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World leading TP LCD/LCM equipment solutions provider Future Industrial Develo p ment Co. , Limited World leading TP ,LCD/LCM equipment solutions provider Shenzhen Liande Automation Equipment Co., Limited 第1页 2015 May

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World leading TP LCD/LCM equipment solutions provider

Future Industr ia l Development Co., Limited

World leading TP,LCD/LCM equipment solutions provider

p ,Shenzhen Liande Automation Equipment Co., Limited

第1页 2015 May

ContentContent

Company ProfileCompany supporting processp y pp g pCompany associated equipment seriesCompany technology integration casesp y gy g

第2页

Profile & Mission Statement

• Founded in 1998

• Pioneered independent manufacture of brand new supporting equipments for LCD & TP products, AOI testing equipments, automation production line & logistics line, and non-standard automation equipment.

• Provides a wide range of automation equipments and services for the FPD, TP industry.

• Good customized equipments service provided to our customers.

• To create a world-class company that is internationally renowned for performing to the highest quality, environmental and ethical standards capable ofenvironmental and ethical standards, capable of designing, manufacturing, and distributing a range of products to service the FPD, TP and LCD industry.

• To provide our employees with a pleasant, professional, and challenging working environment and to promoteand challenging working environment, and to promote care, cleanliness, attention to detail, and environmental awareness amongst our employees, customers, vendors, and the surrounding community.

• To lead the industry development trend and become an

第3页

To lead the industry development trend and become aninternational leading industrial automation equipmentmanufacturer.

ManpowerManpower

• Nearly 600 employees • In-house Research and Engineering DepartmentIn house Research and Engineering Department • Sales offices China wide• Logistic Support China• Dedicated IP department

Sales / supportManufacturingIP dept

第4页

Corporate StructureCorporate Structure

Future industrial, LiandeHeadquarterHeadquarter

Liande ShenzhenShenzhen Fasm machine

Lianwang Shanghai Liande Hengyang

第5页

Support FunctionsSupport Functions

New Product Development

Quality Assurance

Document Control

General Management

Finance

Engineering , Design Services

& LabDocument Control

MIS

Finance

Human ResourcesElectrical

Development

Site Management

Equipment Management

Administration

L i ti S i

Mechanical Development

Equipment Management

Marketing & Communications

Logistic Service

Manufacturing Engineering

Vision Development

Sales

Domestic marketOversea market

第6页

Domestic marketOversea market

MilestonesMilestones

F d d Li d A t ti El t i l1998:

2002:

Founded Liande Automation Electrical Equipment Factory

Renamed as Liande Automation Electrical

2004:

Renamed as Liande Automation Electrical Equipment Co., Ltd

The first semiautomatic polarizer laminator machine developed successfully2004:

2005:

laminator machine developed successfully

Liande Shanghai branch established and passed ISO9001:2000 quality system certification

2006:

certification

The first pulse constant temperature FOG bonding machine developed successfully

2007:

g p y

The semiautomatic pre-COG machine developed & passed Shenzhen hi-tech enterprise certification

第7页

enterprise certification

Milestones, continuedMilestones, continued

2008:Won “2007 Shenzhen technology innovation award” & “Excellence award for2008: innovation award & Excellence award for transformation of scientific and technological achievement of the 10th Hi-tech Fair”

2009:

2010

Passed ISO9001:2008 quality managementsystem certification and won “Excellenceaward for patient of Bao’an district ”

2010: Won “innovation and development award for medium & small size enterprise award”, passed the national hi-tech enterprise certification, vacuum laminating machine developed

2011:

developed

Renamed as Shenzhen Liande Automation Equipment Co., Ltd, semiautomatic FOG connection machine & UV glue laminating

2013:

g gmachine developed, Liande Hengyang branch established

The first shareholder’s meeting held

第8页

2013: g

Quality AssuranceQuality Assurance

Th h l li d tt ti• Through care, cleanliness, and attention to detail, every employee has a role and a responsibility to strive for continuously improving quality standards and to provide our customers with standardsprovide our customers with standards that meet or exceed their expectations

• Products are manufactured in accordance with the ISO9001:2008 Quality System

第9页

EngineeringEngineering

• In-house electronics design, mechanical design and vision design capability

• Patent analysis• Patent analysis

• Development of design processes for new product development and

i ip p

reengineering

• Highly experienced China sourcing

第10页

Engineering - The project management processEngineering - The project management process

Accept Intent Costed Viable P j t Design freeze Certify ReconcileValidate

The Product Introduction Process

Design Product SPVR

Project Design freeze

E l ti

Certify ReconcileValidateGW2 GW3 GW4 GW5 GW6 GW7

I iti t

GW1

Design Reviews Releas

eProductionValidation

Development

Product &

Evaluation

Validation

Detailed Design

Initiate

BUDGET QUOTATION

Approval toCommit resources

to develop opportunityFIRM QUOTATION

Approved Product

Product &Process design

Data packVerification ofProto models

Acceptance of designThoroughness and

Validated ProductionC bilit

Implementation

ValidatedProduct

Support

New TechnologyIntroduction

New Tech’

to develop opportunity Approved Product, Process and

Project proposal.Authority to

commit resources

for implementation

Tooling & Equipment

accuracy.Validated off-

ToolProduct

Job 1 SPVR

CapabilityLessons gainednew capability

New Tech’ FullNew Tech’

