Common mode filter with ESD protection for USB 2.0 interface · 2019. 10. 13. · This is information on a product in full production. May 2014 DocID022286 Rev 2 1/15 ECMF02-4CMX8

This is information on a product in full production.

May 2014 DocID022286 Rev 2 1/15

ECMF02-4CMX8

Common mode filter with ESD protection for USB 2.0 interface

Datasheet − production data

Features• Integrated common mode filter• Differential pair ESD protection• 16 V VBUS ESD and EOS protection• ID pin ESD protection• Low profile micro QFN-8L package• High bandwidth: > 6 GHz• Optimized for high speed USB 2.0 • High common mode attenuation at 900 MHz

and 1.8 GHz

• Support of audio over USB 2.0 thanks to bidirectional ESD protection

• Ultra compact, low board space • Low height: < 0.55 mm

Complies with the following standards:

• IEC 61000-4-2 level 4:– ±15 kV (air discharge)– ±8 kV (contact discharge)

• RoHS2 compliant

ApplicationsWhere transient over-voltage protection in ESD sensitive equipment is required, such as:

• Computers• Printers• Communication systems• Cellular phone handsets and accessories• Video equipment

DescriptionECMF02-4CMX8 affords key component integration such as common mode filter D+ and D- lines and ESD protection on all lines. This device offers an optimized flow-through footprint for USB 2.0 applications.

Figure 1. Pin configuration (top view)

Micro QFN-8 L(pin view)

D+

D- D-

GNDVBUS

GNDID

D+

www.st.com

http://www.st.com

Characteristics ECMF02-4CMX8

2/15 DocID022286 Rev 2

1 Characteristics

Figure 2. Electrical characteristics - definitions

Table 1. Absolute maximum ratings (Tamb = 25 °C)

Symbol Parameter Value Unit

VPP Peak pulse voltage(1)

ESD discharge IEC 61000-4-2, level 4

Contact discharge on D+/D- pinsContact discharge on VBUS and ID pinsAir discharge on all pins

10

2030

kV

PPP Peak pulse power (8/20µs) on VBUS 150 W

IPP Peak pulse current (8/20µs) on VBUS 4.8 A

Top Operating temperature -30 to +85 °C

Tj Maximum junction temperature 125 °C

Tstg Storage temperature range - 55 to +150 °C

1. Measurements done on IEC 61000-4-2 test bench. For further details see Application note AN3353.

I

V

IPPIPP

VCLVCLVBRVBRVRMVRM

IRIRIRMIRM

IRMIRMIRIR

IPPIPP

VRMVRMVBRVBRVCLVCL

Symbol ParameterV = Breakdown voltageI = Leakage current @ VV = Stand-off voltageV = Clamping voltageI = Peak pulse currentI = Breakdown current

BR

RM RM

RM

CL

PP

R

DocID022286 Rev 2 3/15

ECMF02-4CMX8 Characteristics

15

Figure 3. SDD21 differential attenuation measurement (Z0 diff = 90 Ω ) for data lines D+ and D-

Table 2. Electrical characteristics (values, Tamb = 25 °C)

Symbol Test conditions Min. Typ. Max. Unit

Data Lines

VBR IR = 1 mA 6 V

IRM VRM = 5.5 V per line 100 nA

RDC DC serial resistance on data line 3 4 Ω

VBUS

VBR IR = 1 mA 15 16.5 18 V

IRM VRM = 12 V 50 nA

VCL Clamping voltage. IPP = 1 A, tp = 8/20 µs 20 V

VCL Clamping voltage. IPP = 2.5 A, tp = 8/20 µs 24 V

ID

VBR IR = 1 mA 6 V

IRM VRM = 1.5 V per line 100 nA

SDD21 (dB)

100k 1M 10M 100M 1G

-3

-2.5

-2

-1.5

-1

-0.5

0

F (Hz)


4/15 DocID022286 Rev 2

Figure 4. SCC21 common mode attenuation measurement (Z0 com = 45 Ω )

Figure 5. ID frequency response measurement (Z0 = 75 Ω )

SCC21 (dB)

100k 1M 10M 100M 1G

-40

-35

-30

-25

-20

-15

-10

-5

0

F (Hz)

100k 1M 10M 100M 1G-30

-25

-20

-15

-10

-5

0

F (Hz)

