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Creative Optimization with Additive ManufacturingWebinar - Additive Manufacturing with Particle Size and Shape Analysis
Many Additive Manufacturing (also called 3D printing) techniques such as selective laser sintering (SLS), selective laser melting (SLM) and electro-beam melting (EBM) use metal particle powders as a raw material (Aluminum, Titanium, Steel, Nickel, Tungsten and many Alloys). The particle size, size distribution and shape have a strong effect on the manufacturing result. Therefore it is important for manufacturers and suppliers to control the particle size and shape of their powders used in this process.In order to control particle size and shape these parameters must be measured. We discuss how to use the CAMSIZER technology to improve additive manufacturing results by monitoring the incoming particles. Value of Dynamic Image Analysis in 3D additive manufacturing How does Dynamic Image Analysis work?Why two cameras can control and monitor dust and oversize?Check the manufacturing and production of Additive Manufacturing powdersCheck the incoming raw material and the recycled powder for reuse
CAMSIZER XT & CAMSIZER X2 Additive Manufacturing
December 5th of 2017
Julie ChenHORIBA Scientific
Gert BeckmannRetsch Technology GmbH
3
Classification Technology Description Materials
Binder Jetting 3D PrintingInk-Jetting
S-PrintM-Print
Creates objects by depositing a binding agent to join powdered
material.
Metal, Polymer, Ceramic
Direct Energy Deposition
Direct Metal DepositionLaser Deposition
Laser ConsolidationElectron Beam Direct Melting
Builds parts by using focused thermal energy to fuse materials as they are deposited on a substrate.
Metal powder, Metal wire
Material Extrusion
Fused Deposition Modelling Creates objects by dispensing material through a nozzle to build
layers.
Polymer
Material Jetting PolyjetInk-JettingThermojet
Builds parts by depositing small droplets of build material, which
are then cured by exposure to light.
Photo-polymer, Wax
Powder Bed Fusion
Direct Metal Laser SinteringSelective Laser MeltingElectron Beam Melting
Selective Laser Sintering
Creates objects by using thermal energy to fuse regions of a powder
bed.
Metal, Polymer, Ceramic
Sheet Lamination
Ultrasonic ConsolidationLaminated Object Manufacture
Builds parts by trimming sheets of material and binding them together
in layers.
Hybrids,Metallic,Ceramic
VAT Photopoly-merisation
StereolithographyDigital Light Processing
Builds parts by using light to selectively cure layers of material in
a vat of photopolymer.
Photo-polymer,Ceramic
Processes
4
Classification Technology Description Materials
Binder Jetting 3D PrintingInk-Jetting
S-PrintM-Print
Creates objects by depositing a binding agent to join powdered
material.
Metal, Polymer, Ceramic
Direct Energy Deposition
Direct Metal DepositionLaser Deposition
Laser ConsolidationElectron Beam Direct Melting
Builds parts by using focused thermal energy to fuse materials as they are deposited on a substrate.
Metal powder, Metal wire
Material Extrusion
Fused Deposition Modelling Creates objects by dispensing material through a nozzle to build
layers.
PolymerFilament
Material Jetting PolyjetInk-JettingThermojet
Builds parts by depositing small droplets of build material, which
are then cured by exposure to light.
Photo-polymer, Wax
Powder Bed Fusion
Direct Metal Laser SinteringSelective Laser MeltingElectron Beam Melting
Selective Laser Sintering
Creates objects by using thermal energy to fuse regions of a powder
bed.
Metal, Polymer, Ceramic
Sheet Lamination
Ultrasonic ConsolidationLaminated Object Manufacture
Builds parts by trimming sheets of material and binding them together
in layers.
Hybrids,Metallic,Ceramic
VAT Photopoly-merisation
StereolithographyDigital Light Processing
Builds parts by using light to selectively cure layers of material in
a vat of photopolymer.