Product

ProjectReporting

SystemR&R’s

第11页

New TechDesign

feedback

Equipment Verificationof Capability

CapabilityFeedback

Corporate Engineering - Products and ServicesCorporate Engineering - Products and Services

• Equipments for LCD, FPD

• Equipments for TP• Automation production line &Automation production line &

logistic line, • Non-standard customized

automation equipmentAOI ti i ti i t

第12页

• AOI optics inspection equipment

Main Customers

第13页

6、Future Industrial Existing Products(1)For LCM Industry(LCM)

Polarizer Laminating M/C Backlit Laminating M/C

Laminating M/C

Pad cleaning M/C BLU/LCD

Assembly

COG

第14页

FOG/FOB

6、Future Industrial Existing Products(2)For Touch Module Industry (TP)

Flex to rigid Soft film Flex to rigid Laminating M/C laminator

Rigid to rigid Laminating M/C

FOG/TOD

g

OCR l i ti

第15页

OCR laminating M/C

OCA Laminating Production line

Laminating machine

6、Future Industrial Existing Products(3)For non-standard customized Series

Automation production line & logistics line--partial

SMT group transmission line LCM antistatic assembling lineIntelligent logistics and distribution system

FOG antistatic belt production line FFU clean desk and LCM assembly line

Double aging

第16页

assembly line

6、Future Industrial Existing Products(3)For non-standard customized Series

Non-standard automation customized equipment--Partial

FPC hardening device PSI inspection machine High voltage tester

Thermoforming machine Hot melt machine 3 points soldering

第17页

Thermoforming machine Hot melt machine 3 points soldering machine

6、Future Industrial Existing Products(3)For non-standard customized Series

Non-standard customized fixture--Partial

Half module tester Triangular prism Module tester (lot 3)

measurement fixturemeasurement fixture

G for half module tester IC heavy machine Electrical test

第18页

G for half module tester IC heavy machine Electrical test stand

Company profileCompany supporting processCompany associated equipmentCompany technology Integrated cases

第19页

1、Touch Control/Display Structure—External

G FF G GCG

OCA

X-Sensor

OCA

G+FF G+GCG

OCA

SG

OGS/OFSOGS

CTPExternal

touch panel

IC

OCA

Y-Sensor

SG p

Polarizer

PolarizerTFT glass

液晶

CF glass

Liquid crystal

IC

FPC

PCBPanel

Shading film

Enhancement Film

Enhancement Film

Enhancement Film

Diffuser

Frame

Light guide plate

Reflector plate

BLUB/L module

第20页

Reflector plate

Light (LED/CCFL)

2、 Touch Control/Display Structure—Embedded

PolarizerCover Glass Polarizer

TFT glass

液晶

CF glass

Liquid Crystal

IC

FPC1,FPC2

PCB

Cover Glass

Touch layer

Polarizer

CF glass IC

Touch control+DisplayEmbedded

Touch panelCover Glass

PolarizerTFT glass

On-cell

PolarizerTFT glass

液晶

CF glass

Liquid Crystal

IC

FPC1,FPC2

PCB

Touch layer

Shading film

Enhancement film

Enhancement film

In-cell

Enhancement film

Diffuser

Frame

Light guide plate

Reflector plate

BLUB/L Module

第21页

Reflector plate

Light(LED/CCFL)

3, LCM Production Process

ACleaning Coating PR coating Expose Develop StripEtch

Array

Print plastic boxCleaning PI printing Rubbing

Print plastic box and silver point

Piece together Cutting lobes LCD irrigation

Cell

PI printing Rubbing Powder coaterCleaning

POL lamination COG FOG PCB/OLB BLU Panel/BLU +Module

Cleaning

第22页

POL lamination COG FOG PCB/OLB BLU assemblyCleaning

4, LCM Matching Equipment

AOI/ET Dispen-ser

Automatic assembly machine

Dispe C/V

COG

IC

FOG/OLB

FPC FPCFinished good unloadLD POL

Clean

Polarizer laminating M/C

BLU l di

Automatic laminator

-nsingC/V

C/VE/C ACF Pre Main ACF Pre MainPrePresetStation C/V C/V

Polarizer ChipChip

Chip

ACF

FPC

LCD

BLU loading

PolarizerEnhancement film

Polarizer LCDLCD

ACFLCD

PCB/TAB BLU Frame

Enhancement filmDiffuser

FOG(FPC On Glass)

LCD ACF

BLU Frame

Polarizer laminator COG(Chip On Glass)

OLB(Outer Lead Bonding)

LCD & BLU assembly B/L module assembly

No Stations Function Description

1 Polarizer M/C Laminate POL on panel, process of Panel & POL loading, cleaning, film stripping, lamination completed by machine automatically

2 COG M/C COG (Chip On Glass), bond chip on Panel, it includes Panel load, cleaning, ACF attachment, IC load, pre-bonding, main bonding ..

3 FOG OLB M/C FOG(FPC on Glass) OLB (Outer Lead Bonding) mainly refers to bonding process of FPC PCB TAB COF material etc3 FOG,OLB M/C FOG(FPC on Glass), OLB (Outer Lead Bonding), mainly refers to bonding process of FPC,PCB,TAB,COF material etc

4 AOI M/C AOI(Automatic Optical Inspection) detect number of conductive particles, binding position offset, IC binding direction etc

5 Dispensing M/C Dispense glue of Silicon, Tuff rubber, the main purpose is to prevent corrosion of ITO line, FPC reinforcement, etc.

