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International Exhibition and Conference for the Printed Electronics Industry
CatalogExhibition: April 6–7, 2016Conference: April 5–7, 2016Messe München, Germany
Printed Electronics—We Build the Market
lopec.com
Connecting Global Competence
LOP16_Titel_en_lay.indd 1 19.01.16 13:23
Conference Program Overview – Day 1Tuesday – April 5, 2016
09:30MaterialsElectronic Materials Design and Their Implementation in Printed Field-Effect Devices
Room 13aThe OE-A (Organic and Printed Electronics Association) is the leading international industry association for the emerging technology of organic and printed electronics.
Representing the entire value chain, the OE-A provides a unique platform for local and international cooperation between companies and research institutes.
By organizing working group meetings, workshops, trade fairs, seminars, and conferen-ces, the OE-A offers its mem-bers networking opportunities and supports the continued development of the printed electronics industry.
Get to know the OE-A and the printed electronics industry – Visit our booth B0 510!
Connecting the
Organic and Printed Electronics Industry
www.oe-a.orgSou
rce:
Hol
st C
entr
e
A working group within
09:30 Business and Product Developments
Room 13b
Short Courses Business Conference
COFFEE BREAk
11:30DevicesComparison of Thin-film Transistor Technologies for Printing Applications
Room 13a
11:10 Supply-chain Challenges
Room 13b
LUNCh
14:00Printing and PatterningAdvanced Functional Printing Technologiesfor Electronics
Room 13a
COFFEE BREAk
16:00Biomedical Applications and WearablesOrganic Electronics for Biomedical Applications
Room 13a
14:00 End-user Applications and Requirements
14:40 Market and Industry ForecastsRoom 13b
16:00 Examples and Strategies of IP Usageto Transform Technology to Business
17:00 Wearable ApplicationsRoom 13b
09:00 am | Plenary Session – Room 13b
09:00 | Words of Welcome09:05 | Printed Organic Electronics – Status and Next Step in the Future
Conference Program Overview – Day 3Thursday – April 7, 2016
Conference Program Overview – Day 2Wednesday – April 6, 2016
COFFEE BREAk
LUNCh
11:30Lighting
Room 13a
11:30Circuit Design andSmart Systems
Room 14a
COFFEE BREAk
09:00 | Plenary Session – Room 14b
09:00 | Words of Welcome09:15 | OLED Technology in Automotive Lighting09:40 | Printed Electronics Materials and Their Applications10:05 | Wearables Grown Up – Status Quo
20:00 | LOPEC Dinner and Awards
11:30Publicly Funded Projects
Room 13b
11:30Recent Progressin MaterialPerformance
Room 14c
14:00Substrates andEncapsulation
Room 13a
14:00Sensor Systems
Room 14a
14:00Technological Challenges ofPrinted ElectronicsApplications I
Room 13b
14:00Additive Manufacturing in Printed Electronics
Room 14c
16:00Printing andPatterningProcesses I
Room 14a
16:00PhotovoltaicDevices
Room 14c
COFFEE BREAk
LUNCh
11:30Functional Materials
Room 13a
COFFEE BREAk
11:30Energy
Room 13b
14:00Flexible Displays
Room 13a
14:00WearableElectronics
Room 13b
16:00Touch
Room 13a
16:00Smart and hybrid Systems
Room 13b
15:40Technological Challenges ofPrinted Electronics Applications II
Room 13b
15:40UpscalingProduction andManufacturingProcesses
Room 13a
EXHIBITO
R FO
RUM
Start-up FOR
UM
EXHIBITO
R FO
RUM
09:00 | Plenary Session – Room 14b
09:00 | Words of Welcome09:05 | Mainland China Display Industry Technology Now and Future09:25 | Low-Temperature Organic and Oxide Transistors Enabling Flexible Electronics09:50 | 5000 Years Long We’ve Been Playing (Board) Games Together, What’s next?10:15 | Technology Development for Printed Digital/Analogue Circuits Based on
Organic Semiconductors
Technical Conference Scientific Conference
EXHIBITION
–ha
ll B0
Technical Conference
EXHIBITION
–ha
ll B011:30
Manufacturing ofPrinted ElectronicsDevices
Room 14a
11:30Sensor Systemsand Transistors
Room 14c
14:00Printing andPatterningProcesses II
Room 14a
14:00Copper-basedand Novel Materials
Room 14c
16:00Novel Printing Methods
Room 14a
Scientific Conference
18:00SC Poster Session –ICM Foyer
18:00TC Poster Session –ICM Foyer
18:00BC Poster Session –ICM Foyer
COFFEE BREAk
Conference Program – Day 1Tuesday – April 5, 2016
Conference Program – Day 1Tuesday – April 5, 2016
Short CoursesRoom 13a
Short Courses Chair: Dr. Giovanni NisatoCSEM MuttenzSenior Manager Business and Technology Development, Ch
Materials09:30 Electronic Materials Design and Their Implementation in
Printed Field-Effect DevicesProf. Antonio FacchettiNorthwestern University and Polyera Corporation, Research Professor, US• Fundamentals of printed electronic materials for transistors• Molecular/polymeric organic, inorganic, and 2D semiconductors• Dielectrics, conductors, surface treatment/charge injection layers
Devices11:30 Comparison of thin-film transistor technologies for printing applications
Prof. Ananth DodabalapurThe University of Texas at Austin, US• Solution-processed and printed thin-film transistors materials• Scaling behaviour and performance • Bridging the gap between low cost and high performance
Plenary Session Room 13b
Chairman: Mr. Wolfgang Mildner MSW, Founder, CEO, DE Chairman Strategic Advisory Board
09:00 Words of Welcome Mr. Wolfgang Mildner MSW, Founder, CEO, DE Chairman Strategic Advisory Board
09:05 Printed Organic Electronics – Status and Next Step in the Future Dr. Felix Görth BASF New Business Gmbh, Director Organic Electronics, DE
• Printed Organic Electronics Technology Status is presented and its consequences for the Industry
• Today´s possibilities and ideas to develop this industry further are discussed
Business ConferenceRoom 13b
Conference Chair: Mr. Thibaud Le Séguillonheliatek Gmbh, CEO, DE
Business and product developments09:30 Printable Electronics in Canada:
Successes in Materials, Inks and End-user ApplicationsDr. Bhavana Deore, National Research Council, Research Officer, CA• Development of conducting inks • Fabrication of fully printable sc-SWCNTs based thin film transistor • Application towards wearables and smart packaging
09:50 Helping patients with printed technology and ITMr. Jesper hassel, Mevia, CEO, FI• how Mevia has utilize printed technology to help patients • how is Mevia commercializing a product with printed technology • how can we combine printed technology, electronics and IT in an
optimal way for the user10:10 Commercial developments in flexible electronics
Mr. Scott White, PragmatIC, CEO, Uk• Recently launched products using flexible integrated circuits • Supply chain ecosystems for commercial product delivery • What’s next? Future priorities and challenges
Supply-chain challenges11:10 Supply chain construction of new semitransparent solar cell in
