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4 y December 2008 y CompactPCI and AdvancedTCA Systems
www.compactpci-systems.com www.advancedtca-systems.com
Volu m e 12 • N u m be r 9
DeCember 20 08CompactPCI ®
AdvancedTCA ®and Systems
The Magazine for Developers of Open Communication, Industrial, and Rugged Systems
AdvancedMCsSponsor: JumpGen
BladesSponsors: Sun; PDSi – Pinnacle Data Systems
ConnectorsSponsor: HARTING
EnclosuresSponsor: Schroff
Integrated Platforms
MicroTCA
Networking/Communications
Packet ProcessingSponsor: Interphase
PMCs PrPMCs
SBCs
Storage
Switches
Thermal Management
VoIP
2 0 0 9 B U Y E R ’ S G U I D E
Published by:
© 2008 OpenSystems Media/OpenSystems Publishing® CompactPCI, PICMG, AdvancedTCA, ATCA, MicroTCA, and their logos are
registered trademarks of the PCI Industrial Computer Manufacturers Group.TM AdvancedMC and CompactTCA are trademarks of the PCI Industrial Computer Manufacturers Group. © 2008 CompactPCI and AdvancedTCA SystemsAll registered brands and trademarks in CompactPCI and AdvancedTCA Systems are property of their respective owners.
Member since 1998
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1119312334271229213517202822E - L E T T E R
www.compactpci-systems/eletterDECEMBER:Choosing solid-state solutions for single board computers: Designer’s nightmare? By Paul Dinh, Virtium Technology
JANUARY:PICMG’s Interconnect Channel Characterization Committee: Bringing the embedded industry up to speed By Stuart Jamieson, Emerson Network Power Embedded Computing
W E B R E S O U R C E SSubscribe to the magazine or E-letter at:www.opensystems-publishing.com/subscriptions
Industry news:Read: www.compactpci-systems.com/newsSubmit: http://submit.opensystemsmedia.com/
New products:Search: www.compactpci-systems.com/productsSubmit: http://submit.opensystemsmedia.com/
E - C A S T SCatch up on recent E-CASTS at http://ecast.opensystemsmedia.comNet-centric warfare: How embedded tech collides with the digitized battlefield, Halo, and the InternetPresented by: Curtiss-Wright, Mercury Computer Systems, AdvancedIO Systems, Tek Micro
Virtualization: Operating Systems and I/OPresented by: Freescale, LynuxWorksSpeakers: Arun Subbarao, (Vice President of Engineering, LynuxWorks)Stuart Yoder, (Software Architect, Freescale)Moderated by: Jerry Gipper
COVER:(Clockwise) The Interphase iNAV 31K AdvancedMC Carrier Card is a flexible, high-performance addition to next-generation systems. • The HARTING AdvancedMC Plug replaces the gold pads on the AdvancedMC module creating a reliable two piece connector system out of the card edge interface. The Plug ensures the reliability of the card edge connection with tightly controlled tolerances and superior design. The HARTING AdvancedMC Plug connector is the ideal solution for ruggedized TCA applications and superior system operation. • Pinnacle Data Systems’ (PDSi’s) ATCA F1 Blade offers dual high-performance AMD Opteron processors, an AdvancedMC slot, and RTM interface for extended I/O.
F E A T U R E SAdvancedMCs 8 AdvancedMC and AdvancedTCA markets: What’s ahead and why? Joe Pavlat interviews Keate Despain, RadiSys
SBCs 37 Designing CompactPCI into rugged applications By David Pursley, Kontron
Storage 43 To keep oil pipelines flowing, embedded storage systems have to be tougher By Gary Drossel, SiliconSystems
Switches 47 Enabling multihost system architectures with PCI Express switches: Innovation in design through multiroot partitionable switch architecture By Matt Jones, IDT
O N L I N E F E A T U R E Swww.advancedtca-systems.com The codec world widens By Jean-Marc Valin, Octasic
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6 y December 2008 y CompactPCI and AdvancedTCA Systems
Page Advertiser/Ad title
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Joe Pavlat Editorial Director [email protected]
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CompactPCI and AdvancedTCA Systems (USPS 019-288) is published nine times a year (Feb, March, April, May, June, July/Aug, Sept, Oct, Nov/Dec) by OpenSystems Media, 16626 E. Ave of the Fountains, Ste 203, Fountain Hills, AZ 85258CompactPCI and AdvancedTCA Systems is free to qualified engineers or management dealing with or considering open system technologies. For others, paid subscription rates inside the US and Canada are $63/year. For first class delivery outside the US and Canada, subscriptions are $90/year (advance payment in US funds required). Periodicals postage paid at St. Clair Shores, MI, and at additional mailing offices.
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21 3M Electronic Solutions Division – Open Your Eyes
39 ADLINK Technology, Inc. – Quad-Core ATCA & cPCI Solutions
44 Advantech Corporation – Advanced Blade Solutions
30 Alphi Technology Corporation – Modular Solutions for MIL-STD-1553
2 Annapolis Micro Systems, Inc. – WILDSTAR 5 MINI TAB 17 Astek Corporation – Storage Solutions MINI TAB 23 Carlo Gavazzi Computing Solutions –
AdvancedTCA system 12 Concurrent Technologies, Inc. – x86 Processor
Boards 13 CONEC Corporation – CONEC Embedded Series 32 Conference Concepts – Advanced/MicroTCA
Summits MINI TAB 29 Continuous Computing Corporation –
FlexPacket ATCA-PP50 MINI TAB 30 Continuous Computing Corporation – FlexTCA
DPI System 3 Data Device Corp. (DDC) – First AMC 35 Degree Controls, Inc. – Partners in Thermal
Management 45 ELMA Electronic – Cutting it close doesn’t cut it 9 Excalibur Systems, Inc. – ccVME 1553 5 GE Fanuc Intelligent Platforms, Inc. – Processor
AdvancedMC TAB 31 HARTING Technology Group – Connectors 20 Hartmann Elektronik – CompactPCI backplanes 29 Hybricon Corp. – Let Hybricon Put Your Mind
At Ease 40 Hypertronics – Protect Against Shock and
Vibration 41 Interface Concept – Trust a world-wide expert TAB 11 Interphase Corporation – High Performance
Packet Accelerators TAB 11 JumpGen Systems – Jumping to Next
Generation Technology 14 Kaparel Corporation – For perfect system
integration 25 Kaparel Corporation – At Rittal, We Handle
CompactPCI System Designs MINI TAB 11 Kontron – AdvancedMC Series 33 Kontron – 3U CompactPCI MINI TAB 34 Kontron – OM9020 storage server 31 National Instruments – Introducing 1 GHz
PXI Digitizers 17 Nextronics LEANPAC ATCA AMC Faceplates 50 North Atlantic Industries – More Functions.
Less Space. 42 One Stop Systems Inc. – PCIe over Cable MINI TAB 27 Performance Technologies – MicroTCA Family 46 Performance Technologies – Looking for a
First-Class CompactPCI Solution TAB 19 Pinnacle Data Systems – Embedded Computing
Solutions 7 Positronic Industries – True Blue Power
Connectors 19 Red Rock Technologies, Inc. – Mass Storage
Modules 28 Schroff a Brand of Pentair Electronic
Packaging – Performance TAB 31 Schroff a Brand of Pentair Electronic
Packaging – Enclosures 36 Simclar Group – AdvancedTCA Platforms 24 Simon Industries – Conduction-Cooled Heat
Frames TAB 19 Sun Microsystems, Inc. – Sun Netra ATCA
Solutions 26 Super Talent Technologies – Reinventing
Storage 22 Technobox, Inc. – Your Source for PMC
Solutions 51 TEWS Technologies LLC – I/O Solutions 52 VadaTech Inc. – Build Strong 15 White Electronic Designs – DDR2 SDRAM 34 Winchester Electronics – Power Connector
Solutions 18 Xalyo Systems – XS-AMC2 16 XTech – The XTech Files
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AdvAncedMcsFEATURE g
CompactPCI and AdvancedTCA Systems Editorial Director Joe Pavlat recently spoke with Keate Despain, Senior Director of Product Marketing, RadiSys, about the AdvancedTCA/AdvancedMC market.
Q. What is your high-altitude perspective on the AdvancedMC and AdvancedTCA markets?
A. We continue to see the business grow, and we continue to like the growth rate at which it is expanding and the new opportunities for network elements emerging on AdvancedTCA as their hardware platform of choice. We are excited about that.
That gives us an open field to go in with some of the market-leading products that we have already announced or will be announcing shortly and that will hit the market in the late 2008/early 2009 timeframe. [These] include our packet processor blade, the ATCA-7220. This is a dual Cavium blade that is capable of doing high-speed 10 gig deep packet inspection. It’s one of our key products right now for the second half of 2008. We also have our DSP-based blades.
Our DSP-based blades are the densest DSP blades you can have on an AdvancedTCA offering, with up to 20, and we can deliver those either on the TI DSP family or on the Freescale family. So those are the two that are going to be readily available either now or toward the end of 2008.
Then, looking towards 2009, you are going to start hearing quite a bit from RadiSys with Intel in terms of capitalizing on the new Intel microarchitecture coming out for the telecom as well as for the server market, known as the Nehalem platform. We think the solution is going to be pretty game-changing in that area.
Q. What factors make it game-changing?
A. The technology [Intel] included by bringing in the memory controller hub. By bringing that technology into the silicon itself instead of having a separate chip managing [process control], it reduces the overall latency in and out of memory, which is incredibly beneficial to telecom applications because they do a lot of memory fetches.
Q. What design decisions were made with regard to the 7220?
A. We have put in a nonblocking 10 Gig Ethernet switch with high gig capability (a Broadcom-based chip) that allows the full use of both OCTEON and the multicores that come along with that to allow it to have full usage of all the cores. Some of the other competitors that we have been watching have similar solutions coming out and have actually linked the Cavium chips together to where you have to use one of the cores to manage the processes between the two chips. By putting the switch in there in a nonblocking fashion, it can move the data to all the cores instead of encumbering one of the cores to manage the control of processes.
We have avoided a performance constraint. We have allowed the full performance of the Cavium processors to be utilized instead of having to put one aside to just manage the internal control processes among the chips on the board. The high gig switch is capable of doing that, instead of burdening one of the Cavium cores with that function.
Q. How much did cost play in the development of the 7220?
A. Cost is always a trade-off you have to manage as you develop these boards. Because they are in the data flow and are managing the packets, I would say performance is at a much
An interview by Joe PAvlAt
higher premium than looking at the cost per se. So getting the performance right and making sure you are maximizing the ability of the blade play to a much stronger feature set than trying to deliver the cost. Of course, as the blade ramps in volume, we allow what we call our value engineering to take over and start figuring out, where can we maximize for the cost reduction that this market requires over time. For now, it is really about performance and developing the fastest leading packet processing blade for the AdvancedTCA market.
When customers come to us and say, “These are the applications and the network elements we are going to place on top of the platforms,” we then recommend, “Here is what we believe the architecture should look like, with an X blade or Y blade, that gives you the optimum configuration based on your constraints, whether that is performance, whether that is cost, or whether that is size of the solution you want to put in place.”
Q. Are we moving toward consolida- tion, that is, rather than separate media processing and packet processing, a blade that does both?
A. Absolutely. With the way the semi-conductor market is embracing and [driv-ing for] multicore architecture you are going to be able to have more and more of that ability to do cross-functional capability on a single blade. I think there are going to be two questions: (1) Do you have legacy software? Porting or changing that software from one architecture to the next if it was not written in a way that [makes it able to be abstracted] is very challenging and costly. (2) How much performance do I need? If general-purpose is good enough, that is okay, but when you are trying to deliver data to highly dense populations such as Shanghai or New York City, you need the performance and capability that each of these specialized silicon solutions brings, and that is where the mix and match comes.
I would see in the more rural areas the opportunity to possibly go across on a single architecture, but I think we are probably five to seven years away from that.
AdvancedMC and AdvancedTCA markets: What’s ahead and why?
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10 y December 2008 y CompactPCI and AdvancedTCA Systems
Q. How important will the 10 gigabit per pair Ethernet standard, 10GBASE-KR, be for AdvancedTCA?
A. For AdvancedTCA, the transition will be similar to the transition from 1G to 10G. It opens up a host of new applications and speeds at which AdvancedTCA platforms can deliver solutions for their respective network elements. For LTE and other high-speed, broadband applications, it will be able to deliver innovative IP services that otherwise were not possible over a 1G platform.
Q. What do you think the timeframe for implementation needs to be to meet customer expectations?
A. I think we will see real deployments in networks in the 2012 to 2013 timeframe. Of course, there will be early adopters who will jump to market sooner, but the base technology will not truly arrive until end of year 2009 and then take three years to work through the standard development and testing life cycles found in the telecom market.
Q. What benefits to telecom equipment manufacturers are we going to see emerging as the AdvancedTCA market continues to grow?
A. One benefit is speed, the ability to get to market quickly on these application-ready platforms that have been fully validated and are ready to implement on the customers’ applications.
A surprise is that as we start to break through some of the volume boundaries, we are able to start seeing the cost model decrease pretty quickly for AdvancedTCA. It has been probably two years of continually trying to get the costs down and driving for it because the volumes were not quite there yet. [However,] as the volume ramps up and starts to reach those plateaus or milestones where bigger [cost-reduction] breaks occur, it is a good opportunity for us to capitalize on as the market grows in 2009 and 2010 – with even more volume being pushed over to AdvancedTCA platforms.
Q. What has been the strongest driver in getting those volumes to ramp up?
A. I think it has been the value the telecom equipment manufacturers are seeing in a common platform on which they are running multiple different network elements. They can see the economy of scale that comes across not only on their development side, but also on their procurement side. They can buy the same hardware, configured slightly differently, but pretty much the same hardware, while addressing multiple different network elements.
Q. When considering rival technologies, how does one pick which horse to back?
A. As we work across the market, we not only consult with our customers in terms of what they are seeing and what they like out of the various silicon vendors and the new technologies that are coming out, but we also provide a lot of insight by getting to know these architectures very deeply as we design around them. For now, from a DSP perspective, it is a two-horse race, and that is why we are working with Freescale and TI.
When it comes to packet processing blades, we have certainly made a decision to have a strategic relationship with Cavium in that area, and then for the CPU blades, RadiSys has been delivering Intel architecture solutions on Intel technology for years now versus going with the other x86 provider.
You have to pick your key technology, but it is really driven by what technology is applicable to the market and who is delivering it best to the market.
Q. What about the RadiSys culture is helpful when assessing new technologies?
A. First and foremost, RadiSys is very customer-focused. If, as we are working with our top customers, we see a market change happening – possibly a new technology from a new provider is coming out that is game-changing – we will move very quickly not only to work with our customers who are interested in that technology, but also to understand what are the benefits and what are the trade-offs. Then we’ll go back to our customers and explain to them what we think, what is our view, and ultimately work to satisfy our customers with these new technologies that they may be driving towards. It requires a willingness to open up and collaborate closely with our customers.
We also enjoy the flexibility of being a medium-sized business in this space that is focused 100 percent on telecom and wants to deliver the AdvancedTCA solution fastest to the market.