6 Automatic l i t

The machine can stack diffuser, enhancement film, shading film etc other soft film in the backlight frame. It includes loading, t ti fil t i t ti li t & t k l di t

第23页

laminator automatic film tearing, automatic alignment & stack, unloading etc

7 Automatic assembly M/C

Mainly applicable to lamination between panel & BLU, it includes loading, tear film, alignment, lamination, cutting etc

5, TP Production Process 1-G+G

SensorFilm coating Coating Expose Develop StripEtchCleaning

Cut Shape FPC Lamination

Pre-production

Sensor(Glass/Film)

Cut processing attachment Lamination(OCA)

process

Lamination(OCR)

Protective filmlamination

Cleaning Chemical tempering

Material cutting Polishing

Cover

Lamination(Mouth-type glue)cut Shaping/

drilling Cleaning丝印/烘干Printing/curing

第24页

drilling g丝印/烘干curing

5, TP Production Process 2-G+F

Film sensor process description:

Start Up ITO(roll) Cut Cutted

piece Lamination

(1)

Down OCA(roll) Cut Cutted

piece

Up OCA t Punched Punched

Lamination(2)

Notching

Up OCA(roll) cut Punched

holePunched

slot

C tt d

Lamination(3)

Diecut

Offline

end

Trim Cuttedpiece

Offline ITO

(roll)

Double film structure schematic:Up OCA

Online (ITO)

Down OCA

Line surface

Line surface

第25页

Offline (ITO)Line surface

6, TP matching equipment

FOG

FPC FPC

Flex to rigid lamination

Rigid to rigidlamination

OCRProtective film

lamination

C/V ACF Pre

FPC

MainPre

FPC

C/VOCA/Film

Glass/LCM

CG/TP

SG/LCM

Glass/Film

Glass/LCM

or

Glass/TP

OCA OCR

FOG Flex to rigidlamination

Rigid to rigidlamination OCR Protective film

lamination

No Matching Equip. Function description

1 FOG(FOF)M/C

FOG(FPC On Glass), FOF(FPC On Film), mainly bond FPC on Sensor glass(film), applicable to product structure of OGS, DITO, SITO, Film, On-cell, In-Cell.

2 FTR(flex to rigid) FTR(flex To rigid) mainly bond soft film to substrate lamination method includes roller mesh2 FTR(flex to rigid) FTR(flex To rigid), mainly bond soft film to substrate, lamination method includes roller, mesh

3 RTR(rigid to rigid) mainly refer to lamination between hard substrates under high vacuum, it includes balloon-type, direct pressure

4 OCR M/C Adopt OCR as lamination medium, the machine integrate dispensing, thickness measurement, alignment, bonding, UV pre-curing etc, applicable to FTR, RTR bonding process.

第26页

5 Protective film laminator

Applicable to protective film laminated on the surface of finished or semi-finished product, protective film made from die cut of roll material or cutted piece.

Company profileCompany profileCompany supporting processCompany associated equipmentCompany associated equipmentCompany technology Integrated cases

第27页

1、POL Laminator Series

All equipments will be tested strictly b E i b f d li

q p yby Engineers before deliveryMore competitive priceNo quality compromiseTo meet your budget we offerTo meet your budget, we offer Manual , Semiautomatic and automation Systems options

Equipment model

LPL-0700S

Application Laminate POL on LCD, suits flex to rigid lamination.

Equipment model

LPL-0502A

Application Laminate POL on double side of LCD

Product size 2”~5”Product size Within 7”

Accuracy ±0.1mm

T/T 4sec/pcs(single face test)

Process Load LCD man all ac m s ction film

Product size 2 5

Accuracy ±0.15mm

T/T 4.5sec/pcs(double side test)

Process Fl

Load LCD automatically →adjustment→cleaning(POLd t ti ll ) id AProcess

FlowLoad LCD manually→ vacuum suction→film removing→POL pickup→alignment→lamination→unloading

Feature Loading manually, film removing automatically, suits other flex to rigid lamination

Flow removed automatically)→side A lamination→reversal→adjustment→cleaning(POL removed automatically)→Side Blamination→unloading automatically

Feature Load/unload automatically, double side lamination a tomaticall

第28页

Operator 1(load LCD)automatically

Operator Non

POL Laminator Series--continued

Equipment model

LPL-0708A

Application Laminate POL on double side of LCD automatically

Produce size

0.8”~7”

Accuracy ±0.1mm

T/T 4 ~ 4.5sec/pcs(double side test)

Process flow

LCD loading automatically→AOI(reserved)→LCD adjustment→film on POL removed automatically、adjustment→positive paste POL→ reversal→manual cleaning→ AOI(reserved)→LCD adjustment→film on POL removed automatically、adjustment→negative paste POL →unloading automatically

Feature Line layout load/unload automatically film removed automatically

第29页

Feature Line layout, load/unload automatically, film removed automatically

Operator 1(manual cleaning on LCD after reversal)

2, COG Equipment Series

Equipment model

LCOG-0703A/ LCOG-0704A Equipment model

LCOG-1500A(multi-section, multi ICs)model

Application Bond IC on LCD automatically(Pad cleaning optional)

Produce size

1”~7”

Accuracy ACF lamination:X±0 15mm;Y±0 15mm

model

Application Bond IC on LCD automatically(2 sides utmost, utmost 4 same IC on one side)

Produce size

7”~15”

Accuracy ACF lamination:X±0.15mm;Y±0.15mmPre-bonding:±2um;main bonding:±4um

T/T 4.5sec/pcs(single side, one IC test)