low oil price eraMr. kyusoon Shin, Dongjin Semichem Co., LTD., head of Advanced Institute of Research Chief Technology Officer/Vice President, kR• Introduction of Dye-Sensitized Solar Cell Technology• Application of Dye-Sensitized Solar Cell and the business environment
of renewable energy materials• Open innovation for the launching of Dye-Sensitized Solar Cell business
11:30 IOT enabling technologies at Applied MaterialsDr. Robert Visser, Applied Materials, Senior Director ATG, US• R2R technologies for barrier layers and a wide range of other thin films• high resolution, high throughput (R2R) printing technologies• MEMs technology at Applied Materials
11:50 Commercialization and Integration Challenges of Flexible Hybrid Electronics ApplicationMr. Girish Wable, Jabil, US• Ecosystem components that make up the FhE solution-players and
their offerings• Electronics integration approach and their pros and cons• Possible routes and steps to enable ecosystem components provide the
selection and delivery of the right combinations of integration approaches
Short CoursesRoom 13a
Short Courses Chair: Dr. Giovanni NisatoCSEM MuttenzSenior Manager Business and Technology Development, Ch
Printing and Patterning
14:00 Advanced Functional Printing Technologies for ElectronicsProf. Edgard DörsamTechnische Universität Darmstadt, DE• Printing and coating techniques: conventional printing, digital printing, coating,
and principles of substrate transport• Characterization of materials: surface tension, wetting envelope, rheology,
viscosity, leveling time, and measurement methods• Printing as a sub-process: ink acquisition, dosing, ink transfer, fluid dynamics
on the substrate, and solidification
Biomedical Applications and Wearables
16:00 Organic Electronics for Biomedical ApplicationsProf. George MalliarasÉcole Nationale Supérieure des Mine, head of Department of Bioelectronics, FR• Organics offer unique advantages at the interface with living systems• These advantages can be put to good use in biomedical applications• Applications include neural engineering, diagnostics, and drug delivery
Conference Program – Day 1Tuesday – April 5, 2016
Conference Program – Day 1Tuesday – April 5, 2016
Business ConferenceRoom 13b
Conference Chair: Mr. Thibaud Le Séguillonheliatek Gmbh, CEO, DE
Supply-chain challenges12:10 Ultra-Thin Glass – latest achievements to turn the ideal substrate material
into a ready-to-use solution or: building-up an industry eco-systemDr. Ruediger Sprengard, SChOTT AG, Director New Business Field Ultra Thin Glass, DE• Ultra-thin glass• From a material to a solution• Industry eco system
12:30 Equipment solutions and demonstration capabilities for flexible electronics manufacturingMr. Carsten Deus, VON ARDENNE Gmbh, Strategic Business Development Manager, DE• R2R organic coatings for OLED• R2R vacuum coating of flexible glass• Electrode optimization by flash lamp annealing
End-user applications and requirements14:00 Impact of emerging plastronic technologies for IOT & OT convergence
Dr. Cécile Venet, Schneider Electric, Plastronic Innovation Leader for Technology Innovation Department, FR• Internet of Things & Operational Technologies convergence:
impact on product design• Opportunities for Printed Electronic and Plastronic technologies?
associated challenges• Today & Future: new electronic partition versus disruptive business models
14:20 Manufacturer & Brand Requirements in the Adoption of Flexible DisplaysDr. Michael Cowin, Smartkem Ltd, head of Strategic Marketing, Uk• A low risk route which offers ease of adoption• A route to low cost product with improved margins• Real user benefits in end product form
Market and industry forecasts14:40 Flexible and printed electronics – tremendous opportunities in display
and touch panel industriesDr. Jennifer Colgrove, Touch Display Research, CEO and Principal Analyst, US• Flexible/curved/foldable display technologies and market forecast• Quantum dot technologies and market forecast• Flexible/printed transparent conductors to penetrate in touch panel industry
Conference Program – Day 2Wednesday – April 6, 2016
Conference Program – Day 1Tuesday – April 5, 2016
Plenary SessionRoom 14b
Chairman: Mr. Wolfgang MildnerMSW, Founder, CEO, DEChairman Strategic Advisory Board
09:00 Words of WelcomeMr. Wolfgang MildnerMSW, Founder, CEO, DEChairman Strategic Advisory Board
09:15 OLED technology in automotive lightingDr. Werner Thomas, Audi AG, Project Manager for Innovation Projects, DE• Current status of OLEDs for automotive lighting• Challenges of OLED use in automotive applications• Future perspective of OLED technology in automotive lighting
09:40 Future perspective of OLED technology in automotive lightingDr. Ikuzo Ogawa, Sumitomo Chemical, Managing Executive Officer, JP• Development Status for Printed Electronics Materials in Sumitomo Chemical• Device and Process Development with Printed Electronic Technologies• Possible Applications using Printed Electronics Materials and Devices
10:05 Wearables grown up – status quoMr. Burkhard Dümleradidas group, Director Program & Projects / IT Innovation, DE• adidas wearable history (Pacer, SpeedCell, XCELL, SmartRun, FitSmart,
Shirts) covering Runners, Soccer players, Cardio workouts, Daily Life• adidas requirements for wearables:
Can we wash electronics? At minimum 60 times? What happens if we print electronics on sole? how durable is it against rubbing in shoe running for 500 miles?
Business ConferenceRoom 13b
Conference Chair: Mr. Thibaud Le Séguillonheliatek Gmbh, CEO, DE
15:00 The OE-A Roadmap, a Guidepost to Complex Interlinked Technologies, Applications and MarketsDr. Stephan kirchmeyer, Stephan kirchmeyer Pionierarbeit. Pioneering Work.Member of the OE-A Board, DE• OE-A Roadmap for Organic and Printed Electronics• Linking Technologies, Products and Markets• Consumer Electronics, Automobile and Energy
Examples and strategies of IP usage to transform technology to business16:00 A success with legal doping – from breakthrough technology
to mass productionMr. Gerd Günther, Novaled, CEO, DE• From start up to OLED industry expert with unique doping IP• Organic materials for high performance OLEDs in volume production displays• New applications: organic photovoltaics and beyond (V-OFET)
16:20 From tactile smart patch technology to objects that feel the environmentDr. Gady konvalina, FeelIT, CEO, IL• FeelIT nano-material based smart patch technology• Vision and markets for pressure mapping patches • Business opportunities for tactile smart patches
16:40 IP usage in the OLED industryMr. Gildas Sorin, CYNORA, CEO, DE• What is IP?• You cannot sell twice the same• Some well-known examples; can we see new cases emerging?