Photo-polymer,Ceramic
Processes
5
Type Technologies Materials
ExtrusionFused deposition modeling (FDM) or Fused Filament Fabrication (FFF)
Thermoplastics, Eutectic metals, Edible materials, Rubbers, Modeling clay, Plasticine, Metal clay (including Precious Metal Clay)
Robocasting or Direct Ink Writing (DIW)
Ceramic materials, Metal alloy, Cermet, Metal matrixcomposite, Ceramic matrix composite
Light polymerized Stereolithography (SLA) PhotopolymerDigital Light Processing (DLP) Photopolymer
Powder BedPowder bed and inkjet head 3D Printing (3DP)
Almost any metal alloy, Powdered polymers, Plaster
Electron-Beam Melting (EBM) Almost any metal alloy including Titanium alloys
Selective Laser Melting (SLM)Titanium alloys, Cobalt Chrome alloys, Stainless Steel, Aluminium
Selective Heat Sintering (SHS) Thermoplastic powder
Selective Laser Sintering (SLS) Thermoplastics, Metal powders, Ceramic powders
Direct metal laser sintering (DMLS)
Almost any metal alloy
LaminatedLaminated Object Manufacturing (LOM)
Paper, Metal foil, Plastic film
Powder Fed Directed Energy Deposition Almost any metal alloy
WireElectron Beam Freeform Fabrication (EBF3)
Almost any metal alloy
Processes
6
Type Technologies Materials
ExtrusionFused deposition modeling (FDM) or Fused Filament Fabrication (FFF)
Thermoplastics, Eutectic metals, Edible materials, Rubbers, Modeling clay, Plasticine, Metal clay (including Precious Metal Clay)
Robocasting or Direct Ink Writing (DIW)
Ceramic materials, Metal alloy, Cermet, Metal matrixcomposite, Ceramic matrix composite
Light polymerized Stereolithography (SLA) PhotopolymerDigital Light Processing (DLP) Photopolymer
Powder Bed Powder bed and inkjet head 3D Printing (3DP)
Almost any metal alloy, Powdered polymers, Plaster
Electron-Beam Melting (EBM) Almost any metal alloy including Titanium alloys
Selective Laser Melting (SLM)Titanium alloys, Cobalt Chrome alloys, Stainless Steel, Aluminium
Selective Heat Sintering (SHS) Thermoplastic powder
Selective Laser Sintering (SLS) Thermoplastics, Metal powders, Ceramic powders
Direct metal laser sintering (DMLS)
Almost any metal alloy
LaminatedLaminated Object Manufacturing (LOM)
Paper, Metal foil, Plastic film
Powder Fed Directed Energy Deposition Almost any metal alloy
WireElectron Beam Freeform Fabrication (EBF3)
Almost any metal alloy
Processes
Manufacturing of Metal Powders
7© Retsch Technology GmbH
Direct iron ore reduction (into iron powder) (+) Fast(-) but irregular particle shape
Atomization (iron and other metals)Gas atomization(+) Smoother rounder shape and narrow size distribution (-) but slower and cost intensive
Liquid atomization(+) Fast(-) but irregular particle shape and wider size distribution
Classification of Metal Powders
8© Retsch Technology GmbH
Separating Particle Sizes and Shapes(for manufacturing and/or testing)
Size Classification: - Sieving or Air Classification
Shape Classification: - Sieving with special shaped meshes- Sieving (fast and slow)
- Air Classification
Recycling of Metal Powders
9© Retsch Technology GmbH
Separating Particle sizes bySieving or Air Classification
After Atomization (Sieving or Air Classification )
For Recycling (Sieving off defects, dust, twins, agglomerates)
Example of Additive Manufacturing with Laser Sintering
10
Example for 3D printing
11© Retsch Technology GmbH
AM (Metal, Polymer and Ceramic Powder)Applications Plastic, Ceramic & Metal Powder
12© Retsch Technology GmbH
Automotive, Airospace Industry,Fast Prototyping => small numbers=> individual modificationsPaper => Plastics => Metal Laser Melting (3D Metal Printing)
Vacuum or Nylon Casting
3D Printing of Metal Construstions
13© Retsch Technology GmbH
3D printing with metal: The final frontier of additive manufacturing
CAMSIZER XT 3D Printing & Rapid Prototyping
14© Retsch Technology GmbH
3D Printing
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3D Printing
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Measuring Principle
17© Retsch Technology GmbH
Digital Image Analysis
STATIC(ISO 13322-1)
• Particles do not move during measurement• High resolution > 0,5 μm• Few 100 particles are analyzed
(low statistic)• Limited measurement range• Time consuming• Particles detected in stable orientation
(2 Dimensions)
DYNAMIC(ISO 13322-2)
• Particles in motion relative to camera
• Resolution > 1 μm• Few million particles are analyzed
(representative measurement)• Wide measurement range• Fast• Particles measured in random orientations
(3 Dimensions)
Content
Instrument
1.Measurement principle
2.Results
Applications
3.Markets and applications
4. Alternative analysis methods
18© Retsch Technology GmbH
CAMSIZER P4 (What‘s new)CAMSIZER P4
20© Retsch Technology GmbH
Measurement Range
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Big particles are touching the edge too often reliable quantification not possible.