I can give you an example [of working closely with a technology partner] on our switch card. On our switch card we use Broadcom silicon 10 Gig Ethernet capable silicon.
[Broadcom] acquired LVL7 Systems [a company with] a software solution that sits on the top of that switching silicon. And RadiSys many years ago started a relationship with LVL7 to understand that software. We have rights to that software and source code, and have made well over 600 or 700 software additions to the lines of code to make it run even better on our switch silicon.
RadiSys works not only with the hardware, but also with the elemental software that takes advantage of the silicon, and we provide that as a product that is bundled together.
And to cite another example of working with technology partners, we have recent- ly announced the RadiSys Ecosystem and Demo Interoperability (REDI) Lab. This Lab builds on the efforts of stan- dards organizations, including the Communications Platforms Trade Association (CP-TA), to deliver interoper-ability by pulling together completely configured application-ready platforms that customers can order from RadiSys. This includes AdvancedMC components, various chassis shelf management offer-ings, full size AdvancedTCA blades across multiple technologies, and software support across the operating system and middleware. We provide the environment and the testing to ensure our customers can feel confident in the technology we are proposing to them as a complete standards-based AdvancedTCA solution.
Q. Besides the technology mentioned earlier around Cavium and DSPs, is there anything else emerging for AdvancedTCA users to watch?
A. On the hardware side of things we are seeing some major changes in the market- place around hard disk drive technology. We are excited about some of the tech-nologies, such as the new solid-state drives, and about companies that are coming out with solutions in that space to address some of the environmental issues that are out there [with regard to] AdvancedTCA in terms of thermal and space constraints.
I think on the software side of things, the market continues to move forward with using COTS vendors who can bring middleware to the market to deliver the 6-nines promise of reliability and robustness. RadiSys has a very strong relationship with a couple of the top three vendors.
RadiSyswww.radisys.com
AdvancedMCs
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2 0 0 9 b u Y e r ’ S G u I D ew w w. a d v a n c e d t c a - s y s t e m s . c o mSponsored by K
ontron ww
w.kontron.com
KontronAM4010 and AM4100 RSC No. 39439Multicore processor AdvancedMCs for use in both AdvancedTCA and MicroTCA applications
• 4010: Intel Core Duo or Intel Core 2 Duo, scalable up to 1.66 GHz • 4010: Up to 2 GB SDRAM memory (soldered) with ECC running at 400 MHz • 4010: Single-width, full-size, or mid-size
• 4100: Freescale dual-core MPC8641D PowerPC, 1.0/1.33/1.5 GHz • 4100: 0.5/1/2 GB soldered
SDRAM memory • 4100: Single-width, full-size, or mid-size
www.kontron.com
JumpGen SystemsPRM-100 PrAMC Intel RSC No. 39213PrAMC with latest 45nm Intel Core 2 Duo processor up to 1.8 GHz • Up to 8 GB of ECC DDR2 memory running at 400 MHz • Up to 8 GB of persistent memory 8 GB SSD • Dual 10 GbE interfaces (AMC.2 Type 6 or SCOPE compliant AMC.2 Type 5 with second fabric interface in lanes 17-20 • Dual GbE interfaces (AMC.2 Type E2) and Dual SATA (AMC.3)
interfaces to Common Options • Front panel I/O includes 2 10/100/1000BASE-T Ethernet,
RS-232 serial, and USB • Single-wide AdvancedMC available in both full-size and mid-size AdvancedMC configurations for
AdvancedTCA, MicroTCA, and proprietary architecture systems • RoHS compliant
www.jumpgen.com
Surf Communication SolutionsSurfRider/AMC-EVM RSC No. 39444
Comprehensive application development environment compris-ing an AMC resource board carrying 2 TI TMS320C6412
DSPs • Enables telecom applications developers to handle different DSPs • Stand-alone desktop unit simulating AdvancedTCA and MicroTCA chassis
for resource-efficient telecom develop-ment environment • Full DSP control and monitoring over GbE connection for reduced application development and testing time •
Includes AMC resource board populated with two TI TMS320C6412 720 MHz DSPs
www.surf-com.com
BittWare, Inc.F1/GX-AMC RSC No. 37649Hybrid TI TCI6487 DSP and Altera Stratix II GX reconfigurable AMC • High-performance multicore TI TMS320TCI6487 DSP: 3.0 GHz of total raw DSP processing power; 3 MB ofon-chip L2 SRAM/cache; OBSAI and CPRI antenna interface support; specialized coproces-sors • High-density Altera Stratix II GX FPGA implementing BittWare’s ATLANTiS framework for control of I/O, routing, and processing: 15 full-duplex SerDes transceivers; up to 132,540 equivalent LEs; 252 embedded 18x18 multipliers (63 DSP blocks); 6.7 Mb of RAM; IP available for: Serial RapidIO, PCI Express, GbE, 10 GbE/XAUI, CPRI, and OBSAI • BittWare’s FINe bridge provides control plane processing and interface via GbE, 10/100 Ethernet, and RS-232, along with support • BittWorks SW • Over 1.5 GB of memory: Three banks of DDR2 SDRAM at up to 512 MB each
www.bittware.com
Data Device Corp. (DDC)BU-65590A RSC No. 38890Multiprotocol AdvancedMC card for systems interfacing to a MIL-STD-1553 and/or ARINC 429 data bus • AMC.1 four-lane PCI Express • Single-width, mid-height • Front panel I/O (100 pin Micro-D) • Air-cooled • IRIG-B time code Input • IRIG 106 Chapter 10 monitor• DMA engine for low CPU and PCIe utilization • 48-bit/1µs time stamp • E MA BC/RT/MT architecture - API compatible with Enhanced Mini-ACE library • 1 MB memory w/parity per 1553 channel • VxWorks, Linux, and Windows 2000/XP support
www.ddc-web.com
Interphase CorporationiSPAN 3650 RSC No. 32869Four OC-3/STM-1 or one OC-12/STM-4 SFP interfaces • High performance: 36,000 PVCs,
1 Mps AAL2 CPS packets, 50,000 Active CIDs, full wirespeed • Multiprotocol: AAL1, AAL2,
and AAL5, ATM and PPP over SONET/SDH • Carrier Grade availability with APS support terminated on physically
separate 3650 cards • Embedded MIPS 24K 450 MHz processor for onboard
control processing • Telecom clocks can be input and output on AdvancedMC CLK1 and CLK2
www.interphase.com
JumpGen SystemsT6M-100 PrAMC RSC No. 38844
64-core processor card is a high-performance Processor AdvancedMC (PrAMC) card designed for use in AdvancedTCA or MicroTCA systems
• TILE64 processor with 64 cores running at 700 MHz • 2 GB of ECC DDR2 memory running at 800 MHz • Up to 8 GB of persistent
memory • Dual 10 GbE interfaces (AMC.2 Type 6 or AMC.2 Type 5 with 10 Gbps SFP+ on front panel)• Dual GbE interfaces (AMC.2 Type E2) • Front panel I/O includes an RS-232 serial and an optional SFP+ for 10 Gbps fiber connection • Available in PICMG
AMC.0 Revision 2.0 mid-size or full-size
www.jumpgen.com
XTech2hp AMC Extender RSC No. 38386Enables engineers to convert existing mid-size AdvancedMC modules to a full-size envelope • Uses a simple clip-on “side car” to enable the conversion • Works with single-width and double-width aluminum extruded faceplates from XTech • The extender forms a tight labyrinth, ensuring a rigid assembly and an EMI seal • It’s also compatible with both AMC.0 release 1.0 and 2.0 configurations
www.xtech-outside.com
A d v a n c e d M C s
Kontron
Kontron enhances its ATCA 10GbE portfolio with the introduction of the AM42xx Series of AdvancedMC GbE/10GbE Intelligent I/O modules.
Based on next-generation Cavium OCTEON™ Plus CN5650 multicore packet processors, the Kontron AM4204 with 4x 1GbE ports to the front and software configurable interfaces to the fabric side (PCIe, 4x 1GbE, or XAUI) and AM4220 with 2x 10GbE to the front and PCIe to the fabric side enable a proliferation of potential “NEP-Ready” Kontron platforms. These platforms can be dedicated for load-balancing, secure DPI, content-aware, and QoS over Ethernet applications.
When integrated with a Kontron ATCA 10GbE switch, these packet processor modules can provide exceptional added functionality, such as load balancing for Web Server, SIP Server, SSL Offload, and content- or application-aware processing applications. Likewise, they can sup-port QoS over Ethernet for IPTV, video on demand, and other broadband media services. When integrated with the Kontron OM5080 MicroTCA 2U platform, the AMC modules can be configured with other processor and storage AMCs for various integrated security services.
www.kontron.comRSC No: 39459
AM42xx Series
For more information, enter theproduct ’s RSC number at
www.advancedtca-systems.com/rsc
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12 y December 2008 y CompactPCI and AdvancedTCA Systems
2 0 0 9 b u Y e r ’ S G u I D e w w w. c o m p a c t p c i - s y s t e m s . c o m
TEWS Technologies LLCTAMC900-10 RSC No. 38367High-speed, high-performance A/D converter AdvancedMC with eight high-speed ADCs, preprocessing power by a Virtex-5 FPGA, high-speed onboard memory for full band-width snapshots • Form factor: PICMG AMC.1 Module, x8 PCI Express port (AMC.1 Type 8 compliant) • Virtex-5 LXT FPGA • 4 MB QDR-II SRAM • Analog-to-Digital Converter: 8X LTC2254 ADCs, 105 MSps, 14-bit • IPMI support
www.tews.com
TEWS Technologies LLCTAMC100-10 RSC No. 38368Standard single-width/mid-size or full-size AMC.1 (PCI Express) compliant carrier for one single-size IndustryPack (IP) module • PICMG AMC.1 Module, PCIe single lane (x1) on AMC Port 4 (AMC.1 Type 1 compliant) • ANSI/VITA 4-1995 compliant interface to one IndustryPack module • IPMI V1.5 support • Front panel LEDs • Self- healing fuses and RF-filtering on all IP power lines • Operating temperature: -40 °C to +85 °C
www.tews.com
Xalyo SystemsXS-AMC2 RSC No. 344204 x OC-3/STM1 or 1 x OC-12/STM-4 • 4 x GbE • ATM AAL0, AAL1, AAL2 & AAL5, and POS • Automatic protection switch-ing • Termination, switching, and interworking from any port to any port • Suits wireless networking, VoP, DSLAM, and media signaling gateways • Wintegra’s WinPath2 NP • Interface to handle both ATM and IP simultaneously • Onboard 24K MIPS processor can run advanced protocols (3GPP, SS7, ATM, VoIP) while the NP handles all the data path • Configu-rable I/O ports support a mix of: OC-3/STM-1, OC-12/STM-4, 10BASE-T, 100BASE-TX, 100BASE-FX, 1000BASE-T, and 1000BASE-X • Compliant with PICMG AMC.0, AMC.1, and AMC.2 • Bypasses current systems’ bottleneck by handling all the processing onboard and performing segmentation and reassembly locally, offloading the CPU on the carrier board and optimizing bus transfers while doing termination
www.xalyo.com
Annapolis Micro Systems, Inc.2.0 GSps 10bit A/D RSC No. 36021One e2v AT84AS004 (2.0 GHz, 10-bit) A/D • Four SMA front panel connectors: one 50-Ohm analog input, one single-ended 50-Ohm clock input or differential 1.65 V LVPECL clock input • One high-precision trigger input with Fs precision • High-precision trigger input – 1.65 V LVPECL, 2.5 V LVPECL, 3.3 V LVPECL • Analog input bandwidth is 100 KHz – 3.0 GHz • I/O card plugs onto Wildstar 4 or 5 VME/VXS/PCI-X/PCI Express/IBM blade main boards • JTAG, ChipScope, and serial port access • Full CoreFire Board Support Package for fast, easy appli-cation development • VHDL model, including source code for board level interfaces • Proactive thermal management system • Includes one-year hardware warranty, software updates, and customer support
www.annapmicro.com
Annapolis Micro Systems, Inc.Dual 4.0 GSps DAC RSC No. 36023One or two 12-bit analog-to-digital converters: MAX 19693 for 4.0, MAX 19692 for 2.3, or MAX 5859 for 1.5 GSps • Five SMA front panel connectors: 2 single-ended DAC outputs, 1 high-precision trigger input with Fs precision • 1 Universal single- or double-ended 50 Ohm clock input • High-precision trigger input mfg options – 1.65 V LVPECL, 2.5 V LVPECL, 3.3 V LVPECL • I/O card plugs onto Wildstar 4 or 5 VME/VXS/PCI-X/PCI Express/IBM blade main boards • JTAG, ChipScope, and serial port access • Full CoreFire Board Support Package for fast, easy application development • VHDL model, including source code for board level interfaces • Proactive thermal management system • Industrial temperature range
www.annapmicro.com
Hendon SemiconductorsIES5501 RSC No. 34720The IES5501 bus buffer is a true bidirectional bus buffer with low input-output voltages for use in 2-wire bus sys-tems such as IC, SMBUS, PMBUS, and IPMB • Fully I2C compliant switching levels and support for a wide range of 2-wire standards • Dual bidirectional unity gain buffer • Very low input to output offset voltages (typically 3 0 mV) • Multiple bus buffers allowed in cascade, multi-drop, or “daisy chain” fashion • Level shifting between bus voltages (1.8 V to 15 V) • Chip enable allows bus disconnection • Plugs in to live backplanes
www.bus-buffer.com
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Performance TechnologiesAMC122 RSC No. 38794AdvancedMC single board computer • 2.16 GHz Intel Core 2, dual-core architecture • Supports up to 8 GB DRAM • Onboard MiniSD card site with program and operating system storage space enable the module to boot without an external connection • TCP/IP Offload (TOE), iSCSI, RDMA on Ethernet channels • Enhanced Intel SpeedStep technology for more efficient power management • Low latency, high bandwidth • Compatible with Performance Technologies’ MicroTCA plat-form, the MTC5070 • Can be fully preintegrated using the company’s Linux OS and development environment, NexusWare
www.pt.com
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Continuous Computing1GbE ComputeSystem RSC No. 36002
3rd generation NEBS-compliant Flex21 supporting 90 W per slot • 1 GbE backplane fabric and TDM backplane • Integrated shelf managers with IPMI & console connec-tivity • Trillium protocol packages for IMS and NGN • Low cost development licenses available • On-site Trillium Professional Services available
www.ccpu.com
Innovative IntegrationCarrier Adapter Card RSC No. 37774PCI Express adaptation cards for XMC modules • XMC to PCI Express adapter board (8-lane) • Remote PCI Express peripheral expansion • Chassis expansion • PMC to PCI adapter board • Fast integration of COTS or custom I/O • Ultra-high bandwidth to/from daughter cards • Add XMC modules to PCI host systems • Custom interfaces to XMC P16 • XMC to PCI Express adapter board • Custom interfaces to XMC P1
www.innovative-dsp.com
Interface ConceptComEth4050a RSC No. 226316U/CompactPCI full Gigabit Ethernet switch PICMG 2.16 • 16 to 24 Ethernet ports compliant with 10/100/1000-BT • Layer 2 switching capabilities • VLAN services • Quality of Service engine • Flexible management tools • Online Virtual Cable Tester (Marvell VCT) with advanced cable diagnostic capabilities • Comprehensive Built-in Test (BiT) • Standard, extended, conduction-cooled, and rugged grades • 4 or 24 10/100/1000 Mbs Ethernet Rear Transition Module (standard and extended grades)