Wearable Applications17:00 Wearable Technologies, a market overview and the impact for the
organic electronic industryMr. Christian Stammel, Wearable Technologies AG, CEO, DE• WT market overview• WT Industry Segmentation• Opportunities and use cases for Organic electronics
Conference Program – Day 2Wednesday – April 6, 2016
Start-up Forum, Business ConferenceLOPEC Forum, hall B0
Judging panel:Thibaud Le Séguillon, heliatek, CEO, DEDr. Christian Reitberger, Wellington Partners, General Partner, DEDr. Jan Blochwitz-Nimoth, NOVALED, CSO and Founder, DE
Seed Financing11:00–11:10 Interactive Communication Surface
Mr. Aiko Wiegand, 7am, Student – Industrial Engineering M.Sc., DE• Communication• Augmented Reality• Display
11:10–11:20 Smart energy from heat –Printed thermoelectric generators as a new power source for IoT-devicesMr. Frederick Lessmann, otego, a spin-off from kIT, Business Development, DE• otego's generators turn heat into electricity• Suitable for mass applications through printing• With otego IoT-devices become energy autonomous
11:20–11:30 Molecular Glasses' NONcrystallizable™ OLED MaterialsMr. Michel Molaire, Molecular Glasses, Inc., CEO/Founder, US• NONcrystallizable™ OLED • Vacuum Process• Solution Process
B-Round11:30–11:40 Ink-jet printed electrochemical immunosensor
Mr. Nouran Adly, Forschungszentrum Juelich, Doctoral researcher, DE• Biosensor • health-care• Redox Cycling
11:40–11:50 Flexiramics – 100% ceramic material that bends, folds and shapes any way you want itMr. Pavel Cholakov, Eurekite BV, Researcher, NL• Flexible like paper, thermal resistance, chemical inertness• Advantageous electric properties while being bendable and light• Technology platform with possible applications in antennas, power electronics,
harsh environments and fire safety
11:50–12:00 Industrialising Functional PrintingDr. Juergen Willmann, GT+W Gmbh, CEO, DE• Optimized printing technology • Solutions enabling completely new functional printed products• Our products: Superproofer 220 and Superspectra 3
AND ORGANIC ELECTRONICSFOR PRINTABLE, FLEXIBLE,MARKET DATA AND INSIGHT
LATEST REPORT
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Europe/Asia Stephen Frier Business Development [email protected]+44(0) 1372 802006
North/South America Nicole Mazzocca Business Development [email protected]+1 330 762 7441 ext. 1134
Analyses of key trends, strategic market forecasts
Quantitative 5-year and 10-year market forecastsExtensive research based on market interviews and secondary sources
DisplaysPV
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Lighting
Technical ConferenceRoom 13a
Session Chair: Dr. Nina Riegel,Osram Opto Semiconductors, Senior Engineer, DE
11:30 | How OLED lighting can succeed,Dr. Eric Meulenkamp, Philips, GM of OLEDworks, NL• Market and business insights• Technology and products’ status• Major engineering and manufacturing
challenges
11:50 | Roll-to-roll production of flexbleOLED lighting panels,Mr. Takeshi Hakii, konica Minolta, Product Development Division OLED Unit, JP• Flexible OLED has unique feature, thinness,
feather-light weight, flexibility• The unique feature can open new applica-
tion, which could not be achieved using con-ventional luminaires that has either linear,circular or spherical shape.
• World’s largest roll-to-roll manufacturing offlexible OLED has been started
12:10 | Process development for in-dustrial scale manufacturing of flexibleOLEDs,Dr. Robert Abbel, holst Centre – TNO, Research Scientist, NL• Flexible OLED• Production upscaling• R2R manufacturing
12:30 | Development of a R2R EvaporationSystem for Flexible OLED Lightings,Mr. Sukhan Kim, GJM Co., Ltd., Principal Researcher, kR • Flexible OLED lighting• R2R evaporation system • 6-axis alignment module
Session Chair: Dr. Jerome Gavillet, CEA-Liten,Printed Electronic Program Director, FR
11:30 | The HAPPINESS project, a new approach for human/machine interface,Dr. Fabrice Domingues Dos Santos, Arkema - Piezotech, President, FR• Piezoelectrics & relaxors polymers materials
performances • The design of several actuators devices able
to offer different haptic sensations• The development of a manufacturable printing
process flow on conformable foil for polymer actuators
11:50 | Optical features on printed electronics by hybrid integration,Dr. Jukka-Tapani Mäkinen, VTT – TechnicalResearch Centre of Finland, Senior Scientist, FI• Short description of EC-funded project
Optintegral• VTT’s hybrid integration manufacturing process• Demonstrator case: overmoulded LED bracelet
12:10 | PI-SCALE: Creating an open access European flexible OLED pilot line,Dr. Joanne Wilson, holst Centre, Program Manager, Senior Research Fellow TNO, NL• Open access, customized flexible OLED
services• Bridging the gap between R&D and mass
manufacturing• Accelerating integration of flexible OLEDs in
diverse applications
12:30 | Towards high performance OPV andrelated technologies: experiences from theSunflower FP7 project,Dr. Giovanni Nisato, CSEM, Business andtechnology development senior manager, Ch • OPV tandems, solution processed• New materials from photoactive to encapsu-
lation• Demonstration of materials (BIPV to portable)
Publicly Funded Projects
Technical ConferenceRoom 13b
Circuit Design and Smart Systems
Session Chair: Prof. Dr. Donald Lupo,Tampere University of Technology, FI
11:30 | Printed epidermal electronic system,Prof. Matti Mäntysalo, Tampere University of Technology, Asst. Prof. / Adj. Prof. /Academy research fellow, FI• Thin/flexible/bendable/strechable electronics• Stretchable up to 70%• Push-button for epidermal electronics
11:50 | Printable water sensor systems uti-lising organic electronic transducers,Dr. Richard Wilson, CDT Ltd, Director, New Technology, Uk• Rapid, multi-channel point of use biosensors• Multi-channel water sensor demonstrated• OLED and OPD array biosensors
12:10 | Smart Drug Packaging IncorporatingPrinted Resistance Based Multiplexing,Dr. Neil Graddage,National Research Council of Canada, Research Associate, CA• Smart Packaging• Printed Circuits• Resistors
12:30 | Current Carrying Capacity of InkjetPrinted Silver Tracks,Mr. Bernhard Polzinger, hahn-Schickard, Scientific Assistant, DE• Printed silver tracks on different substrates • Current carrying capacity measurement • Current carrying capacity of inkjet printed silver
Session Chair: Dr. Henning Richter, Nano-C, Inc., Vice President, Research andDevelopment, US
11:30 | Thin-film barriers for OLED devices and photovoltaics,Prof. Pim Groen, holst Centre, Program manager, NL• Barrier film• Roll 2 Roll processing• Oled, OPV and perovskite
11:50 | Low-temperature printable chargeextraction materials for large-scale pro-duction of Perovskite solar cells,Dr. Tobias Stubhan, Nanograde AG, Ch• Perovskite• Printable charge transport layer• Low temperature
12:10 | Designing Inorganic Sol-gel MetalOxide Inks for Gravure Printed Transpar-ent, High-Performance Electronics,Mr. Will Scheideler, UC Berkeley, PhD Student, US• Gravure Printing• Transparent Conductive Oxides• Flexible Electronics
