Conferences, Publications,and Awards

Three of the most important func-tions provided to members of a

Technical Society in the IEEE, such asthe EMC Society, are Conferences,Publications, and Awards. These threeareas of service are highly ranked inevery survey done by the IEEE for anySociety’s membership.

Our Society’s most important con-ference of the year is the 1998 IEEEInternational Symposium on Electro-magnetic Compatibility that is sched-uled to be held in Denver, Coloradofrom August 24-28. This conferencebrings together technical experts fromall over the world for a series of techni-cal presentations on the latest devel-opments in the area of electromagneticcompatibility engineering. In addi-tion, numerous engineering commit-tee meetings will be held at the sametime ranging in size from 50 peopledown to many informal one-on-onemeetings.

In parallel to the technical ses-sions, there will be over 200 exhibitorsshowing their EMC goods and ser-vices. The exhibits will be located inthe Colorado Convention Center to al-low plenty of room for all exhibitors

and, the CCC is located very close tothe main Symposium Hotel, theAdam’s Mark Hotel.

This is the premier “networking”opportunity for EMC professionals for1998. Make sure you take advantageof the opportunity!

The three primary publications ofour Society are the Proceedings of theAnnual Symposium, the Transactionson Electromagnetic Compatibility,and this EMC Society Newsletter. TheProceedings of the Symposium arecalled the “Symposium Record” and itcontains the technical papers pre-sented at the annual show. The “Re-cord” is sent to every member of theEMC Society whether they go to theSymposium or not. (As a member,don’t forget that you can get all theEMCS Symposia Records from1955-1995 on four CDROMs for $40! -See the ad in this newsletter).

The second key publication is the“Transactions” which is the location ofthe archivable papers representingthe latest research in the area of EMC.This publication is published quar-terly by the IEEE with editiorial con-trol by the EMC Society. Our editor formany years has been Motohisa Kandaand we are rightfully proud of thework he has done as editor and thetechnical papers that have been pub-lished in the “Transactions.” TheEMC Society is discussing “go-ing-electronic” with the Transactionsand we hope to have news on our prog-ress shortly.

N E W S L E T T E RISSUE NO. 178 SUMMER 1998 (ISSN 0164-7644) JANET O’NEIL, Editor

IEEEELECTROMAGNETIC

COMPATIBILITY SOCIETYNEWSLETTER

INSIDEPRESIDENT’S MESSAGE

1LETTER FROM THE EDITOR

2CHAPTER CHATTER

3DoD E3 ACTIVITIES

9PRACTICAL PAPERS, ARTICLES

AND APPLICATION NOTES:NORMALIZED SITEATTENUATION AND

TEST SITE VALIDATION10

THE MYSTERIESOF GROUNDING…

13BOOK REVIEW

15PERSONALITY PROFILE

17INTERESTING WEB SITES

18EMC BOARD OF DIRECTORS

ACTIVITIES19

EDUCATION COMMITTEE23

EMCABS24

CALENDAR27

IEEENetworking the World TM

DAN HOOLIHANPRESIDENT,

EMC SOCIETY

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Continued on page 24

There’s lots happening in the EMCSociety these days.......

First, with the EMCSociety Newslet-

ter, we have a newAssociate Editor forAbstracts. After 14years, Bill McGinnisis stepping down andturning the reinsover to ProfessorOsamu Fujiwara.For those of you who

may not know Bill, he started his career inEMC while he was working for RCA on theAtlantic Missile Range in "Frequency Con-trol and Analysis." Later, he was hired byGene Cory at Southwest Research Instituteto work in the RFI lab. Bill worked at SWRIfor 32 years until he retired. Currently, heis working as an RF Design Engineer at Al-exander Utility Engineering. (You may con-tact Bill there at phone 210-496-3200.) Iasked Bill about his history with the Ab-stracts. I was surprised to learn that Billhas been Associate Editor for Abstracts for14 years, having taken over from Mel John-son. Bill recalled that his greatest goal andaccomplishment as Associate Editor for Ab-stracts was the increasingly internationalnature of the abstracts. He was able to re-cruit abstractors in the United States, Eu-rope, Asia and the Middle East. Bill notedthat "the collection of abstracts was greatlyenhanced with the advent of the internet".When we were discussing his 14 year his-tory with the Newsletter, Bill asked that Ipass along his thanks to those who contrib-uted to the abstracts and to those who ex-pressed appreciation for his work.

We are indeed fortunate to have Profes-sor Fujiwara as our newest Associate Editor.As a bit of background on our newest Associ-ate Editor, Osamu Fujiwara received theB.E. degree in electronic engineering from

Nagoya Institute of Technology in 1971,and the M.E. and the D.E. degrees in elec-trical engineering from Nagoya Universityin 1973 and 1980, respectively. From 1973to 1976, he worked in the Central ResearchLaboratories, Hitachi, Ltd., Kokubunji,where he was engaged in the research anddevelopment of system packaging design ofcomputers. From 1980 to 1984 he was withthe Department of Electrical Engineeringat Nagoya University. In 1984 he moved tothe Department of Electrical and ComputerEngineering of Nagoya Institute of Tech-nology, where he is currently a professor.His work in the field of EMC particularly fo-cuses on the bioeffects of electromagneticfields and measurement and modeling forelectromagnetic interference due to dis-charge. Professor Fujiwara has assembledan excellent team of abstractors to assisthim. They are listed in his first column onpage 24.

Many, many thanks to Bill McGinnisfor his excellent work over the years as As-sociate Editor for Abstracts and a sincerewelcome to Professor Fujiwara.

Second, with our new Society Presi-dent, Dan Hoolihan, promoting EMC edu-cation, many of our regional chapters haveresponded with one day tutorial/work-shops devoted to quality EMC education.You'll find summaries and photos of theseeducational activities in the Chapter Chat-ter column. These one day EMC events areexciting and action packed!

Third, and last, but not least, we havethe International IEEE EMC Society inDenver in August. This is our big Societyevent of the year and there has been theusual flurry of activity lately with last min-ute registrations, inquiries, etc. It prom-ises to be a really big show.

See you there!

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Janet O’Neil, Editor, with Len Carlson, EMCS Vice President forCommunication Services, at the Seattle EMC Chapter eventfeaturing Henry Ott.

CORRECTION: In the last issue of the Newsletter, there was an error in theStandards Activities column. The reference on page 14 to “IEEE-STD-299-1998"should be corrected to read ”IEEE-STD-299-1997”. Further, the document was pub-lished in April, not March as shown.

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“X, Y, ceramic, baseball, ...”[Ding] “Alice?”

“What are words that precede‘cap’?”

“Correct!”

“I’ll take ‘EMC Lingo’ for$400.”

If Jeopardy had categorieslike this, I might watch it

more often. But EMC engi-neers are a very small per-centage of the generalpopulation. Most people don’tknow (and don’t want toknow) what we do. Once in anairplane, I heard someone afew rows behind me use theterm “360 degree shield”. Iknew immediately that thisperson was either an EMCengineer or had recently beenin contact with an EMC engi-neer. I couldn’t figure out whosaid it, but I immediately felta sense of camaraderie withthat person.

EMC engineers share aspecial bond, kind of like di-saster survivors, recoveringalcoholics, or parents oftwins. When I meet otherEMC engineers, I have mixedfeelings of respect, pity, andcuriosity. I want to talk tothem, share experiences, andlearn from them. There arefew things in life quite as sat-isfying as an emotionallycharged technical discussionwhere pictures are drawn,equations are solved, and ev-eryone emerges a little wearyand a little wiser.

The problem is that EMCengineers are hard to spot.They don’t wear uniforms orcarry tools around with them.In public places, they lookjust like anyone else. It wouldbe nice if EMC engineerswere issued special badges or

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Newsletter StaffEditor

Janet Nichols O'NeilLindgren RF Enclosures, Inc.

22117 NE 10th PlaceRedmond, WA 98053

Tel: 425-868-2558 Fax: 425-868-0547e-mail: j.n.oneil@ieee.org

Associate EditorsABSTRACTSProfessor Osamu FujiwaraDept. of Elec. & Comp. EngineeringNagoya Institute of TechnologyGokiso-cho, Showa-ku, Nagoya466-8555 Japan+81-52-735-5421fax: +81-52-735-5442e-mail: fujiwara@odin.elcom.nitech.ac.jp

BOOK REVIEWSReinaldo Perezc/o Lockheed MartinMS: S8700, P.O. Box 179Denver, CO 80201303-977-5845fax: 303-971-4306e-mail: ray.j.perez@ast.lmco.com

J.L. Norman VioletteViolette Engineering Corp.120 East Broad St., Ste. BFalls Church, VA 22046703-532-1355fax: 703-538-3810e-mail: enviolette@msn.com

CHAPTER CHATTERTodd HubingUniv. of Missouri-Rolla219 ElectricalEngineering Bldg.Rolla, MO 65401573-341-6069fax: 573-341-4169e-mail: t.hubing@ieee.org

DoD E3

ACTIVITIESRobert D. GoldblumR&B Enterprises20 Clipper RoadWest Conshohocken,PA 19428610-825-1960fax: 610-825-1684e-mail: rgoldblum@RBitem.com

EMC PERSONALITYPROFILEWilliam G. DuffComputer Sciences Corp.Systems Engr. Div., Ste. 3005501 Backlick RoadSpringfield, VA 22151703-914-8450e-mail: w.duff@ieee.org

EMC STANDARDS ACTIVITIESDonald N. Heirman143 Jumping Brook RoadLincroft, NJ 07738-1442732-741-7723fax: 732-530-5695e-mail: d.heirman@worldnet.att.net

EMCS BoD ACTIVITIESJanet Nichols O'NeilLindgren RF Enclosures, Inc.22117 NE 10th PlaceRedmond, WA 98053Tel: 425-868-2558Fax: 425-868-0547e-mail: j.n.oneil@ieee.org

EMCS PHOTOGRAPHERDick Ford6 Westcot PlaceFalmouth, VA 22405202-767-3440fax: 202-404-4064e-mail: dford@radar.nrl.navy.mil

EMCS EDUCATION COMMITTEEKimball WilliamsEaton Corporation26201 Northwestern HighwayP.O. Box 766Southfield, MI 48037248-354-2845fax: 248-354-2739e-mail: k.williams@ieee.org

INTER-SOCIETY ACTIVITIESJoseph E. ButlerParker Chomerics77 Dragon Ct.Woburn, MA 01888781-939-4267fax: 781-938-5071e-mail: jbemc@aol.com

PRACTICAL PAPERS, ARTICLES& APPLICATION NOTESBob RothenbergTechnical Product MarketingP.O. Box 551Carlisle, MA 01741978-369-2860fax: 978-369-3581e-mail: rothenberg@ieee.org

IEEE EMC Society Newsletter Publication SchedulePublication Dates Editorial Deadlines

August July 1November October 1February January 1

May April 1IEEE EMC SOCIETY NEWSLETTER is published quarterly by theElectromagnetic Compatibility Society of the Institute of Electrical andElectronic Engineers, Inc., 345 East 47th Street, New York, NY 10017. Onedollar ($1.00 USD) per member per year (included in the Society fee) for eachmember of the EMC Society. Periodicals postage paid at New York, NY andadditional mailing offices. This newsletter is printed in the USA. Postmaster:Send address changes to IEEE EMC Society Newsletter to 445 Hoes Lane,Piscataway, NJ 08855.

1998 IEEE. Permission to copy without fee all or part of any material withouta copyright notice is granted provided that the copies are not made or distributedfor direct commercial advantage, and the title of the publication and its dateappear on each copy. To copy material with a copyright notice requires specificpermission. Please direct all inquiries or requests to IEEE Copyrights Office.

TODD HUBINGASSOCIATE EDITOR

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pins that identified them. That way, when two EMC engi-neers found themselves waiting in the same line or ridingthe same plane, they could strike up a conversation.

“I couldn’t help but notice that you have the words‘EMC ENGINEER’ tattooed to your forehead. Are you anEMC engineer?”

“Why yes, I am.”“I hear static in my cell phone every time I hold it near

the metal plate in my head. Could you take a look at it?”Well ... perhaps we shouldn’t be quite so obvious.

Maybe we could have a secret symbol, something that iden-tifies us as EMC engineers, but only to other EMC engi-neers. For example, we could all wear green wristwatches.[Green is a good color because, as all EMC engineers know,EMI data plotted in green is more likely to meetspecifications.]

We could even equip these watches with proximity de-tectors that would notify us if we ever came within 3 metersof someone else wearing one of these watches. Of course, ifwe all start wearing watches that emit some kind of EM sig-nal, there are bound to be some interference problems. Also,it wouldn’t be long before enterprising entrepreneurs beganmarketing devices triggered by this signal to help peopleavoid EMC engineers. These avoidance devices would prob-ably be quite popular with product engineers, managers,technicians and spouses of EMC engineers.

OK, forget the proximity detectors. Perhaps we canconvince the IEEE EMC Society to issue luggage tags withthe EMC Society logo to all of its members. At least thatway we could spot other EMC engineers in hotels and air-ports. Let’s all send email to Dan Hoolihan, the societypresident, asking for luggage tags. Better yet, let’s all askfor watches. That way, when the board votes to give us lug-gage tags, they can view it as a cost-saving measure.

AtlantaOn May 28, 1998, Lockheed Martin Aeronautical Sys-

tems in Marietta, Georgia hosted a meeting of the JointEMC/IM Society Atlanta Chapter. After a delicious meal ofpizza and chicken wings, Jack Crosscope of Technical Ob-jectives, Inc. presented “A Look at Eddy Current Inspec-tion.” Dr. Crosscope explained the basic physics of eddycurrent testing, discussed its uses and limitations, andpresented some of his ideas for neural network processingof measurement data. Before the lecture, a quick surveyrevealed that no one in the audience had any prior expo-sure to eddy current testing. The technical depth of the dis-cussions at the conclusion of the presentation was a testa-ment to the excellent job Dr. Crosscope had done inexplaining this subject.