www.interfaceconcept.com
Interphase CorporationiSPAN 5639L RSC No. 39493T1/E1/J1 Communications Controller • Together with the iWARE Software Development Suite, delivers a comprehensive
high-performance connectivity solution for use in PCI Express enabled rack-mount servers • Applications: fixed, wireless, and IP Multimedia Subsystem (IMS)
infrastructure signaling equipment • 4 interfaces on 4 standard RJ-45 connectors, individually configurable as T1, E1, or J1 • High-impedance and monitoring capability • SS7 MTP2 LSL, HSL, SAAL, AAL5 • Linux and
x86/SPARC Solaris drivers • For more information, [email protected] or http://www.iphase.com/products/product.cfm/PCI%20Express/448
www.interphase.com
Interphase CorporationSlotOptimizer RSC No. 39492564GL PCI Express Low Profile Quad-Port Ethernet Adapter • Providing the highest levels of overall system performance while conserving valuable PCI Express slots, the 564GL is a solution for the new generation of small footprint and rack-mounted
servers that have limited expansion options for communications I/O • Supports both low profile and full height brackets • PCI Express x4, revision 1.1 low profile •
Low profile or full height face plate • Four independent 10/100/1000 Gigabit Ethernet ports • For more information, [email protected] or http://www.iphase.com/products/product.cfm/PCI%20Express/443
www.interphase.com
National InstrumentsNI PXI-5154 RSC No. 381142 GSps digitizer/oscilloscope, optimized for automated test • 1 GHz bandwidth • 2 GSps maximum real-time, up to 20 GSps equivalent-time sampling • 2 simultaneously sampled channels • Deep onboard memory: 8 MB/ch standard, up to 256 MB/ch • 100 mV to 5 V input ranges • 50 Ohm input impedance
www.ni.com
National InstrumentsNI TestStand 4.0 RSC No. 35233The new, streamlined sequence editor in NI TestStand 4.0 features preconfigured step templates and drag-and-drop test sequence development • Enhance enterprise system connectivity and reporting by integrating with requirements management, source code control, data management software, and the Automatic Test Markup Language (ATML)
www.ni.com
One Stop Systems Inc.6U CompactPCI Express RSC No. 36490CPU board • Two PCIe x8 and four PCIe x4 links to the backplane • Intel Core Duo 1.66 GHz processor • One PMC and one XMC site • RTM with CompactFlash and 2-1/2” SATA hard drive support • Video port to the onboard ATI Rage Mobility graphics controller in addition to one PMC site and one XMC site
www.onestopsystems.com
N e t w o r k i n g / C o m m u n i c a t i o n s
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N e t w o r k i n g / C o m m u n i c a t i o n s
North Atlantic Industries78CS2 RSC No. 38662The 78CS2 Multifunction card provides a broad assortment of I/O, Synchro/Resolver, and LVDT functions on one single card that can be controlled either via the CompactPCI or Ethernet port • Multiple functions on a single slot CompactPCI card • User can specify five different function modules • The card can be configured for 10 D/S channels, or in combination with A/D, D/A, discrete I/O, TTL I/O, RTD, S/D, Serial Data buses, LVDT, and DLV • Control via CompactPCI or Ethernet • Automatic background BIT testing continu-ally checks and reports health of each channel • Optional onboard 5 VA programmable reference supply • FIFO Buffering/Trigger (select modules) • Connections via front panel, rear connector, or both • Designed for commercial or MIL applications • Convection- and conduction-cooled versions • Software Support Kit and drivers available
www.naii.com
Pentek, Inc.7352 RSC No. 3867832-channel SDR • 3U CompactPCI •
Four 200 MHz 16-bit A/D converters • 32-channel digi-tal downcon-verter IP core installed in its Xilinx Virtex-5 FPGA • User-programmable filter coefficients
• LVPCL clock/sync bus for multi-
board synchronization • Complete software radio
interface solution
www.pentek.com
Pentek, Inc.7251 & 7251D RSC No. 38674
256-channel (Model 7251) and 512-channel (Model 7251D)
SDR • Four or eight 200 MHz 16-bit A/D converters • 6U CompactPCI board • 256- or 512-channel digital downconverter IP cores installed in Xilinx Virtex-5 FPGAs • LVPCL clock/sync bus for multiboard synchronization • User-programmable filter coefficients • Complete software radio interface solution
www.pentek.com
Polaris NetworksxTCA Test Tools RSC No. 39136Conformance test tools for AdvancedTCA, MicroTCA, and AdvancedMC technologies to assist TEM and system integrators in testing interoperability of building blocks and reduce development and integration time • Test cases as per PICMG specification requirement • The testers have been selected by CP-TA for certification testing • Stop or continue on error/warning/info • Test scripts of MicroTCA and AdvancedMC Tester are available in source code form and are editable • New tests may be developed by user in MicroTCA and AMC test tools • Complete decode of packets sent or received during the test run using the Miniscope Decoder • Interactive (operator-driven) and automatic tests • Test reports in HTML format with target device information in MicroTCA and AdvancedMC Test Tools and in text format in the case of AdvancedTCA Tester
www.polarisnetworks.net
Sun Microsystems, Inc.Sun WiMAX ROI Tool RSC No. 35889Routing • Authentication and security • Mobility management • Radio resource management • Connection management • Packet forwarding • Header compression • Traffic aggregation • Policy enforcement • Accounting and statistics
www.sun.com
Tundra Semiconductor CorporationTsi382 PCI Express Bridge RSC No. 39328Small form-factor, high-performance forward bridge that connects a single lane PCI Express (x1 PCIe) interface to the PCI bus standard • Smallest footprint x1 PCIe bridge
• RoHS compliant 10 x 10 mm, 0.8 mm ball pitch BGA package rated for industrial temperature operation (-40 °C to +85 °C) • A 20 mm x 20 mm LQFP pack-age option available for cost-sensitive applications • Incorporates deep buffering and a queuing architecture to minimize latency and maximize throughput • Short-term caching • Bridging: Transparent for efficient, flow-through configurations; Opaque: for multiprocessor configurations and enhanced private device support; Non-transparent: for isolating the PCIe and the PCI/PCI-X domains • No power sequencing restric-tions • Simple 2 voltage supply • Simplifies board layout and design, maximizing signal integrity and
reliability for high-speed serial signal routingwww.tundra.com
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orporation ww
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Astek CorporationA33603-MMC RSC No. 39488
High performance point-to-point storage fabric that fits your enclosure • 3 Gbps per port, 36 ports • Supports multilane aggregation for wide-port
configurations up to 12 Gbps • Can be cascaded to allow a single initiator to control thousands of target
disks • Supports connection to multiple initiators allowing Storage Area Network-ing and system redundancy • Supports SCSI Enclosure Services (SES) such as thermal monitoring and slot-mapping functions • Connects to both SAS and SATA hard disk drives • One-year limited warranty
www.astekcorp.com
Astek CorporationA3803-AMC RSC No. 39485Serial Attached SCSI (SAS) Host Board Adapter (HBA) • The only HBA card now available
in full-height, mid-size, and compact (half-height) form factor • 3 Gbps per port, 8 ports • Connects to both SAS and SATA hard disk drives • AMC.3 support • AMC.1 support for PCI Express (x1, x2, x4, or x8) • LSI Logic’s Fusion-MPT featuring
more than 140,000 I/O per second • Aggregate I/O port bandwidth of 24 Gbps and full duplex
capability • Leverages existing SCSI infrastructure for investment protection and ease of migration
• Allows point-to-point connection and higher availability with dual ported drives
www.astekcorp.com
Astek CorporationA33603-MCH RSC No. 39504Enables storage on the MicroTCA backplane • The Astek A33603-MCH technology platform provides the basis for building complete storage appliances in a MicroTCA platform • Integrated 36 port 3 Gbps SAS expander • Access to internal fabric via front panel IPASS connectors • Optional 24 port PCI Express switch • Supports both SAS and SATA hard disk drives for maximum performance or density • Pending MicroTCA.2 and MicroTCA.3 versions for outside plant and MIL-COTS installations • Supports Solid-State Disks (SSD) for extreme environments • One-year limited warranty
www.astekcorp.com
Astek CorporationA31003-SAS RSC No. 34888MicroTCA Storage Appliance System provides RAID-5/6 storage and iSCSI, NFS, and target mode SAS connectivity to host computers • Complete PICMG MicroTCA compliant system in 1U, 3U, or 6U form factors • With 4-12 disk AdvancedMC sites • Single or dual-redundant MCH and power modules • Single or dual-redundant RAID controllers • Connects to host computers via iSCSI or NFS over 1 GbE or 10 GbE (XAUI) interface • Can also support SAS bus connectivity from SAS hosts • Fully managed storage appliance offers RAID volume management and IPMI based system control compatible with Service Availability Forum specifications • Can use SAS, SATA, or solid-state disk media
www.astekcorp.com
Astek CorporationA7404-AMC RSC No. 39484Four channels of 4.25 Gbps Fibre Channel performance • Full-height, mid-size, and compact (half-height) form factor HBA card • Aggregate I/O port bandwidth of 17 Gbps matched to a 20 Gbps PCI Express interface • Four port, 4 Gbps Fibre Channel Host Bus Adapter with support for initiator and target mode SCSI and IP protocol • AMC.0,
AMC.1 compliant • Supports PCIe x8 for up to 20 Gbps of aggregate data transfer • Four independent channels at 4 Gbps each via SFP optical interface • Auto-negotiation support for 1, 2, and 4 Gbps links, fabric, point-to-point, and arbitrated loops • Operates as an initiator (HBA) or as a target mode device, allowing RAID systems
www.astekcorp.com
Astek Corporation
Astek Corporation offers a complete line of storage solutions in mezzanine cards, custom PCBs, and turnkey storage appliance systems. Astek has worked with parallel SCSI, Serial Attached SCSI (SAS), Fibre Channel, Parallel ATA, Serial ATA, solid state (Flash), and every major bus interface including PCI, PCI Express, InfiniBand, and HyperTransport.
• A3803-PMC - 8 port 3 Gbps PCI-X SAS Host Bus Adapter• A3803-AMC - 8 port 3 Gbps PCI Express SAS Host Bus Adapter, AMC.0, AMC.3 compliant• A7404-AMC - 4 port 4 Gbps PCI Express Fibre Channel Host Bus Adapter • A4XX03-SAS - Complete MicroTCA storage system from 4 to 12 AMC disk modules with up to 2.4 terabytes of storage• A31203-MCH - SAS enabled MicroTCA Carrier Hub • A33603-MMC - SAS bus expander on a module, add SAS fabric to any AdvancedTCA card or other form factor of your choice
www.astekcorp.comRSC No: 34991
Storage Solutions
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3M3M MiniSAS System RSC No. 39490The new 3M Mini Serial Attached SCSI (small computer system interface) External Cable Assemblies provide top performance for SAS storage • Capable of 6 Gbps per channel data rate • Tested to SAS Specification, SAS-2 • Conform to the SFF 8086, 8087, and 8088 standards as well as the current SAS 1.1 specification • Metal latch designed to promote retention • Pull tab ring pro-vides easier unmating • Two levels of EMLB for hot plugging
www.3M.com
Conduant CorporationBig River LTX2-35 RSC No. 39173Stand-alone recorder • Provides more than 500 MBps recording and playback performance in a space and power efficient package • Housed in a standard size 2U rack-mount chassis • Performance and capacity for mobile or portable recording and playback applications • System can operate independently from a host computer with command/control performed over a network
connection or using a web browser connecting to
the internal web server • Control can also be automated from a
software application using the StreamStor
software API from a network connected computer
• Maximum data rate: 500 MBps sustained •
Maximum capacity: 16 TB (using 16 1,000 GB hard disk drives)
www.conduant.com
Red Rock Technologies, Inc.RRT-1SHA-LW-X RSC No. 35041Extended operating temperature range VME hard drive module • Up to 160 GB capacity, -25 °C to +85 °C opera-tion, wide SCSI LVD interface, one VME slot, 6U form factor • -25 °C to +85 °C extended operating temperature range • Capacity of up to 160 GB rotating media hard drives; no additional software needed for operation as a bootable drive • Wide SCSI LVD interface available at front panel and P2 connectors; P2 cable adapter panel available • Fully configurable for 8-bit, single-ended and/or SCSI-2 operation, thus supporting legacy systems • Front panel status and activity LEDs • VMEbus form factor occupying one 6U slot
www.RedRockTech.com
SANBlaze Technology, Inc.AMC-62E RSC No. 34458AMC.3 compliant disk drive module utilizing newly avail-able extreme-environment SATA drives with enhanced thermal, shock, and duty cycle characteristics • The mod-ule provides storage up to 80 GB, with temperature sup-port of 0 ºC to +85 ºC, full (7 x 24) duty cycle and MTBF of 750,000 hours, combining the extended environmental requirements of NEBS and AdvancedTCA chassis with the price/performance of SATA disk technology • Augments existing AdvancedMC disk offerings from SANBlaze, which include solid-state disks, SATA disks, and SAS disks
www.sanblaze.com
White Electronic DesignsMedical CF Cards RSC No. 35353A line of CompactFlash cards tailored specifically to the medical community for devices such as ultrasounds, video imaging equipment, and drug infusion systems • Utilizing a proprietary technique at both the hardware and firmware levels, these cards have built-in protection to mitigate power-down related failures • Single level cell NAND devices provide 100,000 write/erase cycles per cell • Error detection and correction • Optional conformal coat-ing that provides protection and chemical resistance
www.whiteedc.com
Super Talent TechnologiesDuraDrive SSDs RSC No. 37038The DuraDrive SSDs come in industry standard hard drive form factors and use industrial grade SLC NAND Flash to offer the greatest possible reliability and endurance • Exceptional vibration and shock tolerance • Commercial and industrial temperature ranges making them suit
severe environments where reliability is critical • Inter-faces: SATA/IDE/ZIF • Form factors: 1.3"/1.8"/2.5"/3.5" • Capacities: 8-256 GB • Performance with SATA-II speeds and high reliability provided by MLC NAND Flash chips • No moving components • MasterDrive OX SSD consumes up to 85 percent less power than a hard disk drive