Process flow

After LCD cleaning →pre-alignment→ACFattachment→ACF attachment check automatically→IC

Accuracy ACF lamination:X±0.15mm;Y±0.15mmPre-bonding:±2um;main bonding:±4um

T/T 6sec/pcs(single IC test)

Process After LCD cleaning →pre-alignment→ACF attachmentflow attachment ACF attachment check automatically ICloading automatically→visual alignment→pre-bonding→main bonding →unloading

Feature Single side IC bonding,LCD/IC loading automatically, alignment automatically, unloading automatically

Process flow

After LCD cleaning pre alignment ACF attachment on side A, ACF attachment check automatically→ACF stage back & rotate 90 degrees→ ACF attachment on side B、ACF attachment check automatically→ IC rotate, adjustment, loading→visual alignment→pre-bonding→main bonding→unloading

第30页

Operator Non Feature Multi-section, IC bonding,LCD/IC loading, alignment, unloading automatically

Operator Non

3, FOG Equipment Series(within 7”)

Equipment model

LFOG-0745A0/ LFOG-0745S0(single side, IC)

Application Conduct FPC bonded on LCD/OGS/On-cell

Equipment model

LFOG-0735A1(single side, IC)

Application Conduct FPC bonded on LCD/OGS/On-cellautomatically

Produce size

1”~7”

Accuracy ACF lamination:X±0.15mm;Y±0.1mm

Application Conduct FPC bonded on LCD/TP automatically

Produce size

2”~7”

Accuracy ACF lamination:X±0.2mm;Y±0.2mmP b di ±10 i b di ±15Pre-bonding:±10um;main bonding: ±15um

T/T ≤4.5sec/pcs

Process flow

Incoming material→Panel pre-alignment→ ACF Stage → ACF attachment→ACF attachment automatically( h k) FPC l di t ti ll i l

Pre-bonding:±10um;main bonding: ±15um

T/T 3.5sec/pcs

Process flow

Incoming material→Panel pre-alignment→ ACF Stage → ACF attachment→ACF attachment automatically(sensor check)→ FPC loading automatically、

(sensor check)→ FPC loading automatically→visual alignment automatically→pre-bonding→main bonding→back unloading

Feature CCD alignment automatically,1+1+4 configuration, suits OGS & On-cell product

(sensor check)→ FPC loading automatically、adjustment→visual alignment automatically→pre-bonding→main bonding→back unloading

Feature Automatic configuration,2+2+4 configuration, 2 pieces transferred at the same time

第31页

Operator Non (FPC loading manually optional) Operator Non

Remark:accuracy achieved, ACF lamination:X±0.15mm;Y±0.1mm;pre-bonding:±10um;main bonding:±10um

3, FOG Equipment Series(7” above)

Equipment model

LFOG-1255A0/ LFOG-1255S1(single side, IC) Equipment model

LFOG-0735A1(single side, IC or multi-section, multi ICs, a maximum of 4)

Application Conduct FPC bonded on LCD/OGS/On-cellautomatically

Produce size

3”~12”

Application

Conduct FPC bonded on OGS/LCD automatically

Produce size

7”~15.6”

Accuracy ACF lamination:X±0.15mm;Y±0.1mmPre-bonding:±10um;main bonding: ±15um

T/T 5.5sec/pcs

Process fl

Incoming material→Panel pre-alignment→ ACF Stage ACF tt h t ACF tt h t t ti ll

Accuracy ACF lamination:X±0.1mm;Y±0.1mmPre-boding:±10um;main bonding:±20um

T/T 8sec/pcs

Process fl

Loading by feeding M/C→Panel pre-alignment t ti ll ACF St ACF tt h t ACFflow → ACF attachment→ACF attachment automatically

(sensor check)→ FPC loading automatically→visual alignment automatically→pre-bonding→main bonding→back unloading

Feature CCD alignment automatically,1+1+4 configuration, suits OGS & O ll d t

flow automatically→ ACF Stage → ACF attachment→ACF sensor(check) automatically→ FPC loading manually→visual alignment automatically→pre-bonding→main bonding→unloading stage →product received by receiving machine

F t U t 4 i f th FPC b d d i l id

第32页

OGS & On-cell product

Operator Non (FPC loading manually optional)

Feature Up to 4 pieces of the same FPC bonded on single side, 1+1+2 configuration

Operator 1(FPC placed manually)

4, Automatic LCD bonding production line

Equipment model

LLD-4545-01 LDQ-0700A LCOG-0704A L-FOG-0745A0-01

Equipment name

Automatic feeding machine

Pad cleaning machine

COG FOG

Application Automatic Panel loading

Automatic pad cleaning

IC bonded full automatically FPC bonded full automaticallyPanel loading cleaning

Product size Within 7”(single side, single IC/FPC)

Accuracy — — ACF lamination:X±0.15mm;Y±0.15mmPre-bonding:±2um;main bonding:±4um

ACF lamination:X±0.15mm;Y±0.1mmPre-bonding:±10um;main bonding:±15um

T/T 4.5sec/pcs

Process flow Automatic Panel loading→pad cleaning→automatic IC bonding→automatic FPC bonding(can be customized)

Feature — Clean cloth + plasma cleaning

CCD automatic alignment,1+1+3configuration automatic IC loading

CCD automatic alignment,1+1+4configuration FPC automatic loading

第33页

plasma cleaning configuration, automatic IC loading configuration,FPC automatic loading

Operator Non (full automation)