12:30 | Measuring mechanical reliability offlexible electronics: an overview of testingand characterization techniques,Dr. Oleksandr Glushko, Erich Schmid Institute, Project Leader, AT• how to choose a proper mechanical test• What information/parameters can be gained• Mechanical damage vs. electrical degra-
dation
Recent Progress in Material Performances
Scientific ConferenceRoom 14a
Scientific ConferenceRoom 14c
Conference Program – Day 2Wednesday – April 6, 2016
Conference Program – Day 2Wednesday – April 6, 2016
Substrates and Encapsulation
Technical ConferenceRoom 13a
Session Chair: Dr. Bill MacDonald,DuPont Teijin Films, Business Research Associate, Uk
14:00 | Encapsulation of flexible Electro-nics: Technologies and Challenges forBringing Barrier Products to Application,Dr. John Fahlteich, Fraunhofer FEP, SeniorScientist-Project Manager, DE• Recent advances in roll-to-roll technologies
for ultra-high permeation barriers• Application Requirements versus measu-
rable barrier properties: A Discussion• Making flexible OLED devices:
Technology, Recent Advances, Challenges
14:20 | Roll to Roll Production of Transpa-rent Ultra-barrier Films,Dr. Ravi Prasad, Vitriflex, CTO and Co-Founder, US• Novel all inorganic barrier films for Flexible
Electronics• Scale-up of roll-to-roll production systems• Recent results of wide web barrier film
manufacturing
14:40 | A comprehensive approach for a better choice of flexible encapsulation materials and processes,Mr. Stéphane Cros, Univ. Grenoble Alpes,INES, CEA/LITEN, Research Engineer, FR• Encapsulation• Gas barrier measurements• Organic photovoltaics
Session Chair: Dr. Wolfgang Clemens,PolyIC, head of Product Management PolyTC, DE
14:00 | Printed Electronics – The Real Challenge Has Just Begun,Dr. Peter Fischer, Thin Film Electronics ASA,Chief Product Officer, US• Taking printed electronics from lab to fab• System integration is the real beast• Market introduction – you have to kiss a lot of
frogs
14:20 | Injection Molded Structural Electronics,Mr. Antti Keränen, Tactotek, CTO, FI• key aspects in integrating printed circuitry
and discrete electronics into injection moldedplastics
• Challenges to traditional electronics in manu-facturing technology change
14:40 | Continuous monitoring of manufactu-ring processes dedicated to PE,Dr. Michel Popovic, IN-CORE Systèmes, FR• Real time control:
most comprehensive solution• Flexible solution for PE processes• Crucial defect: optical impact to electrical yield
Technological Challenges of Printed Electronics Applications I
Technical ConferenceRoom 13b
Sensor Systems
Session Chair: Prof. Dr. Reinhard Baumann, Fraunhofer ENAS, DE
14:00 | Technical challenges of UltrathinFoldable AMOLED with On-cell Touch Sensor,Mr. Weiyuan Cheng, Display Technology Cen-ter (DTC), Industrial Technology Research Insti-tute (ITRI), Division Director, TW• Ultrathin foldable AMOLED• Front plate with on-cell touch sensor and
gas barr• Existing TFT and OLED manufacturing
facilities
14:20 | Fully printed SWNT-TFT for sensortags and TFT-active matrix based sensors,Dr. Younsu Jung, Sunchon National Uni-versity, Researcher, kR• SWNT-TFT based sensor• Overlay printing registration accuracy• TFT-active matrix
14:40 | Hybrid Photodetectors for X-Ray Imaging,Dr. Sandro Tedde, Siemens healthcareGmbh, Senior Research Scientist, DE• hybrid X-Ray Detector• Medical Imaging• GOS:Tb Scintillator Particles in BhJ Matrix
15:00 | Fully Organic Aerosoljet PrintedPiezoelectric Sensor,Ms. Elisa Starruß, Technische UniversitätDresden, DE• Additive manufacturing• Smart clothing• health monitoring
Session Chair: Prof. Dr. Shlomo Magdassi,The hebrew University, IL
14:00 | 3D-Printed Steel CapacitiveForce/Pressure Sensor with Inkjet-PrintedElectrodes,Ms. Lisa-Marie Faller, Alpen Adria University,University Assistant, AT• 3D- and inkjet-printed force/pressure sensor• Adaptive low-cost capacitive sensor proto-
typing• FEM modelling for structure pre-analysis
14:20 | Inkjet-Printed Dissolved OxygenSensors on Flexible Plastic Substrates,Ms. Ana Moya, IMB-CNM (CSIC), Pre-doc, ES• Inkjet-printed dissolved oxygen sensor• Nanoparticles low-curing temperature inks• Flexible and plastic substrates
14:40 | Ink-Jet Printing of Conductive Ag Electrodes on 3D Printed Polymer Substrates for Advanced Packaging,Dr. Matic Krivec, CTR Carinthian Tech Research AG, Junior Researcher, AT• Advanced packaging• Ink-Jet printing• Polymer substrates
15:00 | Influence of the surface roughnessof polymer substrates on the printing quality of ink jet printed silver nano ink,Mr. Joachim Bahr, Technische hochschuleNürnberg, Research Assistant, DE• Ink jet printing• Injection molded polymer substrates• Silver nano ink
Additive Manufacturing in Printed Electronics
Scientific ConferenceRoom 14a
Scientific ConferenceRoom 14c
Conference Program – Day 2Wednesday – April 6, 2016
Conference Program – Day 2Wednesday – April 6, 2016
Upscaling Production and Manufacturing Processes
Technical ConferenceRoom 13a
Session Chair: Prof. Dr. Karlheinz Bock,Technische Universität Dresden, DE
15:40 | Digital Functional Materials Depo-sition System for Printed Electronics andSmart 3D Printing applications,Mr. Nicolas Bernardin, Ceradrop, Deputy Managing Director, FR• Advantages of digital material deposition pro-
cesses to take up challenges of Printed Elec-tronics and smart 3D Printing applications.
• Detailed presentation of hybrid platform com-bining Inkjet and Aerosol Jet as well as severalpost-process curing technologies integrated inline in order to manufacture mono and multimaterial 2D or 3D functional components.
• Importance of an advanced software suite todrive components manufacturing by digitalfunctional materials deposition processes.
16:00 | Organic photovoltaics and transistorsenabled by printing, plasma treatment, directetching, lift-off and self-alignment – all trans-ferred into a R2R printing line,Dr. Marja Vilkman, VTT Technical ResearchCentre of Finland, Senior Scientist, FI• R2R printing of OPVs and OTFTs• R2R etching, lift-off and self-alignment• R2R plasma for increased OPV performance
16:20 | Printed Thin Film Transistors withMerck’s High Performance Organic Semi-conductors and Dielectrics,Dr. Piotr Wierzchowiec,Merck kGaA, Scientist, DE• Printed Thin Film Transistor• Organic Electronics• Roll-to-Roll Fabrication
Session Chair: Dr. Wolfgang Clemens,PolyIC, head of Product Management PolyTC,DE
15:40 | Printed Electronics for medical devices and wearables,Dr. Ton van Mol, holst Centre, Managing Director, NL• Discussion of potential and challenges of
printed electronics in medical and wearable devices
• We will show 2 examples of printed electronicsin real business cases ie health patch and ledintegration in clothing
16:00 | The challenges of integrating ultrathinand flexible printed batteries into functionalelectronic devices, and the strategies to enabletruly embedded power,Dr. Christine C. Ho, Imprint Energy, Inc., Co-Founder and Chief Executive Officer, US• Today's ultrathin and flexible battery solutions
are reviewed.• The mechanical, electrical, and manufacturing
challenges to integrating ultrathin and flexibleprinted batteries into function electronic devicesare discussed.
• key strategies to overcome these challengesare highlighted.
