inProduction preparation: Burn in
Burn In
CDF: 50-60 C for 8-24 HrsSufficient for tantalums failuresNo sensitivity to semiconductor
failure
US Military: 125 C for 320 Hrs Chip Makers recommend against this
CFEB: 65 C for 24 Hrs Prove to be effective, not damaging
Each DMB: 65C for 24 Hrs
Test Before and After
S. Durkin, Jan. 9, 2004 8
Pre-Production BoardsPre-Production BoardsPre-Production BoardsPre-Production Boards
-11 DAQMB delivered (Nov 19, 2003)
-Stuffed commercially, No problems, Work well
DAQMB well within Budget
Full Production will begin whena Complete Crate of Electronics is tested
Costs: PC Board $ 200 Stuffing $ 60 Components $ 750 Mechanical $ 100
Total: $ 1110
S. Durkin, Jan. 9, 2004 9
New Crate Controller DevelopmentNew Crate Controller DevelopmentNew Crate Controller DevelopmentNew Crate Controller Development
A VMEbus Controller with Gigabit Ethernet – A custom board designed and
developed at OSU– Based on XILINX Virtex-II Pro– Customizable firmware.– Optical transceiver (for Gbit Ethernet) – Communicates with stand-alone PC
(in USC55) via Ethernet
Advantages Over Dynatem– No operating system or software on
the controller. All programming done on stand-alone PC in USC55.
– Faster, less expensive: ~ $600 each
Status– PC board produced and stuffed– Firmware being developed
S. Durkin, Jan. 9, 2004 10
DDU and DCC StatusDDU and DCC StatusDDU and DCC StatusDDU and DCC Status
540 DMB as inputs (160MB/s)
Detector
Peripheral Crates
AFEB
CFEB
ALCT
8 SLINK64 as outputs (800MB/s)Expected data rate 1.2 GB/s
SLINK64
FED Crate (DDU/DCC)
FRL
Myrinet5Gb/s Fibers
CMSDAQ
USC55
DMB to DDUGb/s Fibers
S. Durkin, Jan. 9, 2004 11
FED CrateFED CrateFED CrateFED Crate
• Four 9U Crates
9U X 220mm Board
• Data Concentration:
15 DMB to 1 DDU
9 DDU to 1 DCC
1 DCC to 2 SLINK64
9 DDU per SLINK (4)
4/5 DDU per SLINK (8)
2/3 DDU per SLINK (16)
1 DDU per SLINK (36)
36 DDU, 4/8 DCC needed
DDU DDU
CCD
Base-line design Optional
S. Durkin, Jan. 9, 2004 12
DDU/DCC custom backplaneDDU/DCC custom backplaneDDU/DCC custom backplaneDDU/DCC custom backplane
VME P3 spaces, 6.4 Gbps rated connectorData from DDU to DCCTTC control bus (clock, L1A, command/data)
DCC DDUsDDUs DDUs DCCDDUs
S. Durkin, Jan. 9, 2004 13
DDU-04 FunctionDDU-04 FunctionDDU-04 FunctionDDU-04 Function
• Collect data from 15 DMB (15*160MB/s), Send data to DCC (640MB/s)
• Check data, Detect error, send to FMM
• Spy data by Gigabit Ethernet
• Capable of SLINK64
Improvements over DDU-02:Earlier error detectionBetter PCB timingMore reliableHigher effective data bandwidth
VP20
DMBs
DMBs
GigabitEthernet
SLINK64
VP20
To FMM
DCC
S. Durkin, Jan. 9, 2004 14
DCC FunctionDCC FunctionDCC FunctionDCC Function
• Merge data from 10 DDU (10*640MB/s), send to CMS DAQ SLINK64 (2*800MB/s)
• Receive and fan out TTC fast control for the crate
• Spy data by two Gigabit Ethernet links
• Expected:
Constant 800MB/s on SLINK64
>100MHz DDR FIFO
extra 1MB buffer for the SLINK64
error detection abilityDDUsVP2
VP20
FIFO
SLINK64
GigabitEthernet
GigabitEthernet
TTCrx
SLINK64