www.supertalent.com
SiliconSystems, Inc.SD II USB Blade RSC No. 38904Ultra-small form factor combines integrated advanced storage technologies with the robustness and locking mechanism of the SiliconBlade Socket • Fast data transfer rates • Read: 10 MBps • Write: 10 MBps • 512 MB capacities • 1 and 2 GB • High data reliability
• High shock and vibration tolerances • Wide operating temperature range
• Multiyear product life cycle • 4,000,000 hours of MTBF • 5-year warranty • Low power consumption • Lightweight
• No moving parts • Zero dB noise
www.siliconsystems.com
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RadiSys CorporationPromentum MPCBL0050 RSC No. 35998Single board computer • Dual-Core Intel Xeon processor LV 5138 • Combines Intel 64 Technology+ (Intel 64) with dual-core, dual-processing capabilities for a total of four processor cores on a single platform • Also supports an AMC and hard drive on the RTM • Fifth-generation design achieves significant performance improvements for compute-intensive and database-access applications including IP Multimedia Subsystems (IMS), wireless control plane, and IPTV • Supports first-generation AdvancedTCA chassis that limit front-board power to less than 200 W • Interoperates with AdvancedTCA products from RadiSys
and with third-party building blocks meeting PICMG 3.0
www.radisys.com
ADLINK Technology, Inc.aTCA-6900 RSC No. 38531Dual Quad-Core LV Xeon 10 Gigabit Ethernet AdvancedTCA Processor Blade • Quad-Core or Dual-Core LV Xeon processors • Intel EM64T 64-bit Extended Memory Technology • Dual channel DDR2-667 REG/ECC with 32 GB maximum capacity • Intel 5100/ICH9R chipset • Dual AMC.0 mid-size bays • Dual 10GBASE-KX4/ 1000BASE-BX Fabric interface channels
www.adlinktech.com
Advantech CorporationDual-Core ATCA Blade with 2 AMC RSC No. 35978Two Dual-Core Intel Xeon processors LV 2.0 GHz • Intel E7520 chipset supports 667 MHz FSB • Dual channel DDR2 400 MHz ECC registered SDRAM, configurable up to 16 GB • Four 1000BASE-BX ports on fabric interface, two 1000BASE-TX ports on base interface • Two PCI Express x4 (PCIe) AMC slots with style B/B+ connector • Supports optional Serial Attached SCSI (SAS) module
www.advantech.com
KontronAT8030 – 3xCore2 Duo RSC No. 39454AdvancedTCA Triple Intel Core 2 Duo processor blade with AdvancedMC support and integrated switch for 10 GbE on fabric • Suitable processor node for IMS clustering applications • Three Intel Core 2 Duo processors each with dedicated memory, plus one AdvancedMC slot and an integrated Gigabit switch fully manageable via PowerQuick III processor for 10 GbE on the fabric interface • One dual-core CPU could manage a live HDTV stream, the second a stored VoD stream, while the third could process data from a web server • Single AdvancedTCA node board occupies one slot in the AdvancedTCA chassis • Each CPU can be managed independently via IPMI •
Triple Intel Core 2 Duo • Dedi-
cated SDRAM
memory per CPU core
• One mid-size AdvancedMC bay •
PCI Express x4 and dual GbE connectivity
www.kontron.com
PDSi – Pinnacle Data Systems, Inc.ATCA-F1 Dual AMD Opteron Blade RSC No. 39364
The ATCA-F1 blade features two dual-core or quad-core AMD Opteron CPUs for high performance and low power consumption • Up to 32 GB
667 MHz memory • An AdvancedMC site and RTM interface provide I/O expansion capability (using PDSi ATCA-RT01) • Robust general-
purpose server platform for telecom, aerospace, military, and enterprise AdvancedTCA systems • NEBS Level 3 compliant
• Windows and Linux compatible • Customization welcomed • Extended availability assured • Visit http://www.pinnacle.com/products2/advancedtca/bladef1/ or contact [email protected], or e-mail
PDSi - Pinnacle Data Systems, Inc.ATCA-RT01 Advanced RTM RSC No. 39363
The ATCA-RT01 w/ Video & Storage provides high reliability SAS storage, VGA video output, andadditional I/O functionality for AdvancedTCA systems using x86 processor blades from
PDSi or Sun Microsystems, plus Sun’s Netra CP3260 blade • For telecom, aerospace,and military systems requiring a mix of these compute blades, the
ATCA-RT01 can provide a common RTM solution • NEBS Level 3compliant • Windows and Linux compatible • Customization welcomed • Extended availability assured • Visit http://www.pinnacle.com/products2/advancedtca/rtm/ or contact
[email protected], or e-mail [email protected]
Sun Microsystems, Inc.Netra CP3220 Blade RSC No. 35568Sun Microsystem’s AdvancedTCA Blade Server based on the AMD Opteron processor runs on the Sun Netra CT900 Server • Carrier-grade availability and maximum density for next-gen data centers • Single-socket, dual-core, quad-core-ready AMD Opteron processor • 10 GbE for breakthrough performance and lowered TCO • Support for Sun’s standards-based Advanced Rear Transition Modules • Standards-based AdvancedTCA I/O • Solaris 10 OS, Carrier Grade Linux, and Microsoft Windows 2003 Advanced Server
www.sun.com
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CP3250 RSC No. 37853AdvancedTCA blade server • Next-generation AdvancedTCA blade infrastructure with the Sun Netra CP3250 AdvancedTCA
Blade Server based on the Quad-Core Intel Xeon processor • Runs on the Sun Netra CT900 AdvancedTCA Server with the 10 GbE networking and AdvancedRTM technology, delivers performance, operating system choice, and choice of the new Sun Intel Xeon AdvancedTCA Blade as well as blades based on the AMD Opteron processor and the UltraSPARC T1 and T2 processors
www.sun.com
Sun Microsystems, Inc.Netra CP3260 Blade RSC No. 35569Sun Microsystem’s AdvancedTCA Blade Server based on UltraSPARC T2 processor – 64 threads and double the performance without changing the power and cooling requirements • Six- or eight-core UltraSPARC T2 processors with eight threads per core • Chip Multithreading Technology (CMT) for massive throughput • Extreme compute density per shelf and rack within an eco-friendly footprint • Multithreaded 10 Gigabit Ethernet (GbE) with packet classification • Sun Netra Data Plane Software enables line speed 10G network processing • Solaris 10 operating system for carrier-grade availability
www.sun.com
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JumpGen SystemsPRA-200 ATCA Node RSC No. 38940
Single-slot AdvancedTCA blade supporting 1 or 2 Intel low-voltage Xeon Quad-Core processors and either AdvancedMC, PMC, or SATA HD expansion options • 1 or 2 low-power Intel Xeon processor L5408 (quad-core) running up to 2.13 GHz or Intel Xeon processor L5238 (dual-core) up to 2.66 GHz or other Intel Xeon processors 5400, 5300, 5200, and 5100 Series • Intel 5100 Memory Controller Hub supporting Front Side Bus up to 1333 MHz • Up to 32 GB of ECC DDR2 memory running at 667 MHz • Up to 16 GB of SSD (useable as persistent memory) • PICMG 3.1 Dual 10 GbE AdvancedTCA Fabric Interfaces (Option 9); also functions as 1 GbE (Option 1) • Dual GbE AdvancedTCA Base Interface • AdvancedMC, PMC, XMC, or SATA HD expansion options • Front panel I/O includes 10/100/1000BASE-T Ethernet, RS-232 Serial, and USB • RoHS-compliant
www.jumpgen.com
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For more information, enter theproduct ’s RSC number at
www.advancedtca-systems.com/rsc
MEN Micro Elektronik GmbH3U Managed 8-Port Ethernet Switch RSC No. 38964
3U managed 8-port Ethernet switch with RJ-45 • 3U, 18 HP, 19" rack mountable • 8 Fast Ethernet ports (front) • RJ-45 connectors • Power over Ethernet (PoE) functionality • Configuration via Web interface, Telnet command line interface, SNMP ver. 3 or hardware key • Service interface via D-Sub • Status LEDs for all ports, PoE and board state • Wide input range PSU (14 to 154V), EN50155 qualified • -40 ºC to +85 °C with qualified components
www.menmicro.com
KontronAT8904 10 GbE Switch RSC No. 39455AdvancedTCA 10 GbE Hub board with 10 GbE AdvancedMC uplinks • Suitable platform for open modular-based broadband
media servers used to support Video on Demand (VoD) from a library of movies, delivered over DSL or CableTV networks, as well as VoD short videos from online service platforms,
such as YouTube, delivered to mobile phones and wireless clients • Two AdvancedMC slots to host any of the following: Processor AdvancedMC modules as main controllers; storage AdvancedMC modules as mass storage devices for Processor AdvancedMCs • Dual 10 GbE uplink
AdvancedMCs to interlink the fabric www.kontron.com
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Extreme Engineering SolutionsXPedite6201 RSC No. 37404Dual Freescale 7447A/7448 PowerPC Processor PMC module with two GbE ports • Dual Freescale 7447A/7448 PowerPC processors running at up to 1.4 GHz • Up to 1 GB of DDR SDRAM • Up to 128 MB of soldered flash • Two GbE ports • PTMC configuration 5 P14 Ethernet • Bellcore 1089 surge protection • Two RS-232 serial ports • PCI-X interface • VxWorks BSP, Linux LSP, QNX Neutrino BSP, Green Hills INTEGRITY BSP
www.xes-inc.com
General Standards CorporationPMC66-18AI32SSC1M RSC No. 39197
PMC66-18AI32SSC1M provides 32 channels of 1 MSps with individual A/D per channel • 256 K-Sample FIFO
data buffer • Sampling controlled by an internal rate generator, a software trigger, or externally • Hardware sync I/O for multiboard operation through both front panel and internal ports • On-demand internal autocalibration of all channels • Completely software-configurable • No field jumpers • Single-width PMC form factor with integral EMI shield
www.generalstandards.com
General Standards CorporationPCI Express Choices: Free Drivers & Loaner Boards RSC No. 39196Adapters for PMC to PCI Express, both 1-lane and 4-lane • Allows a user to adapt the wide variety of PMC I/O cards to PCI Express • Thus, development efforts can proceed while the PMC cards are being re-spun for a true PCI Express form factor
• Adapters are transparent to software • Final PCI Express cards can be used immediately upon arrival
www.generalstandards.com
PDSi - Pinnacle Data Systems, Inc.XMC-E24D/PMC-E24D Dual Graphics RSC No. 39360The XMC-E24D and PMC-E24D are versatile, low-cost, high-performance graphics
mezzanine cards featuring the ATI Radeon E2400 graphics controller • Independent
DVI-I and VGA outputs support 2D and 3D graphics at resolutions up to 1600x1200 (digital) or 2048x1536 (analog) with 32-bit color • LVDS
output also available • Bring modern graphics to CompactPCI and VME systems
• Windows, Linux, and Solaris x86 compatible • Customization welcomed • Extended availability
assured • Contact [email protected] or e-mail [email protected]
www.pinnacle.com
PDSi - Pinnacle Data Systems, Inc.XMC-GBX4 Quad Ethernet Adaptor RSC No. 39362The XMC-GBX4 is a high-performance, low-latency network adaptor providing four high-
speed Ethernet interfaces • Intel 82571EB controller eliminates performance bottlenecks and efficiently handles packets, including jumbo
frames • Provides four Gigabit copper ports with front-mounted RJ-45 connectors and full status indicators, or four rear-accessible SERDES ports • Windows,
Linux, and Solaris x86 compatible • Customization welcomed • Extended availability assured • Contact
[email protected] or e-mail [email protected]
www.pinnacle.com
P m C s P r P m C s
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PrPM
Cs Data Device Corp. (DDC)
BU-65569T/BX RSC No. 38892Single- or multichannel MIL-STD-1553 CompactPCI/PMC card, offering one to four dual redundant 1553 channels on a convection-cooled card • 32-bit/33 MHz CompactPCI card • PICMG certified • One to four dual redundant MIL-STD-1553 channels • Enhanced Mini-ACE BC/RT/MT architecture • 64K-word RAM per channel • Highly autonomous Bus Controller architecture • RT buffering options • Selective Message Monitor • Supports PCI interrupts • VxWorks software driver • Windows 95/98/2000/XP and Windows NT drivers
www.ddc-web.com
Excalibur Systems, Inc.EXC-1553ccPMC/Px RSC No. 34434A multichannel (up to four) MIL-STD-1553 interface board for conduction-cooled PCI Mezzanine Card (PMC) compatible computers • Each dual redun-dant 1553 channel can operate simultaneously as a Bus Controller and up to 32 Remote Terminals and as a Triggerable Monitor and is compatible with all common variations of MIL-STD-1553 (A, B) • In addition, error injection (BC and RT modes), error detection (all modes), and cableless internal loop-back are supported on each channel • Supplied with C drivers, including source code, and Merlin+ Windows software
www.mil-1553.com
JumpGen SystemsPRX-100 PrPMC/XMC RSC No. 39315A PMC or XMC • Intel EP80579 Integrated Processor with Intel QuickAssist Technology and 2 GB of soldered ECC DDR2 memory • The PRX-100 supports 3 GbE interfaces • Intel EP80579 Integrated processor running up at 600 MHz, 1.066 GHz, or 1.2 GHz • Up to 2 GB of ECC DDR2 memory running up to 800 MHz • Up to 8 GB of SSD (also usable as persistent memory) • Dual 1 GbE interfaces through PMC (PICMG 2.15, Configuration 5) or XMC connector • Other I/O includes SATA, GPIO, 2 USB, and 2 COM through PMC or XMC connector • Front panel I/O, 10/100/1000BASE-T Ethernet • RoHS compliant
www.jumpgen.com
Technobox, Inc.5012 RSC No. 39351Bridged PMC-X to PCI-X adapter • Adapts PMC or PMC-X modules to PCI or PCI-X • Intel 31154 bridge • Supports PCI (33/66 MHz) and PCI-X (66/100/133 MHz) • Rear I/O support • LEDs for key PCI bus signals and power • RoHS compliant
www.technobox.com
Technobox, Inc.4978 RSC No. 393538-lane 3 Gbps SATA/SAS controller PMC with dual SFF-8470 front
panel connectors • Rates up to 3 Gbps per lane • LSI SAS1068 • Onboard storage of user defined parameters, BIOS, and mirroring
data • Eight sets of onboard LEDs convey device status and activity • RoHS compliant
www.technobox.com
P m C s P r P m C s
Octasic, Inc.Vocallo RSC No. 39306Multicore media gateway solution • DSP platform for voice and video over IP applications • Supports applications such as 3G-324M, video phones, video-conferencing, and video-enabled services with capabilities such as real-time video transcoding, video transrating, and conferencing • Media API integrates H.263, MPEG-4 and H.264 codecs and several real-time video processing functions • Codecs designed to deliver quality video on error-prone, bandwidth-constrained wireless networks • Codecs include error resilience and concealment techniques, minimizing packet loss effects • The bit rate controller uses an advanced Variable Bit Rate mode, which allows more channels to be carried on a given link • Integration of voice and video allows frame rate control
www.octasic.com
