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Cloud CAE A Game Changer for Engineers
Ian Campbell
CEO, OnScale
HPC AI Stanford Conference 2
1940’s 1960’s 1980’s 2020’s
Engineers: Making Science Fiction Reality Since 10,000 B.C.
Design Simulatefor Days/Weeks/Months…
Computer Aided Engineering
3
CAE Should Answer: “How can I engineer the BEST design?”
Analyze ResultsIdea
(Repeat over and over and over and over…)
100B Core-Hours/Year, 99% On-Premise
HPC AI Stanford Conference
The Solution:
4
Faster!Results
FREE CAE SOFTWARE
NO L ICENSES, NO IT, NO HW
Engineering Problems
Engineering Results
than Legacy
CAE Solutions
Source: 1000’s of Customer Benchmarks
SAAS, ON-DEMAND, SCALABLE
WORLD-CLASS SOLVERS
On-Demand Scalable Cloud CAE
Private
Hybrid
Public
Actionable Data
HPC AI Stanford Conference
OnScale at a Glance
Founded in 2017 by world-class engineers/entrepreneurs
Venture backed and growing quickly
Focusing on Future of Engineering:
HPC AI Stanford Conference 5
Work-
flow
Cloud
HPC
Solvers
AI
Disruptive Cloud CAE Platform
BioMed Devices ADAS Sensors/Systems
IoT Sensors 5G RF Components
Advanced Therapies Consumer Ultrasound 3D Ultrasound Driver Monitoring
Initial Applications: High Tech
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Multi-Billion Dollar Markets, Big, Bursty CAE Workloads
MEMS Mics Gesture Sensors RF Filters MEMS RF Switches
The Multi-Billion Dollar Pain
7
Month 1 Month 2 Month 3 Month 4 Month 5 Month 6
Risk
Fab Device
Design
Freeze
Device
Verification
Go or
No-Go
MPSystem Verification
If “No-Go”
then Reiterate
(and spend another $1M …)
Traditional Design Cycle = Too Much Risk, Time, and Cost
CONFIDENTIAL
CAE
<10 S
ims
Device-Only CAE:
No System Insights
Up-front
CAE
Bottleneck
Cloud CAE → Minimize Risk, Time, and Cost
e
The Solution
8
Month 1 Month 2 Month 3 Month 4 Month 5 Month 6
Device
Verification Go!
>1M
Sim
s
CONFIDENTIAL
CAE
Cloud CAE Breaks
Bottleneck
Fab Device
Minimize Protos
& Short Loops
System Verification
Head Start on
Algos, FW/SW
Reduce
Time
MP
More
Design Wins!
Design
Freeze
Use Case: 5G RF Front-Ends
5
Full 3D Simulations: Impossible with On-premise CAE
Optimize Next Gen 5G
Filters in Full 3D
HPC AI Stanford Conference
Use Case: Fingerprint Sensors
5
Massive Sim Studies Reduce Risk, Cost and Time to Market
Simulates Sensor AND System
Effects in Full 3D
Simulation Data Enhances AI Algos
for Fingerprint Recognition
HPC AI Stanford Conference
Enhanced Engineering Workflows
HPC AI Stanford Conference 11
Example: IoT Sensor Design Plugins
EDA for ASIC Design
MCAD for Sensor Design
Iterate
Design
Iterate
Design
EDA Plugin
CAD Plugin
Problems
Results
ProblemsResults
Data
• On-Demand HPC
• Data Storage
• Version Control
• Central Data Repo
Disruptive SaaS Sales Model
Other Benefits: No IT, No Licenses, No Hardware, One-hour Setup, Free GUI
for Model Setup & Post Processing, Free Training/Examples
HPC AI Stanford Conference 12
Cloud CAE = No SW LicensesCloud CAE breaks licensing constraints
– Run massive numbers of sims in parallel
– Multi-tenant, supports large engineering teams
HPC AI Stanford Conference 13
Legacy CAE
1 Engineer 1 License1 PC
1 Sim
Limited Data
Cloud CAE
Many
Engineers
“Infinite”
Hardware
Many, Many
Simulations
Wealth of Data
Unified Pricing Model
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Why Solver Efficiency Matters
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Low Med High Very High
Solv
e T
ime
Min
Hrs
Days
Problem Size (DoF)
OnScale Scales with Problem Size – Legacy Competition Does Not:
100k 10M 100M1M
Wks
Advantages:
• Solve Time
• Cloud Compute Cost
Limited
Practicality
(takes weeks)
High Cloud
Compute
Cost Barrier
Impossiblewith Legacy(too large for any system)
Fully Coupled Physics“Fully Coupled”: all physics algos on same finite element mesh
– Reduces CPU and RAM requirements
– Reduces overall solve time and Cloud Compute cost
HPC AI Stanford Conference 16
Legacy CAE OnScale
Mechanical Electrical EM
Decoupled solvers, serial solve,
separate FEM matrices
FEM1 FEM2 FEM3
Mechanical
Electrical
EM
Single
FEM
Fully coupled solvers, parallel
solve, single FEM matrix
OnScale Cloud MPI Acceleration• MPI splits model across 10,000’s of cores
• Unparalleled acceleration on Cloud HPC
• Previously impossible problems now Solvable
HPC AI Stanford Conference 17
Legacy CAE
• Not possible, too large
• Even 1M DoF problems
take hours/days
OnScale
Cores 900
Runtime 47 min
3D BAW Model, 100 MDoF
OnScale MPI Acceleration
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With MPI, simulation acceleration is linear with additional cores
212
210
28
26
24
22
22 24 26 28 210 212
CPU Cores
Accele
rati
on M
ult
iple
Competition
Diminishing
Returns
Why the Time is Right
Cloud CAE is Enabled by New Cloud tech:– Kubernetes clusters (2015)
– Docker container system (2016)
– True Cloud “Bare Metal HPCs” (2017)
– Advanced token “licensing” (2017)
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Big-Compute is waiting for
the Perfect Cloud CAE App– Ground-up physics coupling
– Parallelism built-in from day 1
– Move 100B core-hours to Cloud
Questions?
CAE is a massive HPC workload world wide
99% of of CAE is on-premise, Legacy model
In 3-5 years, majority will be on Cloud HPC
HPC AI Stanford Conference 20