Accurate measurement of big particles is not possible, even if they fit into the field of view:
Upper measurement limit defined by the field of view
Particle size ~ 1/3 of field of view
Two Camera-System (CAMSIZER P4, XT and X2)
22© Retsch Technology GmbH
Zoom CameraBasic Camera
Small particles in high resolution
Large amountof big particles
One pixel is element of a projection when at least half of the pixel is covered.
Resolution
ISO 13322-2:Smallest detectable particle:
1 pixel
CCD Basic CCD Zoom
23© Retsch Technology GmbH
24© Retsch Technology GmbH
Advanced, patented optics design
Sample flow
Light source 2
Light source 1
Basic Camera
Zoom Camera
Measurement principle (CAMSIZER XT)
New Optical Design of CAMSIZER X2
25© Retsch Technology GmbH
Advanced, patented optical design
Comparison CAMSIZER XT CAMSIZER X2
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Why is perpendicular orientation* better?
* Light Measurement Plane †
Focal plane is always in the measurement plane
Measurement Results
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What is the size of this particle?
Particle Size
28© Retsch Technology GmbH
xcmin
xc min
“width”
A
A‘ = Ax a
rea
“diameter overprojection surface”
xarea
“length”
xFe max
xFemax
CAMSIZER results are
compatible with
sieve analysis
Results X-Jet
29© Retsch Technology GmbH
Better Size Analysis due to Understanding of Particle Shape:Length, Width, Average Diameter
Particle Shape
30© Retsch Technology GmbH
• Width/length(aspect ratio)
• Roundness (sphericity)
• Symmetry
• Convexity
xFe max
xc min
A P
r1
r2
S
A convex
A real
= 1
< 1
Particle Shape: Mixture
32© Retsch Technology GmbH
32.8 %
67.2 %
xFe max
xc min
Q3 (round) =
Better Hardware for New Software Features
33© Retsch Technology GmbH
CAMSIZER P4 and CAMSIZER X2
33© Retsch Technology GmbH
KrumbeinsRoundness and SphericityFor proppants, sands, and other non-round, angular particlesCompatible with ISO 13503-2 and API
Krumbein Sphericity SPHT_Kmeasures the elongation of the particles (like w/l = b/l).