For more information, enter theproduct ’s RSC number at
www.advancedtca-systems.com/rsc
Vo I P
VoIP
For Single Print Only
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Enclosures2 0 0 9 b u Y e r ’ S G u I D ew w w. a d v a n c e d t c a - s y s t e m s . c o m
Sponsored by Carlo G
avazzi Com
puting Solutions ww
w.gavazzi-com
puting.com
ChomericsCHO-SEAL Soft EMI RSC No. 39344Very soft molded elastomer EMI shielding gasket • Typically 35 ±5 Shore A durometer hardness • Low 9 percent compression set • Superior mechanical performance, electrical conductivity, and long-term stability • Reduced assembly costs as compared with higher hardness shielding materials • Shielding effectiveness greater than 70 dB from 100 MHz through 10 GHz • Available in various product forms including compression molded sheets, die-cut parts, and custom molded shapes with available thicknesses ranging from 0.010-0.125 inch (0.25-0.18 mm)
www.chomerics.com
Carlo Gavazzi Computing Solutions535 Series RSC No. 35873
Redundant IPMI system manager • CompactPCI 2.16 fabric backplane with two fabric switch slots and legacy 64-bit/33 MHz bus • RoHS and NEBS Level 3 compliant • Hot swap 400 or 600 W power supply • Front replaceable speed-controlled and monitored fan tray • 15.75" (9U) high x 12" deep enclosure rack mountable
www.gavazzi-computing.com
Carlo Gavazzi Computing Solutions716 Series RSC No. 34423
A series of conduction-cooled rugged ATR enclosures avail-able in standard ARINC sizes that include 1/2 ATR short to 1-1/2 ATR long and any custom form factor required • VME, VME64x, VXS, and CompactPCI architectures in 3U and 6U • A compact-sized and lightweight line engineered for maximum flexibility, strength, and cooling in a range of harsh-environment applications • Incorporates configurable conducting walls • Can be customized for a wide range of thermal requirements
www.gavazzi-computing.com
ELMA Electronic2nd gen 5U AdvancedTCA Chassis RSC No. 38556System platform offers dual redundant fan trays, shelf managers, and A/C power supply options • Side-to-side cooling via plug-in fan trays with dual 170 CFM fans with pulse width modulation control • The redundant push/pull configurations of the fans offer higher levels of reliability • The fans reach the back of the chassis for cooling the rear I/O slots • Dual 1200 W AC power supplies and dual shelf managers, which are all front pluggable above the card cage • DC power versions are also available • 19" rack-mount unit with rugged steel construction • 2nd gen shelf manager with bused or quasi-radial IPMB routing • Elma’s unique board mating receptacle on the card guides provides secures grounding and accurate alignment and accepts wide tolerances of the alignment pin spacing
www.elma.com
Hartmann ElektronikPXI Desktop Enclosure RSC No. 33732CompactPCI/PXI Desktop Premium housing • 63 HP 4U, aluminum: anodized, top/bottom cover: aluminum, powder coated RAL 9005 • Inside clear chromated • Cover angle with handle • EMC support, EMC stripes • Adjustable legs • Design side panels, very rigid • 3 x fans, 80 x 80 x 25 • Front handles
www.hartmann-elektronik.de
KaparelPicoTCA 2U Shelf RSC No. 39612Complies with PICMG MicroTCA.0 R1.0 and AMC.0 R1.0 • NEBS compliant • Hot-swap compatible • 19" rack-mount, 482.6 mm, 2U, 254 mm deep • Includes 2 hot swappable fan trays (push-pull) and exchangeable air filter • Stainless steel construction provides
excellent corrosion resistance • RoHS compliant • Accommodates up to 12 AMCs and 1 MCH • AC/DC power supply, max. 450 W: Input voltage 90 VAC max. 264 VAC with PFC • Backplane with inte-grated JTAG connectors for debugging and testing • Support for up to 12.5 Gbps • Full range of faceplates and filler panels • Air management panels and handles available
www.kaparel.com
KaparelAdvancedTCA Shelf RSC No. 3786819” rack-mount, 482.6 mm, 5U, 400 mm deep • Stainless steel construction provides
excellent corrosion resistance • Available with full mesh or dual star backplane topology • Can accommodate Intel Wagontire, Pigeon Point, and VadaTech shelf managers • Slot cooling of up to 200 W (at the front) • Slot cooling of up to 30 W per RTM • 2 switch slots (horizontal with RTM) • 2 built-in fan trays • Full range of faceplates, filler/air management panels, and handles available
www.kaparel.com
KaparelMicroTCA 5U Shelf RSC No. 39613Complies with PICMG MicroTCA.0 R1.0 and AMC.0 R1.0 • System availability of at least 99.999% • Hot swap compatible • 19" rack-mount, 482.6 mm, 5U, 200 mm deep • Fan
and filter unit (for development systems) • Stainless steel construction provides excellent corrosion resistance • Available with 14 slots • MCH and AMC and power modules plugged directly into the backplane • Compact design for variable installation • RoHS compliant • Slot cooling 20-80 W per module • Full range of faceplates and filler panels, air management panels, and handles available
www.kaparel.com
SOUTHCOCompactPCI Ejector Handle RSC No. 37287Microswitch protection against short circuits during modular board hot-swapping in network, telecom, and general computing applications • Ergonomically friendly design for easy operation • Ample grip and a straightforward action with low operating force to simplify the user experience
www.southco.com
e n c l o s u r e s
Carlo Gavazzi Computing Solutions
Model 646 is a 3U, 2-slot AdvancedTCA system offering flexible power options in a tightly integrated system for maximum flexi-bility in a range of communications applications. The Field Replace-able Units (FRUs) of the 646 2-slot AdvancedTCA system feature dual redundant AC and DC power inputs at 600 W.
The system’s thermal management provides high pressure, high flow rate axial fans used in a separated push-push configuration for cooling more than 250 W per slot. The rear thermal management has the capability to cool 30 W per slot. The system includes the Carlo Gavazzi SMM04 Shelf Manager Carrier card containing a Pigeon Point ShMM 500 module and integrated thermal management. The thermal management system includes temperature monitoring, pulse modulation fan control, air intake, and exhaust monitoring thus enabling efficient diagnostics and increased system performance. The 646 2-slot AdvancedTCA from Carlo Gavazzi Computing Solutions provides an Intelligent Platform Management Interface that is compliant with the PICMG 3.0 AdvancedTCA specifica-tion. The system does not include any chassis cabling, ensuring both high availability and reliability.
www.gavazzi-computing.comRSC No: 35258
Model 646 2-slot
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AdvancedTCA Chassis RSC No. 3856414 slots • 19-inch subrack • RoHS compliant steel construction with black finish • Custom chassis available • Front and back cable trays • Fine heat dissipation
www.leanpac.com
Schroff a Brand of Pentair Electronic PackagingAdvancedTCA Systems RSC No. 35880Broadest range of 2- to 16-slot AdvancedTCA systems • AC and DC options for both NEBS
Telco and cost-sensitive enter-prise requirements • Backplane topology options including dual star, full mesh, and triple replicated mesh with bused or radial IPMB • Proven high-performance thermal solutions for 200 W per slot and beyond • Schroff Shelf Management Architecture based on Pigeon Point ShMM-500 technology • Full range of accessory products including air baffles, front panels, test boards, and cabinets • Engineered custom configurations to meet your exact requirements
www.schroff.us
Schroff a Brand of Pentair Electronic PackagingCompactPCI Systems RSC No. 37839CompactPCI backplane designs that support various options for PICMG 2.16, H.110 CT, and
32/64-bit • Intelligent monitoring for temperature, fan control, and power supply status • 1U through 12U rack-mount systems with redundant hot swappable cooling solutions • Solutions with pluggable or fixed AC or DC power supplies • Optimized backplane design
for lower layer count and high performance • Engineered thermal solutions using FloTherm simulations and empirical testing
www.schroff.us
Schroff a Brand of Pentair Electronic PackagingIEA-R Handle RSC No. 35879Robust die-cast latch • Intuitive inject/eject operation • Industry-leading ergonomic design • Push-button activation of microswitch • Positive locking with audible feedback • ID labels for customization
www.schroff.us
Schroff a Brand of Pentair Electronic PackagingMicroTCA Enclosure RSC No. 39214Meets PICMG MicroTCA.0 R1.0 specification • Allows for 12x single, mid-size AdvancedMC and 2x single, full-size MCH modules • 2x MicroTCA power module slots with options for up to 12 HP per module • Backplane, dual star connection for GbE and fat pipe/extended fat
pipe, direct connections for the storage interface • Active cooling via
2x rear pluggable Cooling Units (CU) for front-to-rear cooling • Each CU has a
Schroff Enhanced Module Management Controller (EMMC) • Front removable air filter and upper fixed cable management
www.schroff.us
e n c l o s u r e s
For Single Print Only
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MicroTC
A2 0 0 9 b u Y e r ’ S G u I D ew w w. a d v a n c e d t c a - s y s t e m s . c o m
Sponsored by Performance Technologies w
ww
.pt.com
Concurrent Technologies, Inc.SY AMC/205 RSC No. 38767
MicroTCA development system • Supports 4 single-width and 1 double-width AdvancedMC • Supports PICMG MicroTCA.0 1.0 and PICMG AMC.0 • MicroTCA backplane provides 5 vertically mounted card slots: 1 AdvancedMC double-width full-height slot; 4 AdvancedMC single-width full-height slots; 1 MicroTCA Carrier Hub slot; 1 MicroTCA Power Input Module slot
www.gocct.com
ELMA ElectronicMicroTCA EcoBox System Platform RSC No. 39607
Low-cost MicroTCA system platform • Desktop or rack-mount • One MCH and 5 single AdvancedMC slots • Power Module (PM) uses a 300 W ATX power supply • IPMI for voltage supply and control is integrated on an active backplane • Active BP management includes 3.3 V, in-rush current control and over-current protec-tion • Tested with various industry-standard MCHs and AdvancedMCs • Direct SATA connections • PCIe
links integrated on the BP • Optimized via signal integrity studies
www.elma.com
Hybricon Corp.Rugged MicroTCA RSC No. 38483Full ATR long chassis with a shock-mounted MicroTCA card cage for all rugged environ-ments • 10.5" (W) x 10.625" (H) x 19.62" (D) with front to rear airflow • MIL-STD-461 EMI containment; fully EMI gasketed • Top load MicroTCA/AMC cards • MicroTCA Card Cage supports a front 150 mm section and rear 75 mm section with air flowing through the two series front to back • AC/DC front end power supply supporting 110/220 VAC operation with 48 VDC output to DC MicroTCA Power Module • 150 mm front row, 3 full-size double-width (150 mm) slots for 150 mm AMC, 2 full-size double-width slots with conversion module to convert to (2) single-width slots • Designed to meet MIL-STD-461E; CE102, CS101, CS116, RE101, RE10 • Low smoke wiring (no PVC)
www.hybricon.com
Performance TechnologiesMTC5070 RSC No. 36463A highly integrated 1U MicroTCA platform supporting up to six mid-sized AdvancedMC mod-ules • Designed for deployment in telecom, defense, aerospace, enterprise, and commercial
applications • Integrated Ethernet switch with dual 1 GbE uplinks • Integrated PCIe switch • Integrated MicroTCA
carrier and shelf managers • Front to rear, push/pull cooling • Power and cooling support up to 40 W per mid-sized, single AMC module •
AC or DC power input options • Fully compliant with MicroTCA.0, AMC.0,
AMC.1, AMC.2, and AMC.3
www.pt.com
VadaTech Inc.AMC220 RSC No. 39518AMC packet processor for dual 10 GbE and/or TOE • AMC.1 • Single-width, mid-height
(full-height option available) • Cavium OCTEON CN56xx/CN57xx multicore • MIPS64 processor
• Options for 6 to 12 processor cores • Options for 600 MHz to 1 GHz speed grade • DDR2 with ECC memory • Two SFP+ socket supporting 10 GbE • PCIe x4
www.vadatech.com
VadaTech Inc.AMC341 RSC No. 39487AMC dual channel DVI/VGA with HDMI video/audio • Based on ATI graphics processor
chipset • Provides two separate high-performance Dual DVI or VGA channels • Support of the latest
high-resolution and wide-screen displays such as QXGA (2048x1536) at 75 Hz, 2560x1600 at 60 Hz • 128 MB of memory • Analog displays
(VGA) 2048x1536 • Optimized for DirectX 10 • Optional “Y” adapter cable to convert the LFH
connector to DVI-I connectors or VGA • HDMI with multi-channel 5.1 surround audio • AMC.1 compliant • PCIe x4
or x8 lanes • Single-width, mid-height, or full-height
www.vadatech.com
VadaTech Inc.UTC001 RSC No. 39517MCH for MicroTCA chassis • Single-width, full-height module per AMC.0 • 400 MHz RISC
CPU with 64 MB DDR for MicroTCA Carrier Manage-ment Controller (MCMC) and Shelf Manager •
IPMI 2.0 compliant • Redundant boot system to ensure fail-safe upgrades • Fail-over with dual UTC001 in system • GbE to each AdvancedMC (Managed Layer Two) •
SAS/SATA to each AdvancedMC • Nonblocking PCIe x4 Gen 2 to each AdvancedMC slot with
option for SRIO or 10 GbE (Layer Three managed) • Telcom/GPS clock (Stratum-3) • Fabric clock with
Spread Spectrum capability • Linux 2.6 embedded OS
www.vadatech.com
For more information, enter the product ’s RSC number atwww.advancedtca-systems.com/rsc
m i c r o T C A
Performance Technologies
Performance Technologies’ MicroTCA™ platform family consists of highly integrated 1U platforms; each supporting up to six mid-size, single AdvancedMC™ (AMC) modules. The innovative architecture maximizes payload slot density and at the same time minimizes overhead costs by incorporating platform infrastructure functions such as the Ethernet switch, PCI Express® switch, carrier/shelf manager, and power supplies into the rear of the chassis. The chas-sis are the first 1U MicroTCA platforms to feature front-to-rear cooling, making them ideal for NEBS specified installations. Both PCI Express and Ethernet switching are supported to each slot, while storage is accom-modated by direct SATA/SAS slot-to-slot connections between the AMC sites. The onboard platform management subsystem provides MicroTCA compliant carrier and shelf management. Performance Technologies’ MicroTCA solution set is rounded out by a line of cost-effective and high-performance AdvancedMC modules that include x86 processor modules, PowerPC® processor modules, a storage/video module, and a synchro-nous WAN Communications module. Integrated with the company’s NexusWare® Linux® OS and development environment, Performance Technologies’ fully deployable MicroTCA platforms and flexible AMC mod-ules are designed to be the foundation for applications in telecommunica-
tions, wireless, aerospace and defense, and commercial applications.