For those who may not have heard, Herb Zajac, theVice Chair of the EMCS Atlanta Chapter and a member ofthe EMCS BoD, was diagnosed with a brain tumor in May.At this writing (June 30), Herb is undergoing radiationtreatments and chemotherapy - surgery is a possibility af-ter the treatments. Please keep Herb and his family inyour thoughts and prayers. Notes and telephone calls arevery much appreciated, and may be directed to: Herb andLinda Zajac, 4525 Apache Ct., Kennesaw, GA 30152,Phone: (770) 425-1986.

BeijingDr. Li Shufang and Beijing chapter chair Prof. Gao

Yougang report that the domestic EMC academic meetingwas held in Laizhou, Shandong province in November.Eighty-three delegates attended and sixty papers werepublished. During the meeting, some developing coopera-tion projects from factories and research institutes werediscussed with satisfying results.

On Mar. 10-20, 1998, a small-scale international con-ference on new technology for lightning protection andelectromagnetic compatibility was held at Beijing Univer-

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Germany Chapter Chairman Professor Heyno Garbe (left) introduces theMay meeting speaker, Dr. Oeing of INCASES. Dr. Oeing spoke about thelatest developments in EMC-CAD tools for printed circuit boards.

At the June Germany Chapter meeting, Dr. Form of Volkswagen AG spokeabout EMC aspects in the automobile industry. Some 35 people attendedthe meeting. Dr. Form presented a TEM-cell used for susceptibility testing.

sity of Posts and Telecommunications (BUPT). About 60scholars from Germany, Australia, Russia, China and othercountries attended the meeting.

Seven new IEEE members have been signed and theIEEE Student Branch in BUPT was formed. The China chap-ter president, Prof. Gao Yougang, is the student advisor.

Central New EnglandJohn Clarke reports that the April meeting of the Cen-

tral New England chapter featured Werner W. Paster, ofEUROCONSULT, Inc. in Manchester, MA. Twenty-onepeople attended the presentation titled, “European Compli-ance and CE Marking.” The European Union (EU) Direc-tives covering EMC, Low Voltage equipment, Machineryand Medical Devices have a major impact on U.S. indus-tries exporting to EU member countries. The speaker dis-cussed new standards and industry requirements regard-ing EMC and safety that must be met to comply with theseDirectives. Several related issues have also resulted fromthe need to meet these new and/or changing requirements,namely; CE marking, component marking and the GermanSafety(GS) Mark; Self-Declaration as opposed to thirdparty approvals; and the differences between CE Declara-tion of Conformity and Declaration of Incorporation. Equip-ment today must be designed for the global market withsafety and EMC compliance in mind.

The subject of the May meeting was “Joining of TwoConductors for EMI/ESD Protection.” The speaker was Dr.Richard Haynes, of Richard Haynes Consultants. A com-mon trouble spot is the electrical discontinuity at an inter-face between two conductors. Material choices for suchjoints are usually compromises between the minimum im-pedance and maximum corrosion resistance at the inter-face. The talk reviewed (1) The representation of corrosionand its prevention using equivalent circuits, (2) conductivematerials and surface finishes commonly used in makingjoints and (3) technical principles used in the proper choiceof materials. Design guidelines for joints that could be usedin electronic products were also presented.

CNE Chapter Officers for 1998/1999 are:Chair and Secretary: John Clarke, EMC ConsultantVice-Chair: John Luchini, Brite Voice SystemsVice-Chair: Lee Hill, Silent Solutions

GermanyProf. Heyno Garbe reports that the German chapter

hosted two presentations this spring at the University ofHannover. 25 persons attended the May meeting where Dr.Oeing, of INCASES, Paderborn, reported on the latest devel-opments in EMC-CAD tools for Printed Circuit Boards(PCBs). The auditorium agreed with the speaker that it isabsolutely necessary to create software tools in order to de-crease the development time. Dr. Oeing pointed out thatwith the present EMC-CAD tools it is possible to treat a sin-

gle PCB, but it is a great challenge for EMC engineers to in-clude the whole system into the CAD program.

In June, 35 persons were present when Dr. Form,Volkswagen AG, Wolfsburg, gave his talk about EMC con-cerns in the automobile industry. First, he introduced thetypical environment in which cars have to work and theEMC requirements that have to be met. It was very impres-sive to see that a normal car has to withstand a fieldstrength that is more than fifty times higher than the limitfor household equipment.

The speaker also described the different measurementand test facilities that are necessary for automotive EMCtesting. He also discussed the EMC management system atVolkswagen AG. After this talk everyone agreed that Dr.Form’s talk was excellent.

Los AngelesThe Chairman of the the Los Angeles Chapter, Ray Ad-

ams, is one smart cookie. Once Ray heard that Henry Ott

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(L-R) Jennifer Fisher of Test Equipment Corporation and Virginia Fischer ofFischer Custom Communications join Janet O’Neil of Lindgren RF Enclo-sures for the raffle following the Henry Ott event in Manhattan Beach.

Long time EMC Society members and legendary “experts” reunite at theManhattan Beach Henry Ott event. Pictured are Al Parker (L) of Solar Elec-tronics and Joe Fischer of Fischer Custom Communications.

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would be in Seattle on April 28 for the Seattle Chapterevent, he begged, pleaded and borrowed to get Henry to re-peat the program for the Los Angeles Chapter. Raythought that since Henry was already on the West Coast inSeattle, he could make the trip down to Los Angeles fairlyeasily. Fortunately, Henry agreed, and thus the LA Chap-ter also sponsored the one-day tutorial with Henry Ott ti-tled “The Ten Most Common EMC Problems and Their So-lutions Plus EMC Measurement Diagnostic Techniques.”This was held on April 30 at the Marriott Hotel inManhattan Beach. Over 130 EMC professionals attended.As in Seattle, attendees were treated to a full day of HenryOtt, continental breakfast, a delicious sit-down lunch anda reception which featured a pasta bar and a bottom-lessbowl of jumbo shrimp. All at a luxuryhotel overlooking agolf course! In addition to the tutorial, there was a vendortabletop display area which featured the latest and great-est in EMC products and services. The highlight of the re-ception was a raffle. Credence Technologies donated aScanEM hand-held near-field probe and Fischer CustomCommunications donated H and E field sniffers.

Mohawk ValleyThe Mohawk Valley Chapter held its first meeting in

over a year following a period of significant change in theengineering and technical community of the Rome-Utica,NY area. Our sincere gratitude goes out to outgoing ChairDonald Pflug of the US Air Force Research Laboratory inRome for his past efforts to keep the chapter active amidsta time when local engineering companies and military fa-cilities were being downsized, relocated, and restructured.The chapter membership roster and cycle of meetings weredisrupted as a result of these recent events. Due to the ded-ication, sacrifice, and planning of the Section members andlocal community professionals, this situation is improving.We are now in a growth mode and going back to a regularcycle of EMC Chapter meetings. Following in Don Pflug’sfootsteps is Andy Drozd. Andy took over the Chapter Chairposition at the beginning of this year.

The May luncheon meeting of the Mohawk ValleyChapter featured Don Bush of dBi Corporation as guestspeaker. Don’s participation was sponsored through theEMC Society Distinguished Lecturer Program. His talkwas titled “A History of EMC, Impacts of the InformationAge and Instituting Collaborative/Concurrent Engi-neering Practices in the Workplace.” The presentation fo-cused on the evolution of EMC measurement methods andhow modern information technologies have affected theway engineers perform measurements today compared tocomparable practices over the past several decades. Donalso highlighted the importance of properly consideringEMC in view of other technical disciplines including hu-man factors and safety engineering. His presentation hithome for many who are working directly in the combinedareas of EMC, integrated product team engineering, andthe application of advanced information technologies in

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Lowell Beezley of ARC Technical Resources clearly enjoys the “bottom-less” bowl of jumbo shrimp at the Henry Ott event in Manhattan Beach.

The spotlight is on Pam Tucker of CKC Labs and Chris Steding of Electro-Metrics during the Henry Ott event in Seattle. Pam and Chris also partici-pated in the Henry Ott event in Manhattan Beach.

Los Angeles Chapter Chairman, Ray Adams (L) of Hughes, promotes thesales of EMC Society CD-ROMs at the Henry Ott event in Manhattan Beach.David Fischer of Fischer Custom Communications provides good companyfor Ray.

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product designs as well as for conducting specificationscompliance testing. Over 25 members and guests were inattendance at the May luncheon meeting. Overall, an excel-lent presentation and a job well done by Don Bush!

The Mohawk Valley EMC Chapter is planning for sev-eral more presentations courtesy of the Distinguished Lec-turers Program following a brief Summer hiatus.

PhiladelphiaThe April meeting of the Philadelphia chapter featured

Dr. William Duff of Computer Sciences Corporation. Dr.Duff gave a very interesting presentation titled, “Danger -Electromagnetic Interference (EMI) Communication Sys-tems Overload.”

Santa ClaraJoining the bandwagon to promote EMC education, the

Santa Clara Valley Chapter organized a one day EMCevent titled “EMC ‘98: A Colloquium and Exhibition onProduct Compliance, Understanding the Fundamentals.”This was held at the Westin Hotel and Santa Clara Conven-tion Center on June 1. Some 200 EMC professionals at-tended the event which featured two parallel tracks of pre-sentations; one addressed Product Compliance while theother addressed EMC Design. The objective was to enableattendees to hear nationally and internationally recognizedindustry leaders and technical experts present up-to-dateinformation on all aspects of regulatory agency approvalprocesses and product design. Featured speakers includedEMC Society Board of Directors members Don Heirman,

Dan Hoolihan, and Todd Hubing, as well as Dr. ZoricaPantic-Tanner (who was also the Treasurer for the event),Jim Chiappe, Bill Ritenour and Franz Gisin, among others.In fact, Franz Gisin of Silicon Graphics chaired the eventand was ably assisted by a planning committee which in-cluded Ken Renda of Lockheed-Martin as Vice-Chair,Jennifer Fisher of Test Equipment Corporation for Ar-rangements, Jay Gaertner of ARC Technical Resources forExhibitis, John Shelter of of TRW for Registration, SusanSavage of Advanced Performance Materials for Publicity,John Will of Sun Microsystems for the Technical Program,Jon Zobel of TRW for Publications, and Jeff Evans of SiliconGraphics as the Webmaster. It took a big crew to put on thissummer blockbuster! In addition to the technical presenta-

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Don Heirman takes a break from the action at EMC ‘98 in Santa Clara. Thedessert buffet was just one of the highlights of the one day event which fea-tured some 15 speakers, including Mr. Heirman, during the two parallelsessions.

Scenes from under the “big top” at EMC ‘98 in Santa Clara. Attendees areshown gathering around the lunch buffet which was served in the vendor ta-ble top display area.

Henry Ott is shown with Janet O’Neil following the one-day tutorial he pre-sented entitled: “The Ten Most Common EMC Problems and Their Solu-tions Plus EMC Measurement Diagnostic Techniques.” During the Seattleand Manhattan Beach tutorials, Henry provided quality EMC education toover 200 engineers.

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tions, the exhibition featured over 40 vendors of EMCproducts and services.

SeattleOn April 28, over 100 EMC engineers and professionals

converged at the Hyatt Regency Hotel in Bellevue to attenda one-day tutorial with Henry Ott. Titled “The Ten MostCommon EMC Problems and Their Solutions Plus EMCMeasurement Diagnostic Techniques”, this event was orga-nized by the Seattle Chapter to promote affordable,high-quality EMC education. Tutorial topics included PCBlayout, grouding, cabling, and shielding. The morning ses-sion of the tutorial addressed the most common EMC prob-lems and provided the designer with a check list of whatshould be considered at the beginning of a design. The after-noon session addressed simple measurement techniquesthat could be used in a lab to determine the EMC perfor-mance of a design. The objective was successful “up-front”EMC design. Attendees were treated to a full day of HenryOtt, continental breakfast, a delicious sit-down lunch and areception which featured a pasta station. In addition to thetutorial, there was a vendor tabletop display area which fea-tured the latest and greatest in EMC products and services.There was also a book signing with Henry Ott for those whopurchased his book “Noise Reduction Techniques in Elec-tronic Systems”, 2nd edition. All agreed it was a great event,thanks largely to the excellent speaker, Mr. Ott, and thesuper organizational skills of the planning committee. Nodetail was left unturned!

In May, Lee Hill from Silent Solutions in Hollis, NewHampshire visited the Pacific Northwest to speak on thetopic “Inductance, Ground Plane Gaps, and Radiated EMIin PC Boards.” Lee treated the chapter to a very profes-sional presentation which was lively and informative. Henoted that previous work in EMC literature has demon-strated that the presence of common mode current on theexternal cables of electronic equipment is often the pri-mary source of radiated EMI at frequencies above 30 MHz.To reduce radiated EMI, many engineers have imple-

mented segmented, gapped and/or narrow width groundplane geometries in multi-layer PC board designs. Lee pre-sented the results of recent research and experiments toexplore and develop a better understanding of inductance,common mode voltage, and the fundamental mechanismsresponsible for radiated EMI from PC boards....all in onehour! In closing, the effects of inductance in PC board as-semblies were demonstrated with working hardware and aspectrum analyzer.