S21 (dB)

DocID022286 Rev 2 5/15


15

Figure 6. ESD test conditions

Figure 7. ESD response to IEC 61000-4-2 (+8 kV contact discharge) on VBUS

- 20 dB - 20 dB

D+

D- D-

GNDVBUS

GNDID

D+

Attenuators

Oscilloscope 50 Ω

V : ESD peak voltageV :clamping voltage @ 30 nsV :clamping voltage @ 60 ns

PP

CL

CL

V :clamping voltage @ 100 nsCL

1234

85.6 V

46.3 V

30.7 V 23.5 V

1

2

43


6/15 DocID022286 Rev 2

Figure 8. ESD response to IEC 61000-4-2 (-8 kV contact discharge) on VBUS

Figure 9. ESD response to IEC 61000-4-2 (+8 kV contact discharge) on ID

-83.5 V

-46.0 V

-30.4 V-22.0 V

1

2

43


PP

CL

CL


1234


PP

CL

CL


1234

47.2 V 19.0 V

17.6 V 15.5 V1

2

43

DocID022286 Rev 2 7/15


15

Figure 10. ESD response to IEC 61000-4-2 (-8 kV contact discharge) on ID

Figure 11. ESD response to IEC 61000-4-2 (+8 kV contact discharge) on differential lane

-56.0 V

-25.1 V

-25.2 V-21.2 V

1

2

43


PP

CL

CL


1234


PP

CL

CL


1234

54.7 V

33.1 V

20.6 V 13.2 V

1

2

43


8/15 DocID022286 Rev 2

Figure 12. ESD response to IEC 61000-4-2 (-8 kV contact discharge) on differential lane

-49.5 V-27.3 V

-17.0 V-11.4 V

12

43


PP

CL

CL


1234

Figure 13. Eye diagram (loaded by Zdiff = 90 Ω) with USB2.0 [mask 1] board only

Figure 14. Eye diagram (loaded by Zdiff = 90 Ω) with USB2.0 [mask 1] board with ECM02-4CMX8

Rise time (ps) Fall time (ps) Eye height (mv) Eye width (ns)347 347 721 2.04

Rise time (ps) Fall time (ps) Eye height (mv) Eye width (ns)432 432 674 2.03

DocID022286 Rev 2 9/15


15

Figure 15. TDR measurement (loaded by Zdiff = 90 Ω), rise time 400 ps

Figure 16. HS sync

88

90

92

94

96

98

100

0 1 2 3 4

t (ns)

Zdiff ( )Ω


10/15 DocID022286 Rev 2

Figure 17. Total harmonic distortion on differential lanes

Figure 18. Crosstalk on differential lanes

DocID022286 Rev 2 11/15

ECMF02-4CMX8 Application schematic

15

2 Application schematic

Figure 19. Application schematic

Micro - USBreceptaclereceptacle

ECMF02-4CMX8

Tow

ard

s U

SB

tra

nsc

eive

r

D+

D- D-

GNDVBUS

GNDID

D+

Package information ECMF02-4CMX8

12/15 DocID022286 Rev 2

3 Package information

• Epoxy meets UL94, V0• Lead-free packages

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

Figure 20. Micro QFN-8L dimension definitions

Table 3. Micro QFN-8L dimension values

Ref.

Dimensions

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 0.45 0.50 0.55 0.018 0.020 0.022

A1 0.00 0.02 0.05 0.00 0.0008 0.002

b 0.15 0.20 0.25 0.006 0.008 0.010

D 2.45 2.50 2.55 0.096 0.098 0.100

E 1.15 1.20 1.25 0.045 0.047 0.049

e 0.45 0.50 0.55 0.018 0.020 0.022

L 0.30 0.40 0.50 0.012 0.016 0.020

L0.20

b

PIN 1#

A

A1

D

e

E

0.40

http://www.st.com

DocID022286 Rev 2 13/15

ECMF02-4CMX8 Package information

15

Figure 23. Tape and reel specifications

Note: More packing information is available in the application notes: AN1751: “EMI Filters: Recommendations and measurements”

Figure 21. Footprint Figure 22. Marking

0.50

2.10

0.20

0.40

0.60

0.20

0.40

1.60

XXWW

Y P

Dot: Pin 1XX: MarkingWW: Assembly weekY: Assembly yearP: Assembly plant

Dot identifying Pin A1 location

User direction of unreelingAll dimensions are typical values in mm

Ø 0.80

4.0 0.1±

4.0 ± 0.1

2.0 0.05±

8.0

+0.3

/-0.1

1.7

5±

0.1

3.5

±0.0

5

Ø 1.55 ± 0.05

0.70 ± 0.051.45 ± 0.05

0.30 0.02±

2.8

0±

0.0

5

Ordering information ECMF02-4CMX8

14/15 DocID022286 Rev 2

4 Ordering information

Figure 24. Ordering information scheme

For the latest information on available order codes see the product pages on: www.st.com.