www.pt.comRSC No: 39606
MicroTCA Family
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NextronicsMicroTCA Single Shelf 6U Subrack RSC No. 38341MicroTCA.0, single-shelf MicroTCA subrack • 21 mid-size slots • RoHS compliant steel • Extension area for custom design • Fan tray and filter trays included • Card guide plate instead of single card guides
www.leanpac.com
Simon IndustriesMicroTCA Chassis RSC No. 33223MicroTCA table-top development chassis • Well-suited for developing and debugging MicroTCA systems using full-height and half-height AdvancedMC modules • Utilizing the Molex Dual-Star backplane can facilitate hardware and software development, accelerate time to market, and allow developers to evaluate various AdvancedMC cards, power supplies, and MCH products • Blind mating connectors to enable live replacement of the fan tray without powering down the chassis • Molex press-fit edge card connectors combined with precise launch geometry, minimizing reflections, and enabling 10 Gbps over each dif-ferential pair, allowing backplane to handle up to 4 times the bandwidth of other backplanes • Spacing between pairs of at least 0.25 mm (0.010") to minimize crosstalk
www.simonindustries.com
VadaTech Inc.UTC010 RSC No. 39486
Power module for MicroTCA chassis • Single-width, full-height module per AMC.0 • Dual -36 VDC to
-75 VDC input • Blue, red, amber, and green LEDs • Field upgradable • IPMI 2.0 compliant • HPM.1 compliant • 792 W (available in 396 W) • Hot swappable • Support for power module
redundancy • Dual IPMI bus • Two banks of 256K flash for redundancy
www.vadatech.com
Degree Controls, Inc.ATM2400 RSC No. 36932Connect 36 air velocity and airflow temperature, thermo-couple, and/or humidity sensors • Validate thermal and airflow models quickly and accurately • Measure air and temperature in multiple locations simultaneously • Small sensors access remote and compact locations • USB connection to PC, easy to use – just plug in and start measuring • Airflow measurement accuracy 5 percent of reading from 0 °C to +70 °C
www.degreec.com
Degree Controls, Inc.Rugged Fan Controllers RSC No. 37434Rugged military fan controllers • Meet both MIL-STD-461 for EMI/EMC and MIL-STD-810F for environmental constraints • The family of products utilizes micro-controller designs and DegreeC software to monitor system temperatures and adjust fan speed(s) accordingly • Programmable alarm thresholds can be set, along with speed curves that more precisely adjust temperatures to minimize thermal shock or deal with specialized ambient conditions
www.degreec.com
Simclar GroupTurboFabric Chassis RSC No. 34702TurboFabric is a range of highly scalable PICMG 3.0 compliant AdvancedTCA shelves designed to support IEEE 802.3 10GBASE-KR data transmission making 40 GbE switch fabrics a reality • Full mesh and dual star fabrics available • 14-slot 19-inch CP-TA Class B.4 thermal performance • Pigeon Point based Shelf Management Module • NEBS ready • 5-slot, 2-slot, and 16-slot options
www.simclar.com
XTechExternally Adjustable AMC BaffleRSC No. 37285
Uses a faceplate mounted control knob to control airflow • With the external control knob, users can direct airflow away from blank boards and towards the active boards where the flow is most needed
www.xtech-outside.com
Ther
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Man
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For more information, enter theproduct ’s RSC number at
www.advancedtca-systems.com/rsc
m i c r o T C A
For Single Print Only
CompactPCI and AdvancedTCA Systems y December 2008 y 29
Packet Processing2 0 0 9 b u Y e r ’ S G u I D ew w w. a d v a n c e d t c a - s y s t e m s . c o m
Sponsored by Continuous C
omputing w
ww
.ccpu.com
Emerson Network Power Embedded ComputingAMC-9210 AMC Module RSC No. 38660Packet processing solution for broadband networks • AMC.0 R2.0 mid-size and full-size AdvancedMC module • Cavium Networks high-performance OCTEON Plus CN58xx family
of packet processors • 4x GbE (AMC.2) plus x4 PCI Express (AMC.1) to carrier and 4x GbE small form factor plug-in (SFP) interfaces on front panel • 2x 1000BASE-BX interfaces to carrier • Hot swappable • Integrated IPMI
Interphase CorporationiSPAN 55MC8 PCI-X Quad SFP GE Packet Processor RSC No. 39491Extends the broad Interphase portfolio of communication and network processor solutions
for use with PCI-X enabled rack-mount server platform solutions • Addresses the growing need for wire-speed
packet inspection and processing for the delivery of broadband services in enterprise, wireless, Voice over IP, and IMS network infrastructure • PCI-X
card for rack-mount server form factor • OCTEON Plus 58xx multicore processor up to 750 MHz
• Wire-speed IPSEC acceleration • 4x SFP GbE interfaces on front panel • Up to 4 GB RAM • For more information, fastnet@
iphase.com or http://www.iphase.com/products/product.cfm/PCI/441www.interphase.com
www.emersonnetworkpower.com/embeddedcomputing
KontronAM4204/AM4220 RSC No. 39459Kontron portfolio of AMC Intelligent IO modules based on next-generation Cavium OCTEON Plus CN5650 multicore packet processors •Two Intelligent AMC modules • Kontron AM4204 with 4x 1GbE ports to the front and software configurable Interfaces to the Fabric side (PCIe, 4x 1GbE, or XAUI); and the Kontron AM4220 with 2x 10GbE to the front and PCIe to the fabric side • These modules enable a proliferation of potential “NEP-Ready” Kontron platforms dedicated for: load-balancing; secure DPI; content-aware and QoS over Ethernet applications • When integrated with a Kontron ATCA 10GbE switch, these packet processor modules can provide exceptional added functionality, such as load balancing for Web Server, SIP Server, SSL Offload, and content- or application-aware processing applications
www.kontron.com
Continuous Computing
FlexPacket™ ATCA-PP50 offers Network Equipment Providers(NEPs) Deep Packet Inspection (DPI) capabilities that support advanced content-aware services as well as security in next generation multi-service IP networks.
The blade is engineered to manage the rapid growth in bandwidth driven by next-generation infrastructure and services including IPTV, fixed and mobile broadband, and network security platforms.
Features• Dual processor XLR732 multi-core MIP64 processor (up to 64 vCPU)• Integrated 10 Gbps security acceleration engine• Up to 16 GB memory to support millions of packet flows and users• Onboard TCAM for high-performance routing and pattern matching• Multiple 10 GbE and 1 GbE ports with copper and fiber support (SFP/SFP+)• Comprehensive range of fast path functions and telecom protocols for XLR
www.ccpu.comRSC No: 36001
FlexPacket ATCA-PP50
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GE Fanuc Intelligent Platforms, Inc.WANic 5654 RSC No. 38894High-performance packet processor PCI Express card • Cavium OCTEON Plus 12-core
600 MHz CN5650-NSP processor • Up to 4 GB of high-speed DDR2 SDRAM packet memory via VLP
mini-RDIMMs • 4 front panel access ports of GbE • Optional 32 MB of DDR SDRAM
persistent memory • Up to 4 GB Flash Disk (optional) • x4 lanes of PCI Express
host interface • XAUI board-to-board interconnect • Software support includes
Debian Linux, LSP, UBoot, and POST • Designed for NEBS compliance • RoHS compliant
www.gefanuc.com/embedded
GE Fanuc Intelligent Platforms, Inc.Telum ASLP11 RSC No. 38385High-performance processor AdvancedMC module • Up to 4 GB of ECC memory • Intel Core 2 Duo L7400 1.5 GHz CPU • Single width, full- or mid-sized AdvancedMC processor board • Suitable for distributed AdvancedTCA/MicroTCA processing applications such as wireless base stations, voice over packet, test and measurement, server blades, and other enterprise-wide computing • Onboard x8 PCIe controller and associated FCLKA fabric clock may be configured as either the root controller for a subtending PCIe subnet or as an end node (target) on a PCIe subnet • Defined by the host system during power up • Superior flexibility
and enhanced price/performance • Allows the host system to deploy dis-
tributed processing resources to support more sophisticated
network applications • Designed to be more reliable
through the use of solder to attach all components to the board
www.gefanuc.com/embedded
P a c k e t P r o c e s s i n g
Continuous Computing
FlexTCA™ DPI Systems are targeted at Network Equipment Providers (NEPs) creating LTE and 3G platforms. This includes next generation core network solutions such xGSN, Serving Gateway, MME and others. FlexTCA is a scalable bladed solution that combines high-performance switch-ing with 80 Gbps uplink capacity, leading edge quad core compute blades for control plane applications and specialized packet processing for bearer plane, security and DPI func-tions. Trillium® protocol software may also be pre-integrated for fastest time to market.
System Benefits• Capacity up to 80Gbps, fully redundant configuration• Scalable solutions from 2U to 12U• Customize to balance control and bearer plane processing requirements• Common platform underpins many different core network devices• Leading edge quad core compute and RMI XLR packet processing technology• Trillium Multi-Core protocol software
www.ccpu.comRSC No: 36000
FlexTCA DPI System
For Single Print Only
Sponsored by HA
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Connectors
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3M3M MetPak HSHM RSC No. 39489Using a highly flexible and modular high-speed connector technology from 3M Electronics – the High-Speed Hard Metric (HSHM) implemented on computer boards: single board computer • Up to 5 Gbps data rate • Modular/scalable format per IEC 61076-4-101 • Low cross talk at high frequencies • 50/100 – (single-ended/differential) impedance • 63 mated lines per linear inch • Dual beam contact construction for high reliability
www.3M.com
American Conec CorporationAMC Connectors RSC No. 39273High-speed AdvancedMC backplane connectors for MicroTCA applications • 170-position Advanced Mezzanine Card Edge Connector • Designed to handle data transmission speed up to 12.5 Gbps • The connector features integrated internal shielding between contact rows; contact design allows up to 200 mating cycles • Termination and installation is accomplished with press-fit contacts utilizing the eye of the needle design • Flat rock tooling is used for installation
www.conec.com
American Conec CorporationMicroTCA Connectors RSC No. 39274Complete connector series for MicroTCA applications • Meet the strict requirements of the MTCA.0 specification and go above and beyond to provide high performance • The program encompasses the AMC backplane connectors in press-fit technology • A broad array of power module input connectors as solder and SMD versions available in dual and single port • Suitable for use on dual-port interfaces by way of special power module • D-SUB socket connectors with unbridged and bridged signal contacts and extra flat screws • CONEC offers a 16-page product brochure that provides information about this entire series of products
www.conec.com
C o n n e c t o r s
HARTING Inc. of North AmericaHARTING AdvancedMC Connector with con:card+ technology RSC No. 39365The HARTING AdvancedMC connector (B+ style) is fully compliant with the PICMG AMC.0 specification for use with
AdvancedTCA carrier boards or related applications • The HARTING MicroTCA connector is fully compliant with the PICMG MicroTCA specification for use with MicroTCA backplanes • Designed to support the full range of AdvancedMC data transmission speeds up to 12.5 Gbps while sharing a precision press-fit compliant pin designed for 0.55 mm
plated PCB holes • The footprints minimize PCB layer count, leading to PCB mfg cost reductions • HARTING AdvancedMC connectors feature
con:card+ technology for enhanced mating reliability (www.concardplus.com)
www.HARTING-usa.com
HARTING Inc. of North AmericaHARTING AdvancedTCA and MicroTCA Power Connectors RSC No. 39366Comprehensive offering of AdvancedTCA and MicroTCA power connec-tors • Designed in accordance with the PICMG 3.0 specification, HARTING’s AdvancedTCA hybrid power connectors have 8 power contacts (AWG size 16), rated to 16 A with 22 signal contacts (AWG size 22) for critical management functions • HARTING’s 96-position MicroTCA hybrid power connector is suitable for use in MicroTCA PSUs • The 24 power contacts are rated to 9.3 A @ 80% derating (IEC 60 512 method), and the 72 signal contacts supply crucial management and power functions to the system • Designed in accordance with the PICMG MTCA.0 R1.0 symmetric footprint
www.HARTING-usa.com
HARTING Inc. of North AmericaHARTING Micro Card Edge Connector RSC No. 39354For applications requiring board-to-board mezzanine or small pluggable daughter card connections, the new HARTING Micro Card Edge (MCE) data connectors provide a reliable and flexible solution • A small circuit board links the connectors, which allows for maximum flexibility in the mechanical design of the system • Parallel boards can be as close as 20 mm to each other, with no theoretical maximum distance • Suitable for telecom-munication, medical, and industrial applications, data transmission rates up to 14 Gbps can be achieved with excellent signal integrity characteristics • For more information, e-mail [email protected]
www.HARTING-usa.com
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Positronic IndustriesModular Connector RSC No. 39189New GG Series • Modular power connector • 256 possible contact variations • Signal and
power contacts in a single connector with power contact up to size 0 • Sequential contact mating system • Two level systems
featured for size 16 and size 20 contacts • Multiple termination options • “Safety Feature” contacts • Molding inserts for size 20, 16, 12, and 0 contacts • Up to
four inserts can be placed into the tool to produce a one-piece finished connector
• Current ratings up to 200 amps and voltages up to 500 V r.m.s. are available in a rugged connector with outstanding blind mate features •
Float bushing and jackscrew options are also available
www.connectpositronic.com
Cinch Connectors, Inc.AMC Compression Style Mezzanine Connector RSC No. 39494Robust compression style mezzanine connector for standard AdvancedTCA platform blades • Meets or exceeds the latest PICMG AdvancedTCA specification, AMC.0 Rev 2, which requires support for data transmissions of up to 12.5 Gbps per channel • One-piece stamped contacts provide seamless carrier board to mezzanine card paths for long-term robust performance • The captured individual contacts are low insertion force, with support
for wide board planarities and multiple card insertions • Compression tech-
nology for simplified trace routing and reduced stub-effects and reflections • Solderless attachment allows for easy removal and rework
www.cinch.com
FCID-Sub Shielded Hood RSC No. 38383Suits indoor signal or power applications requiring robustness and/or high EMI/RFI perfor-mance • Simplified connector design results in a lighter connector and allows for reduced assembly time, which can yield up to 20 percent reduced total applied cost • Two half-metal covers in zamack (zinc alloy), two jack screws • Steel fiber-reinforced plastic strain relief for EMI/RFI screening and mechanical cable retention • Strain relief works with cable diameters from 4.0 mm to 13 mm • Just two screws to fasten • Available in 9-, 15-, 25- and 37-position versions • Hoods can withstand an operating temperature from -40 °C to +120 °C • UL94V-0 qualified
www.fciconnect.com
Hypertronics2mm cPCI RSC No. 35133Hypertronics 2mm connectors are tested to military standards and deliver high performance in a ruggedized CompactPCI format for mission-critical applications • Standard 2 mm footprint interchangeable with CompactPCI COTS systems • Hypertac contacts provide high reliability • Immune to shock and vibration fretting • Keying feature ensures proper mating • High-temp LCP insulator meets NASA outgassing requirements • Shield prevents EMI/RFI
www.hypertronics.com
Yamaichi Electronics USA, Inc.CN074-340-0003 RSC No. 38562An AdvancedMC connector series for carriers/backplanes • Available for dual stack mid-size AdvancedMC in 1U blade size • High-speed interface up to 12.5 Gbps • Integrated high-performance YFLEX in CN074 • High-speed Compression Mount Technology (CMT)
www.yeu.com
For more information, enter theproduct ’s RSC number at
www.advancedtca-systems.com/rsc
C o n n e c t o r s
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NEIA-13000 ATCA System RSC No. 34760NEI’s A-5000 and A-13000 carrier-grade AdvancedTCA platforms offer customers a standardized architecture for next-generation communications applications • These products have passed rigorous testing required by today’s telecommunication organizations • NEI AdvancedTCA systems offer scalability and greater than 5-nines (99.999%) availability
• With standardized packet-switched backplane topologies, node-based switching for board commu-
nications and centralized management with IPMI, the NEI A-Series family is the right architecture for carrier-grade next-generation communication applications • Dual redundant power inputs for maximum uptime • NEBS Level 3 and ETSI compliant for high availability • Dual shelf managers monitor the system components such as the fans and Power Entry Modules (PEMS) to maximize uptime • Supports the latest dual-core computing blades • Scale from three to 14 compute blades in a single platform • Fabric connections of up to 10 GB each, wide range of fabric protocols are supported including PCIe,
GbE, InfiniBand, and RapidIOwww.nei.com
I n t e g r a t e d P l a t f o r m s
Emerson Network Power Embedded ComputingSpiderWareM3 RSC No. 39586SpiderWareM3 platform management software reduces development cycle time and lowers OpEx by enhancing the usability of leading-edge AdvancedTCA and MicroTCA plat-forms • Manage, monitor, and maintain multiple AdvancedTCA and MicroTCA platforms • Remote access from any location – fault and threshold alerts • Monitor chassis and blades in real time • Facilitate rapid system integration – HPI and XML APIs • Quick platform set up • Asset management: Identify all the platform and blade assets, access FRU records, and visually represent the platform hardware • Easy-to-navigate graphical user interface • Easy-to-use single screen presentation of hardware management
www.emersonnetworkpower.com/embeddedcomputing
Kontron
The unique standards-based iSCSI over 10GbE OM9020 Server-Storage ATCA Platform elegantly eliminates the need for complex proprietary fiber channel storage servers. Reliably and easily scaling edge network architectures has been a major bar-rier to rapidly designing new content delivery applications. As even more content moves to network storage, complex fiber channel-based systems become too difficult to scale and manage. Thanks to Facebook, Salesforce.com, Google, YouTube, IPTV services, etc., network storage demand will be triple current storage capacities.
