COCKPIT SYSTEM OF SMART CAR & MARKET/ TECHNICAL TREND OF ADAS · PDF file · 2016-06-29SMART CAR & MARKET/ TECHNICAL TREND OF ADAS ... Migration from Modular system to Integrated

© 2016 Renesas Electronics Corporation. All rights reserved.

COCKPIT SYSTEM OF SMART CAR & MARKET/ TECHNICAL TREND OF ADAS

4/7/2016MATTE HO何吉哲MB:0963-358-186E-MAIL: [email protected]

AUTOMOTIVE INFORMATION SYSTEM BUSINESS RENESAS ELECTRONICS CORPORATION

AISM-AA-15-0301


SPECIALLY WE TALK ABOUT CAR BUILD-IN SYSTEMS!Not these ones:

Page 2


EXAMPLES OF STANDARD CAR INFOTAINMENT SYSTEMSVW/Golf: with BT/HF Telefone Renault: with Audio Processing

Renault: with Internet+Apps Renault: with Body Control I/F Page 3


EXAMPLES FOR CLUSTER, ADAS, NAVIGATION

Page 4


RENESAS’S INTEGRATED COCKPITProviding comfort, secure and safety to drivers, “Human-friendly interface”

Quickly display the information needed at the timing desired, all through the cockpit

Comfort, secure, safety

Renesas Integrated Cockpit

Driving assistInfotainmentDashboard

No.1 No.1

Renesas’s Integrated Cockpit Demo(Drive simulator)

Page 5


Migration from Modular system to Integrated system for user- friendly and cost optimizationCY2015~2017 CY2018~21

Modular ECU systemby Tier1

Integrated ECU systemby OEM

Integrated ECU systemby OEM

Display ECUCockpit Platform

RadioModule

MultimediaModule

Connectivity

InstrumentsCluster

Surround View

Navi/GPSModule

Radio/Au

dio

Navi/GPS

Conn

ectiv

ity

Multim

edia

Security

Cluster

Increasing demand to optimizeBOM cost like software module

SYSTEM EVOLUTION TO “INTEGRATED COCKPIT”

Page 6


Integrated Cockpit system must operate many functions simultaneously

Multi OS Virtualization

EthernetAVB forSound routing and Camera

Digital Radio

Fast boot cameraand Surround view

Secure Architecture

Audio DSP forHigh Quality Audio

HWHyper Visor

OS OS

Apps Apps

Powerful Processorfor rich HMI

Latest Graphics technologyHigh DefinitionVideo codec

SYSTEM REQUIREMENT AND KEY TECHNOLOGIES

Page 7


R-CAR ROADMAP FOR NEXT COCKPIT

2011 2012 2013 2014

Generation 2 (28nm)Generation 2 (28nm)

Perf

orm

ance

201x

Developing

Year

R-Car E1

R-Car M1A

R-Car H1



R-Car H2

Quad core in Automotivewith big.LITTLETM

R-Car M2

Perf

orm

ance

Sca

labi

lity

Softw

are

com

patib

ility

R-Car E2

R-Car YYR-Car YY

Generation 4Generation 4

20162015

R-Car H3

R-Car XX

Planning

Smart phone connectivityCar Play, Google Auto

Multi screen, Cluster,Hypervisor, Ethernet

ADAS integrationCluster integration

R-Car E2XProduction start

R-Car XX

Developing

Page 8


TOP PERFORMANCE IN THE MARKET

Today’s high-end performance available tomorrow main stream.

Continuously improve performance by Generation.

Cortex A9Automotive, 45nm

Cortex A9Automotive, 45nm

4x Cortex A9Automotive , 45nm

4x Cortex A154x Cortex A7SH-4AAutomotive, 28nm

2x Cortex A15SH-4AAutomotive, 28nm

2x Cortex A7SH-4AAutomotive, 28nm

M1A 3K DMIPS

E1 1.3K DMIPS

H1 12K DMIPS

H2

M2

E2

CA15CA15 CA15CA15

CA15CA15 CA15CA15

CA7CA7 CA7CA7

CA7CA7 CA7CA7

G6400GraphicsG6400Graphics

VCP3FullHD codec

VCP3FullHD codec

IMPImage IMP

Image

USB3.0USB3.0

EthernetAVB

EthernetAVB

CA15CA15 CA15CA15

SGX544MP2Graphics

SGX544MP2Graphics

VCP3FullHD codec

VCP3FullHD codec

USB3.0USB3.0

EthernetAVB

EthernetAVB

CA7CA7 CA7CA7

SGX540GraphicsSGX540Graphics

VCP3FullHD codec

VCP3FullHD codec USB2.0USB2.0

EthernetAVB

EthernetAVB

21K DMIPS

10K DMIPS

3.8K DMIPS

Page 9


R-CAR PLATFORM IS SCALABLE AND FLEXIBLE

R-Car HPremiumClass

MiddleClass

Entry Class(EmergingCountries)