This was the last meeting of the regular year for thechapter. New chapter officers were elected for next year(September 98 through May 99). Re-elected as Chairman,Vice-Chairman, and Secretary, respectively, were GheryPettit of Intel, Janet O’Neil of Lindgren RF Enclosures andJohn Kuras of Boeing. Kitty Tam of Northwest EMC waselected as Treasurer, replacing outgoing Treasurer TomLindgren. Tom, formerly of Boeing, moved to New Mexico tojoin BF Goodrich Aerospace. The Seattle Chapter wishesTom the best of luck with his new job! We’ll miss you!

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Lee Hill of Silent Solutions (L) was the featured speaker at the May SeattleChapter meeting. He is joined after the meeting by Ghery Pettit (center) ofIntel and Seattle Chapter Chairman, and Ed Blankenship of Hewlett-Packard (R) in Camus who represented the Portland Chapter at the meeting.

(L-R) Del Black of Del Black/McDonald Associates enjoys a yummy lunchwith Tom Lindgren of BF Goodrich Aerospace and Jim Muccioli of Chryslerat the Henry Ott event in Seattle. Note the height of the chocolate cake!

Jovial Jerry Page of Northwest EMC (center) welcomes David and AllenFischer (Left and Right) to his table top display at the Henry Ott event inSeattle.

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The Department of Defense, Joint Spec-trum Center (JSC), is currently conduct-

ing two ongoing E3 efforts. One is theDepartment of Defense/Industry Electro-magnetic Environmental Effects StandardsCommittee (DIESC) whose objective is tocompare military EMI standards with com-mercial EMI standards for the purpose ofharmonization. Considering the mandatefor military agencies to utilize as much com-mercial equipment as practical, the DIESCis developing a handbook, “Guide on the Useof Commercial EMC/EMI Standards by Mil-itary Agencies.” A draft of the handbook willsoon be circulated within DoD agencies forreview and approval. It will not be madeavailable to industry, in general, until itsformal release. However, representativesfrom industry participated in the prepara-tion of this handbook. For instance, Dr.Ralph Showers from the University of Penn-sylvania, was a representative for the Amer-ican National Standards Committee C63.Other industry organizations that were rep-resented in its preparation include the Soci-ety of Automotive Engineers, AE4Committee on Electromagnetic Compatibil-ity, Electronic Industry Association, G-46Committee on Electromagnetic Compatibil-ity, IEEE EMC Society, and NEMA. Othernon-DoD participants included NASA andthe NTIA.

The other ongoing activity involves theupdating of MIL-STD-461D/462D, with thelast meeting having been conducted in June1998. Most of the changes have been clarifi-cations, some changes in frequency rangesto harmonize with the European Union andRTCA DO-160 (FAA) requirements, andmatters of this nature. No totally new re-quirements were added nor were any spe-cific requirements deleted. However, the ap-plicability of some requirements, such asCS115 and CS116, were broadened. Addi-tionally, the use of a reverberation chamberas an alternate method for performingRS103 testing will be provided. The mostsignificant revision was the combining ofMIL-STD-461 and 462 into a singlestandalone interface document. This will ul-timately result in the cancellation ofMIL-STD-461D and 462D and the issuanceof MIL-STD-461E.

One of the topics discussed at the re-cent revision meeting of MIL-STD-461/462was the addition of ISO Guide 25 “GeneralRequirements for the Compliance of Cali-bration and Testing Laboratories.” Notice1 to MIL-STD-462 specifies ISO Guide10012-1 “Quality Assurance Requirementsfor Measuring Equipment, Part 1" whichaddresses equipment calibration. How-ever, there was some concern that test lab-oratories performing military testingshould be on a par with commercial labora-tories relative to capability and quality. Inthis regard, commercial laboratories arerequired to comply with ISO Guide 25 forFCC testing, European Commission re-quirements testing, and for certification bythe NIST NVLAP Program and the A2LAEMC Test Laboratory Accreditation Pro-gram. It was noted, on the other hand, thatMIL-STD-461 is an interface standard andthat a laboratory quality standard shouldnot be imposed in the document. This mat-ter is still under consideration.

Other Government E3 activities in-cluded an E3 meeting conducted by theArmy in Huntsville, Alabama which wasplanned for the week of August 10, 1998.This conference included three trainingseminars focusing on MIL-HDBK-237, thespectrum certification process, and the de-sign of equipment to withstand HEMP en-vironments. This conference follows thegeneral DoD E3 Conference which was con-ducted in Orlando, Florida during theweek of April 6 and the NAVAIR EMCConference which was conducted in SanDiego during the week of May 15, 1998.

It is important to note that the con-tents of this article represent the opinionsand views of the author and not that of theGovernment. I write this column to helpkeep the membership informed of DoDEMC activities (as I see them) since manyof our EMCS members are still involved inDoD EMC matters. Comments on this col-umn as well as this article are welcome. Inparticular, I would like to learn of the spe-cific interests in DoD E3 activities by ourmembership. Readers can contact me atrgoldblum@RBitem.com.

9

BOB GOLDBLUMASSOCIATE EDITOR

DoD

E3Ac

tiviti

es

NORMALIZED SITE ATTENUATION AND TESTSITE VALIDATIONW. Scott Bennett

Abstract

Free-Space AttenuationMathematical expressions for

are obtained by inverting a well-knownexpression for power transmission from oneantenna to another [1]. Then, to obtain ex-pressions for site attenuation(NSA), both antennas are assumed to haveantenna factors of 1 meter-1. That implies thatthe transmitting antenna radiates equally inall directions and the receiving antenna re-ceives equally from all directions. In otherwords, normalization eliminates any direc-tional variations in site attenuation otherthan those caused by the site itself.

If the “site” is free space, then, for thesame distance from source to receiving an-tenna NSA will always have the same value,regardless of direction. In free space, NSAwill vary only with wavelength, or fre-quency, and the distance from one antennato the other. In mathematical terms,

NSA RZ

dc=

λ

0

22 or, in decibels,

NSA RcZ

ddB =

20

0

logλ

In these expressionsc is the

(typically 50 ohms),λ is the (in

meters),0 is the

(120π ohms), andis the

(in meters).NSA has no units, because the units of

the antenna factors (meters-1) cancel thoseof λ and (meters).

In free space, radiated electric andmagnetic fields, or E-fields and H-fields,are both inversely proportional to the dis-tance from their source to their observa-tion point. In other words, if the source isuniformly directional and is that dis-tance, then the E-field and H-field magni-tudes are both proportional to 1

d. So, if

and denote those magnitudes adistance from the source, then it is easily

seen that dEEd

= 1 , and dHHd

= 1 .

Also, as a sinusoidal E-field andH-field propagate away from their source,they remain in phase and, at any distance

, E Z Hd d= 0 . Therefore, if the units of Ed

and Hd are volts/meter and amperes/me-ter, the at any dis-tance will be E H Z E Z Hd d d d= =−

01 2

02

in watts/meter2. And, as the fields propa-gate in any direction from = 1 to anygreater distance , the power density willbe by an amount equal toE HE H

EE

HH

dd d d d

1 1 12

21

2

22= = = . Thus, in free

space is the product of RZ

c λ

0

2

and

any one of those four equal quantities, re-gardless of direction.

Free-space on actual test sites is lim-ited, however, and radiated E-fields andH-fields will be reflected by objects thatlimit the free space. As a result, on actualtest sites radiated E-fields and H-fields aresums of two, or more, components. Onecomponent travels to the observa-tion point, and the others arrive there

, because of reflection. Therefore, ifEobs and Hobs are the magnitudes of the

electric and magnetic fields arriving atthe observation point on a test site, thepower density attenuation at that point

will beE H

E HE

EH

Hobs obs obs obs

1 1 12

21

2

2= = . That

says that on test site is the prod-

10

BOB ROTHENBERGASSOCIATE EDITOR

Prac

tical

Pape

rs,A

rticl

esan

dAp

plic

atio

nNo

tes

Here are two articles which shouldbe of interest to EMCS members.In the first, on open field test sitevalidation, W. Scott Bennett ex-poses errors in the ANSI C63.4definition of an ideal site for a ver-tically polarized source. (Scott isthe author of Control and Mea-surement of Unintentional Elec-tromagnetic Radiation, which wasreviewed in the Summer ‘97Newsletter.) In the second, DarylGerke and William Kimmel ofKimmel Gerke Associates tacklethe issue of grounding, with auseful “sewer” analogy.

Our intention in this section of theNewsletter is to provide EMCpractitioners with an outlet forsharing knowledge or perspec-tive gained from experience. Tipson problem finding, solving,avoiding or understanding areespecially appropriate. Opinionsand ideas are as welcome as irre-futable facts. Unlike archivalworks, such as IEEE Transac-tions or Symposium papers,Newsletter submissions will notundergo the scrutiny of multiplepeer reviews prior to publication.They may be edited for length orcontent, but only with the con-currence of the author. Readerfeedback is also welcome, eitheras a Letter (or e-mail) to the Edi-tor or directly to the author.

To submit an article for consid-eration, send it via fax, e-mail orreal mail to this Associate Editor.See page 3 for addresses andphone numbers.

uct of RZ

c λ

0

2

and any one of those three equal ratios.

Open-Field Test SitesOn an open-field test site with a highly conductive

ground plane, the ideal to be simulated is an emptyhalf-space over a perfectly-conducting horizontal groundplane of infinite extent. The only reflecting body on theideal test site is the ground plane. Therefore, the observedfields ( ) and ( ) will each be the sum of two compo-nents — one arriving directly and one arriving indirectlybecause of reflection by the ground plane.

Now, at any observation point the directions of theE-field and H-field of any radiated wave will always be per-pendicular to each other and perpendicular to the directionin which they propagate. Also, a radiated wave on anopen-field test site is said to be if itsE-field is horizontal and parallel to the ground plane. And,that wave is said to be if its E-field liesin the vertical plane that contains both the source and theobservation point. Therefore,means , andmeans .

An H-field that is reflected by an infinite per-fectly-conducting ground plane to which it is parallel has areflection coefficient of ρH = +1. In other words, just abovethe ground plane the incident and reflected H-fields of a ver-tically polarized wave will be equal in magnitude and havethe direction. On the other hand, an E-field that is re-flected by an infinite perfectly-conducting ground plane to

which it is parallel has areflection coefficient of ρE= -1 _E=-1. That meansthat just above the groundplane the incident and re-flected E-fields of a hori-zontally polarized wavewill be equal in magni-tude withdirections.

Therefore, with a ver-tically polarized sourceon the ideal open-fieldtest site, the radiatedH-field arriving at anyobservation point willhave two collinear hori-zontal components. How-ever, whether those com-ponents have the same oropposite directions willdepend on the differencein the distances theyhave traveled. As shownin Fig. 1, the distance

traveled by the direct wave is d h a s= + −2 2( ) , and the dis-

tance traveled by the reflected wave is r h a s= + +2 2( ) . Inthese expressions is the , is the

is the(the observation point). And, since is always greater than0, is always greater than .

Suppose the H-field arriving at the observation

point a distance from the source isH tHd

td ( ) cos( )= 1 ω . Then,

the H-field arriving at that point after traveling

the distance will beH tHr

t r d cr H( ) cos( ( ( / ))= − −ρ ω1 because

of the difference in propagation times ( - . (The divisor= 3 × 108 meters/second is the and also thatof the H-field and E-field.) And, because H ( ) and ( )have either the same or opposite directions, theH-field at the observation point, H ( ), will be their sum.

So, with vertical polarization on the ideal open-fieldtest site, and noting that ω π π

λcf

c= =2 2 , it is seen that

[ ]H tHrd

r t d t r dobs H( ) cos( ) cos( ( ) / )= + − −1 2ω ρ ω π λ

And, from basic trigonometry it follows that the magni-tude of H ( ) is

HHrd

r rd r d dobs H= + − +1 2 22 2ρ π λcos( ( ) / )

Thus, since ρH = +1, the power density attenuation fromsource to receiving antenna will be

11

Figure 1. Open-field test site measurement geometry

HH

rdr rd r d dobs

12

2 2 2

2

2 2=

+ − +

cos( ( ) / )π λ

and multiplying that by RZ

c λ

0

2

yields .

Therefore, with on the open-fieldtest site

NSA RZ

rdr rd r d d

dBc=

+ − +

20

2 202 2

logcos( ( ) / )

λ

π λ

Now suppose the polarization is horizontal. Then, inthe preceding equations is replaced with and, since ρ= -1, it follows that the power density attenuation fromsource to receiving antenna will be

EE

rdr rd r d dobs

12

2 2 2

2

2 2=

− − +

cos( ( ) / )π λ

Therefore, with on the idealopen-field test site

NSA RZ

rdr rd r d d

dBc=

− − +

20

2 202 2

logcos( ( ) / )

λ

π λ

In other words, expressions for NSA differ for verti-cal and horizontal polarization only in the sign of the co-

sine term. And, that difference results because ρ = +1 andρ = -1.

Comparative Values of NSAIn measuring NSA, the value recorded for each

source height and frequency is the minimum value ob-tained over a specified range of receiving antennaheights. In calculating those values for NSA with theabove equation for , there is com-plete agreement with the values given in ANSI C63.4 [2],for all frequencies and geometries. However, the valuesobtained with the above equation for NSA with

polarization do not agree with the values given inthat standard. For a measurement distance of 10 meters,source heights of 1.0, 1.5 and 2.75 meters, and verticalpolarization, the values for NSA in ANSI C63.4 are toohigh by the amounts shown in Fig. 2. For a measurementdistance of 30 meters and vertical polarization, the val-ues of NSA given in ANSI C63.4 all appear to be only0.1 dB higher than they should be.