16:20 | A new energy storage technology forthe Internet-of-Things,Dr. Michael Korell, Evonik Creavis Gmbh, Project Manager – Intrapreneur, DE• The Internet-of-Things is emerging• Smart objects require a new form of energy
storage• New energy storage materials
Technological Challenges of PrintedElectronics Applications II
Technical ConferenceRoom 13b
Printing and Patterning Processes I
Session Chair: Dr. Cheng-Chung Lee,Industrial Technology Research Institute, ITRI,Deputy General Director of Display TechnologyCenter, TW
16:00 | Direct printing of 10 µ resolution patterns using commercial pad printer andcommercial inks,Prof. Nir Tessler, Technion Israel Institute ofTechnology, head of Microelectronics and Nanoelectronics centers, IL• Direct printing of 10 micron resolution• Organic electronics• Pad printing
16:20 | Extrusion printing process for themanufacturing of electrodes on planar andcurved substrates,Mr. Martin Ungerer, karlsruhe Institute of Tech-nology, PhD Student, DE• Extrusion printing• Small linewidth and high aspect ratio• Planar and 3D-surface
16:40 | Pulse Shaping Effect on Laser Sintering of Ag Nanoparticle-based Inks,Dr. Martin Bolduc, INO – National Optics Institute, CA• Sintering• Laser processing• Inkjet printing
Session Chair: Dr. Bertrand Fillon,CEA-Liten, Vice President European Affairs,FR
16:00 | Diffractive Nanostructures for Enhanced Light-Harvesting in OPV Devices,Mr. Jan Mayer, CSEM, PhD Student, Ch• Printed photovoltaics• Absorption enhancement• Diffraction grating
16:20 | Highly efficient, all-solutionprocessed, mechanically flexible, semi-transparent organic solar modules,Mr. Jens Czolk, karlsruhe Institute of Technology (kIT), PhD, DE• Organic photovoltaics• Solar modules• Printing
16:40 | Solution-processed organic solar cells and tandems,Prof. Pierre Beaujuge, king Abdullah University of Science and Technology(kAUST), Faculty, SA• Organic solar cells• Solution-processing• Multi-junction solar cells
Photovoltaic Devices
Scientific ConferenceRoom 14a
Scientific ConferenceRoom 14c
Conference Program – Day 2Wednesday – April 6, 2016
Conference Program – Day 2Wednesday – April 6, 2016
Upscaling Production and Manufacturing Processes
Technical ConferenceRoom 13a
Session Chair: Prof. Dr. Karlheinz Bock,Technische Universität Dresden, DE
16:40 | Integration of Nano imprint R2R intothe production processes for printed elec-tronic products,Mr. Thomas Kolbusch, Coatema CoatingMachinery Gmbh, Vice President, DE• UV Nanoimprint R2R• Thermal Nanoimprint R2R• Integration into inline production processes
17:00 | Technology transfer for intermittedslot die coating processes developed for battery electrodes to conductive layer application and OPV products,Ms. Andrea Glawe, kROENERT Gmbh & CokG, Regional Sales Director Asia-Pacific, DE• Intermittent slot-die technology• Printing process• Precise eletrode production
17:20 | Optimization of Adhesiv coating byHigh Presision Slot Die,Mr. Naoki Rikita,MMC RYOTEC CORPORATION by MitsubishiMaterials, Technical Director, JP• Adhesive coating• Presision slot die• Process optimization
17:40 | Industry 4.0: Creating competitiveedge for equipment manufacturers,Mr. Hans Niessen,Bosch Rexroth, Project Manager, NL• Industry 4.0• Machine control equipment• From lab to fab
Dr. Wolfgang Clemens,PolyIC, head of Product Management PolyTC,DE
16:40 | Use of Printed Electronics to enableLarge-Area Organic Robust Imager for X-RaySensing (LORIX),Dr. Octavio Trovarelli, Plastic Logic Germany,Director of Strategic Projects, DE
• Large-Area Printed Organic Electronics• Robust X-Ray Sensors• Plastic Electronics
Technological Challenges of PrintedElectronics Applications II
Technical ConferenceRoom 13b
Printing and Patterning Processes I
Session Chair: Dr. Cheng-Chung Lee,Industrial Technology Research Institute, ITRI,Deputy General Director of Display TechnologyCenter, TW
17:00 | Towards improved printed electro-nics: Assessing the role of fluid elasticityon extensional surface instabilities forma-tion for improving uniform deposition inprinting,Dr. Davide Deganello, Swansea University,Senior Lecturer, Uk• Surface instabilities• Planar flows• Printing uniformity
17:20 | High volume solution based roll-to-roll processing of plastic electronic devices,Prof. Pim Groen, holst Centre, Program manager, NL• Roll 2 roll• Oled processing• Patterning
Scientific ConferenceRoom 14a
Conference Program – Day 2Wednesday – April 6, 2016
Conference Program – Day 2Wednesday – April 6, 2016
TC Poster SessionFoyer ICM 18:00–20:00
Lighting
Current status and future prospects of roll-to-roll printed large area transparent OLEDsMr. Markus TuomikoskiVTT Technical Research Centre of Finland Ltd, Senior Scientist, FIHybrid White OLEDs Fabricated by a RollMr. Eun JungSungkyunkwan University, Graduate Student, kRLow Temperature Photonic Sintering for Printed ElectronicDr. Ahmed SaadXENON Corporation, USOptimization of cathode and ALD film material for top-emission OLEDMs. Claudia keiblerFraunhofer FEP, EU-Project leader, DE
Publicly Funded Projects
Printed Logic for Applications of Screen Matrix Activation SystemsProf. Stelios ChoulisCyprus University of Technology, head of the Molecular Electronics and Photonics Research Unit, CY
Substrates and Encapsulation
Printed electronics on non-conventional substrates by a roll to roll processMr. José GonçalvesCeNTI, Researcher, PT
Upscaling Production and Manufacturing Processes
All-Printed TFT Array Flexible Film for Pressure SensorDr. Shinichi NishiJapan Advanced Printed Electronics Technology Research Association, JPIndustrial Scale Production of Disposable Cartridges for Biosensor PlatformMr. Leandro MonsalveINTI-CONICET, Researcher, ARIn-line optical metrology tools for robust quality control of roll-to-roll manufacturing of Organic ElectronicsMr. Argiris LaskarakisAristotle University of Thessaloniki, head of Organic Electronics Group, GRProduction chain appoach for inkjet links by using a three roll mill masterbach processUlf koepkeEXAkT Advanced Technologies Gmbh, DE
Towards high volume fabrication of functional printed structures for Printed Electronics (PE) applicationsMr. Eric Rubinghholst Centre – TNO, Researcher Printing Technologies, NL
Technological Challenges of Printed Electronics Applications
Development of Smart Machines, Tools and Processes for the Precision Synthesis of nanomaterials with tailored properties for Organic Photovoltaics (EU FP7 Project SMARTONICS) Mr. Argiris LaskarakisAristotle University of Thessaloniki, head of Organic Electronics Group, GRPrinted Fringing Field Capacitive Sensors Integrated in Composite Structures for Automotive IndustryMs. Ana MontesCeNTI – Centre for Nanotechnology and Smart Marterials, Researcher, PT
Energy
