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CSE477 L01 Introduction.1 Irwin&Vijay, PSU, 2002
ECE484VLSI Digital Circuits
Fall 2014
Lecture 01: Introduction
Adapted from slides provided by Mary Jane Irwin.
[Adapted from Rabaey’s Digital Integrated Circuits, ©2002, J. Rabaey et al.]
CSE477 L01 Introduction.2 Irwin&Vijay, PSU, 2002
Course Contents
Introduction to digital integrated circuits CMOS devices and manufacturing technology. CMOS logic
gates and their layout. Propagation delay, noise margins, and power dissipation. Combinational (e.g., arithmetic) and sequential circuit design.
Course goals Ability to design and implement CMOS digital circuits and
optimize them with respect to different constraints: size (cost), speed, power dissipation, and reliability
Course prerequisites ECE 326. Electronic Circuit Design ECE 282. Logic Design of Digital Systems
CSE477 L01 Introduction.3 Irwin&Vijay, PSU, 2002
Course Administration
Instructor: George L. [email protected]
www.siue.edu/~gengel
TA: Geetha [email protected]
Labs: Need account on ECE machine (see Steve Muren,
Text: Digital Integrated Circuits, 2nd Edition Rabaey et. al.,
©2002
CSE477 L01 Introduction.4 Irwin&Vijay, PSU, 2002
Background from ECE282 and ECE326
Basic circuit theory resistance, capacitance, inductance MOS gate characteristics
Hardware description language VHDL or verilog
Logic design logical minimization, FSMs, component design
CSE477 L01 Introduction.5 Irwin&Vijay, PSU, 2002
Transistor Revolution
Transistor –Bardeen (Bell Labs) in 1947
Bipolar transistor – Schockley in 1949
First bipolar digital logic gate – Harris in 1956
First monolithic IC – Jack Kilby in 1959
First commercial IC logic gates – Fairchild 1960
TTL – 1962 into the 1990’s
ECL – 1974 into the 1980’s
CSE477 L01 Introduction.6 Irwin&Vijay, PSU, 2002
MOSFET Technology
MOSFET transistor - Lilienfeld (Canada) in 1925 and Heil (England) in 1935
CMOS – 1960’s, but plagued with manufacturing problems
PMOS in 1960’s (calculators)
NMOS in 1970’s (4004, 8080) – for speed
CMOS in 1980’s – preferred MOSFET technology because of power benefits
BiCMOS, Gallium-Arsenide, Silicon-Germanium
SOI, Copper , …
CSE477 L01 Introduction.7 Irwin&Vijay, PSU, 2002
Moore’s Law
In 1965, Gordon Moore predicted that the number of transistors that can be integrated on a die would double every 18 to 14 months (i.e., grow exponentially with time).
Amazingly visionary – million transistor/chip barrier was crossed in the 1980’s.
2300 transistors, 1 MHz clock (Intel 4004) - 1971 16 Million transistors (Ultra Sparc III) 42 Million, 2 GHz clock (Intel P4) - 2001 140 Million transistor (HP PA-8500)
CSE477 L01 Introduction.8 Irwin&Vijay, PSU, 2002
Intel 4004 Microprocessor
CSE477 L01 Introduction.9 Irwin&Vijay, PSU, 2002
Intel Pentium (IV) Microprocessor
CSE477 L01 Introduction.10 Irwin&Vijay, PSU, 2002
State-of-the Art: Lead Microprocessors
CSE477 L01 Introduction.11 Irwin&Vijay, PSU, 2002
Moore’s Law in Microprocessors
40048008
80808085 8086
286386
486Pentium® proc
P6
0.001
0.01
0.1
1
10
100
1000
1970 1980 1990 2000 2010
Year
Tra
nsi
sto
rs (
MT
)
2X growth in 1.96 years!
Transistors on lead microprocessors double every 2 yearsTransistors on lead microprocessors double every 2 years
Courtesy, Intel
CSE477 L01 Introduction.12 Irwin&Vijay, PSU, 2002
64
256
1,000
4,000
16,000
64,000
256,000
1,000,000
4,000,000
16,000,000
64,000,000
10
100
1000
10000
100000
1000000
10000000
100000000
1980 1983 1986 1989 1992 1995 1998 2001 2004 2007 2010
Year
Kbit
capa
city
/chi
p
Evolution in DRAM Chip Capacity
1.6-2.4 m
1.0-1.2 m
0.7-0.8 m
0.5-0.6 m
0.35-0.4 m
0.18-0.25 m
0.13 m
0.1 m
0.07 m
human memoryhuman DNA
encyclopedia2 hrs CD audio30 sec HDTV
book
page
4X growth every 3 years!