Pre-tested and validated, this COTS 2U, 2-slot AdvancedTCA platform offers new high-performance, lower-cost system design opportunities for NEPs to keep pace with content delivery. Together Kontron (AT8030 ATCA node with three Intel® Core™2 Duo processors) and Astute Networks deliver a solution that provides 1.5 TB of RAID 5 protected storage, able to share 300 standard-definition movies across many subscribers (using 300GB SAS drives, available in late 2008). This two-bladed platform offer-ing can easily scale up to a redundant 14-slot AdvancedTCA® platform to support 1,800 movies within 9TB of storage deployable for central office environments. Any similar proprietary configuration would need nearly
three times the space and power.
www.kontron.comRSC No: 36487
OM9020
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SBCs
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ADLINK Technology, Inc.cPCI-3920 RSC No. 350763U CompactPCI • Low power Intel Core 2 Duo and Core Duo Processor • Intel 3100 chipset • Up to 2 GB DDR2-400 Registered ECC Soldered SDRAM • Two PCI Express GbE • Supports USB 1.1/2.0 flash drive and Serial ATA storage • Includes a wide variety of I/O interfaces and is supported with hardware monitoring and a watchdog timer • The high-performance ability of the cPCI-3920 makes it suitable for telecom, data center, and Internet applications
www.adlinktech.com
Alphi Technology CorporationCPCI-6713-4 IP RSC No. 38950Intelligent Quad IP Carrier-32M SDRAM offering speed, flexibility and up to 192 I/Os on a single board • High-performance Floating-Point Digital Signal Processor (DSP): TMS320C6713B up to 300 MHz system clock • Quad IndustryPack sites • 8/32 MHz operation • Up to 32 MB of SDRAM • Four IP slots: Up to 192 I/Os • Compatible with most IPs on the market • 4.0 Mbit flash memory for bootstrap program
www.alphitech.com
Continuous ComputingATCA-XE50 RSC No. 35159
AdvancedTCA SBC • Two quad-core Xeon processors • Dual Quad-Core Xeon processing power • 8-way SMP processing • Single and dual processor configurations of Quad-Core
Intel Low Voltage CPUs • 8 MB of L2 cache per socket, 1066/1333 MHz FSB processor bus • Supports memory-intensive applications with a potential maximum capacity of 24 GB; using 6 Mini-DIMM sockets and 32 MB Persistent Memory • Intel chipset (San Clemente) provides
2 memory channels (theoretical maximum memory bandwidth of 10.6 GBps) • Dual base interface ports: redundant 1 Gbps path for
control and management data www.ccpu.com
General DynamicsSingle Board Computers RSC No. 35281GD Canada designs and manufactures conduction-cooled SBCs using Intel processors • Available in 6U and 3U form factors for CompactPCI backplanes • Fully backward compatible with earlier models • Upgradeable via the change-out of processor, memory, and I/O modules • Used within GD Canada computer systems and sold as individual products
www.gdcanada.com
KontronCP6016 RSC No. 394126U CompactPCI • Core 2 Duo T9400 processor, 45 nm technology • Serial ATA II RAID, greater speed 300 MBps, now with RAID 0/1/5/10 • Up to 8 GB RAM with ECC at 667 MHz • High Ethernet performance: 5x GbE ports • Trusted Platform Module (TPM)
www.kontron.com
KontronCP6014 RSC No. 39460CompactPCI 2.16 8HP Dual Intel Quad-Core Processor Board • Dual Intel Quad-Core Xeon LV L5408 (45 nm technology) processor board, complemented by the cost-optimized Intel 5100 MCH chipset and Intel I/O Controller Hub 9R • Targets storage, wireless infrastructure, security, voice, and the medical market segments • Upgrade and extend the life of deployed CompactPCI systems, reduce up to 10 single core boards to 1 dual quad-core board, and configure a super computer platform with up to 7 quad-core boards • Taken in conjunction with the advantages of virtualization software, the CP6014 can now address new data-intensive applications such as video recogni-tion and medical imaging
www.kontron.com
S b C s
For more information, enter the product’s RSC number atwww.advancedtca-systems.com/rsc
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Figure 1
sBcsFEATURE g
Designing CompactPCI
intorugged
applications
the MIL-STD-810 environmental profiles for tracked ground vehicles in terms of shock and vibration. Also, it will need to be operational throughout the -40 ºC to +85 ºC temperature range. It is also safe to assume that 28 VDC vehicle power runs this application, which means it will require a power supply able to handle the peculiar requirements of this type of power input.
Finally, we should note that there would typically be many more environmental requirements, covering everything from weight to salt fog exposure to fungal resistance. These are beyond the scope of this article, but they would factor into your choice of ATR box. Because the electronics will be sealed from the environment, these do not typically affect the selection of your single board computers.
Architecture choiceGiven the target installation of a rugged ATR inside a ground combat vehicle, CompactPCI and VME are the most logical architectural candidates. Years ago, VME was the only choice available for truly
David discusses the process and challenges involved in designing highly ruggedized CompactPCI systems.
IntroductionCompactPCI has emerged as the architecture of choice for rugged military and aerospace applications. Its high bandwidth, ruggedness, and familiar computing paradigm have enabled CompactPCI boards to be deployed in everything from shelters to aircraft to ground vehicles.
I have taken special care to highlight the differences between designing ruggedized and nonruggedized CompactPCI systems.
Throughout the article, we will use the design of a hypothetical, but very typical, COTS system in a rugged Air Transport Rack (ATR) as a vehicle for discussion.
Designing a navigation computerWhen first designing a new system, engineers must determine the desired capabilities of the system (I/O, power, environmental conditions, and the like), figure out which types of software application(s) will be run, and then choose a computing architecture that best matches those needs.
For the purposes of this article, we will assume we have been given the task of design- ing a navigation computer for a ground vehicle (Figure 1). The form factor for the computer is specified to be a 1/2 short ATR. It will be cooled by hard mounting to a cold plate, so that all system-generated heat must dissipate through the walls of the chassis and into the cold plate. Note that ATRs, despite their name, are not confined to avionic systems. They are also widely used in vetronic (ground vehicles) and navtronic (naval) applications.
Because it is a ground vehicle, the environmental specifications can be derived from existing MIL specs, such as MIL-STD-810F. Although in the “real world” it seems there is always some deviation from these profiles. We’ll assume that this system needs to meet
by DAviD Pursley
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rugged applications, and VME continues to have a very strong presence in technology refresh and new military applications today. But as the demands continue to change and evolve in this market, CompactPCI has become a reliable counterpart to VME.
In many cases, the limitations of the VMEbus preclude it from being con-sidered. This is especially true for mobile platforms and other small footprint ap- plications requiring the 3U form factor. Limitations of 3U VME in terms of bus width, bandwidth, and rear I/O pins make it impossible to use for many applications. Instead, designers choose 3U CompactPCI for these applications as it supports a much higher bandwidth with plenty of rear I/O.
However, this argument doesn’t apply to our system because the chosen ATR will allow five 6U slots. This suggests the CompactPCI’s derivative PICMG 2.16 or VME derivatives VITA 31 and VITA 41 would all be candidate 6U architectures. All natively support a switched or mesh fabric on the backplane. Table 1 compares these architectures. PICMG 2.16 is the obvious choice for applications requiring a significant number of rear I/O pins, but our system has modest rear I/O requirements, so any of these architectures would meet the application’s rear I/O needs.
Instead, it is the improved reliability and reduction in Total Ownership Cost (TOC) that causes us to select the 6U CompactPCI/PICMG 2.16 architecture for our system. PICMG 2.16 improves reliability in two ways over VITA 31 or VITA 41. First, the PICMG 2.16 architecture provides Intelligent Platform Management Interface (IPMI) on the boards and backplane via an I2C bus. This allows the system to be monitored so that failing boards can be identified and swapped with a replace-ment board. Second, PICMG 2.16 does not have a data bus shared among the cards. Therefore, no single card can go haywire and completely prevent all communication in the system. On the other hand, VITA 31 and VITA 41 include legacy VME64x
support, which means that a single bus is shared among the boards, giving the opportunity for a single board to fail the system. In the most pathological case, an electronic failure on a single board could damage all cards in the system.
Combined, these PICMG 2.16 features provide the capabilities necessary for this application, including the ability to create a rugged multiblade supercomputer with reliability benefits that reduce the total lifetime cost of the deployed systems.
Choosing system componentsIn this case, the choice of the ATR enclosure should be fairly straightforward, given that the environmental and backplane requirements are well-defined. We need a 1/2 short ATR that supports hard mounting to a cold plate for conduction cooling. Running off 28 VDC, the ATR’s power supply must generate enough power for the CompactPCI boards. In this case, we’ll assume the power supply provides 115 W, which is a typical capacity for an ATR of this size.
The type and number of CompactPCI boards is highly dependent on the application, as it is with any other system design. However, we now have the additional constraints of 115 W total board power, conduction-cooling, and the need to meet the environmental specifications.
Recently the VITA standards organization made it significantly simpler to evaluate a board’s environmental specifications. VITA 47 defines a handful of environmental classes for boards to meet so that board vendors and customers can work in accordance with a single small set of environmental requirements. In our case, the boards would need to meet the VITA 47 ECC4 environmental class, which is the conduction-cooled class with the harshest temperature range, -40 ºC to +85 ºC.
This simplifies our search to include boards that meet the ECC4 requirements and have a total combined power consumption of less than 115 W. We’ll also assume that the software architecture will require as much compute power as possible, which suggests the five slots should be used for four CompactPCI dual-core single board computers and one switch. The blades will use PICMG 2.16 Gigabit Ethernet communication across the backplane.
Figure 2 shows two boards in which CompactPCI’s versatility lends itself well to diverse military applications. Kontron’s ITC-320 (left) is a 3U CompactPCI solution, while the Kontron CP6001 (right) is a 6U version with PICMG 2.16 connectivity. Both conduction-cooled boards provide high computational power by way of dual-core CPUs.
These requirements can be met by using four conduction-cooled Intel Core Duo processor blades plus one conduction-cooled PICMG 2.16 Gigabit Ethernet switch. In this configuration, the blades consume 17 W and the switch consumes 28 W, for a total
of 96 W, well under the 115 W constraint.
Rugged application design vs. nonrugged designOnce the boards are chosen, application development can begin. However, appli-cation development for rugged and non-rugged systems have one significant difference. Rugged systems do not typi-cally use standard I/O connectors, whether from the front panel or the Rear Transition Module (RTM). In fact, in most cases, there is not enough room for an RTM in the ATR.
Figure 2
Table 1
PICMG 2.16 (6U) VITA 31 (6U) VITA 41 (6U)
Backplane fabric
Rear I/O
Gigabit Ethernet
295
Gigabit Ethernet
205
PCI Express,InfiniBand,StarFabric,
Serial RapidIO110
System Management IPMI Limited Limited
System protected fromsingle-board failures Yes No No
SBCS
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As shown in Figure 3, rugged military systems differ from “standard” CompactPCI systems because a custom back- plane is used both for interboard communi- cation and to route the I/O for the system. The I/O from the backplane connects to MIL-style connectors on the ATR box through custom cabling or the use of flex circuit interconnects.
This means that a cus-tom backplane and/or flex circuits will be needed for each rug-ged application. Also, the number, type, and placement of MIL-style connectors require the ATR box to be tailored to each application. Combined, this means that it may be weeks or months before the target ATR box is actually available. As a consequence, most of the application development must be done on a nonrugged system until the ATR box is available. In many cases, all development work is done on the nonrugged systems, simply because it can be difficult to properly cool a conduction-cooled ATR box. Also, standard CompactPCI boards tend to be much less expensive than conduction-cooled boards, so using nonrugged boards for software development has the side benefit of reducing the cost of develop-ment systems.
Some rugged board vendors, such as Kontron, fully support this model of appli-cation development by manufacturing the exact same board in both conduction-cooled and convection-cooled variants. That is, the Circuit Card Assembly (CCA) is identi-cal for both boards, with the exception of the heat sinking – the convection-cooled board will use a finned heat sink, whereas the conduction-cooled board will use a conduction plate and wedge locks to dissipate heat to the chassis.
Using the same board for both the non-rugged development systems and the rugged deployment systems removes the risk associated with software porting. The software can be developed and tested on less costly nonrugged systems, and then ported to the ATR box with confidence once it is available and ready for deployment.
ConclusionNote that while this was a hypothetical example, it is an accurate, albeit simplified, representation of a typical design scenario and the design choices made throughout. CompactPCI systems have been deployed in a wide variety of military and aerospace applications, including submarines, naval ships, airborne applications, and ground vehicles. CompactPCI’s ruggedness and reliability, along with its ability to meet connectivity and rear I/O requirements, give CompactPCI the versatility that makes it so attractive to system designers.
David Pursley is an Applications Engineer with Kontron. He is responsible for business development of Kontron’s MicroTCA, AdvancedTCA, CompactPCI, and ThinkIO product lines in North America and is based in Pittsburgh, PA. Previously, he held various positions as a Field Applications Engineer, Technical Marketing Engineer, and Marketing Manager. David holds a Bachelor of Science in Computer Science and Engineering from Bucknell University and a Master’s degree in Electrical and Computer Engineering from Carnegie Mellon University.