Therefore, to accurately determine how well a given10-meter open-field test site simulates the ideal with

polarization, measured values of NSA can be com-pared to the values given in ANSI C63.4. However, with

polarization, to make that deter-mination with the same accuracy, mea-sured values of NSA should be com-pared to values given in ANSI C63.4 afterthey have been reduced by the amountsgiven in Fig. 2. For additional measure-ment geometries, the required value ofNSA can be accurately determined foreither polarization using the equationsgiven above.

References[1] Friis, H. T., “A note on a simple transmis-sion formula”, , vol. 34,pp.254-256, May 1946.

[2] ANSI C63.4-1992, “Methods of Measure-ment of Radio-Noise Emissions fromLow-Voltage Electrical and Electronic Equip-ment in the Range of 9 kHz to 40 GHz.”

Scott Bennett isan EMC consul-tant, and can bereached at 7093East CountyRoad 74, Carr,CO 80612 (Tel:970-897-2764).

12

Figure 2. Positive error in values of NSAdB given in ANSI C63.4 for the 10-meter measurement dis-tance with vertical polarization.

The Mysteries of Grounding...Daryl Gerke, PE, and William Kimmel, PEKimmel Gerke Associates, Ltd.

Grounding is one of the most important, yet least under-stood, aspects of electrical engineering. As EMC engi-

neers, most of us have seen grounding as a majorcontributor to EMC problems at both the systems andequipment levels. Entire books have been written on thesubject, so this article will be but a brief attempt to high-light some key concepts on grounding. We’ll do this by ask-ing several simple questions.

Ask an electronic design engi-neer, and you will get a different answer from a power engi-neer. Ask someone dealing with ESD, and you may get an-other answer. That’s part of the problem — the term is oftenvague, ambiguous, and context dependent.

The answer we like is that a ground is simply a “returnpath for current.” That path may be intended, or it may beunintended. Electrons don’t care, as they can’t read sche-matics anyway. Just remember that electrons “always re-turn to their source”.

One answer we don’t particularly like for EMC issues isthe classical “equipotential reference” definition. Anytimewe have a finite current flowing in a finite impedance, wemust have a finite voltage difference. (Yes, Ohm’s Law re-ally works.) If the voltage difference is small, perhaps wecan ignore it, and use the “equipotential” approximation.But often times the non-equipotential reality is whatcauses EMC problems.

We have a favorite analogy for grounds — the “seweranalogy”. Consider a ground as a path for “used electrons” ifyou like, and remember, it’s a path, not a cesspool. To ex-pand the analogy, what is a desirable attribute of a sewer?Low impedance to flow. Is it acceptable to have more thanone sewer? Sure, such as separate sanitary sewers andstorm sewers (like separate “analog” and “digital” grounds.)Separation prevents unwanted mixing of sewage (or cur-rents) that might otherwise share a common path.

Grounds are used for many reason,including power, safety, lightning, EMI, and ESD. Some-times one ground may perform several functions — in-tended or unintended. This is why grounding can be such asticky issue.

Grounding requirements may vary widely due to vastlydifferent amplitudes and frequencies. The latter is a key is-sue, since ground impedance is often highly frequency de-pendent. For example, round wire inductance become an is-sue above about 10 kHz, which necessitates lowerinductance ground planes, grids, or bond straps at higherfrequencies. Transmission line effects also become an issuewhen ground dimensions become significant. A commonEMC rule of thumb for these effects is physical distancesgreater than 1/20 wavelength — about 250 km for 60 Hz,but only about 15 cm at 100 MHz. As a result, specific

grounding techniques may vary widely. A general purposeground may not solve a specific problem at all. Let’s look atseveral of these areas.

— In power systems, this is often re-ferred to as the “neutral”. This conductor carries currentback to the sources, such as a transformer, service panel, orbattery. This type of ground may carry large currents(many amps) but needs only to work at relatively low fre-quencies (50/60 Hz or DC). As a result, the constraints areresistance and current carrying capability.

— In power systems, this is the conduitor the “green wire”. Unlike the neutral, this conductor isonly supposed to carry current during a fault condition,such as a short circuit to a metal cabinet. Like the neutral,it must carry large currents at low frequencies, but only fora relatively short time.

— This type of ground provides acontrolled connection to the earth for lightning currents tofollow. A lightning ground must carry huge currents (up-wards of 200,000 amps) but only for a fraction of a second.Due to the transient nature of lightning, the frequency con-tent is in the 300 kHz to 1 MHz range. The constraints forlightning grounds are inductance and peak currents. Thisrequires solid connections with a minimum of bends.

— For “noise” control, an EMI groundmust often work over a very wide frequency range. At thesame time, currents are often small (microamps ormilliamps). Thus, low inductance paths with low induc-tance/resistance connections are often needed.

— This is a special case of an EMI ground.A human body discharge can result in tens of amps, butonly for nanoseconds. Due to the very fast rise times, ESDfrequency content is in the 300 MHz range. Thus, low in-ductance grounds are mandatory for ESD. Sometimes weuse “resistive” or “soft” grounds to limit the ESD current aswell.

In simple terms, it de-pends on the threat frequency. For low frequency threats,such as stray 60 Hz power currents, theis preferred. This prevents “ground loops”, which can letunwanted noise currents mix with intended signal currentsin a common path. The strategy is to steer currents withcareful wiring practices.

For high frequency threats (RF, or even power linetransients), the is preferred. Aboveabout 10 kHz, parasitic inductance and parasitic capaci-tance allow noise currents to follow alternate paths, so thesingle point ground becomes difficult, if not impossible, toimplement. In addition, transmission line effects becomean issue, also mandating multiple connections. Further-more, to lower the inductance, planes and grids are needed.

The single-point/multi-point guidelines extend to cableshield grounding as well. For low frequencies, the preferred

13

approach is to ground cable shields at one end, while forhigh frequencies, the preferred approach is to ground cableshields at both ends.

For systems facing a combination of high frequencyand low frequency threats, may be needed.Capacitors can be used to provide multiple “high fre-quency” connections, and inductors can be used to isolate“high frequency” paths. Once again, these techniques ap-ply to cable shield grounding. For example, we’ve solvednumerous transient (high frequency) problems in instru-mentation systems that traditionally use single-point (lowfrequency) techniques, by simply adding a small high fre-quency capacitor to the open end of a cable shield.

An earth connection isreally only needed for lightning, but by convention it iswidely used for power line safety as well. But you don’tneed an “earth” ground for many situations. For example,an airframe can be used as a ground (return path for cur-rent flow), but you don’t see many 747s flying across thecountry dragging an earth ground cable with them. A com-mon misunderstanding we often see is the urge to “drivemore ground rods” to lower ground impedance. While this

may help if your primary concern is lightning, usually it in-dicates a desperate approach that fails to address the realground problems in the system.

One final comment. Safety issues must always takeprecedence over any other grounding needs. Before mak-ing any grounding changes, always be sure the system re-mains safe.

Daryl Gerke, PE, and William Kimmel, PE, may be contacted atKimmel Gerke Associates, Ltd. at 1-888-EMI-GURU (Toll Free),or at their web site at http://www.emiguru.com.

14

William Kimmel, PEDaryl Gerke, PE

IEEE AND ABET SEEK PROGRAM EVALUATORS TO ENSUREQUALITY OF ENGINEERING PROGRAMS

PISCATAWAY, NJ, June 18, 1998 — The IEEE Educational Activities Board is now accepting applications forprogram evaluators for engineering and engineering technology programs at U.S. colleges and universities.The application deadline is October 30, 1998. Candidates sought are engineering professionals from indus-trial, government and academic sectors.

The goal of prospective evaluators is to assess the quality of engineering education. Selected applicants at-tend a one-day training session, sponsored by the IEEE, that explains the IEEE/ABET accreditation process.Following training, evaluators are prepared to assist with program evaluations that take place each fall andgenerally run for two to three days.

Nomination packages are available from: Accreditation Administrator, IEEE Educational Activities, 445 HoesLane, Piscataway, NJ, USA 08855-1331; tel:732.562.5484; e-mail: “accreditation@ieee.org” or via theWorld Wide Web; for engineering:

Http://www.ieee.org/eab/accredit/eval1.html;for engineering technology:

http://www.ieee.org/eab/accredit/eval2.html

In this book review, we address an intro-ductory EMC book written for the under-

graduate level of teaching. This book hasbeen well researched and well written bythe author. The material of the book seemsto have originated from many technical pa-pers published by the EMC community overthe last 15 years (I recognize much of thismaterial). The author has done a good job incompiling all this material together in a con-cise and understandable manner. The bookis made up of 13 chapters and 4 appendicesand covers the fundamentals of a seniorlevel EMC engineering course.

Chapter 1 is introductory in nature andoutlines some of the early history of EMC asan art and science from the pre-W.W.II erato today’s modern standards. The chapteralso describes some basic definitions andprovides some examples of practical experi-ences concerning EMI situations such ashigh voltage transmission lines,switches/relays, biological effects, aircraftnavigation, etc. Some discussion concerningthe present and future demands of fre-quency spectrum and the EMI implicationsare also discussed. Chapter 2 addressessome natural and quasi-natural sources ofEMI; specifically, the work is dedicated tolightning, electrostatic discharge (ESD),and electromagnetic pulse. Each of thesesubjects are introduced briefly but with suf-ficient detail for a good conceptual under-standing. It includes also some models rep-resenting the effect of the phenomena.

Chapter 3 provides a description of sev-eral sources of electromagnetic noise in elec-trical, electromechanical, and electronic ap-paratus. The electromagnetic noiseaccounted for is the one originated withinthese apparatus. Among the noise sourcesdescribed are: systems (e.g. radar, aircraft,communications systems, mobile transmit-ters, power lines), relays and switches, in-cluding those in telephone equipment, andnonlinear sources such as rectifiers, mixer,logic in digital circuits. Simple noise modelsfor amplifiers and modulation techniques areintroduced. The chapter next explores thewell-known subject of interference couplingthrough crosstalk for multi-conductor lines.Finally, the chapter ends with an introduc-tion on the subject of field to wire coupling.

Chapter 4 follows an alternate approachin describing electromagnetic interferenceusing analytical macromodels of statistical

nature when EMI is assumed not to be of adeterministic nature but instead randomand non-Gaussian. In such an approach,EMI is expressed as a function of randomvariables or stochastic variables. Analyti-cal models that are based on statisticalphysical information combine the physicaland statistical description of general EMI.

Chapters 5 through 7 are dedicated toEMI measurements. Actually, in this re-viewer’s opinion, these are the best chap-ters in the book where the subject of mea-surements is well discussed. Chapter 5addresses open area test site (OATS) mea-surements for radiated emissions and ra-diated susceptibility. Several important is-sues related to OATS are discussed, suchas: a) the type of test antennas, b) mea-surement considerations such as the elec-tromagnetic environment, scatterers andpower cable connections, c) the shape andproper sizes of OATS, d) measurement con-figurations (the stationary EUT vs the sta-tionary antenna), and e) terrain rough-ness. The chapter then addresses the veryimportant subject of OATS and normalizedsite attenuation measurements (for farzone electric field). Using calculations ofthe maximum electric field possible in thepresence of a conducting plane, the hori-zontal half-wavelength dipole, the verticalhalf-wavelength dipole, and a general an-tenna electric field expressions are calcu-lated. Several sections are also dedicatedto the concept of site attenuation, mea-surement test site imperfections and an-tenna factor measurements. Chapter 6covers the material of radiated emissionmeasurements using other facilities be-sides OATS. Among the facilities discussedare the anechoic chamber, the TEM cell,the reverberating chamber and the GTEMcell. For each of these testing facilities, thechapter describes the physical fundamen-tals of such facilities and how measure-ments are usually performed in them. Thechapter ends with a brief comparisonamong the testing facilities. Chapter 7,which is the last of the measurement chap-ters, addresses the subject of conducted in-terference measurements. Among the sub-jects discussed are: a) electrical transientsand other disturbances carried by electri-cal power supply lines, their characteriza-tion, and approaches to measurements, b)procedures for the measurements of con-

15

RAY PEREZASSOCIATE EDITOR

Book

Revi

ew

EngineeringElectromagneticCompatibility: Principles,Measurements, andTechnologiesbyV.Prosad KodaliPublisher: IEEE Press

ducted EMI (power line or signal line) originating from theoperation of electronic equipment, and c) procedures fordetermining the immunity of equipment under test to con-ducted interferences. It is this chapter where the conceptsof differential mode and common mode currents are dis-cussed and how to perform such measurements.

In Chapter 8 the book addresses the concept of interfer-ence due to pulse interference or interference caused bypulses or transients. There are three types of pulses coveredin the chapter: electrostatic discharge, fast electrical tran-sients/burst, and electrical surges. Most of the chapter isdedicated to ESD and it includes the physics of ESD and theproper way of doing ESD testing (there is also a section onthe usage of ESD testing hardware). Test set ups include ta-ble-top apparatus, standing equipment, and in-situ. Electri-cal fast transients are generated when inductive, capacitivecircuits are interrupted from inductive loads such as relays,coils, timers, motors, or contactors that generate arcs of dif-ferent kinds. Test beds for electrical fast transient immu-nity and some physical examples of burst generators arediscussed. The chapter ends with a discussion of high volt-age surge testing per IEEE standards.

Chapter 9 addresses the subjects of grounding, shield-ing, and bonding that are usually the most popular subjectswithin EMC. As in other EMC books, the subjects are wellcovered with the help of the many good papers in this areathat have been written over the last 20 years. Among thetopics covered are: earthing of facilities and other systems(including the concept of earth impedance, single rod elec-trons, multiple rods, and measurement of ground noise re-sistance), single point/multi-point grounding, cable shieldgrounding, shielding and shielding effectiveness (theory ofsingle and multiple shields), shielding materials, disconti-nuities and apertures in shields, cable shields, measure-ments of shielding effectiveness and an introduction tobonding issues.