A Study on Aluminum surface treatments influencing the Bond Strength of Lithium Ion Secondary Battery Pouch FilmProf. Dong Soo kimhanbat National University, kRCustom-shaped organic photovoltaics – freedom of designMs. Marja VälimäkiVTT Technical Research Centre of Finland, Research Scientist, FIFrom lab-to-fab - Achievements and Progress of R&D OPVMr. Diego Bagniscsem brasil, R&D Manager of Organic Electronics, BRPrinted supercapacitors with environmentally friendly materials for energy harvesting applicationsMr. Jari keskinenTampere University of Technology, Project Manager, FIPrinting of electrolyte material for low temperature ceramic fuel cellsMs. Chandra Pandeyhelsinki Metropolia University of Applied Sciences, Research Assistant, FI
Flexible Displays
Fast response electrochromic device for transparent displayDr. Weiyuan ChengITRI, Manager, TWLarge area flexible reflective displays based on electrochromic polymersMs. Joana FonsecaCeNTI – Centre for Nanotecnology and smart materials, Researcher, PT
Conference Program – Day 2Wednesday – April 6, 2016
Conference Program – Day 2Wednesday – April 6, 2016
Functional Materials
Development of Transparent Electrochromic Materials for Display ApplicationMr. Yu-Ruei kungIndustrial Technology Research Institute, Researcher, TWElectrochromic devices fabricated at room temperature with solution processed materialsProf. haekyoung kimYeungnam University, kRExtremely pure metal nanoinkMr. Masayuki kaneharaCOLLOIDAL INk Co., Ltd., CEO, JP
Smart and Hybrid Systems
Flexible Thin Film Humidity SensorMr. Maksim korobkinMetropolia UAS, Innovator, FI
Wearable Electronics
A WiFi Tracking Device Printed Directly on Textile for Wearable Electronics ApplicationsProf. Atif Shamimking Abdullah University of Science and Technology, Assistant Professor, SA
Conference Program – Day 2Wednesday – April 6, 2016
LOPEC 2017
Messe München, Germany
Save the dateExhibition: March 29 – 30, Conference: March 28 – 30
March 28 – 30, 2017
International Exhibition and Conference for the Printed Electronics Industry
www.lopec.com
Connecting Global Competence
1 07.03.16 12:42
SC Poster SessionFoyer ICM 18:00–20:00
Advances in conducting and semiconducting materials
A Fully Printed Tunable RF Inductor Using Fe2O3 Nanoparticles and Silver-Organo-Complex InkMr. Muhammad Fahad Farooquiking Abdullah University of Science and Technology, Student, SAEnhanced response and sensitivity of self-corrugated chemically modified graphene for high performance flexible gas sensorsProf. Seung Yol Jeongkorea Electrotechnology Research Institute, Senior Research Scientist, kRFormulation of a Particle Free Silver Ink for Inkjet Printed ElectronicsDr. Mohammad Vaseemking Abdullah University of Science and Technology, Post Doctoral Fellow, SALinking the Topography of Ag-Nanowire/PEDOT:PSS Blend Films to Electrical Conductivity and Optical TransmittanceMr. Alexander BlümelNanoTecCenter Weiz Forschungsgesellschaft mbh, ATModelling carrier mobility of crystalline organic semiconductorsDr. Jacob GavartinSchrodinger Inc., Materials Science Lead, UkScreen Printable Molecular Copper Ink for Printed ElectronicsDr. Bhavana DeoreNational Research Council, Research Officer, CATungsten oxide sol-gel inks for inkjet printingMs. Tjaša VidmarFaculty of Electrical Engineering, SL
Circuit Design, Simulations, and Systems
Analysis and optimization of materials properties and materials synthesis by quantum mechanical simulationsDr. Marek ChecinskiCreativeQuantum Gmbh, Managing Director/CEO, DE
Manufacturing and measurement techniques – from lab to fab
Alternative curing and sintering approaches of dispenser printed metal pastes for conducting linesMr. Tobias UlrichFraunhofer IWS, DEAre we ready to industrially laser-print electrical connections?Dr. Emeric BiverOxford Lasers Ltd., Marie-Curie post-doctoral fellow, Uk
Direct laser ablation of polymers for a new printing technologyMr. Mirko NaumannLeibniz Institute of Surface Modification, DEDirect Printing of Transparent Silver Honeycomb Electrodes Using Nanoporous StampsMr. Dhanushkodi D. MariappanMassachusetts Institute of Technology, USHybrid Additive Processes for High Frequency Devices on Flexible Glass SubstratesMr. kai-Jun WangITRI, Associate Engineer, TWHyperspectral Imaging for Large Area and High-Resolution Thickness and Sheet Resistance Measurement of Thin Transparent Conductive Oxide LayersMr. Florian GruberFraunhofer IWS, Research Assistant, DEInline-Imaging-Ellipsometry for Printed ElectronicsMr. Ferdinand BammerVienna Univ. of Technology, ATNanosecond Impulse Laser Micromachining of Hierarchical Superhydrophobic SurfaceProf. Grzegorz CelichowskiUniversity of Lodz, PLOptimization of doctoring parameters by controlling doctoring angle and force for high printability of printed PatternsProf. Chung hwan kimChungnam National University, Associate Professor, kRRapid Prediction of the Water Vapour Transmission Rate (WVTR) of Barrier Films by Hyperspectral ImagingDr. Wulf GrählertFraunhofer IWS, DEReverse-offset roll printing for fine metal patterns and its application to a transparent metal mesh electrodeDr. Sin kwonkorea Institute of Machinery & Materials (kIMM), Senior Researcher, kRRoll-to-roll in-line hybrid manufacturing process using gravure and inkjet printing techniqueMr. Anh Tuan Tran LeTU Chemnitz, Research assistant, DEThickness measurement on the example of printed OLED layersMr. Robert ThiemeGT+W Gmbh, Managing Director, DEVolume manufacturing of printed heaters through process and material optimizationDr. Eifion JewellSwansea University, Senior Lecturer, Uk
Conference Program – Day 2Wednesday – April 6, 2016
Conference Program – Day 2Wednesday – April 6, 2016
Recent deveolopments in devices research
Dispenser Printed Thermoelectric – From Material to ModuleMr. Lukas StepienFraunhofer IWS Dresden, Scientific Staff, DEElectrolyte-gated printed oxide electronicsDr. Subho Dasguptakarlsruhe Institute of Technology, DEFabrication of visible-blind ZnO UV detector on flexible substrate by inkjet printingProf. Suleyman OzcelikGazi University, Director, TRInk-jet printed electrochemical immunosensorMs. Nouran AdlyForschungszentrum Juelich, DEOrganic temperature sensors and 3-bit ADC read-out circuits using organic transistorsDr. Mayumi UnoTRI Osaka (Technology Research Institute of Osaka) / The University of Tokyo, Senior researcher, JPPrintable, polymer-based, secondary batteriesDr. Andreas WildFSU Jena, DEPrintable transparent organic resistors for sensor applicationsMr. Stefan körnerFraunhofer Gesellschaft, Research Assistant, DEStretchable electronic devices based on carbon nanotubesMs. Evgenia GilshteynSkolkovo Institute of Science and Technology, Scientific Researcher, RUThe impact of residual water in barrier films for roll to roll OLED lighting applicationsDr. Jacqueline hauptmannFraunhofer FEP, Physicist, DEUltra-Low-Cost and Rapid Production of Inkjet-Printed Conductive Patterns using Silver and Copper Oxide NanoparticlesMr. Andreas AlbrechtTechnische Universität München, Doctoral candidate, DE
Conference Program – Day 2Wednesday – April 6, 2016
Conference Program – Day 2Wednesday – April 6, 2016
BC Poster SessionFoyer ICM 18:00
End-user applications and requirements
Applications through customers eyesMr. Antti Backman Delektre Ltd., CEO, FI
Supply-chain challenges
Roll-to-roll vacuum deposition without front side touchingDr. hannes klumbies FhR Anlagenbau Gmbh, Product Manager, DE