5, Backlight stacking machine series

Equipment model

LBZD-0705/LBZD-5/LBZD-2

Application Stack all kinds of film in the plastic frame

Produce size

2”~5”; 4”~7”;

Accuracy ±0 05mmAccuracy ±0.05mm

T/T 3.2 ~ 3.6sec/pcs(within 5”); 4.2 sec/pcs(5 ~ 7”);

Process flow

Semi-finished BLU loading→remove dust→film sent to each station, tear film, adjustment, stacking completed by rotating platform→lamination →unloading

F t R t l t

第34页

Feature Rotary layout

Operator 1(BLU loaded manually)

6, Module assembly series

Equipment model

LGP-0709A Equipment model

LGP-0708A

Application Applicable to assemble LCD with BLU

Produce size

1.5”~7”

Accuracy ±0.05mm

Application

Applicable to assemble LCD with BLU

Produce size

3”~7”

T/T 4sec/pcs

Process flow

Automatic loading LCD→ adjustment→automatic tear film

Load BLU manually →cleaning, tear film

Accuracy

±0.1mm

T/T 4sec/pcs

Process flow

Automatic loading LCD→ adjustment→automatic tear film

Automatic visual alignment→assembly→unloading

Feature Rotary layout, automatic alignment, BLU duplex alternately feeding

O t 1(l d LCD ll )

flowAutomatic loading BLU →reversal→tear film

Automatic visual alignment→assembly→unloading

Feature Straight-through layout, LCD/BLU automatic loading,

第35页

Operator 1(load LCD manually)g g y , g,

alternatively assembly, automatic tearing film

Operator Non

7, Flex to rigid laminating machine series

Equipment model

LOL-1300A

Application Applicable to laminate OCA on TP(CG)

Produce 4”~13”

Equipment model

LOL-0701S

Application Applicable to laminate OCA on TP(CG)

Produce 2.8”~7”size

Accuracy ±0.1mm

T/T 15sec/pcs(including manual, automatic loading and unloading)

size

Accuracy ±0.1mm

T/T 15sec/pcs(equipment time)

Process Load TP manually→ cleaning tear filmProcess flow

Load TP manually→ cleaning, tear filmLoad OCA manually →cleaning, tear filmAutomatic visual alignment→lamination→manual unloading

F t A t ti CCD li t t ti l i ti

Process flow

Load TP manually→ cleaning, tear filmAutomatic picking up OCA→ adjustment→tear filmAutomatic visual alignment→lamination→manual

unloading

Feature Automatic OCA loading & unloading, automatic CCD li t t ti l i ti

第36页

Feature Automatic CCD alignment, automatic lamination

Operator 1(manual loading, unloading)

alignment, automatic lamination

Operator 1(manual loading LCD and finished product unloading)

7, Flex to rigid laminating machine series continuedseries-continued

Equipment model

LOL-0702A

Application Applicable to laminate OCA on lens

Equipment model

LFL-0701A

Application Laminate film on lens and assemble with TP

Produce size

3”~7”

Accuracy ±0.15mm

T/T ≤8.5sec/pcs

Produce size

2.8”~7”

Accuracy ±0.15mm

T/T ≤8.5sec/pcs

Process flow

Lens conveyed by C/VAutomatic loading OCA→ adjustment→tear film Automatic visual alignment→lamination→automatic unloading

Feature Double OCA tray automatic CCD alignment automatic

Process flow

Lens conveyed by C/VAutomatic loading film→ adjustment→tear film Automatic visual alignment→lamination→TP unloading

Feature Double OCA tray, automatic CCD alignment, automatic loading/unloading rotary layout

第37页

Feature Double OCA tray, automatic CCD alignment, automatic loading/unloading, rotary layout

Operator Non

loading/unloading, rotary layout

Operator Non

8, Flex to flex laminating machine series

Equipment model

LOL-2200S/LOL-2401S/LOL-2402S, S74

Application Laminate large-size soft film together such as OCA+PET or PET+PETApplication Laminate large size soft film together, such as OCA PET, or PET PET

Produce size Maximum dimension 500mm*650mm (can be customized)

Accuracy ±0.1mm

T/T 30sec/pcs(equipment operation time of 10 seconds)T/T 30sec/pcs(equipment operation time of 10 seconds)

Process flow Product placed on flipping table & net chamber manually→cleaning, tear film→table flipping→automatic CCD alignment→lamination→manual unloading

Feature Table flipping, automatic CCD alignment( manual alignment optional)

第38页

Operator 1(manual loading/unloading)

9, Rigid to rigid laminating machine series

Equipment model

LOCA-0720S

Application Conduct lamination between CG & SG or TP & LCM

Equipment model

LOCA-0708S/LOCA-0710S/LOCA-1207S

Application Conduct lamination between CG & SG or TP & LCM

Produce 3”~7”; 4 3 ” ~12”Produce size

3”~7”

Accuracy ±0.1mm

T/T 15sec/pcs(equipment time, pressure keeping 3S)

Produce size

3 7 ; 4.3 12

Accuracy ±0.1mm

T/T 20 ~ 23sec/pcs(equipment time, pressure keeping 2 ~ 3S)

Process flow

TP loading(LCM duplex alternately feeding)→cleaning, tear film→photograph→automatic alignment→chamber close & vacuum→lamination→breaking vacuum→reset→unloading

Feature Alternate double inferior chamber LCM, automatic CCD

Process flow

TP loading(LCM loading)→cleaning, tear film→photograph→automatic alignment→chamber close & vacuum→lamination→breaking vacuum→reset→unloading