Common mode filters are discussed in Chapter 10. Con-ventional filter analysis and design is a well-established sci-ence except that all this work assumes that the filter isideal. This chapter covers mainly power line filters. Imped-

ance mismatch effects are considered (i.e when load andsource impedances are different). Lumped element low-passfilter types are considered such as capacitor filter, inductorfilter, LC filter, the pi and T filter, lossy lines, and active fil-ter. High pass/low pass filters and band reject filters arealso considered briefly. The chapter ends with the subject ofpower line filter design for common mode and differentialmode current suppression.

Chapter 11 addresses the importance of proper ca-ble selection in achieving electromagnetic compatibilityand minimizing interference. Among the topics dis-cussed are absorptive cables (such as the single braid,double braid, foil, and their application depending uponthe frequency and shielding effectiveness desired). Rib-bon type cables are also discussed. The role of connec-tors in shielding effectiveness is discussed such aspig-tail effects, connector shielding and the “rusty bolteffect”. Together with connectors, EMC gaskets and thedifferent kinds of gaskets most commonly used in theindustry are reviewed. A couple of more items discussedin this chapter are the isolation transformer, whichsuppresses common mode and differential mode inter-ference, and optical isolators to greatly reduce electro-magnetic interference in signal transmission lines. Thechapter ends with a brief discussion of transient sup-pression devices (gas discharged tubes) and semicon-ductor devices (varistors and zener diodes).

In Chapter 12, the concept of frequency assignmentand spectrum conservation are discussed. Frequency allo-cation is important in order to make the several radio ser-vices function in a compatible manner without electromag-netic interference among each other. The increasingdemands on the frequency spectrum necessitates the de-velopment of methods and frequency assignments for spec-trum efficiency. The chapter outlines the principles of fre-quency assignment and proper spectrum usage. The finalchapter, or Chapter 13, briefly covers EMC standards mostfamiliar to the EMC community.

In summary, the book is well written and can be rec-ommended as an introductory EMC book.

16

NEW “BEST STUDENT PAPER” CONTEST!CASH PRIZE – WIN BIG BUCKS & TRAVEL ALLOWANCE TO

ATTEND 1999 EMC SYMPOSIUM!The IEEE 1999 International EMC Society Symposium in Seattle, Washington is hold-ing a student paper contest. Abstracts from undergraduate or graduate students(where the student is the primary author) are due by October 19, 1998. Watch for fur-ther details in the official "Call for Papers" mailed to EMC Society membership, or con-tact Dave Walen, Technical Program Chairman, phone 425.227.1156, e-mail:dave.walen@ faa.dot.gov for more information.

Penny Caran, born in May of 1948, grad-uated from the College of William and

Mary in 1969, and began her working ca-reer working for then Governor of NewYork State, Nelson A. Rockefeller. UponGovernor Rockefeller’s retirement as Gov-ernor, she went on to become Deputy Di-rector, Washington D. C. Office for theCommonwealth of Massachusetts. In theensuing years, she continued in the politi-cal, government service arena, marriedand had two children.

After returning to Warrenton, Virginiawhere she was raised, Penny first heard theterm “EMC” in February of 1982, when shejoined the consulting firm, known as DonWhite Consultants Inc., in Gainesville, Vir-ginia. Employed as Assistant Marketing Di-rector, Penny worked for the organizationuntil 1987. During the six years with DonWhite Consultants, the company expandedits consulting and training services to in-clude offices in Western Europe, Japan, andAustralia.

She advanced to Sales Director and wasresponsible for managing the Sales Depart-ment and supporting the International Rep-resentative Offices. While advancing herknowledge and experience with Don WhiteConsultants in the 80’s, she actively partici-pated in the EMC business expansion.

The huge growth in the EMC businessmarket spurred the company to change itsname to Interference Control Technologies,Inc. (ICT), start a quarterly technical tradejournal, called EMC Technology, launch anew annual EMC Symposium, and continuepublishing an expanded library of its techni-cal books. In 1983 when the FCC imple-mented its new Part 15J rules, the demandfor EMC consultants, training courses, andregulatory information was huge. Little didshe know that this huge EMC growth phe-nomenon would be repeated fifteen yearslater. In 1987, Penny left ICT and went on toother pursuits.

In 1990, she was contacted by a formerICT business associate and adjunct instruc-tor, Martin Green, who in 1987 had estab-lished his own company located in theUnited Kingdom. Because of the coming Eu-ropean Union single internal marketchanges on the horizon, particularly thepending impact of the EU Directive onEMC, Mr. Green was very interested in de-veloping a North American business subsid-

iary. As Mr. Green’s company was on theadvance list of “to be appointed” regulatorybodies known as “competent bodies” for theEMC Directive, he wished to develop earlymarket access to North American compa-nies who might wish to have technical sup-port and assistance to meet the CE Mark-ing requirements of the EMC Directive.

Calling on long time business associ-ates, Penny began to develop a marketingand sales plan to start a North Americanbusiness subsidiary. Today Technology In-ternational Inc., headquartered in Rich-mond, Virginia has offices in Dallas, Texasand Sunnyvale, California and serves thebroad industrial and commercial market ofmanufacturers. Today Technology Inter-national (Europe) Ltd., the parent com-pany, provides the legal certification sup-port for not only the EMC Directive butalso for the Low Voltage Directive and Ma-chinery Safety Directives.

Although Penny says she is not offi-cially an EMC Engineer, and she is not, shedoes participate actively in IEEE activities,and is a member of the Northern VirginiaChapter of the EMC Society. “Haven’tmissed an annual IEEE EMC Symposiumin many years”, she says, and attributes hersuccess in developing Technology Interna-tional to the excellent business relation-ships and personal friendships she has de-veloped over the years of working in theEMC community. “The International EMCSociety is a small group of hard working

17

DR. WILLIAM G. DUFFASSOCIATE EDITOR

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people who all know each other. I certainly don’t know all ofthe members, but to those I do, I owe some measure ofthanks for their support and assistance over the years. ”

She was the 1997 Program Co-Chairman of the FirstAnnual EMC Harmonization Conference sponsored by theNorthern Virginia Chapter of the IEEE EMC Society. Asthe 1998 Conference Chairman of the Second Annual EMCHarmonization Conference sponsored by the IEEE sec-tions (including the National Capital Area Council, theWashington Section, the Northern Virginia Section, andthe Washington and Northern Virginia Chapter of theElectromagnetic Compatibility Society), she activelyworked with the other committee members to put togetheran excellent technical program with the theme of “Gettingthe Job Done”.

Penny lives in Richmond, Virginia. Her two sons areboth full time college students. Chris (22) is completinghis Masters Degree in Public Administration at NorthCarolina State University in Raleigh, North Carolina.David (20) is a rising Junior at Virginia Tech inBlacksburg, Virginia and is pursuing a degree in techni-cal theater production.

Penny is president of a local investment club, a mem-ber of the Board of Directors of the Virginia Biotechnol-ogy Association, a member of the EMC Society, AAMIand several other business associations. She is also ac-tive in local community groups. She enjoys reading, sail-ing, music and scuba diving.

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INTERESTING WEB SITES(Do you know of other non-commercial websites which may be of interest to EMC Society members? If so, please contact the Editor.)

Sites at the National Institute of Standards and Technology(NIST)National Institute of Standards and Technology (NIST)

http://www.nist.gov/National Voluntary Laboratory Accreditation Program(NVLAP)

http://ts.nist.gov/nvlapNIST Office of Weights and Measures (OWM) also NationalConference on Weights and Measures (NCWM)

http://ts.nist.gov/ts/htdocs/230/235/owmhome.htmOffice of Standards Services (OSS)

http://ts.nist.gov/ossGlobal Standards Program (GSP)

http://ts.nist.gov/gspInternational Organization of Legal Metrology (OIML)

http://ts.nist.gov/ts/htdocs/210/215/oiml-fxs.htm

Sites Around the WorldInternational Laboratory Accreditation Co-operation (ILAC)

http://www.ilac.org/

Asia Pacific Laboratory Accreditation Cooperation(APLAC)

http://www.ianz.govt.nz/aplac.htmAsia-Pacific Economic Cooperation (APEC)

http://www.apecsec.org.sg/Interamerican Accreditation Cooperation (IAAC)

http://www.ibpinetsp.com.br/iaac/International Organization for Standardization (ISO)

http://www.iso.ch/International Bureau of Weights and Measures (BIPM)

http://www.health.gov.au/hfs/arl/irs_tm.htmNational Conference of Standards Laboratories (NCSL)

http://www.ncsl-hq.org/

Sources of PublicationsNIST publications on standards and conformityassessment activities

http: //ts.nist.gov/ts/htdocs/210/217/osc.htmISO Quality Management Standardization

http://ts.nist.gov/ts/htdocs/210/216/iso9OOO.htm

EMCS Board of Directors ActivitiesBy Janet O’Neil, Secretary of the Board

President Dan Hoolihan called the meeting to orderat 8:00 am. A round of introductions was made. Board

members in attendance included President Hoolihan, Trea-surer Warren Kesselman, Secretary Janet O’Neil and Direc-tors Franz Gisin, Don Heirman, Bob Hofmann, JimMuccioli, Joe Butler, Andy Drozd, Herb Zajac, HenryBenitez, Todd Hubing, Mark Montrose, Henry Ott, DonSweeney, Kimball Williams and Takeo Yoshino. AbsentBoard members included Bill Gjertson, Bill McGinnis, NormViolette, Ferdy Mayer and Andrew Podgorski. Mr. Hoolihanwelcomed the guests in attendance, including past Boardmembers Don Weber and Walt McKerchar, as well as BarryWallen, Chairman of the 1998 IEEE EMC Symposium inDenver. Members of the 1999 IEEE EMC Symposium in Se-attle organizing committee, Bill Price, John Kuras, and Di-ane Heidlebaugh, were also welcomed as guests. The agendafor the meeting was presented and approved.

President Hoolihan presented the minutes from the No-vember 8, 1997 meeting on behalf of Secretary Janet O’Neil.The minutes were approved with minor amendments.

Treasurer Warren Kesselman presented his report.He noted that the IEEE’s 1997 post-closing pre-audit finan-cial report for the EMC Society projects a 1997 operating sur-plus of $99,400. This surplus is largely due to investment/in-terest income as well as the partial surplus from the 1997symposium. The Society’s net worth at December 31, 1997 is$681,070. This represents approximately $100,000 in growthover the year, which again is primarily due to increases in in-vestment/interest income.

Todd Hubing,Vice-President for Member Ser-vices, presented his report. The Board voted upon theawards that will be presented during the Awards Luncheonat the Denver symposium. Regarding chapter activity, RayAdams is in the process of updating the Chapter Officer’sHandbook. He has also contacted the Chapter Chairmen re-garding the Angel fund policy. Bill Duff reported that therewere seven candidates from the EMC Society for the Fellowaward this year. This is a significant number for the Soci-ety. Scott Roleson, Chairman of the Distinguished LecturerProgram, is looking at the possibility of adding one or twoDistinguished Lecturers (DL) who will lecture primarily inEurope and Asia. The program is attempting to address theneed for a global program to reflect our international mem-bership. Regarding Professional Activities (PACE), Al Millsis organizing a session on professional activities at the 1999Seattle EMC Symposium. Ferdy Mayer will represent theEMC Society and run the IEEE EMC Society membershipbooth at the Wroclaw Symposium in June. Dick Ford pre-sented a summary of the data taken from the surveys re-ceived from the Austin symposium. Mr. Hubing concludedhis report by noting that EMC Society membership is cur-

rently at 5,605 members, an increase from the 5,243 mem-bers in November 1997.

Len Carlson, Vice-President for CommunicationServices, presented his report. Newsletter Editor JanetO’Neil reported that good articles are now regularly sub-mitted for the practical papers column. The goal is to fea-ture a minimum of two practical papers or commentarytype articles with each issue. Costs for using cover colorphotos turned out to be higher than estimated so the coverphotos will be black and white. The Newsletter is now avail-able on the Society’s web page in the html format. An in-crease in next year’s budget for the Newsletter will be re-quested so that the page count can regularly be at 32 or 36pages to accommodate the increase in material submitted.Regarding the proposed creation of an EMC Society Maga-zine, Mr. Carlson discussed his research with the IEEEabout this topic. The IEEE discouraged the EMC Societyfrom starting a magazine at this time since the member-ship number is low relative to other Societies that havemagazines. Thus, the current plan is to delay the develop-ment of an EMC Society magazine and rather “beef up” theexisting Newsletter to include a minimum of three practicalpapers or commentary type articles per issue. TransactionsEditor Moto Kanda reports that he has been assigned a newSenior Editor at the IEEE for the Transactions on EMC.This is Helene Dortheimer. A special August issue on light-ning is currently being prepared with 15 papers.

Henry Ott, Chairman of the Symposia and ConferencesCommittee, reported that the 1996 Santa Clara Sympo-sium is ready to close its books now that the final audit hastaken place. The IEEE is currently auditing the financialbooks of the 1997 Austin Symposium. The 1998 DenverSymposium is running smoothly. The 1999 Seattle Sympo-

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(L-R) Janet O’Neil, Dan Doolihan, and Diane Heidlebaugh pause in front ofthe Westin Hotel, headquarters hotel for the IEEE 1999 International EMCSociety Symposium in Seattle. Diane is in charge of arrangements for thesymposium organizing committee.