Conference Program – Day 3Thursday – April 7, 2016
Plenary SessionRoom 14b
Session Chair: Mr. Wolfgang MildnerMSW, Founder, CEO, DEChairman Strategic Advisory Board
09:00 Mainland China Display Industry Technology Now and FutureDr. Xiolin YanTCL Corporation Ltd., Chief Technology Officer & Senior Vice President, CN• Mainland China Display Industry development • Mainland China Display Technology Now and Future • Consideration of QLED Materials
09:25 Low-Temperature Organic and oxide Transistors Enabling Flexible electronicsProf. henning SirringhausUniversity of Cambridge, Cavendish Laboratory, Uk• Review of recent performance advances in organic and oxide thin film
transistor technology • Discussion of unique aspects of their materials and device physics • Commercialisation status
09:50 5000 years long we’ve been playing (board) games together, what’s next?Mr. Steven NietveltCarta Mundi, Chief Innovation and Marketing Officer, BE• The digital revolution in game play• Cartamundi’s strategy: hybrid game play (best of both worlds)• The roll of (printed) technology to connect the physical and digital world
10:15 Technology Development for Printed Digital/Analogue Circuits Based on Organic SemiconductorsProf. Jun TakeyaGraduate School of Frontier Sciences, The University of Tokyo, JP• Development of key technologies for printed digital/analogue circuits• Low-cost platforms for RFID communication, data processing,
and sensing circuitries• Research innovation in high-mobility organic semiconductor materials
Functional Materials
Technical ConferenceRoom 13a
Session Chair: Dr. Mark James,Merck Chemicals, R&D Director, head of Organic Electronics, Uk
11:30 | Clevios™ PEDOT Touch Panels and their Integration with Flexible AMOLEDDisplays,Dr. Wilfried Lövenich, heraeus DeutschlandGmbh & Co. kG, head of the R&D and Inno-vation Department, DE• A flexible 6” PEDOT-based touch sensor was
prepared and its flexibility tested• The sensor was integrated with a flexible
AMOLED display• Progress of PEDOT pilot line patterning by
different processes will be reported
11:50 | Recent Applications of FlexOS™OTFT Technology,Dr. Mike Simms, NeuDrive Ltd, head of Materials Development, Uk• Introduction to NeuDrive and its OTFT
technology• Flexible display, logic and sensor applications• hIgh speed circuitry using FlexOS™
12:10 | NONcrystallizable™ OLED: A Bridge to the Future,Mr. Michel Molaire, Molecular Glasses, Inc.,CEO/Founder, US• NONcrystallizable OLED• Molecular Glass Mixtures• Non-crystallizable Organic Semiconductors
12:30 | Solution processed electronic devices at CDT: overview of technologyplatforms and current performance,Dr. Miguel Carrasco, Cambridge DisplayTechnology Limited, Programme Manager,Printed Electronics, Uk• Flexible displays• Organic photovoltaics and photodetectors• Organic transistors and circuits
Session Chair: Prof. Dr. Arto Maaninen,VTT Technical Ressearch Centre of Finland, Vice President Operations, FI
11:30 | Organic solar films from vacuum roll-to-roll manufacturing for building-integrated photovoltaics,Dr. Martin Pfeiffer, heliatek Gmbh, CTO, DE• Vacuum R2R production of tandem modules
on PET• Stable efficiencies above 12% in lab, 7% in fab • Organic BIPV pilot projects on various
materials
11:50 | Towards Roll-to-Roll production ofPerovskite based PV: challenges and newopportunities for printed electronics,Mr. Ronn Andriessen, TNO, Program Manager, NL• From high efficient lab devices to mini-modules.• From lab devices to up-scaled large area
devices.• Fom S2S to R2R processed Perovskite based
PV.
12:10 | High efficiency polymer semiconduc-tors for organic photovoltaics with improvedstability,Dr. Owen Lozman, Merck Chemicals Ltd, Senior R&D Manager, Uk• Carefully tailored high performance inks for
OPV• Improved thermal and light stability• Integration into commercially viable solar
modules
12:30 | Printed flexible photovoltaic modulefoils based on CZTS semiconductors,Dr. Gerhard Peharz, JOANNEUM RESEARCh, Senior Scientist, AT• Printed photovoltaic foils• Based on CZTS semiconductors• Roll-to-roll production
Energy
Technical ConferenceRoom 13b
Session Chair: Prof. Dr. Antonio Facchetti,Northwestern University / Polyera, US
11:30 | Fully Roll-to-Roll Gravure Printed 40 DPI Flexible Thin Film Transistor Back-plane,Mr. Junfeng Sun, Sunchon National University, kR• Fully Roll-to-Roll Gravure• 40 DPI Flexible Thin Film Transistor Back-
plane• Typical Parameters Of Printed TFTs
11:50 | Laser Thin Film Processing forQuick Prototyping and Low-Medium Volume Production of Flexible Displays,Mr. Riccardo Geremia, Oxford Lasers Ltd, Application Engineer, Uk• Laser Ablation• Thin Film Patterning• Flexible Displays
12:10 | Fully Solution Processed, ITO-freeOrganic Light-emitting ElectrochemicalCells (OLEC) with ZnO Interlayer for Lab-on-Chip Applications,Mr. Zhe Shu, Fraunhofer Institute for AppliedOptics and Precision Engineering (IOF), PhDstudent, DE• OLED • Solution processing• Lab-on-chip
12:30 | Digitally Processed Large Area Polymer Solar Cells,Dr. Matthieu Manceau, CEA, Research Engineer, FR• Inkjet printing • Laser patterning • Freedom of Design
Session Chair: Dr. Ton van Mol,holst Centre, Managing Director, NL
11:30 | Screen-printed biochemical sensorsfor sweat ammonia levels,Dr. Michael Jank, Fraunhofer Institute for Inte-grated Systems and Device Technology, IISB,DE• Screen-printed biosensor• Biomedical sensor for sweat ammonia• Ion-selective electrode for wearable devices
11:50 | PyzoFlex®- All-printed ferroelectricsensors for a multitude of applications,Dr. Herbert Gold, Joanneum Research, AT• Large area• Screen printing• Piezoelectric
12:10 | A Novel Scale-Up Technique forPrinting Organic Semiconductors for HighPerformance Reproducible Transistors,Dr. Sergi Galindo, ICMAB-CSIC, Researcher, ES• Large Area Organic Electronics• Organic Field Effect Transistors• Printed Organic Electronics
12:30 | Charge transport in high-performancen-channel organic field-effect transistors,Prof. Thomas Weitz, LMU München Faculty of Physics, DE• Organic field-effect transistors• N-channel• Charge transport study
12:50 | Performance and reliability mappingfor all Inkjet-printed thin-film-transistor arrays using industrial inkjet accessories,Mr. Kalyan Yoti Mitra, Technische UniversitätChemnitz, Scientific Researcher, DE• Inkjet printed thin-film-transistor (TFTs) arrays• TFTs fabircated using ind. inkjet accesories• Focus on manufacturing yield and failure origins
Sensor Systems and Transistors
Scientific ConferenceRoom 14a
Scientific ConferenceRoom 14c
Conference Program – Day 3Thursday – April 7, 2016
Conference Program – Day 3Thursday – April 7, 2016
Manufacturing of Printed ElectronicsDevices
Flexible Displays
Technical ConferenceRoom 13a
Session Chair: Dr. Edzer Huitema,Polyera, CEO, US
14:00 | Flexible Electrophoretic Displaysare in Production and Growing,Dr. Michael McCreary,E Ink Corporation, Chief Technology Officer, US• Flexible EPD, forecast for many years,
is in production.• Flexible TFT EPD allows curved and
bendable wearables. • Flexible EPD in architecture is lighter and
more robust.