Average diameter of all corners dividedby diameter of maximum inscribed circle
Krumbein Roundness RDNS_Cmeasures the „angularity“, or „corner curvature radius“
Optical Process Control
34© Retsch Technology GmbH
Analysis for size and shape
Particle X-Plorer: New Software Features
35© Retsch Technology GmbH
New Image database
New Tool for improved understanding and documentation
Typically ~100.000 single particle pictures per measurement
Particle X-Plorer New Software Features
36© Retsch Technology GmbH
3D - Scatter Plot3D - Point Cloud
3D-Display of data points
Powerful toolfor distinguishing particleswith different sizeand / or different shapes
40© Retsch Technology GmbH
Powdered Metal
Sorting metals by Roundness (“Willingness” to roll)
Reports and Warnings
41© Retsch Technology GmbH
Dispersion Modules (CAMSIZER XT)
43© Retsch Technology GmbH
Particle Size Range from 1µm to 3mm
Three modes in 2 modules (dry and wet): X-Fall: for dry and free flowing particlesX-Jet: air pressure dispersion for fine and agglomerated powdersX-Flow: wet module for emulsions and suspensions,
with ultrasonic probe, optional for organic solvents
The Next Generation
44© Retsch Technology GmbH
CAMSIZER XT => CAMSIZER X2
Extended size range: 0.8 µm to 8 mm New optics:
Higher resolution: 0.8 µm per pixel
Larger field of view (□Basic)New cameras:
Higher resolution 2 * 4.2 Mpixel310 frames per second/muchhigher data rate (factor 3.6)
Size range: 1.6 µm to 3 mm New optics:
Resolution: 1.6 µm per pixel(with integration => 2.5µm)
Smaller field of view (▫Basic)New cameras:
Camera resolution 1.3 Mpixel270 frames per second
Modular "X-Change" Concept
45© Retsch Technology GmbH
Flexible configuration for a wide application range
simple • safe • fast
Dispersion Modules (CAMSIZER XT)
46© Retsch Technology GmbH
Dry Dispersion Inserts (2 Plug-In Options)
X- Fall (Gravity dispersion)
X-Jet (Air pressure dispersion)
Measurement principle – X-Fall
47© Retsch Technology GmbH
Measurement range from 10µm to 8mm
For free flowing materials
similar to standard CAMSIZER
Sample recovery after analysis
• Complete sample recovery
• No contamination
Dry Dispersion with X-Fall
CAMSIZER X2 with X-Dry and X-Fall
48© Retsch Technology GmbH
Measurement principle – X-Flow
50© Retsch Technology GmbH
Measurement rangefrom 1 µm to 600 µm for emulsions and suspensions
stronger dispersionwith ultrasonicmodule
Optional for organicsolvents
Wet Dispersion with X-Flow
New X-Flow for CAMSIZER X2
51© Retsch Technology GmbH
Measurement principle
52© Retsch Technology GmbH
Highlights of the optics setup design:• More than 275 images per second
• Full frame cameras with > 1.3 Megapixel resolution
• Separate light sources for optimised brightness, homogenity, and contrast
• 2 Cameras: High resolution combined with excellent statistic
for a wide dynamic range
• Image processing in real-time: Each particle in each image is analysed
• Hundreds of particles in each image: Excellent statistics in short time
CAMSIZER XT can measure in a wider dynamic rangewith better statistics and reproducibilitythan any other image processing system
Advantages
fast repeatable and reproducible
maintenance free and robust
precise
53© Retsch Technology GmbH
Dispersion Modules (CAMSIZER XT)
54© Retsch Technology GmbH
Dry Dispersion with X-Jet
Measurement range from 1µm to 3mm
For fine powders and agglomeratingmaterials
Dry Dispersion by pressurized air
CAMSIZER X2 with X-Dry and X-Jet
55© Retsch Technology GmbH
Results
56© Retsch Technology GmbH
For agglomerating powders
- Metal powder- Coal dust- Wheat flour
Particle size
Lower Measurement Range
57© Retsch Technology GmbH
58© Retsch Technology GmbH
Reproducibility of Metal Powder Results