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sium has successfully resolved the problem of not havingenough booth space by moving the exhibits from theWestin Hotel to the Seattle Convention Center. The com-mittee is investigating having the IEEE Travel and Con-ference Management Services (ITCMS) group handle partof or the entire symposium operations. Lastly, HughDenny reports that the revised edition of the EMC SocietySymposium Manual is ready and will be distributed to allfuture EMC Society Symposia chairmen. Regarding theHistory Committee, Chet Smith reports that sales of theCD-ROM discs have been steady since the August sympo-sium in Austin. However, more publicity is required tomove inventory. Mr. Smith would like to advertise sales ofthe CD-ROM discs in the IEEE’s Spectrum Magazine.Also, chapters are encouraged to sell the CD-ROMS fromthe IEEE booth, if possible, during tabletop shows and/orone-day technical events. Sales of the CD-ROMs at inter-national EMC symposia are being considered as well.

Kimball Williams, Vice-President for TechnicalServices, presented his report. Mr. Williams first reportedas outgoing Chairman of the Education Committee. MikeBoguzs, chair of the Student Activities subcommittee, is ac-tively fostering the involvement of students in EMC technol-ogy. This includes promoting/advertising the President’sscholarship as well as the student paper contest. Andy Drozdand Larry Cohen, co-chairs of the Demonstrations subcommit-tee, report that they have secured a large open area immedi-ately outside the exhibit hall for the demonstrations in Den-ver. The demonstrations are being treated as a special papersession, but with hardware. Jim Drewniak, chair of the Exper-iments Manual, Volume II subcommittee, reports that thecommittee activity is currently at a standstill. Attempts arebeing made to reactivate the committee work. VichateUngvichian, chair of the Standards Education subcommittee,reports that they are considering holding a “standards work-shop” during the Seattle symposium in 1999 which will pro-vide an introduction to the standards process as well as anoverview of the standards community. They are coordinatingwith SAC on this effort. Dick Ford, chair of Video Productions,reports that the committee is continually updating the demon-strations video from Santa Clara with material from each suc-ceeding symposium added where appropriate. The productionof a standards overview education video is being considered.The NARTE video is still being evaluated. If suitable, thevideo may be used to help prepare NARTE certification appli-cants for all NARTE examinations. IEEE EAB has requestedthe creation of a video on EMC geared towards high schoolteachers. Lastly, a member of the EMC Society has offered tooverdub the current EMC Society video in Spanish. This is be-ing considered in conjunction with a membership drive inSpain and South America. John Howard, chair of the Univer-sity Grant subcommittee, reports that advertising for thegrants has been sent out via e-mail this year. Last year’saward was presented to Dr. McGill at the meeting of the IEEEStudent Chapter at Northern Illinois University on March 19,1998. Maqsood Mohd, chair of the Tutorials subcommittee, re-

ports that planning forthe Denver symposiumis complete with an ex-pected 400 attendees.Jim Whalen, chair ofthe NARTE subcom-mittee, reports that theexam preparationworkshop will be heldonce again in Denverand that the actualexam will also takeplace. 40 students areexpected to take theNARTE exam. KimballWilliams, chair of LifeLong Learning, reportsthat several activitiesare being organized toprepare and assist re-tired engineers to act asmentors and tutors for students. Also, a pre-college committeeis under consideration to prepare students for careers in sci-ence and engineering.

Other Education Committee related items include aTC-2 workshop in Denver on measurements and a TC-8workshop on product safety and the low voltage directive.

Mr. Williams distributed Andrew Podgorski’s reporton the Technical Committees. This provides a summary ofthe chairmen and charters of the nine technical commit-tees. Regarding the Denver symposium, some 240 paperswere received and reviewed. The largest number of papers(79) were related to TC-2 “Electromagnetic CompatibilityMeasurements”. 72 papers were related to TC-4 “Electro-magnetic Interference Control”. TAC activities in progressinclude posting the TAC Policy and Procedures Handbookon the EMC-S website and regular submission of articlesfor publication in the EMC-S Newsletter.

Mr. Williams distributed the report of Leo Makowski,Chairman of the Representative Advisory Committee(RAC). He advised that Mr. Makowski resigned as chair-man of the RAC. Mr. Makowski recommends committeemember David Case as the new RAC chairman. The Boardaccepted Mr. Makowski’s letter of resignation and his rec-ommended replacement. Mr. Williams commended Mr.Makowski’s years of service as chairman of this importantcommittee. The 10-page RAC report included informationon several liaison committees, some of which are discussedherein. EMC-S representative Dan Hoolihan reports thatCOMAR is developing a new position statement on the pos-sible health effects that might result from cellular phoneuse. The Technical Information Statement (TIS) on “RadioFrequency Interference with Medical Devices” written byHoward Bassen et al. will appear in the EMB magazineMay/June 1998. There are several TIS’s under review byCOMAR this year. A list of TIS titles was distributed. Len

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EMC Society Board member Takeo Yoshinopersonally invited the Board to attend EMC‘99 Tokyo from May 17-21, 1999. He pro-vided an overview presentation on the con-ference to the Board.

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Carlson, EMC-S representative to the IEEE Technology Pol-icy Council Committee Aerospace R&D reports that the Soci-ety needs to be aware of any legislation impacting EMC inorder to provide the appropriate technical expertise. TheRAC committee to the USAB R&D Policy Council is develop-ing a metric for evaluating the quality of research done byFederal Research Laboratories, according to representativeDick Ford. Dave Imeson, representative to the Association ofCompetent Bodies (ACB), advised that the ACB is in the pro-cess of transforming itself into the ECACB which meansthat it will operate with assistance from the European Com-mission. Assistance includes the administrative and techni-cal secretariat. Don Heirman, representative to ANSI ASCC63, reports that final ballot preparation is under way forC63.4, including a modification to add such items as TEMdevices. Application/geometry specific antenna calibrationsare under review as they apply to qualifying semi-anechoicchambers. EMC-S representative to CISPR B, Dan Hoolihanreports that the committee is discussing a number of topicsincluding alternative test sites, labeling, test equipment,measurement at closer distances than specified, RF welding,limits in the 1-18 GHz range, microwave lighting devices, re-laxation of limits for Group 2 Class A equipment from470-1000 MHz, medical devices, and the 61.25 GHz ISMband. The 61.25 GHz issue is that the communications in-dustry would like to use the bandwidth but the industrialcommunity does not want to give it up because it is a uniquearea of the spectrum where oxygen is a significant absorberof energy. The EMC-S representative to the Radio TechnicalCommission for Aeronautics (RTCA) is Erik Borgstrom. Mr.Borgstrom reports that the committee is working on the ex-pected Change Notice 1 to DO-160D which will be a completerevision of Section 20, RF Susceptibility (Radiated and Con-ducted). The two major changes involve the more thanten-fold increase in the maximum radiated susceptibilitytest level, to a test level of 7200 volts/meter. Also, themode-stirred chamber test method will be revised com-pletely to bring it up to date to “state-of-the-art” and in linewith international standards under development. RAC ischairing a special session during the Denver symposium.This features speakers Elena Santiago from the EU DGIIIand Mary Saunders from the NIST Office of Standard Ser-vice. RAC will be represented by Dave Case and DaveImeson who will co-host the session.

Vice-President for Standards, Don Heirman, pre-sented his report. This included a two page copy of theApril 26, 1998 Standards Status Report and a roster of theSCOM membership and working group chairs. Briefly, Stan-dards 139, 140, 187, 377, 473, 1140 and 1309 are currentwith no working group activity. Standards 213 and 376 havereached four years since reconfirmation. Standard 213 needsto be revised to update LISN requirements of FCC Part 15that should begin in 1999. A reconfirmation ballot will be cir-culated by October 1, 1998. PAR 482-1992 was cancelled.Mr. Hoeft submitted a working group report and a new PARthat needs some minor work. PAR 1128 had a passing ballot

and negative comments completed re-circulation to the bal-loting group. The SCOM secretary received an extensionuntil the December 1998 IEEE Standards Board meeting.Mr. Heirman also circulated a copy of an article by Donald C.Loughry of Hewlett-Packard titled “The IEEE-SA: A NewEra for Standards”. This article describes the newIEEE-Standards Association which has become the um-brella organization under which all IEEE standards pro-grams are carried out. The objective is to ensure theIEEE-SA is well positioned to keep abreast of the most im-portant developments in technology.

Under Committee Business on the agenda, in theabsence of Bill Gjertson, Nominations Committee Chair-man, President Hoolihan advised that the services of theIEEE for the Society’s election process have been secured byMr. Gjertson to handle nominations for the Board of Direc-tors. The EMC-S Directors-at-Large nomination slate withbiographical sketches will be submitted for circulation to themembership in June. A minimum of 12 names will be on theballot. Voting results will be reported in early October. Thoseelected will serve a three-year term on the EMC-S Board ofDirectors effective January 1, 1999. The Nomination Com-mittee’s members include Joe Butler, Dave Hanttula, MikeViolette, Warren Kesselman and Bill Gjertson, Chairman.

Andrew Drozd reported on the February 1998 meeting ofthe Intelligent Transportation Systems (ITS) committee heldduring the IEEE TAB meetings in Los Angeles. He advisedthat TAB was expected to approve the ITS petition to transi-tion to a technical council by early 1999. His report includedthe roster of voting members from participating societies aswell as the Constitution and Bylaws of the ITS. Mr. Drozd rec-ommends that the EMC Society support the activities of ITS.

President Hoolihan next invited the EMC Society sympo-sia chairs in attendance to present their respective reports.

Barry Wallen, Chair of the 1998 Denver symposiumcommittee, presented a report. To date, 130 exhibitors are

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EMC Society Board of Directors visit the Seattle Convention Center, site ofthe exhibits and technical presentations during the IEEE 1999 InternationalEMC Society Symposium in Seattle.

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participating with a total of 220 booths. TEAM Inc. has beenretained to handle the registration process. A housing bureauwill be used for the hotel reservations. The committee expectsto achieve its goal of a 16.7% surplus. 236 technical papers willbe presented, resulting in a two-volume record.

In the absence of Chair Bill Gjertson, Bill Price,Vice-Chair of the 1999 Seattle symposium committee,presented a report. He reviewed the budget summary thatshows a 16% surplus of the operating budget. The contractswith the Westin Hotel and Seattle Convention Center, whichwere negotiated with the assistance of IEEE Travel and Con-ference Management Services (ITCMS), have been signed.The Call for Papers will be mailed to the EMC-S membershipin August and will also be included in the registration packetsdistributed at the Denver symposium. Diane Heidlebaugh,Arrangements Chair, was introduced to the Board. She pro-vided a brief overview of the hotels that will be used and theallocation of meeting/exhibit space during the symposium.The Board was then taken on a tour of the Seattle ConventionCenter, led by Ms. Heidlebaugh and the manager of the Seat-tle Convention Center. It was noted that the Seattle sympo-sium would occur during the city’s famous “Seafair” week dur-ing August 1-5 so the hotels will fill quickly with symposiumattendees and tourists.

Takeo Yoshino gave a brief presentation on the1999 International Symposium on EMC in Tokyo,Japan from May 17-21. This is sponsored by the Techni-cal Group on EMC of IEICE and the Technical Group onEMC of the IEE of Japan. The EMC Society of the IEEEand its Tokyo Chapter are technical co-sponsors. Thesymposium will be held at Surugadai Memorial Hall,Chuo University. Further information about the Tokyosymposium may be found on their web page athttp://www.cs.takushoku-u.ac.jp/is/emc99/

Under Old Business, several motions were pro-posed and approved, including a motion regardinge-mail voting. The Board agreed to adopt a procedure formaking, seconding, discussing and balloting on urgent ad-

ministrative matters via e-mail for those matters requir-ing only a majority vote of the Board of Directors. TheBoard also agreed to direct the Planning Committee to in-vestigate the implications of requiring all members of theBoard to upgrade their software operating/business sys-tems to Microsoft Windows 95 and Microsoft Office 97. Re-garding the office of the Treasurer, the Board approved thepurchase of a new personal computer, a new MicrosoftWindows 95 operating system and a new Microsoft Office97 software package with for the Treasurer. The Boardalso requested that the Planning Committee investigatethe establishment of a “paid” business administrator posi-tion for coordinating current Treasurer functions. TheBoard agreed to direct the Member Services and Commu-nication Services Vice-Presidents to investigate memberoptions for receiving Transactions.

The Board agreed to allocate funds to reimburse Boardmember travel in an amount not to exceed $1,500 per Boardmember in order to hold an EMC Society Board of Directorsmeeting at the Tokyo EMC Symposium in Japan in May1999. The Board approved providing financial resources in1998 for the support of the new Standards CoordinatingCommittee for Disability Access. It was also agreed that atthe conclusion of each Board meeting, the Society Policy andProcedures Manual editor shall be given an action item toupdate the manual to capture those Board approved motionsthat are identified as modifications to the Policy and Proce-dures Manual. Regarding the WWW page for the EMC Soci-ety, the Board approved allocating funds to establish a webpage alias that is not tied to the UMR site. The Board ap-proved allocating funds for the marketing committee to ad-vertise for the sale of the EMC-S CD-ROMS. The Board ap-proved the audited financial report for the 1996 Santa ClaraSymposium. Lastly, the Board approved the request of the1999 IEEE EMC Symposium in Seattle for an additional ad-vance of $4,000, bringing the total advance to date to $9,000.