14:20 | Keep your cell phone in your pocket! – Printed displays as a simple way to make objects interactive,Dr. Carlos Pinheiro Baptista,Ynvisible SA, CTO, PT• Printed and Electrochromic Displays• Visual indicator and Internet of Things• Low-voltage and low-power consumption
14:40 | OLED meets Film-Insert-Moulding,Dr. Christoph Patron, COPT.Center - University of Cologne, Scientific Coworker, DE• OLED/sensor integration via FIM-Process• More elegant form factors possible• Thinner, lighter and cheaper products
Session Chair: Dr. Jyrki Schroderus,PolarElectro, CTO, FI
14:00 | Multimodal sensor band – Great concept but why it is not on the market?,Mr. Tapio Fabritius, Oulu University, FI• Multimodal sensors are the future wellbeing
technology• Lack of the reliable measurement data is a key
challenge• Need for novel designs and signal processing
algorithms
14:20 | Gear Up for the Internet of Everythingwith Wearable Electronics,Dr. Thomas Kraft, Tampere University of Technology, Post-Doctoral Researcher, FI• Gadget-free with energy autonomous
flexible devices• Integration of stretchable electronics in textiles• Printed electronics for soft epidermal
applications
14:40 | Printed Electronics enabling newWearable Products,Dr. Gordon Smith, GSI Technologies, Chief Technology Officer, US• Wearable electronics market review• Developments in printed electronics • Future product requirements
Wearable Electronics
Technical ConferenceRoom 13b
Session Chair: Prof. Dr. Gyou-Jin Cho,Sunchon National University, kR
14:00 | Influence of drying temperature on inkjet printed droplets morphology byusing silver nanoparticles based ink: relation with electrical performances,Dr. Vincent Faure,Grenoble INP, FR• Inkjet• Coffee ring• Silver nanoparticles ink
14:20 | Micrometer Resolution Flexoprintingof Conductive Inks Using Engineered Carbon Nanotube Stamps,Dr. Sanha Kim, Massachusetts Institute ofTechnology, Postdoctoral Associate, US• Flexography• Carbon Nanotubes• Conductive Ink
14:40 | Short pulse laser patterning processes for roll-to-roll manufacturing of organic photovoltaics,Prof. Stergios Logothetidis,Aristotle University of Thessaloniki, GR• Laser patterning, Organic Photovoltaics• Roll-to-Roll printing, Flexible OPVs• Bulk heterojunction, Polymers
15:00 | Integration of SAMBA inkjet printhead into an inline roll-to-roll repairing system,Mr. Anh Tuan Tran Le,TU Chemnitz, Research assistant, DE• Roll-to-roll• SAMBA inkjet• Repairing system
Session Chair: Prof. Dr. Klaus Meerholz,University of Cologne, DE
14:00 | Conductive copper complex inkjetink with self reduction mechanism for flexible electronics,Mr. Yousef Farraj, The hebrew University of Jerusalem, PhD student, IS• Copper complex conductive ink• Formation of flexible electronics • Ink performance and post treatment
14:20 | Developing New Copper Inks for 2Dand 3D Objects by Using Self-ReducingPrecursors,Mr. Yitzchak (Isaac) Rosen, The hebrew University of Jerusalem, PhD student, IS• Copper salt NP ink developed• Parameters affecting copper morphology
described • New method for copper pattern analysis
14:40 | Manufacturing of CuNiMn-alloy Inks for digital printing,Dr. Volker Zöllmer, Fraunhofer IFAM, head of Department Functional Printing, DE• Ink manufacturing• Printing metallic alloys• Sintering of metallic structures
15:00 | Patterning CNT-forest for the Fabrication of Nano-Channel OFET of High W/L,Mr. H M Dipu Kabir, The hong kong Universityof Science and Technology, PhD Candidate, hk• Smaller channel means higher investment• OFET with high aspect ratio (W/L)• Nanogap using micrometer technology
Scientific ConferenceRoom 14a
Scientific ConferenceRoom 14c
Printing and Patterning Processes II Copper-based and Novel Materials
Conference Program – Day 3Thursday – April 7, 2016
Conference Program – Day 3Thursday – April 7, 2016
Touch
Technical ConferenceRoom 13a
Session Chair: Dr. Wilfried Lövenich,heraeus Deutschland Gmbh & Co. kG, headof the R&D and Innovation Department, DE
16:00 | EcoFlash™: Next Level of Enhanced Isotropic Etchants,Dr. Dirk Tews, Atotech Deutschland Gmbh,Product Manager, DE• Next Level of Differential Etchant• SAP and MSAP Manufacturing• Green solution & Waste reduction
16:20 | Touch and Gesture Sensors basedon flexible Silver Metal Mesh Films,Dr. Wolfgang Clemens,PolyIC Gmbh & Co. kG, head of Product Management PolyTC, DE• Applications of Touch and Gesture sensors
as hMI • Silver metal mesh transparent conductive
films• Smart surfaces with combined decoration
and touch
Session Chair: Mr. Scott White,PragmatIC, CEO, Uk
16:00 | The Internet of EVERYTHING: The Manufacturing Challenge,Mr. Alan McClelland, Centre for Process Innovation, Commercial Manager, Uk• Products enabled for the internet of things
has created a new opportunity for thin film,flexible, printed electronics
• Now that there is a demand, how do we manufacture and integrate electronics intoproducts at volume and at low cost?
• how do we develop new supply chains tocreate these products and what other aspectsregarding legislation and standards will needto be considered?
16:20 | Hybrid electronics systems by CSEM,Dr. Nenad Marjanovic,CSEM SA, Project Manager, Ch• hybrid integration printed and Si-based
electronic• Printed passive and active components
and SMDs• Applications: sun sensor, optical imager
16:40 | Active Acoustic Noise Silencer WithPrinted Electronics,Mr. Tommi Rintala, Delektre Ltd, CTO, FI• Demand for noise control applications is
growing• Large area speakers and microphones• Better customization possibilities?
Smart and Hybrid Systems
Technical ConferenceRoom 13b
Novel Printing Methods
Session Chair: Prof. Dr. Jukka Hast,VTT Technical Research Centre of Finland,Research Professor – VTT Printed Intelligence,FI
16:00 | Advanced process and material in-vestigations of large-area silver nanowirespray coatings for maximum quality,Mr. Yilei Shen, University Erlangen-Nürnberg, PhD student, DE• Large area spray coating of silver nanowire
layer• Master curve of spray AgNW layer• Mean drop size of silver nanowire spray
16:20 | Investigation on inkjet-printing offunctional components for the manufac-turing of a quantum dot based sensor for mechanical load detection,Ms. Melinda Hartwig, Technische UniversitätChemnitz, Scientific Research Assistant, DE• Inkjet• Quantum dot• Mechanical load detection
16:40 | Direct nanoimprint of metal nano-wires for transparent electronics,Mr. Johannes Maurer, INM – Leibniz Institutfür Neue Materialien, PhD student, DE• Transparent electronics• Nanoimprint• Metal nanowires
Scientific ConferenceRoom 14a
Conference Program – Day 3Thursday – April 7, 2016
Conference Program – Day 3Thursday – April 7, 2016