Kontronwww.kontron.com
Figure 3
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CompactPCI and AdvancedTCA Systems y December 2008 y 41
Using the sAMe BoArd
for Both the nonrUgged
developMent systeMs And the
rUgged deployMent systeMs
reMoves the risk AssociAted
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Human beings not only cannot be on hand on a daily basis to see that oil and gas pipelines in Alaska’s remote wilderness run 24/7, they cannot even get to the equipment 10 months out of the year. So a company that provides a variety of sensing equipment and monitoring services to oil and gas pipeline companies
throughout Alaska requires the most reliable and rugged systems possible for remote monitoring. Designers of the CompactPCI-based oil and gas pipeline remote monitoring system chose highly reliable solid-state storage for this critical system application.
System designers are turning to solid-state storage in large numbers as drop-in replacements for hard drives or traditional flash cards that were originally designed for consumer applications and cannot take the rigors of true industrial-grade system requirements.
A case study in harsh condition remote monitoring systemsAlthough the Alaska wilderness pipelines noted earlier can only be accessed for human inspection one or two months of the year, with millions of dollars and precious commodities at stake, the operators and owners must evaluate the pipeline status on an ongoing basis.
Pipelines, due to their continuous nature over remote terrain, are naturally susceptible to disruption by geotechnical events. The oil and gas monitoring and services company needed to remotely manage its pipeline equipment throughout the year, with a field deployment of four years or longer. This required an advanced storage system that enabled the sensing equipment to reliably store monitoring data and not be susceptible to the harsh conditions.
The pipeline remote monitoring solution was an integrated single board CompactPCI computing system, and though the company’s monitoring devices were among the best in the industry, their previously chosen storage system had been a painful point of failure in past deployments. Unexpected storage failures caused disruption of data and event log-ging, which meant that critical events were not recorded or transmitted. This threatened to affect the pipeline’s operation.
Advanced solid-state storage answers tough demandsYear-round remote monitoring of the pipelines required:
Long product lifeElimination of field failures from power anomalies User-selectable security features to protect application data and software IPExtended temperature ranges High tolerances for shock and vibration
By switching the storage subsystem to advanced solid-state storage technology specifically designed for embedded system applica-tions instead of one originally designed for consumer applications, the oil and gas monitoring and services company implemented real-time detection of geological motion and the ability to pinpoint the exact location of rock or soil movements along the pipelines the company monitors. The pipelines are continuously interrogated for faults on a user-determined schedule. Even in the dead of night in a full-scale blizzard, highly reliable monitoring takes place. No one needs to travel to the data collection site except for periodic
inspections and repair, which can now be scheduled according to the user’s time-table and favorable weather conditions. The storage subsystem is no longer the weak link and the source for system failure.
Monitoring storage usage generates additional benefitsThe remote monitoring equipment OEM gained additional benefits by select-ing SiliconDrive products (Figure 1)from SiliconSystems. For example, the SiliconDrive solution enables scheduling preemptive maintenance. This approach minimizes and even alleviates unscheduled downtime by monitoring solid-state storage usage. Newly enhanced Self-Monitoring Analysis and Reporting Technology (SMART) creates usage reports (see Figure 2) and works by monitoring the write and erase cycles of each block along with the usage of spare blocks in the storage system to accurately calculate remaining life. Eliminating unscheduled maintenance calls saves time, money, and unnecessary system downtime. The alternative is to chance a system failure.
storAgeFEATURE g
by GAry DrosselAdvanced solid-state storage is solving a number of challenges for a manufacturer of remote pipeline monitoring equipment.
To keep oil pipelines flowing, embedded
storage systems have to be tougher
Figure 2
Figure 1
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Up to now, consumer flash cards did not incorporate any type of feedback mechanism and consequently had been allowed to operate until they exceeded endurance specifications and failed. Solid-state storage without a monitoring solution is analogous to driving a car without a fuel gauge – the system operates until it “runs out of gas.” Monitoring spares only is like having a light that comes on just before running out of gas. In this scenario, there may or may not be enough time “to get to a gas station” before the system fails. Advanced solid-state storage that integrates monitoring technology provides the needed fuel gauge (Figure 3).
Even newer advanced solid-state storage products, such as the SiliconDrive Blade in its postage-stamp sized form factor, are providing a proven scalable platform for the next round of design innovation, just like CompactFlash did in its time.
At one time OEMs eyeing smaller embedded form factors and needing high performance and high reliability really had no cost-effective choice. CompactFlash cards were available and a proven form factor, but risky in harsh environments or in heavy duty-cycle
SToRAgE
applications where the card could literally wear out. The risk was even greater with SD or MMC cards, which were specifically designed for consumer applications and never intended for industrial use.
Due to growing consumer and industrial customer demand for solid-state storage and constant innovation, advanced solid-state storage technology is available today in multiple small and ultra-small form factors with zero loss in performance, reliabili- ty, endurance, product life, and more.
The innovation pendulum is swinging back from the industrial market to consumer applications once again in the form of embedded security. Advanced solid-state storage has long included security features that protect application data and software IP. In today’s world of mobile miniature devices, address books and confidential personal data like credit card information or medical history are at risk. Hard drives have done little besides basic encryption to address these issues.
The pioneers of advanced solid-state storage continue to lead the way for new consumer innovations. As these benefits find their way into consumer markets, driving new uses and expectations, no doubt the innovation pendulum will once again reverse directions.
Gary Drossel is a storage and embedded systems industry expert with nearly 20 years of experience. He joined SiliconSystems in 2004 as Director of Product Marketing and was named Vice President of Product Planning in September 2006.
SiliconSystemswww.siliconsystems.com
Figure 3
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Matt explains design innovations
that have taken the latest
generation of PCI Express
(PCIe) beyond its traditional role
as a chip-to-chip interconnect.
In the high-tech world, the overuse of the term “emergence” has devalued its impact and rendered it somewhat trite. Technologies and applications
are deemed “emerging” with a relatively low bar in hopes that users will line up to be early adopters to garner the perceived advantage of being on the cutting edge.
Those who subscribe to a classical, less diluted definition of emergence might bring up “complex systems that arise from the multiplicity of more basic interactions with the resulting system or form,” and explain that what’s being discussed, though built upon or from previously simpler stages, also has to be “sufficiently disparate from its constituent elements to be worthy of a unique or new classification.”
With a nod to the classical definition, a new approach to switching architecture has emerged to solve key system problems previously preventing the adoption of PCI Express as the primary system interconnect in demanding AdvancedTCA and proprietary bladed communications, as well as in embedded and server/storage applications. Although PCIe has become the de facto standard for local and chip-to-chip interconnects in these applications, its reach as the primary system interconnect for systems with distributed intelligence has been minimal. Up until now, it has run into limits when tasked with enabling multiroot system architectures and ef- ficiently managing system resources.
switchesFEATURE g
by MAtt Jones
Complex though the barriers are, the solution – a multiroot partitionable PCIe switch architecture – breaks the PCIe protocol and switching tasks down to their most basic elements and leverages the simplest transactions across multiple instances to arrive at a new PCIe switching solution.
PCIe system topology and switching overviewPCIe, a standard serial interconnect that has been widely adopted for its efficiency, scalability, power, and system cost advantages over other competing standards, is built on the foundation of legacy PCI constructs to ensure compatibility with existing system software and firmware code bases. Although the previous bus-based topology of PCI and PCI-X has been replaced by point-to-point connectivity, which utilizes packet switches for distribution, the resultant topography remains, at its base, a simple tree structure with a single root complex (in most cases, a CPU or processor complex) as shown in Figure 1. The root complex is responsible for system configuration and enumeration of PCIe resources, and manages interrupts and errors for the PCIe tree. To further support simplicity and legacy constructs, a root complex and its endpoints share a single address space and communicate through memory reads and writes and interrupts.
Internally, PCIe devices implement virtual PCI-to-PCI bridges and buses and logical structures that mimic the physical bridging and bus functions in legacy PCI-based systems as well as allow for support of the legacy protocols’ interrupts and messages. The Figure 1 exploded view shows logical details of virtual bridge and bus hierarchies in a PCIe implementation.
Figure 1
Enabling multihostsystem architectures with
PCI Express switches:Innovation in design through
multiroot partitionableswitch architecture
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Replicating logical PCI-based structures within PCIe devices eased the hardware and software migration between standards but left the new standard with limited extensibility, particularly to multiroot applications. The protocol remained focused on efficient interconnect for single root constructs – with a one-to-one relationship between a root and an endpoint.
Challenges for PCIe as a multiroot system interconnectTo enable PCIe as the primary system interconnect for multiroot systems, the challenge is to work within or extend the standard specification to enable system architects to leverage the efficiency, scal-ability, and low-power advantages of PCIe and capitalize on its rich and rapidly growing and commoditizing ecosystem of processors and peripherals. This challenge is well-studied with proposed solutions to date that include working within the standard via NonTransparent Bridging (NTB) constructs and the MultiRoot I/O Virtualization (MR-IOV) extension of the standard. Both approaches have merit, but fundamentally fail as they do not utilize the current ecosystem and/or require proprietary software development.
The solution to providing multiroot sup-port and enabling efficient system resource utilization and sharing within the PCIe specification may be much “simpler” than previously offered solutions. Revisiting the classical definition of emergence, a new approach suggests that the problems can be addressed within the current standard and ecosystem by focusing on the most basic PCIe elements, keeping the transactions simple, and rendering small switching solutions that, through multiplicity, combine to solve larger system switching problems.
Partitionable multiroot switch architectureLeveraging the constituent logical elements of a PCIe switch – the virtual PCI-to-PCI bridges and virtual PCI bus – the multiroot partitionable switch architecture creates multiple logical switches or switch partitions within a single switching device by using physical controls (Figure 2). Each of the resulting switch partitions is logically discrete and adheres to the PCI Express Base 2.0 specification. Each independent partition represents a PCIe hierarchy whose configuration, switching operation, and reset logic are isolated from other partitions.
Replication of the control and management structures associated with the virtual PCIe bus makes it possible to support multiple
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separate virtual PCI buses. This approach allows multiple distinct root complexes to coexist on a PCIe-compliant switch. The ability to freely associate virtual PCI-to-PCI bridges to any of the established virtual buses adds more architectural flexibility. Association can take place either statically at the time of a fundamental reset to the switch or dynamically while the switch is operating.
The multiroot partitionable switch architecture then allows system designers to partition an n-port physical switch into n-partitions (that is, 16 partitions for a 16-port switch) and the flexibility to assign any switch ports to any of the partitions as well as the unique capability to change the system configuration and port assignments dynamically during switch operation. Further, within a given partition, any port can be assigned as the upstream or root port with the ability to move that root port as well during switch operation.
Despite the independence of the partitions, the shared control logic for the partitions within the switch remains a global resource that can be controlled via the physical switches’ System Management Bus (SMBus) or in band from any of the roots attached to any of the logical partitions. This extends the flexibility of the architecture to allow the dynamic reallocation of resources to be initiated by roots within or outside a given partition.
The switch architecture supports multiroot system architectures, enables advanced applications of the functionality that increase system configurability, and optimizes system resource utilization, availability, and security.
Increased system configurability and hardware reuseThe most direct application of the architecture to aid system configurability is to replace multiple discrete physical PCIe switches with a single partitioned switch. Such a replacement shrinks the total cost of ownership by reducing power consumption, decreasing board space requirements, and lowering system interconnect costs. Additionally, the unified switch complex reduces system development costs through hardware reuse paradigms that enable a single hardware platform to serve many end markets and price/performance points.
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In one paradigm, a multiroot system with a fixed set of computing resources leverages the partitionable switch architecture to enable a wide array of systems through the ability to efficiently map the compute resources to a varying number and an assortment of peripheral devices or cards. An example of this flexible slot and I/O provisioning is offered in Figure 3 with a contrasting discrete switch implementation.
A second paradigm utilizes the partitionable switch to augment compute resources to a fixed set of I/O and peripherals to provide an overall system per-formance boost by reducing the ratio of I/O peripherals to computing resources. For example, as Figure 4 shows, a multicarded application can be provisioned in the field with an additional compute card to improve performance to the eight feature or line cards.
Optimized resource utilization and QoS management – dynamic resource allocation In addition to the flexibility in static configurations noted earlier, the multiroot partitionable architecture allows dynamic reconfiguration during switch operation. This capability allows compute and I/O or peripheral elements to be nimbly managed for optimal utilization and sharing of system resources.
In addition to driving down system costs by maximizing resource utilization in the form of optimal compute and I/O resource matching, the switch directly enables management of system-level Quality of Service (QoS) and guarantees of Service-Level Agreements (SLAs) for key traffic or users. Figure 5 provides a basic example of a system reconfiguration event where global system resources have been redistributed and the leftmost root has offloaded supported peripherals to ensure maximum bandwidth for high-priority traffic or users on a single root.
The dynamic allocation of switch resources the architecture supports also adds additional depth to the two static configuration paradigms discussed previously as system peripherals or cards added to or removed from the system through supported hot plug functionality can be redistributed dynamically without taking unaffected system elements offline.
Increased resource availability – advancedfailover supportAn important extension of the dynamic resource allocation is its application to increase system resource availability and reliability through advanced failover support.
With the multiroot partitionable architecture, resources associated with a failing root can be dynamically reassigned to operational roots as shown in Figure 6. The architecture allows any number of the remaining functional roots to take control of the isolated system resources to reestablish service with minimal interruption and data loss. The architectural flexibility affords system designers the ability to select any number of failover strategies from the simplest reassignment to a predetermined root or more elegant implemen-tations that allow for assignment based on the current state of the switch and the active roots’ current loading.
The advanced support for failover in the multiroot partitioning architecture offers significantly greater resource availability and system reliability than previously offered in the PCIe switching ecosystem. Previous approaches to this problem offered relief for dual-host failover and most often did so via proprietary NTB-based algorithms. Although effective for two-root systems, this paradigm becomes overly cumbersome in multiroot systems
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and increases the burden on system design time and cost because of the software development required to enable the proprietary NTB functionality.
In the case of failover and the underlying dynamic resource allocation capabilities, the multiroot partitionable architecture utilizes standard, off-the-shelf PCIe-based processing and peripheral devices, and leverages existing system firmware and software.
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ConclusionBy breaking down the PCIe switch and system switching tasks to the most basic of elements and the simplest of transactions with multiple instances, IDT PCIe switches featuring the multiroot partitionable architecture solve complex system design problems that previously prohibited the adoption of PCIe as the primary interconnect standard in multiroot systems. The new architecture provides multiroot support and enables key system constructs to optimize system resources for maximized utilization, load balancing, and QoS management. Perhaps most importantly, the architecture leverages the rich and growing PCIe ecosystem with no special hardware modifications or software upgrades, keeping system costs low and development cycles short to realize true multiroot PCIe-based systems.
By whatever definition we choose – the current or the classical – the new switch architecture earns the tag of emergence. No shortage of system vendors has adopted the technology, and all will seek to gain early mover advantages by applying the dynamic architecture – an architecture that leverages basic PCIe constructs in multiplicity to form a new class of solutions for system application needs.
Matt Jones is a Product Marketing Manager in the Enterprise Computing Division at IDT. During his 13 years in the semiconductor industry, he has held marketing positions in the IDT Internetworking Products Division, microprocessor products group, and corporate marketing organization. Matt holds a Bachelor of Science in Electrical Engineering and a Bachelor of Arts in Economics from Stanford University.
IDTwww.idt.com
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