Under New Business, several motions were pro-posed and approved, including a motion regarding the ap-proval of the President’s Memorial Scholarship Award recipientin 1998. The Board approved allocating the initiation fee to pro-vide for EMC-S representation on the ITS. The Board approvedestablishing a Distinguished Lecturer Program for Europe andincreasing the budget for the program for this purpose. It wasagreed that an EMC Society “New Member” welcome letter becreated and distributed via IEEE member services in 1999. TheBoard authorized the reimbursement for travel expenses in anamount not to exceed $1,500 per Board meeting for Region 8and 10 Directors-at-Large to attend 1998 BOD meetings held inRegions 1-6. The Board requested that the Secretary and BobHofmann develop an action plan to track receipt of importante-mails. The Board established the photographer as an officialposition reporting to the Vice-President of Member Services.

Action Items assigned to various Board members werethen reviewed.

There being no further business, the meeting ad-journed at 5:00 pm.

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During the Seattle Board meetings, John Osburn (right), Chairman of theIEEE 1997 International EMC Society Symposium in Austin, presentedEMC Society Treasurer Warren Kesselman with the final check represent-ing the surplus of funds received from the Austin symposium.

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A New Beginning

The natural growth of every organizationrequires new leadership from time to

time in order to ensure that the leaders keeptheir ‘edge’. When I received the appoint-ment as chair of the Education Committeein 1993 I had no idea how long that tenureshould last. Within this last year I no longerhad any doubt. It had become obvious, atleast to me, that I no longer had the ‘edge’.

Fortunately, we have an excellent can-didate for the chair of Education. Most ofour members already know Dr. Maqsood(Mac) Mohd from attending the “Funda-mentals Tutorials” that he mastermindedand organized at the last four IEEEEMC-S symposia. Many may not have re-alized that Mac was also the Vice-Chair for

Education. Basedupon his experi-ence within theEducation Com-mittee, and his re-cord of contributionto the society, theBoard of Directorsfollowed the recom-mendation of theCommittee Execu-tive Board and ap-pointed Mac as the

Chair of the Education and Student Activ-ities Committee.

I hope everyone in the EMC Society willjoin me in welcoming Mac as the new Chairof the Education Committee. I also hopemany of you will also consider how you maybe able to help the Education Committee.Many EMC-S members have talents, abili-ties, knowledge and skills that can signifi-cantly contribute to EMC-S Education ac-tivities. If you would like to help, please joinus at the Symposium in Denver or contact

Mac in Denver. The Education Committeemeeting will take place on August 25th at7:00 am (sorry about that) in the Plaza CTroom in the Adam’s Mark Hotel. Pleasecheck the hotel directory when you arriveto catch any last minute changes.

Off the Hook and Back to the GrindstoneWith the Education Committee in good

hands, I can just sit back and relax, right?Well, not exactly. The policy and proce-dures of the Education Committee pre-scribes that the recent past chairs remainin close communication with the currentChair in order to lend support whenneeded, guidance when asked and in gen-eral, kibitz from the sidelines on the activi-ties of the new Chair and the ExecutiveCommittee.

At our meeting in Denver there will beopportunities for a major re-alignment ofthe personalities within the Education andStudent Activities Committee. Mostsub-committee positions usually remainunder the direction of the persons who vol-unteered and were confirmed into that po-sition from year to year. However, theChair and the Executive Committee havethe duty to review current activities ofeach position and make changes whichthey feel would be in the best interests ofthe Society as a whole. To quote the Policyand Procedure Manual, “Committee chair-persons, members at large, liaisons toother organizations, etc., shall be ap-pointed at the discretion of the Chair withthe consent of the executive board”.

I hope to see you in Denver.

Kimball WilliamsPast Chair

Education and Student Activities Committee

KIMBALL WILLIAMSASSOCIATE EDITOR

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Dr. Maqsood Mohd

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Following are abstracts of papers fromprevious EMC symposia, related con-ferences, meetings and publications.

EMCAB COMMITTEEBob Hunter, Consultantr.d.hunter@ieee.comSha Fei, EMC Research Section, NorthernJiatong University, Beijing, Chinaemclab@center.njtu.edu.cnFerdy Mayer, L.E.A.D., Maisons, Alfort FranceFerdyMayerLEADFrance@compuserve.comMaria Sabrina Sarto, Department of ElectricalEngineering, University of Rome, Italysarto@elettrica.ing.uniroma1.it

“HOW CAN I GET A COPY OF AN ABSTRACTED ARTICLE?”Engineering college/university libraries, public libraries, company orcorporate libraries, National Technical Information Services (NTIS),or the Defense Technical Information Center (DTIC) are all possiblesources for copies of abstracted articles of papers. If the library youvisit does not own the source document, the librarian can probably re-quest the material or a copy from another library through interlibraryloan, or for a small fee, order it from NTIS or DTIC. Recently it becameclear that EMCABs were more timely than publications which werebeing listed in data files. Therefore, additional information will be in-cluded, when available, to assist in obtaining desired articles or pa-pers. Examples are: IEEE, SAE, ISBN, and Library of Congress identi-fication numbers.

Also, the steering staffs of the Japan Technical Group and theEMC Japan Tokyo Chapter have offered to act as a central point for re-quests of papers abstracted here. Most of the papers will be availablein Japanese only. Abstracts of papers from EMC Japan will be clearlyidentified. As a member of the steering staff, I will assist in routingyour request to the author(s) but will not translate the papers.

Some of the Chinese papers are not available in English. ProfessorSha Fei, EMC Research Section, Northern Jiatong University, has of-fered his time and assistance in routing requests for papers to appro-priate author(s). He is not furnishing a translation service.

As the EMC Society becomes more international, we will be addingadditional worldwide abstractors who will be reviewing articles andpapers in many languages. We will continue to set up these informalcooperation networks to assist members in getting the information orcontacting the author(s). We are particularly interested in symposiumproceedings which have not been available for review in the past.Thank you for any assistance you can give to expand the EMCS knowl-edge base.

OSAMU FUJIWARAASSOCIATE EDITOR

EMCA

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The EMCS Newsletter is our quarterlypublication that is intended to keep ourmembers aware of late-breaking newswhile also publishing some timely techni-cal articles which are largely practical innature. It is also the primary means thatthe EMC Society’s Board of Directors usesto keep the 5000 EMCS members informedof what is going on in the AdministrativeActivities of the Society. The Newsletter isnow available electronically from the Soci-ety’s web page (http://www.emclab.umr.edu/ieee_emc/).

Awards constitute a very visible sign ofthe “rewards” of participating in a volun-teer organization such as the IEEE, and,more specifically, the EMC Society. TheEMC Society has a major program ofawards which includes special recognitionfor both technical and administrativeachievements. It includes recognizingone-time events and life-long support ofthe Society and the IEEE.

We will be distributing the Awards forthis year at the Awards Luncheon onThursday, August 27 at noon during theAnnual Symposium. Come and bask in thefame and glory of the award recipients.

I hope to see many of you at the Sympo-sium in Denver. Please, stop and say “hi”to me when you are there.

Dan HoolihanPresident, EMCS 98-99

IEEEPhone: 651 638-0250

Fax: 651 638-0285Email: dhoolihan@tuvps.com

President’s MessageContinued from page 1

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NUMERICAL MODELING OF MOBILE PHONE EQUIPMENTR. EhmannCST Gmbh, Darmstadt, Germanye-mail: ehmann@temf.tu-darmstadt.deS.Gutschling, B.Trapp and T. WeilandDarmstadt University of Technology, Darmstadt, GermanyProceedings of 14th International Wroclaw Symposium and Exhibition on ElectromagneticCompatibility, Wroclaw, Poland, June 23-25, 1998, pp.334-338

The influence of using a cellular phone inside a car on the radiated electromagneticfield is analyzed numerically. The specific absorption rate (SAR) inside the head and theantenna characteristics are considered for a simulation with and without car. For thecomputations, the Finite Integration Technique in time domain implemented in the SoftwarePackage MAFIA (Maxwells Finite Integration Algorithm) is used.

cellular phone, SAR, antenna characteristics, simulation

MICROSTRIP ANTENNAS ON MULTILAYER DIELECTRIC FOR MOBILESYSTEM COMMUNICATIONM.Wnul, W.Kolosowski and M.AmnowiczMilitary University of Technology, Warsaw, Polande-mail: mwnuk@wel.wat.waw.plProceedings of 14th International Wroclaw Symposium and Exhibition on ElectromagneticCompatibility, Wroclaw, Poland, June 23-25, 1998, pp.346-350

Intensive development of cellular personal communication systems has been observedlately. Thus, protection of a man, and especially protection of his head against non-ionizingelectromagnetic radiation generated by cellular telephones is becoming one of the mostimportant problems. The results of elaborated microstrip antennas which have minimizedradiation towards the user’s head are presented in this paper.

cellular telephones, radiation protection, microstrip antennas

ENGINEERING MODEL FOR SHIELDING EFFECTIVENESS EVALUATIONV.LenivenkoMITEC Ltd., Brisbane, AustraliaM.MostafaNokia Research Center, Tampere, FinlandProceedings of 14th International Wroclaw Symposium and Exhibition on ElectromagneticCompatibility, Wroclaw, Poland, June 23-25, 1998, pp.300-305

This paper presents results of the modeling of Shielding Effectiveness for modulartype shielding enclosures of 3-m and 10-m EMC chambers. Propagation of electromagneticwaves inside and outside the shielding enclosure was analyzed. Engineering models based onthe equivalent circuit approach and mode matching solution were employed. Results of the twoapproaches were compared with each other and with experimental data. Influence of structuralconfiguration and mechanical tolerances on the overall Shielding Effectiveness of the chamberwas studied based on the typical enclosure design. Frequency band from 1 to 20 GHz was takenunder consideration though results might be applicable for other frequency bands as well.

shielding enclosures, shielding effectiveness, analysis

EFFECTS OF ELECTROMAGNETIC INTERFERENCES ON OPERATIONALAMPLIFIERSJ.KolodziejskiInstitute of Electron Tecnology, Warsaw, Polande-mail: jekolo@ite.waw.plM.SkorupskiTechnical-Agriculture Academy, Bydgoszcz, PolandProceedings of 14th International Wroclaw Symposium and Exhibition on ElectromagneticCompatibility, Wroclaw, Poland, June 23-25, 1998, pp.522-526

In the work some results of simulation and experimental investigations are given,concerning the susceptibility of operational amplifiers (OpAmps) to electromagneticinterferences (EMI). The effects of EMI, mainly hf (out-of-band) in the form of short pulses, onthe inputs of OpAmps and on their power supply lines are considered. Conventional (voltagedependent) and current feedback amplifiers (FCAs) are taken into account. Final conclusionsembrace some practical recommendations.

operational amplifiers, EMI, simulation, experiment

HAZARD FOR ELECTRONIC SYSTEMS DUE TO EFFECTS OF LIGHTNINGELECTROMAGNETIC IMPULSESC.MazzettiUniversity of Rome, “La Sapienza”Rome, ItalyZ.Flisowski and B.KucaWarsaw University of Technology, Warsaw, PolandProceedings of 14th International Wroclaw Symposium and Exhibition on ElectromagneticCompatibility, Wroclaw, Poland, June 23-25, 1998, pp.500-505

The paper deals with a simplified method of the hazard assessment for electronicsystems due to lightning electromagnetic impulses (LEMP). The main idea of the method ispresented in which the immunity level of the considered system is to be correlated with thestatistical distribution of overvoltages appearing inside the protected structure. On the basis ofthis correlation, the way for risk and frequency of possible damages of the system underconsideration is discussed and evaluated.

lightning EMP, hazard assessment, statistical analysis

THE OCCURRENCE OF TRANSIENT FIELDS AND ESD IN TYPICALSELECTED AREASS.FreiBerlin University of Technology, Berlin, Germanye-mail: frei@ihs.ee.tu-berlin.deProceedings of 14th International Wroclaw Symposium and Exhibition on ElectromagneticCompatibility, Wroclaw, Poland, June 23-25, 1998, pp.486-490

The occurrence rate of Electrostatic Discharges (ESD) depends extremely on theenvironment. Several parameters influence ESD and the severity of this interference. A specialmeasurement system to measure the transient fields of ESD was designed. Measurementswere done in different environments. A theoretical model was developed, helping to predict andto evaluate the severity level of an environment towards ESD.

ESD, transient fields, measurement system

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COMPUTER SIMULATION OF ESD FROM OBJECT WITH SURFACERESISTANCEP.I.Shubitidze, R.Jobava and D.KarkashadzeTbilisi State University, Tibilisi, Georgiae-mail: lae@resonan.geD.Pommerenke, Hewlett Packard, Roseville, USAR.Zaridze, Tbilisi State University, Tibilisi, GeorgiaProceedings of 14th International Wroclaw Symposium and Exhibition on ElectromagneticCompatibility, Wroclaw, Poland, June 23-25, 1998, pp.511-513

Electrostatic discharge of the body with different surface resistance is investigated.Influence of the surface resistance on the current in the arc and on the radiated by the body fieldsis studied. The problem is formulated in the terms of surface integral equation for magnetic field.The equation is solved by the Method of Moments in time domain. Results are given for spheroidwith different surface resistance. It is shown that for some kind of distribution of surfaceimpedance, the level of radiation from electrostatic discharge can be reduced.