Feature Automatic CCD alignment vacuum direct pressure

第39页

,alignment, vacuum direct pressure lamination

Operator 2(manual loading, unloading)

Feature Automatic CCD alignment,vacuum direct pressure lamination

Operator 1 (manual loading & unloading)

10, OCA laminating production line

Equipment model

LOCA-0800A Equipment LOCA-0702A/LOCA-0805A/LOCA-0806A

LOCA-0800A LOCA-0702A LOCA-0805A

model

Application Conduct lamination between TP & LCM with OCA as medium

Produce size

3”~8”

model

Application Conduct lamination between TP & LCM with OCA as medium

Produce size

3.5”~7”; 3” ~8 ”

Accuracy Flex to rigid lamination:±0.1mm, rigid to rigid: ±0.1mm

T/T 18sec/pcs(equipment time, pressure keeping time 2S)

Process flow

TP automatic loading(OCA automatic loading)→ adjustment→cleaning, tear film→automatic

size

Accuracy Flex to rigid lamination:±0.1mm, rigid to rigid: ±0.1mm

T/T 15sec/pcs(equipment time, pressure keeping time 2S)

Process flow

OCA automatic loading→tear film→ TPloading photograph automatic alignment silkscreenj g,

alignment→silkscreen lamination→OCA other surface cleaning, tear film→LCM loading→ cleaning, tear film→automatic alignment→ vacuum→lamination→ breading vacuum→unloading

Feature OCA&LCM automatic cleaning, tear film, CCD automatic

flow loading→photograph→automatic alignment→silkscreen lamination→ OCA other surface cleaning, tear film(tear film & dispose it) →LCM loading→photograph→automatic alignment→vacuum→lamination→breaking vacuum→unloading

Feature CCD automatic alignment vacuum direct pressure

第40页

g, ,alignment, vacuum direct pressure lamination, TP&OCAautomatic loading

Operator 1(LCM loading & finished product unloading)

Feature CCD automatic alignment, vacuum direct pressure lamination,,1 STH+2 HTH configuration

Operator 2(TP loading & LCM loading +finished product unloading)

11, LOCR laminating machine-dispensing series

( )Equipment model

LOCR-3000S(large size, stacking glass lamination)

Application Multi pieces & large size OGS glass laminated together with OCR as media

Produce dimension:600mm*500mm

Equipment model

LOCR-1800S/LOCR-1801S

Application Conduct OCR lamination between Glass & Glass

Produce size 7”~18”Produce size

dimension:600mm 500mm

Accuracy ±0.05mm

T/T 120sec/pcs(lead time for single piece)

Process Glass loading measure thickness dispensing loading

Accuracy Lamination accuracy:±0.1mm;

Thickness accuracy:± 10%;glue control accuracy:±5%

T/T 60sec/pcs(equipment time, pre-curing time 5S)Process flow

Glass loading→ measure thickness→dispensing→loading another glass→rolling & leveling→manual alignment→pre-curing→ curing→laminate another piece of glass→ unloading

Feature Adapt manual photograph, alignment, thickness measurement

Process flow TP manual cleaning, loading→ alignment→dispensing→reversal→LCM manual cleaning, loading→alignment→lamination→ unloading

Feature Thickness measurement optional, duplex alternate work

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measurement

Operator 1(manual loading, unloading)Operator 1(TP loading & LCM loading +finished product

unloading)

11, LOCR laminating machine-Frictioning series

Equipment LOCR-1510S(Nano silver transfer equipment) Equipment LOCR-1810SEquipment model

LOCR 1510S(Nano silver transfer equipment)

Application Applicable to OCR lamination between glass & PET

Produce size

10”~15.6”

model

Application Applicable to OCR lamination between glass & glass

Produce size 7”~18”

Accuracy Laminating accuracy:±0.2mm, thickness accuracy:±0.03mm(thickness≤0.3mm)

T/T 15sec/pcs(equipment circle)

Process Glass loading→adjustment→scratch sizing→PET

Accuracy Laminating accuracy:±0.15mm;

Thickness accuracy:± 5%;glue control accuracy:± 5%

T/T 45sec/pcs

flowg j g

loading→tear film→silkscreen lamination→pre-curing→automatic unloading

Feature Adapt CCD adjustment, scratch sizing, rotary layout

Operator 1(manual loading PET)

Process flow LCM manual cleaning, loading→ alignment→scratch sizing→ pre-curing all around→TP loading→reversal→move to laminating position→vacuum→lamination→pre-curing→ breaking vacuum→unloading

F V l i i d l i l k

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Feature Vacuum lamination , duplex station alternate work, scratch sizing

Operator 1(manual loading, unloading)

11, LOCR Laminating machine series-suit both OCA&OCR

Equipment LOCR-0701Aq pmodel

Application Applicable to laminate glass & glass together with OCR or OCA as medium

Product size 4”~7”;

Accuracy Laminating accuracy:±0 05mm;glue thickness:0 06-0 1mm;thickness accuracy: ±0 01mmAccuracy Laminating accuracy:±0.05mm;glue thickness:0.06 0.1mm;thickness accuracy: ±0.01mm

T/T 45sec/pcs

OCR process Glass1 automatic loading→adjustment→automatic tear film→scratch sizingGlass2 automatic loading →adjustment

Close vacuum chamber→photograph & automatic alignment→lamination→breaking vacuum→unloadingClose vacuum chamber photograph & automatic alignment lamination breaking vacuum unloading