Customer had sent 30 different samples to Retsch Technology but some of these samples were the same (red, blue and green). We found out the groups and showed to the customer the good reproducibility of CAMSIZER XT (and proofed his sample splitting as well)
xc_min [µm]10 15 20 25 30 35 40 45 500
10
20
30
40
50
60
70
80
90
Q3 [%]
0
1
2
3
4
5
6
7
8
9
q3 [%/µm]
Powder-#8-X-Jet-30kPa_vvv_xc_min_Mv.rdfPowder-#8-X-Jet-30kPa_TP1_vvv_xc_min_001.rdfPowder-#8-X-Jet-30kPa_TP2_vvv_xc_min_002.rdfPowder-#13-X-Jet-30kPa_TP1_vvv_xc_min_001.rdfPowder-#13-X-Jet-30kPa_TP2_vvv_xc_min_002.rdfPowder-#13-X-Jet-30kPa_vvv_xc_min_Mv.rdfPowder-#27-X-Jet-30kPa_TP1_vvv_xc_min_001.rdfPowder-#27-X-Jet-30kPa_TP2_vvv_xc_min_002.rdfPowder-#27-X-Jet-30kPa_vvv_xc_min_Mv.rdf
CAMSIZER XT for Metal Powders
59© Retsch Technology GmbH
CAMSIZER XT for Metal Powders
60© Retsch Technology GmbH
Metal Powder
Reproducibility and Instrument-to-Instrument agreementΔ = 0.1µm – 0.3µm
Features of the CAMSIZER®
61© Retsch Technology GmbH
Calibration Reticule
- Traceble to an International Standard- Covering the Whole Measurement Range- Instrument to Instrument Agreement
StaticCalibration
62© Retsch Technology GmbH
Features of the CAMSIZER XT
Calibration Reticule
StaticCalibration
Physical Dynamic Partical Standards
63© Retsch Technology GmbH
Whitehouse Glass Bead Standard XX030for X-Dry and X-Fall
Dynamic Calibration
Size Range and Sieve Correlation
64© Retsch Technology GmbH
System Comparison DIA, DIA, DIA, Sieving, LD
65© Retsch Technology GmbH
xc_min [µm]4 6 8 10 120
5
10
15
20
25
30
35
40
45
50
q3 [%/µm]
Duke10um12um_gl0_xc_min_009.rdfDuke10um12um_gl0_xc_min_010.rdfDuke10um12um_gl0_xc_min_011.rdfDuke10um_xc_min_002.rdfDuke10um_xc_min_003.rdfDuke10um_xc_min_004.rdf
67© Retsch Technology GmbH
Particle size
Results X-Flow (Calibration)
Particle Size Distribution 10µm + 12µm, Wet Dispersion
68© Retsch Technology GmbH
Particle size
Results X-Flow
Particle Size Distribution 2.5µm + 5µm, Wet Dispersion
69© Retsch Technology GmbH
X-Flow Measurement Results CAMSIZER X2
Particle size distribution: 2.5 µm and 5 µm
High resolution for small particles.
Content
70© Retsch Technology GmbH
Instrument
1.Measurement principle
2.Results
Applications
3.Markets and applications
4. Alternative analysis methods
• Digital image processing with patented 2-camera system (ISO 13322-2)
• Wide dynamic range from 1µm to > 3mm
• Newly developed optical system with ultra bright LEDs for sharp contrasts and large depth of focus
• Short analysis time 1 – 3 minutes for few million particles
• Safe detection of oversized and undersized
• Modules for dry and wet dispersion
• Analysis results compatible to sieve analysis
Advantages
74© Retsch Technology GmbH
Content
75© Retsch Technology GmbH
Instrument
1.Measurement principle
2.Results
Applications
3.Markets and applications
4. Alternative analysis methods
• Industrial labs
• Research institutes
• Production control
• Quality control for final products
• Quality control of incoming raw materials
• Immediate control and optimisation of
production processes
Application areas
76© Retsch Technology GmbH
Application areas
77© Retsch Technology GmbH
Typical sample materials
• Pharmaceutical powders, granules or
small pellets
• Pulverized and granulated food, spices
• Detergents, enzymes, fillers for washing powders
• Metal or ore powders
• Abrasives (medium and small grit)
• Sand and cement, building materials, limestone
• Fibres
Content
78© Retsch Technology GmbH
Instrument
1.Measurement principle
2.Results
Applications
3.Markets and applications
4. Alternative analysis methods
Alternative Methods
79© Retsch Technology GmbH
0.8µm - CAMSIZER X2 - 8mm
Sieving CAMSIZER XTSize range 10µm - 63mm 1µm – 3mmShape analysis no yesDetection of oversizedparticles each particle few big particles
from < 0.1% Vol.Resolution poor high resolution