R-Car M

R-Car E

Scalable platform

S/W Platform

Customer’s applications

Open environmentFlexible platform

H/W Platform

Page 10


R-Car E2X


[Background of Market boom]

INFOTAINMENT SYSTEM FORECAST

Car production(W/W)

Display system ratio will be more standard in Low-end cars

Entry

MidHigh

Page 12


R-CAR E2X POSITIONING AND VALUE1. BOM Cost Reduction No need for additional analogue I/Fs CVBS IN/Out, LVDS Out 2 Package Variation Supports 6 layer or 4 layer trough hole PCB Reduced SOC cost: Applied lower cost Silicon process

2. Connectivity - Suitable CPU and DDR bandwidth ⇒ CarPlay,

Android Auto, Miracast1. 2x Cortex-A7 （1GHz) :3800DMIPS2. x32 DDR3-1000

3. Software Flexibility Can start TODAY with R-Car E2

1. HW IPs: Reused from Gen22. SW(M/W, Drivers): Reused from Gen2

Supports various kinds of OS Linux, Android, QNX

Gen.3High/

Premium

Mid-range

R-CarE1

R-Car H1

*・・・Under Development

Preliminary

R-Car H3**

R-Car H2*

Gen.1

Gen.2

R-CarE3**

R-CarM3**

R-CarM2W*

Entry

R-CarM1

R-CarE2*

R-CarE2x*

Per

form

ance

R-CarM2N*

Same performance level

Page 13


R-CAR E2X PACKAGE 1 (6 LAYER THROUGH HOLE VERSION) Package: 501pin FCBGA, 21x21 0.8mm pitchSupports 6 Layer Through Hole PCB

Standard Interfaces6x SCIF(UART)

6x I2C

3x MSIOF(SPI)

1x PCI Express

1x Ethernet AVB

1x DigitalRadio I/F

GPIOs

Timers

1x WDT

2xCMT0 8xCMT1

Sec.Timer/WDT

7x PWM 4xTPU

System

INTC

CPG(Clock gen.)

DMAC

SYSC(System ctrl.)

CryptCore

Audio IPs6x Async SRC

10x SSIU

Audio Router

Graphic/Display IPs

2x Display Out

2x CVBS Input(selectable)

2x Digital Video In

1x CVBS output

SGX5312D/3D GPU260MHz, 21Mpoly/s

Secure Boot

1x LVDS output

VCP3Video codecs EngineFullHD enc/dec

VSPVideo Processor

2x USB2.0 Host/Function

2x CAN2.0B

2x Display Unit

1x FDP

TCON

1x TCON Out

1xTSIF

Memory Interfaces

2x SDHI(SDR104/50)

1x SDHI(SDR104 w/MMC mode)

16bit ExtBus(BSC)

32bit DDR3-1000

2x S-Flash

1x Ethernet I/F

CPUs2x ARM Cortex-A71GHz 2xVFP 2xNeon

L2 Cache 512Kbyte

SH4A 260MHz

Upgrade from E2

Page 14


Memory Interfaces

CPUs2x ARM Cortex-A71GHz

R-CAR E2X PACKAGE 2 (4 LAYER THROUGH HOLE VERSION)Package: 501pin FCBGA, 21x21 0.8mm pitchSupports 4 Layer Through Hole PCB

Standard Interfaces6x SCIF(UART)

6x I2C

2x SDHI(SDR104/50)

3x MSIOF(SPI)

1x SDHI(SDR104 w/MMC mode)

1x Ethernet AVB

1x DigitalRadio I/F

GPIOs

Timers

1x WDT

2xCMT0 8xCMT1

Sec.Timer/WDT

7x PWM 4xTPU

System

INTC

CPG(Clock gen.)