5 Revision history

Table 4. Ordering information

Order code Marking Package Weight Base qty Delivery mode

ECMF02-4CMX8 KG Micro QFN-8L 3,7 mg 3000 Tape and reel

ECMF 02 - 4 C MX8

FunctionESD common mode filter

Number of lines02 = 2 lines

Number of ESD protected lines

4 = 4 ESD protected lines

Version

C = 16 V V for VBR BUS

PackageMX8 = Micro QFN-8L

Table 5. Document revision history

Date Revision Changes

19-Sep-2012 1 Initial release.

27-May-2014 2 Updated Figure 23, Figure 24 and reformatted the document.

http://www.st.com

DocID022286 Rev 2 15/15

ECMF02-4CMX8

15

Please Read Carefully:

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve theright to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at anytime, without notice.

All ST products are sold pursuant to ST’s terms and conditions of sale.

Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes noliability whatsoever relating to the choice, selection or use of the ST products and services described herein.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of thisdocument refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party productsor services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of suchthird party products or services or any intellectual property contained therein.

UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIEDWARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIEDWARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWSOF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFESUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B)AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONSOR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS ATPURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT ISEXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRYDOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED AREDEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY.

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately voidany warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, anyliability of ST.

ST and the ST logo are trademarks or registered trademarks of ST in various countries.Information in this document supersedes and replaces all information previously supplied.

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

© 2014 STMicroelectronics - All rights reserved

STMicroelectronics group of companies

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America

www.st.com

Figure 1. Pin configuration (top view)1 CharacteristicsTable 1. Absolute maximum ratings (Tamb = 25 °C)Figure 2. Electrical characteristics - definitionsTable 2. Electrical characteristics (values, Tamb = 25 °C)Figure 3. SDD21 differential attenuation measurement (Z0 diff = 90 Ω) for data lines D+ and D-Figure 4. SCC21 common mode attenuation measurement (Z0 com = 45 Ω)Figure 5. ID frequency response measurement (Z0 = 75 Ω)Figure 6. ESD test conditionsFigure 7. ESD response to IEC 61000-4-2 (+8 kV contact discharge) on VBUSFigure 8. ESD response to IEC 61000-4-2 (-8 kV contact discharge) on VBUSFigure 9. ESD response to IEC 61000-4-2 (+8 kV contact discharge) on IDFigure 10. ESD response to IEC 61000-4-2 (-8 kV contact discharge) on IDFigure 11. ESD response to IEC 61000-4-2 (+8 kV contact discharge) on differential laneFigure 12. ESD response to IEC 61000-4-2 (-8 kV contact discharge) on differential laneFigure 13. Eye diagram (loaded by Zdiff = 90 W) with USB2.0 [mask 1] board onlyFigure 14. Eye diagram (loaded by Zdiff = 90 W) with USB2.0 [mask 1] board with ECM02-4CMX8Figure 15. TDR measurement (loaded by Zdiff = 90 W), rise time 400 psFigure 16. HS syncFigure 17. Total harmonic distortion on differential lanesFigure 18. Crosstalk on differential lanes

2 Application schematicFigure 19. Application schematic

3 Package informationFigure 20. Micro QFN-8L dimension definitionsTable 3. Micro QFN-8L dimension valuesFigure 21. FootprintFigure 22. MarkingFigure 23. Tape and reel specifications

4 Ordering informationFigure 24. Ordering information schemeTable 4. Ordering information

5 Revision historyTable 5. Document revision history

Documents

Common mode filter with ESD protection for USB 2.0 interface · 2019. 10. 13. · This is information on a product in full production. May 2014 DocID022286 Rev 2 1/15 ECMF02-4CMX8