Multi-modal distributions poor size resolution better resolution
Repeatability andlab-to-lab comparison „difficult“ superior
Comparison with sieving identical results possible
Handling simple,but time consuming easy and fast
Sieving CAMSIZER XT
81© Retsch Technology GmbH
Results X-Jet
82© Retsch Technology GmbH
Identical results to sieve analysis
xc_min [mm]0.1 0.2 0.3 0.4 0.5 0.6 0.70
10
20
30
40
50
60
70
80
90
Q3 [%]
Ca-hydrogenphosphate_100kPa-T38567-vvv_xc_min_005.rdfCa-hydrogenphosphate_100kPa-T38567-vvv_xc_min_003.rdfCa-hydrogenphosphate_100kPa-T38567-vvv_xc_min_004.rdfT38567-Sieve-Analysis-Customer-Site.ref
83© Retsch Technology GmbH
Sieving CAMSIZER XT
Spheroidal Particles
x [µm] 200 400 600 800 1000 1200 0
10
20
30
40
50
60
70
80
90 Passing [%]
Sample-1__xc_min_002.rdf Sample-1__xc_min_001.rdf Sieving-Nominal-S1.ref
xc min =∅ = d = Xc min
particle-width
84© Retsch Technology GmbH
Sieving CAMSIZER XT
Influence of Mesh Width
1400µm 1400µm 1429.5µm
Mesh sizes warpMesh sizes weft
Nominal Sieve Mesh = 1400µm Real Sieve Mesh >1400 = 1455
only beads < 1400µm
will pass the sieve mesh
beads > 1400µm will not pass the sieve mesh
Upper mesh size range ~1455µm sieve No. 03033531 (nominal 1400µm)
Theory: Reality:
85© Retsch Technology GmbH
Sieving CAMSIZER XT
Real Mesh Width
x [µm] 200 400 600 800 1000 1200 0
10
20
30
40
50
60
70
80
90 Passing [%]
Sample-1__xc_min_002.rdf Sieving-upper-range-S1.ref
86© Retsch Technology GmbH
Sample Reproducibility of CAMSIZER XT measurements of xc min (red, and blue) with Basic + Zoom or Zoom only, Retsch sieve result (real mesh sizes from optical inspection) AS 200 TAB (*black), Customer nominal sieve results (*blue)
Results of Metal Powder
xc_min [µm]10 20 30 40 500
10
20
30
40
50
60
70
80
90
Q3 [%]Solder_Sample_G_xc_min_001.rdfSolder_Sample_G_xc_min_002.rdfSolder_Sample_G_xc_min_003.rdfTin-Solder_Sample_G__xc_min_001.rdfTin-Solder_Sample_G__xc_min_002.rdfTin-Solder_Sample_G__xc_min_003.rdfRT1763 Sieve-Analysis G customer-site-nominal.refRT1763 Sieve-Analysis_G_AS200tap_real-sizes.ref
Applications: Metal powdersMaterial: Cu
87© Retsch Technology GmbH
Identical results to thesieve analysis
xc_min [mm]0.04 0.1 0.2 0.4 1 20
10
20
30
40
50
60
70
80
90
Q3 [%]
Automatic reports,many languages
available
Comparison of Methods: Sieving• robust and industrial-suited• easy handling• references available from user
Advantages
Disadvantages
• high amount of time and work• low resolution, small number
of investigatable classes• limited sample amount
(overloading is critical)• Difference between
nominal and real sizes
Competing Measuring Methods
Worn out sieves
91© Retsch Technology GmbH
F2
F1
1. Move
2. Sliding friction
3. Static friction
xc_min [mm]0.5 0.6 0.7 0.8 0.9 1.00
10
20
30
40
50
60
70
80
90
Q3 [%]
0
50
100
150
200
250
300
350
400
450
q3 [%/m m]5454_PT100_xc_min_008.rdf5454_random_xc_m in_009.rdf5454_Huntsman-sieve.ref
Roundparticles withlow density
are capturedwithout
rerelease
Sieving Problems (here Blinding and Overloading)
Test Sievesthat comply with standards
If sieve analysis is used for quality controlwithin the context of DIN EN ISO 9000:2000
then both the sieve shaker and thetest sieves must be subjected to
test agent monitoring.
w = mesh widthd = wire diameter
Tolerance for mean value (Y):The mean value of the mesh width must not differ from thenominal value w by more than the tolerance ± Y.
w
w
Ø d
Ø dTechnical requirements & testing
according to ISO 3310
CAMSIZER XT finding Fibers in Beads
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Finding the Fibers
CAMSIZER XT Laser sizer
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Laser sizer CAMSIZER XTSize range down to 20nm > 1µmShape analysis no yesDetection of oversizedparticles percent range few big particles
< 0.1% Vol.