DMAC

SYSC(System ctrl.)

CryptCore

Audio IPs6x Async SRC

10x SSIU

Audio Router

Graphic/Display IPs

2x Display Out

2x CVBS Input(selectable)

2x Digital Video In

1x CVBS output

SGX5312D/3D GPU260MHz, 21Mpoly/s

Secure Boot

1x LVDS output

VCP3Video codecs EngineFullHD enc/dec

VSPVideo Processor

2x USB2.0 Host/Function

2x CAN2.0B

16bit ExtBus(BSC)

32bit DDR3-1000

2x S-Flash

2x Display Unit

1x FDP

TCON

1x TCON Out

2xVFP 2xNeon

1xTSIF1x Ethernet I/F

L2 Cache 512Kbyte

SH4A 260MHz

Upgrade from E2

Page 15


R-CarE2X

LCDw/touch panel

I2S

RemoconIC

USB I/F

SDIO or PCIe IF

S-Flash

CD/DVD Deck

GPIO

BackCamera

DigitalVideoINBT.601

DDR3DDR I/F

Analogue Video In(selector)

QSPIMulti I/O

eMMCeMMC I/F(SDIO)

Touch ScreenController

TunerAudio DSP

PowerAMP

BT/WiFiComboModule

(802.11ac)I2SSCI

USB HSHost/Func x1Host/Func x1

HDMI IFICHDMI

SmartPhone

SDIF SDCard

Key

PowerCircuit

I2C

System controlRL78

I2C

SCICAN Bus

CVBSDec

LVDSSerDes LVDS

Out

BOM COST REDUCTION - REDUCES EXTERNAL PARTS COST

APP: DA HMI, MediaPlayer, CarPlay, etc.M/W: AV Codecs, GFX, BT/Wifi stack etc.

S-Flash (2ch)

CVBSEnc

Rear Sheet

MonitorCVBSOut

2ch: Enables Fast boot

$1-2

$1-2

$1-2

Low-end Display Audio System Configuration

Supports eMMC Boot

Page 16


R-CAR E2X EVALUATION BOARD (ALE6 & ALE4)

Nick name Part Number Mounted R-Car E2X Status

ALE6 RTP0RC77945SEB0010S R-Car E2X Package 1(support 6-layer TH PCB)

Deliverable*

ALE4 RTP0RC77946SEB0010S R-Car E2X Package 2(support 4-layer TH PCB)

Deliverable in April *

* TAT is 2 – 3 months.

ALE6

E2X

ALE6 main feature PCB : 6-layer through-hole PCB SoC : R-Car E2X (w/PCIe)

ARM Cortex-A7 Dual 1.0GHz RAM : DDR3-SDRAM 1000MHz 1GB x2 Display : HDMI, LVDS, CVBS output Video in : CVBS input Audio : Audio output, Microphone input Storage : SPI Flash

eMMC x1, SDHI x2, USB2.0 x2 Network : Ethernet, EtherAVB, PCIE Debugger : 20-pin JTAG connector

P/N (Part Number)

Page 17


R-CAR GEN3

Note: The given information are very preliminary as these products are still under specification! Details may change without any notice!


R–CAR GEN3 THE NEXT GENERATION

R-Car Gen 3 is under specification, first silicon planned for Q3/2015 Continue the Big.LITTLE concept with

newest ARM Cortex A57 and A53 Highest embedded memory performance with LPDDR4-3200

at 128bit = 51,2GB/s Use the most modern

16nm Si process (FinFET+) to reduce the power consumption and increase the performance Offer the scalability concept

of R-Car Gen2 with R-Car-H3R-Car-M3R-Car-E3

Page 19


CPUs (=38.500DMIPS)

4x ARM Cortex-A57 1500MHz

R-CAR H3 BLOCK DIAGRAMPackage: xxx pin FCBGA, 31x31, 0.8pitch

MemoryRAM0: 72KB RAM1: 4KB

Memory Interfaces

Timers

WDT

10x 32bit Interval4x 3ch 32bit Timer

7x PWM

System

Interrupt ControllerSystem/Power ctrl.

XXch DMA ctrl.