ESD, object with surface resistance, computer simulation

ANALYSIS OF MICROWAVE ABSORPTION AND MATERIAL PROPERTIES OFM-TYPE HEXAGONAL FERRITES

H.Ota and M.Kimula, EMC Research Laboratories Co. Ltd.,Sendai, JapanR.Sato, Tohoku Gakuin University, Tagajo, JapanK.Okayama and M.Honda, Tohoku University, Sendai, JapanProceedings of 14th International Wroclaw Symposium and Exhibition on ElectromagneticCompatibility, Wroclaw, Poland, June 23-25, 1998, pp.396-399

The microwave absorption properties of M-type hexagonal ferrites are investigated.The complex permeability and permittivity were measured using a network analyzer. In theBaFe12-x(TiCo)xO19 system, the ferrimagnetic resonance frequency shifts down to the 1-20GHz range, when x is increased. Due to the relatively high mu_r" value, thin matchingthickness of 0.9-1.9 mm were obtained in the 5-10 GHz range. The frequency characteristics ofmu_r’ and mu_r" were analyzed and simulated successfully using a parallel resonant circuitmodel based on the crystalline structure. Dual peak characteristics of mu_r" were observed for acertain sintering temperature and duration, and a relative absorption bandwidth of 16% wasobtained. The simulation showed that a wider absorption bandwidth of 33% may be possible.

: M-type hexagonal ferrites, microwave absorption properties, measurement

SHIELDING OF THE DIELECTRIC BALL RESONATORS WITHWHISPERING-GALLERY MODESS.Kharkovsky, Y.F.Fllipov, Z.E.Eremenko, V.V.Kutuzov andA.E.KogutNational Academy of Sciences, Kharkov, Ukrainee-mail: ire@ire.kharkov.uaProceedings of 14th International Wroclaw Symposium and Exhibition on ElectromagneticCompatibility, Wroclaw, Poland, June 23-25, 1998, pp.380-384

New results of the investigation of shielded dielectric ball resonators (DBR) withwhispering gallery modes (WGM’S) are represented. The characteristic relations TM and TEmodes are obtained. The dependence of resonant frequencies Q-factor of WGM’S on resonatorparameters have been calculated numerically. It is shown that the shielding of DBR providesthe increasing modes Q-factor in ten times. A good agreement between theoretical andexperimental results are obtained.

shielded dielectric ball resonators, whispering gallery modes, theory, experiment

ELECTROMAGNETIC FIELD UNIFORMITY TEST USING MODULATEDSCATTERING PROBESR.AzaroUniversity of Genoza, GenozaS.CaorsiUniversity of Pavia, Pavia, ItalyProceedings of 14th International Wroclaw Symposium and Exhibition on ElectromagneticCompatibility, Wroclaw, Poland, June 23-25, 1998, pp.183-187

The use of the Modulated Scattering Technique (MST) for electromagnetic fielduniformity test is proposed. Measurement times associated with the conventional techniqueemploying mechanical positioning of a single probe, are usually long. By using an array ofmodulated scattering probes, electronically driven, the technique allows a dramatic reductionin measurement time. In the paper, the theoretical basis of the technique is discussed, theprototype system is described and some measurement data is presented.

field uniformity test, modulated scattering technique, prototype system

DEVELOPMENT OF FIELD PROBES PRINTED ON SUBSTRATES FORDOSIMETRIC ASSESSMENTS IN THE FREQUENCY RANGE FROM 1 MHZTO 18 GHZC.Probol and K.GonshorekDresden University of Technology, Dresden, Germanye-mail: probol@gmx.deProceedings of 14th International Wroclaw Symposium and Exhibition on ElectromagneticCompatibility, Wroclaw, Poland, June 23-25, 1998, pp.224-228

The electric and magnetic fields in the proximity of strong sources of radiation (e.g.RADAR and broadcasting) can exceed the limits mentioned in the national standards for theexposition of persons. Several field probes have been developed to ensure that people workingclose to these sources of radiation will not be exposed to energy densities above the limit.However, many field probes have disadvantages in the everyday use by people that are notexperienced in measuring electromagnetic fields.

dosimetric assessments, field probes

TEM CELL VS. FREE SPACE: COMPARISON OF THE FIELDS INSIDEDIELECTRIC SPHERESW.M.D‘Amico and R.Baselli, Technical University of Milano,Milano, Italy, e-mail: damico@elet.polimi.itProceedings of 14th International Wroclaw Symposium andExhibition on Electromagnetic Compatibility, Wroclaw, Poland, June 23-25, 1998, pp.193-197

The Crawford cell is a very convenient equipment for generating high intensityTransverse Electromagnetic fields; it has a straightforward design, and it is inexpensive to bebuilt. Unfortunately, when an object is placed inside the cell, the field distribution can besignificantly distorted. To date there is no definite answer on whether the (loaded) Crawfordcell is a good approximation of (loaded) free space. In this work a typical Crawford cell isconsidered, properly designed to obtain a uniform TEM field when empty. A dielectrichemisphere is then assumed to be placed on the central conducting septum; this hemisphere isequivalent (for the images theorem) to a dielectric sphere in the free space. The field inside thedielectric hemispheres is numerically evaluated, using a 3DEM simulator; this field is thencompared with that inside the corresponding sphere in free space, illuminated by a plane wave,for which the analytical solution is known. Comparisons are carried out at several frequencies,for (hemi)spheres of different sizes and refractive indices.

Crawford cell, dielectric hemispheres, uniform TEM field, numerical evaluation

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rEMC RelatedConferences &Symposia1998September 14-18Organized by the Faculty ofEngineering University of Rome“La Sapienza” Rome, ItalyEMC ‘98 ROMA: INTERNATIONALSYMPOSIUM ONELECTROMAGNETICCOMPATIBILITYDaniela FioramontiTel: +39.2.777901Fax: +39.2.798817E-Mail: conferencesaei@aei.it

October 27-28Sponsored by the University ofOklahoma,Center for the Study of Wireless EMC5TH ANNUAL EMC WIRELESSFORUMThe Marriott Key BridgeWashington DCLinda West, 405.325.2429e-mail: lwest@ou.edu

Week of October 5MODE-STIRRED, ANECHOICCHAMBER, AND OATS USERSMEETINGAir Force Research Lab, Rome, NYRaymond W. Tucker, Jr.315.330.3884E-mail: tuckerr@rl.af.mil

1999February 16-18Sponsored by the IEEE SwitzerlandEMC Chapter13TH INTERNATIONAL ZURICHSYMPOSIUM ANDTECHNICAL EXHIBITION ON EMCZurich, SwitzerlandDr. Gabriel Meyer, +411.632.27.90e-mail: gmeyer@nari.ee.ethz.chHttp://www.nari.ee.ethz.ch/emc/

May 3Sponsored by the Phoenix Chapter ofthe EMC SocietyEMC ‘98: A COLLOQUIUM ANDEXHIBITION ON PRE-COMPLIANCEEMC TESTING PROBLEMS ANDSOLUTIONSFeaturing Keynote Speaker Henry OttMesa, AZDaryl Gerke, 602.755.0080e-mail: dgerke@aol.com

May 17-19Sponsored by Wessex Institute ofTechnology, UK andthe University of Toronto, CanadaELECTROSOFT 99 - Software forElectrical EngineeringSeville, SpainLiz Kerr, +44(0)1703 293223fax: +44(0)1703 292853e-mail: liz@wessex.ac.ukHttp://www.wessex.ac.uk

May 17-21Co-Sponsored by the IEEE EMCSociety - Tokyo ChapterEMC ‘99 TOKYOChuo UniversityTokyo, JapanProf. Noboru, +81.426.65.1441e-mail: sch@cs.takushoku-u.ac.jphttp://www.cs.takushoku-u.ac.jp/is/emc99/

IEEE AdministrativeMeetings 1998(For information on all meetings,contact Janet O’Neil, 425.868.2558)

August 23EMC Society Board of DirectorsAdams Mark HotelDenver, CO

September 18EMC Society Board of DirectorsRome, Italy

November 14EMC Society Board of DirectorsNew Brunswick, NJ

EMCSCooperatingSymposiaU.K.: Biannually, even years,

in SeptemberZurich: Biannually, odd years, in

FebruaryWroclaw: Biannually, even years,

in June

EMCSSymposiaSchedule1998 Denver, CO

August 24-28Adam's Mark HotelBarry Wallen303.682.6600

1999 Tokyo, JapanMay 17-21S. NittaE-Mail: nitta@cc.tuat.ac.jp

1999 Seattle, WAAugust 2-6Westin HotelBill Gjertson425.393.2557E-mail: w.gjertson@ieee.org

2000 Washington, DCAugust 21-25Washington HiltonBill Duff703.914.8450

2001 Montreal, CanadaMontreal Convention CenterChristian Dube514.653.6674

2002 Minneapolis/St. PaulHyatt Regency, MinneapolisDan Hoolihan651.638.0250E-Mail: dhoolihan@tuvps.com

2003 Tel-Aviv, IsraelElya JoffeFax: 972.9.765,7065

2003 Boston, MASheraton BostonMirko Matejic508.549.3185

2004 Santa Clara, CAFranz Gisin650.933.8789

2005 Chicago, ILBob Hofmann630.979.3627

The IEEE EMCS Newsletter welcomes contributions tothis calendar pag. Please send information to:

Editor,IEEE EMCS Newsletter

fax 425.868.0547e-mail: j.n.oneil@ieee.org

AMPLIFIER RESEARCH160 School House Road, Souderton, PA 18964-9990 USA

Telephone (215) 723-8181 Fax (215) 723-5688 Website: www.ar-amps.comBroadband RF power amplifiers,1 W to 50 kW, dc to 40 GHz; Antennas and accessories for

RF susceptibility testing; broadband E-field monitors and interference generators for IEC/ISO applications.

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Toll Free (800) 500-4EMC Fax (209) 742-6133 e-mail: ckclabs@ckc.comWorldwide EMC-compliance testing, design consultation and seminar services, DAR EN45001

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EMCOP.O. Box 80589, Austin, TX 78708-0589 USA

Telephone (512) 835-4684 Fax (512) 835-4729Essentials for EMC Testing: Antennas, Towers, Turntables, Current Probes, CDNs,

Broadband E-field Sensors, GTEM Cells, TEM Cells, LISNs and Accessories

FAIR-RITE PRODUCTS CORPORATIONOne Commercial Row, Wallkill, NY 12589

Telephone (914) 895-2055 Fax (914) 895-2629 e-mail: ferrites@fair-rite.com Website: http://www.fair-rite.comFerrite Cores for EMI Suppression, Bead-On-Leads, Surface Mount Beads, Multi-Hole Connector Blocks, and Tile Absorbers.

LINDGREN RF ENCLOSURES, INC.400 High Grove Blvd., Glendale Heights, IL 60139

Telephone (630) 307-7200 Fax (630) 307-7571 e-mail: lrfe@interserv.com Website: www.LindgrenRF.comEMI/RFI Shielded Rooms; RF Shielded Doors and Components; Anechoic Chambers and Absorber Materials;

High Performance Power, Signal, Data and Telecomm Line Filters from ELMAG Division (561) 881-9292

PATTON & ASSOCIATES1600 West Manzanita Drive, Prescott, AZ 86303-6121

Telephone (520) 771-2900 Fax (520) 771-2990 e-mail: patton@patton-assoc.com Website: http://www.patton-assoc.com/Patton & Associates consult in the design, test, regulatory type approval and market entry of

telecommunications terminal equipment worldwide.

RANTECP.O. Box 80589, Austin, TX 78708-0589 USA

Telephone (512) 835-4684 Fax (512) 339-4517Shielded Rooms and Anechoic Chambers, High-performance RF & EMC Absorbers

RAY PROOF LTD. (A Lindgren Company)Boulton Road, Pin Green Ind. Area, Stevenage, Herts. SG1 4TH, U.K.

Telephone +44 (0) 1438 730700 Fax +44 (0) 1438 730750 e-mail: sales@linray.co.uk www.rayproof.demon.co.ukEMI/RFI Shielded Rooms; Anechoic Chambers; Shielded Doors and Components; High Performance Power,

Signal, Data and Telecomm Line Filters; EMP Filter Systems; Fiber Optic CCTV and Communication Systems

SCHAFFNER EMC, INC.9B Fadem Road, Springfield, NJ 07081

Telephone (973) 379-7778 or (800) 367-5566 Fax (973) 379-1151 http://www.schaffner.comEMC Filters, EMC Immunity Test Instruments, Automatic Test Systems for EMC and Power Supply Testing

TEXAS SPECTRUM ELECTRONICS, INC.9110 Autobahn Dr., Dallas, TX 75237

Telephone (972) 296-3699 Fax (972) 296-7881 e-mail: Texasspec@aol.com Website: www.Texasspectrum.comCustom EMI Filters, Miniature EMI Filters, Telecom Power Filters, Filter Arrays, and Filter Suppressor Networks.

Distributor of Plastic Insulation Materials (Heat Shrink) and Wiring Accessories.

WEINSCHEL, BRUNO ASSOCIATES42 Cessna Court, Gaithersburg, MD 20879 USATelephone (301) 948-8342 Fax (301) 869-9783

Attenuators, Fixed Terminations, 5-1000 (av.) W average/10 KW Pk. Power Cont. Var. 0-4 GHz, 1-40 GHz;Power Splitters 0-18 GHz

An Institutional Listing recognizes contributions to support the publication of the IEEE EMC SOCIETY NEWSLETTER and the IEEE TRANSACTIONS ONELECTROMAGNETIC COMPATIBILITY. Minimum rates are $500.00 for four consecutive issues of each publication during one calendar year (eachpublication is distributed quarterly). The above Institutional Listings represent those contracted for 1998. Institutional Listings for 1999 will be solicited inDecember 1998. No agency fee is granted for soliciting such contributions. For inquiries related to institutional listings, please contact Janet O’Neil, Editor,phone 425.868.2558, e-mail j.n.oneil@ieee.org.

The IEEE Electromagnetic Compatibility Society is grateful for theassistance given by the firms listed below and invites application forInstitutional Listings from other firms interested in the electromagneticcompatibility field.

InstitutionalListings

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