Resolution good for fines better resolution forlarge particles
Multi-modal distributions more difficult better volume model, better size resolution
Comparison with sieving not possible identical results
Information content black box + mathematics pictures
CAMSIZER XT Optical Microscope
96© Retsch Technology GmbH
Microscope CAMSIZER XTSize range 0.5 – 500 µm 1 µm -3 mm
Shape analysis yessuperior image quality yes
Detection of oversizedparticles no few big particles
< 0.1% Vol.Resolution better good
Statistics Low,few 1,000 particles million particles/minute
Comparison withsieving not possible identical results possible
Handling time consuming fastRepresentative Sample Amounts
difficult, only narrowdistributions
yes, small and large amounts
Static Dynamic Image Analysis
97© Retsch Technology GmbH
Digital Image Analysis
STATIC(ISO 13322-1)
• Particles do not move during measurement• High resolution > 0,5 μm• Few 100 particles are analyzed
(low statistic)• Limited measurement range• Time consuming• Particles detected in stable orientation
(2 Dimensions)
DYNAMIC(ISO 13322-2)
• Particles in motion relative to camera
• Resolution > 1 μm• Few million particles are analyzed
(representative measurement)• Wide measurement range• Fast• Particles measured in random orientations
(3 Dimensions)
98© Retsch Technology GmbH
CAMSIZER XT Optical Microscope
99© Retsch Technology GmbH
xc_min [µm]200 400 600 800 10000
10
20
30
40
50
60
70
80
90
Q3 [%]
PPO-646_xc_min_001.rdfRT1766_ppo646_sieve.ref
CAMSIZER XT Optical Microscope
100© Retsch Technology GmbH
CAMSIZER XT CAMSIZER
CAMSIZER CAMSIZER XTSize range 30 µm – 30mm 1 µm -3 mmShape analysis yes yesDetection of oversizedparticles yes yes
Images / second 60 277Resolution CCD-Cameras 790,000 1,300,000
Comparison with sieving identical resultspossible
identical resultspossible
Handling fast fastRepresentative Sample Amounts
yes, small and large amounts
yes, small and large amounts
101© Retsch Technology GmbH
Comparison of CAMSIZER and CAMSIZER XT
Results of CAMSIZER (black) and CAMSIZER-XT (red) of sample #30
CAMSIZER distribution is wider, the results are not that accurate and
repeatable as results from CAMSIZER XT.
Results of Metal Powder
xc_min [µm]15 20 25 30 35 40 45 500
10
20
30
40
50
60
70
80
90
Q3 [%]
XT-with-X-Jet-#30-Einzel-250kPa_xc_min_005.rdfXT-with-X-Jet-#30-Einzel-250kPa_xc_min_006.rdfXT-with-X-Jet-#30-Einzel-250kPa_xc_min_007.rdfXT-with-X-Jet-#30-Einzel-250kPa_xc_min_008.rdf#30-classic-CAMSIZER-Repeatability-xc_min_013.rdf#30-classic-CAMSIZER-Repeatability-xc_min_014.rdf#30-classic-CAMSIZER-Repeatability-xc_min_015.rdf#30-classic-CAMSIZER-Repeatability-xc_min_Mv.rdf
Summary
102© Retsch Technology GmbH
Wide dynamic measurement range (factor of >1500)
High resolution, length and diameter!
Shape analysis
Very Sensitive for over- and undersized particles, 0.001%
Results compatible to sieve analysis
Different dispersion options
Measurement ranges
CAMSIZER P4 20µm – 30mm
CAMSIZER X2 0.8µm – 8mm
32.8 %
67.2 %
xFe max
xc min
Q3 (round) =
Thank you for yourattention!