Clock/PLLBoot ROMThermal Sensor2x CryptoCore (option)

Audio IPs

JTAG Debug (Coresight)

Graphic/Display IPs4x DisplayOut1x Digital out; 1x LVDS; 2xHDMI (4K resolution)

4K Video Codec(or 4x HD Video Codec)

2x Image RendererIMRPowerVR G6650

2D/3D GPU550MHzSystem$

JPEG Codec UnitJPU

5x VideoIn4x MIPI-CSI2; 1x Digital

Note: some modules are optional!

4x ARM Cortex-A53 1200MHz (opt)

SECRAM: 256KB MERAM/L3$: xMB

Image ProcessorIMP (option)

VideoProcessorVSP1

XXch Async/SyncSRC

24bit A-DSP (Tensilica)

10ch I²S (6ch TDM possible)

Audio Router

XXch Audio DMA ctrl.

eMMC (5.0, HS200)

4x SDIO (SDR104)

4x 32bit LPDDR4-3200

16bit ExtBus/SRAM(65MHz, P-ATA mux)

2x Quad-SPI Hyperflash

Standard Interfaces11x SCIF (UART)

4x I2C

Xx CAN2.0B

3pin MLB (MOST50)

2x PCIe (Rev2.0, 1 lane)

4x USB2.0 (Host/function)

2x USB3.0 (Host)

4x SPI

EthernetAVB (1Gbps)

SATA (Rev3.2)

xxx GPIOs

ARM Cortex-R7 800MHz (opt)

Page 20


R-CAR SCALABILITY

CPU, Drawing, Mem band width performance scaling

R-Car M2 R-Car M3 R-Car H2 R-Car H3CPU 2x CA15 2x CA57,

2x CA53, 1x R74x CA15, 4x CA7

4x CA57, 4x CA53, 1x R7

CPU max freq (MHz) 1500 1500/1200/8001900 (overdrive, A57 only)*

1400/780 1500/1200/8001900 (overdrive, A57 only)*

Total DMIPS 10.500 20.19823.598 (overdrive)

25.400 38.46845.268 (overdrive)

L2$ (KB) 1024 (CA15 dual) 1024 (CA57 dual)

256 (CA53 dual)

2048 (CA15 quad)

512 (CA7 quad)

1024 (CA57 quad)

256 (CA53 quad)

S3$(KB) -- tbd 2000 tbd

DDR Mem (GB/s) 12,8 25,6 12,8 51,2

GPU @ freq (MHz) SGX544MP2 @ 520 G6250 @ 550@ 650 (overdrive)*

G6400 @ 520 G6650 @ 550@ 650 (overdrive)*

3D Gfx (Polygon/s) 173M 275M325M (overdrive)

260M 275M325M (overdrive)

3D Gfx (Pixel/s) 5200M 2200M2600M (overdrive)

4160M 6600M7800M (overdrive)

3D Gfx FP32 (FLOPS/s) 33G 70G83G (overdrive)

166G 211G250G (overdrive)

Display resolution 150MHz (LVDS) 150MHz (LVDS) 150MHz (LVDS) 250MHz (HDMI)

HD Video (H.264) 1080p30 x 2 1080p30 x 2 1080p60 x 2 4Kp30 x 1

*Note: Overdrive frequencies for max. 10% of key-on-time (tentative)

Page 21


R-CAR ADAS SOLUTION


SYSTEM ARCHITECTURE

Page 23


多合一ADAS功能多功能3D AVM

• 依車輛大小可搭配160-190度魚眼鏡頭• 可搭配任何Distortion分布之魚眼鏡頭• CANbus介面擷取時速、方向盤角度、方向燈等訊號，即時顯示動態倒車軌跡。

• AVM主機單鍵量產系統校正技術• 540度3D自由視角變換• 高畫質之亮度與彩度一致化AVM畫面

車道偏移系統(LDWS) 智慧型行車紀錄器前方防撞系統 (FCWS) 速限標誌偵測與警示車側盲區偵測系統(BSD) 頭燈遠近光自動切換環景視訊(AVM) 動態倒車軌跡後方防撞系統(BCWS) 後車廂自動開啟頭燈自動啟閉

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COCKPIT SYSTEM OF SMART CAR & MARKET/ TECHNICAL TREND OF ADAS · PDF file · 2016-06-29SMART CAR & MARKET/ TECHNICAL TREND OF ADAS ... Migration from Modular system to Integrated