OCA process Glass1 automatic loading→adjustment→automatic tear film(may shielding)Glass2 automatic loading →adjustment

Close vacuum chamber→photograph & automatic alignment→lamination→breaking vacuum→unloading

Feature Tully automatic, vacuum lamination, photograph & alignment with vacuum chamber, suits both OCA & OCR

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Feature Tully automatic, vacuum lamination, photograph & alignment with vacuum chamber, suits both OCA & OCR process

Operator Non

12, Mouth-type glue laminating machine

Equipment LAM-0700S Equipment LAM-0702AEquipment model

LAM 0700S

Application Laminate LCM with TP which attached with mouth-type glue already

Produce 2”~7”;

model

Application Laminate TP with LCM together with mouth-type glue as medium

Produce size

2”~7”;

size

Accuracy ±0.1mm

T/T 4sec/pcs(equipment operating time)

Process Manual loading TP→ cleaning, tear film→manual loading

size

Accuracy ±0.1mm(equipment accuracy)

T/T 6sec/pcs(equipment operating time)

Process fl

Manual loading LCD (manual stack mouth-type glue)LCD t bl t ti i k th t & tProcess

flowManual loading TP cleaning, tear film manual loading LCM→ cleaning, tear film→ CCD assist alignment→lamination→manual unloading

Feature CCD assist alignment, desktop, flipping lamination

Operator 1(manual loading, unloading, alignment)

flow →LCD table rotating, pickup mouth-type & tear film→alignment, lamination→LCD return back to flipping table→LCD reversal adjustment→LCM loading→automatic tear film→lamination at laminating position→automatic unloading

F t O ti l fib li t t ti l di th t

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Feature Optical fiber alignment, automatic loading mouth-type glue and tear film

Operator 1(TP loading, unloading)

13, Film laminating machine series

LMP 1400M LMP 1201S

Equipment model

LMP-1400M

Application Laminate film on both side of LCD

Equipment model

LMP-0700S/LMP-1201S

Application Laminate protective film (i e PE etc) on Module

LMP-1400M LMP-0700S LMP-1201S

Application Laminate film on both side of LCD

Produce size

3”~8”

Accuracy ±0.15mm

T/T 3 ~ 17pcs/min (excludes manual operating time)

Application Laminate protective film (i.e. PE etc) on Module (TP)

Produce size 2”~7”; 7” ~12 ”

Accuracy ±0.15mm

T/T ≤10sec/pcsT/T 3 ~ 17pcs/min (excludes manual operating time)

Process flow

Manual loading LCD→ automatic convey LCD glass to laminating position→laminate film on both side of LCD simultaneously →automatic cut protective film→automatic collection to funnel

T/T ≤10sec/pcs

Process flow Loading roll protective film→absorbing film→ manual loading Module →alignment →lamination→unloading

Feature Optical fiber alignment

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Feature Multi production mode optional

Operator 1

p g

Operator 1

14, ACF & heat bonding (hotbar) machine series

LAL 1300L ACF LaminatorLAL-1300L ACF LaminatorUsage: it can put ACF laminate on Panel

and Film, with special position fixture, it can

also put ACF laminate on FPC and PCB, it can

LHS-1229L Heat Bonding MachineUsage: applicable to hot bond panel with FPC (media ACF)

Product Dimension: panel below 12.4”

Accuracy: X: ±0 015 mm Y: ±0 015mmalso be multi-segment laminated

Product Dimension: panel less than 13”

Accuracy: X:±0.2 mm Y: ±0.2 mm

C it 600 /h

Accuracy: X: ±0.015 mm Y: ±0.015mm

Capacity: 320Pcs/h (bonding time is 8s)

Outline Dimension(mm): 1300Х780Х1480

Process:Capacity: 600pcs/h

Outline Dimension (mm):820X820X1500

Process:

Loading manually vacuum suction

Panel feeding vacuum suction FPC feeding vacuum

suction pre-bonding displacement FPC feeding

vacuum suction pre-bonding…… displacement

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Loading manually vacuum suction

start laminating unloadingfinal bonding return unloading

Company profileCompany profileCompany supporting processCompany associated equipmentCompany associated equipmentCompany technology Integrated cases

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1, Module plant configuration program(within 7”)

Semi-automaticscheme

Full-automatic scheme

POL laminationmachine

Pad cleaning

Semi-automatic POL Laminating machine

LPL-0700S(one side)

Full-automatic POL laminating machine

LPL-0708A(2 sides)

COGmachine

Pad cleaningMachine

——Full-automatic COG machine

LCOG-0703A/0704A

FOG machineSemi-automaticFOG machineLFOG-0745S0

Full-automatic FOG machineLFOG-0745A0

B/L-module Assembly machine

Semi-automatic assembly machine

Full-automatic backlight assembly machiney

B/L stacking

LGP-0600S LGP-0708A/0709A

Fully automatic backlight stacking machine

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B/L stacking machine

stacking machineLBZD-0705

2, TP plant configuration scheme(G+G, within 7”)

S + FPC Sensor + OCA Sensor + coverSensor + FPC(FOG)

Se so OC(flex to rigid lamination)