CSE477 L01 Introduction.13 Irwin&Vijay, PSU, 2002
Die Size Growth
40048008
80808085
8086286
386486 Pentium ® proc
P6
1
10
100
1970 1980 1990 2000 2010
Year
Die
siz
e (m
m)
~7% growth per year
~2X growth in 10 years
Die size grows by 14% to satisfy Moore’s LawDie size grows by 14% to satisfy Moore’s Law
Courtesy, Intel
CSE477 L01 Introduction.14 Irwin&Vijay, PSU, 2002
Clock Frequency
Lead microprocessors frequency doubles every 2 yearsLead microprocessors frequency doubles every 2 years
P6
Pentium ® proc486
38628680868085
8080
80084004
0.1
1
10
100
1000
10000
1970 1980 1990 2000 2010
Year
Fre
qu
ency
(M
hz)
2X every 2 years
Courtesy, Intel
CSE477 L01 Introduction.15 Irwin&Vijay, PSU, 2002
Power Dissipation
P6Pentium ® proc
486
3862868086
80858080
80084004
0.1
1
10
100
1971 1974 1978 1985 1992 2000Year
Po
wer
(W
atts
)Lead Microprocessors power continues to increaseLead Microprocessors power continues to increase
Courtesy, Intel
Power delivery and dissipation will be prohibitivePower delivery and dissipation will be prohibitive
CSE477 L01 Introduction.16 Irwin&Vijay, PSU, 2002
Power Density
40048008
80808085
8086
286386
486Pentium® proc
P6
1
10
100
1000
10000
1970 1980 1990 2000 2010
Year
Po
wer
Den
sity
(W
/cm
2)
Hot Plate
NuclearReactor
RocketNozzle
Power density too high to keep junctions at low tempPower density too high to keep junctions at low temp
Courtesy, Intel
CSE477 L01 Introduction.17 Irwin&Vijay, PSU, 2002
Design Productivity Trends
200
3
198
1
198
3
198
5
198
7
198
9
199
1
199
3
199
5
199
7
199
9
200
1
200
5
200
7
200
9
Logic Tr./Chip
Tr./Staff Month.
xxx
xxx
x
21%/Yr. compoundProductivity growth rate
x
58%/Yr. compoundedComplexity growth rate
10,000
1,000
100
10
1
0.1
0.01
0.001
Lo
gic
Tra
nsi
sto
r p
er C
hip
(M)
0.01
0.1
1
10
100
1,000
10,000
100,000
Pro
du
ctiv
ity
(K)
Tra
ns.
/Sta
ff -
Mo
.
Co
mp
lexi
ty
Courtesy, ITRS Roadmap
Complexity outpaces design productivityComplexity outpaces design productivity
CSE477 L01 Introduction.18 Irwin&Vijay, PSU, 2002
Technology Directions: SIA Roadmap
Year 1999 2002 2005 2008 2011 2014
Feature size (nm) 180 130 100 70 50 35
Mtrans/cm2 7 14-26 47 115 284 701
Chip size (mm2) 170 170-214 235 269 308 354
Signal pins/chip 768 1024 1024 1280 1408 1472
Clock rate (MHz) 600 800 1100 1400 1800 2200
Wiring levels 6-7 7-8 8-9 9 9-10 10
Power supply (V) 1.8 1.5 1.2 0.9 0.6 0.6
High-perf power (W) 90 130 160 170 174 183
Battery power (W) 1.4 2.0 2.4 2.0 2.2 2.4
For Cost-Performance MPU (L1 on-chip SRAM cache; 32KB/1999 doubling every two years)
http://www.itrs.net/ntrs/publntrs.nsf
CSE477 L01 Introduction.19 Irwin&Vijay, PSU, 2002
Why Scaling?
Technology shrinks by ~0.7 per generation
With every generation can integrate 2x more functions on a chip; chip cost does not increase significantly
Cost of a function decreases by 2x
But … How to design chips with more and more functions? Design engineering population does not double every two years…
Hence, a need for more efficient design methods Exploit different levels of abstraction
CSE477 L01 Introduction.20 Irwin&Vijay, PSU, 2002
Design Abstraction Levels
SYSTEM
GATE
CIRCUIT
VoutVin
CIRCUIT
VoutVin
MODULE
+
DEVICE
n+S D
n+
G
CSE477 L01 Introduction.21 Irwin&Vijay, PSU, 2002
Major Design Challenges
Microscopic issues ultra-high speeds power dissipation and
supply rail drop growing importance of
interconnect noise, crosstalk reliability,
manufacturability clock distribution
Macroscopic issues time-to-market design complexity
(millions of gates) high levels of
abstractions reuse and IP, portability systems on a chip (SoC) tool interoperability
Year Tech. Complexity Frequency 3 Yr. Design Staff Size
Staff Costs
1997 0.35 13 M Tr. 400 MHz 210 $90 M
1998 0.25 20 M Tr. 500 MHz 270 $120 M
1999 0.18 32 M Tr. 600 MHz 360 $160 M
2002 0.13 130 M Tr. 800 MHz 800 $360 M