Se so co e(Rigid to rigid

lamination)TP

Semi-automatic FOG machine

LFOG-0745S0

Semi-automatic flex to rigid laminating machine

L0L-0701S

CCD automatic alignmentRigid to rigid

laminating machineLOCA-0710S

Semi-automatic OCR laminating machine

LOCR-1200S

Full-automatic FOG machineLFOG-0745A0

Full-automatic flex torigid laminating machine

LOL-0702A

CCD automatic alignmentDouble station rigid to

Rigid laminating machineLOCA-0720S

for product size above 7”, there are a variety of OCR

Laminating machine

ACF laminatorFTR+RTR

(OCA l i tiFPC bonding

machine

OCA automatic laminating production line

(OCA laminating production line)

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pLOCA-0702A/0805A

3, TP plant configuration scheme G+F

PET + OCA(Flex to flex lamination)

Lens + film(Flex to rigid lamination)

Film + FPC(FOG)

Die cut

Manual alignmentFlex to flex laminating

hi

Semi-automaticFlex to rigid laminating

machineAutomatic FOG machineLFOG 0500Rmachine

LOL-2000S

Automatic alignmentFlex to flex laminating

machineLFL-1002S

full-automaticFlex to rigid laminating

LFOG-0500R

Flex to flex laminating machine

LOL-2402S

g gMachine

LFL-0701AACF laminator

FPC bonding machine

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4,TP&LCD/LCM ASSEM assembly bonding configuration

TP+LCM(rigid to rigid lamination)(rigid to rigid lamination)

Sealant OCA OCR dispensing OCR surface glue

CCD automatic alignmentRigid to rigid laminator

LOCA-0710S

CCD automatic alignment

Semi-automatic OCR laminatorLOCR-1200S

CCD automatic alignmentFull-automaticOCR laminatorLOCR-0701A

Full-automatic month-Type glue laminator

LAM-0702A

Semi-automaticMouth-type glue laminator

LAM-0700S

CCD automatic alignmentDouble stations rigid to

Rigid laminatorLOCA-0720S

Semi-automatic OCR laminatorLOCR-1800S

Semi-automatic OCR laminatorLOCR-1810S

CCD automatic alignmentSingle station

Rigid to rigid laminatorLOCA-1207S

Semi-automatic OCR laminatorLOCR-1801S

OCA lamination production line

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Flex to rigid + rigid to rigidLOCA-0702ALOCA-0805A

5, Full bonding structure description

Advantage Reduce light reflection, increase light transmission, reduce interface, increase strength, suits narrow bezel

G+G G+F/G+F+F OGS In-cell On-cell

Structure Smart display general structure:cover glass + touch sensor+ LCM

Cover glassSensor glass

LCM

Cover glassSensor film

LCMCG+SG

LCMCover glass

LCM +sensorCover glass

LCM +sensor

Full bonding concept Achieve seamless bonding between the 2 panels(face to face)

M i l f t b di b t TP & LCM l it b di b t C Gl &G+G

G+F/G+F+F

Mainly refers to bonding between TP & LCM, also suits bonding between Cover Glass & Sensor Glass (RTR)

Mainly refers to bonding sensor film & LCM, also suits bonding between Cover Glass & Sensor Film(FTR)

OGS

In-cell

Mainly refers to bonding between OGS glass (which integrate touch control & protective function) & LCM

Mainly refers to bonding between Cover Glass & LCM (which integrate touch control & display function)

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On-cell Mainly refers to bonding between Cover Glass & LCM (which integrate touch control & display function)

6, Full bonding Configuration(within 7”)

Media Solid state OCA & liquid OCR

OCA:mainly applicable to FTF, FTR, RTRApplication

OCA:mainly applicable to FTF, FTR, RTR

OCR:mainly applicable to RTR

Full Bonding Configuration

B di B di bj t E i t B di T/T S it bl O tBonding media

Bonding object Equipment model

Bonding accuracy

T/T Suitable size

Operator

LFL-1002S ±0.1mm 15S/pcs 3”~7” 1(manual loading, unloading)

OCA

Flex to rigid bonding(film

sensor & lens)

LOL-0701S ±0.1mm 15S/pcs 3”~7” 1(manual loading glass)

LFL-0701A ±0.15mm 8.5S/pcs 3”~7” Non(full automatic)

LOL-0702A ±0.15mm 8.5S/pcs 3”~7” Non(full automatic)

Rigid to rigid bonding

(CG&SG or TP&LCM)

LCOA-0710S ±0.1mm 20S/pcs 3.5 ~7” 1(manual loading, unloading)

LOCA-0720S ±0.1mm 15S/pcs 3”~7” 1(manual loading, unloading)

OCA bonding production line

LOCA-0805A ±0.1mm 15S/pcs 3”~8” 2(manual loading TP&LCM)

OCRRigid to rigid

bonding(CG&SGLOCR-0701A ±0.05mm 45S/pcs 4”~7” Non(full automatic)

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OCR bonding(CG&SG or TP&LCM) LOCR-1200S ±0.15mm 8S/pcs 3”~12” 1(manual loading,

unloading)

LCD & TP refurbishment equipment series

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Contact: David ZhangSales & Marketing DirectorMobile: +86 13613051580Mobile: +86 13613051580Tel: +86 755 2733 9919 Fax: +86 755 2733 8619Email: [email protected]@

[email protected]: DavidzhanggyFacebook: DavidzhanggyTwitter: Davidzhanggy

Company Add: Unit 2508A 25F bank of America Tower 12 Harcourt Road Central Hong KongUnit 2508A,25F bank of America Tower 12 Harcourt Road Central Hong KongFactory Add: No. 68 Tongfucun Industrial Park, Dalang Street, Bao‘an District, Shenzhen, PRC

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